Application Specification High Speed Standard 1114-11007 AMF Edge Connectors (HSSE) 10 FEB98 Revo Nena All numerical values are in metric units [with U.S. customary units in brackels}. Dimensions are in millimeters [and inches]. Uniess otherwise specified, dimensions have a tolerance of +0.13 [005] and angles have a tolerance of 2. Figures and illustrations are for identification only and are not drawn fo scale. 1. INTRODUCTION This specification covers the requirements for application of AMP* High Speed Standard Edge (HSSE) through hole printed circuit (oc) board connectors. These connectors are a onepiece separable interconnect approach to high-speed signal transmission applications. The connectors have an upper row of signal contacts on 1.27 [.050] centerline with a lower row of ground contacts within each circuit cavity. The positioning of signals and grounds achieves a 0.64 [.025] centerline density in a 1.27 [.050] centerline connector with 40 signal/ground pairs per linear inch and a 1:1 signal to ground ratio. The staggered contact interface height reduces the daughter card mating force. Housing positioning features align the connector assembly with holes positioned on the mother board and retain it for soldering processing. HSSE Connectors are available in sizes: 50 dual positions (100 signal and 50 ground contacts, 150 total contacts and 200 virtual contacts) to 130 dual positions (260 signal and 130 ground contacts, 390 total contacts and 520 virtual contacts) in increments of 10 dual positions (20 signal contacts and 10 ground contacts, 30 total contacts and 40 virtual contacts). When corresponding with AMP personnel, use the terminology provided on this specification to help facilitate your inquiry for information. Basic terms and features of components are provided in Figure 1. Card Scoop CTs, MY Divider Wall Mating Face ch oxi he yl i Card Slot ci <a Te yi | : | Beil i | Contact Tines Ue Hold-Down Figure 1 AMP Incorporated, Harrisburg, PA 17105 TOOLING ASSISTANCE CENTER 1-800-722-1111 AMP FAX'PRODUCT INFO 1-800-522-6752 1of 14 This AMP controlled document is subject to change. For latest revision call the AMP FAX number. Copyright 1998 by AMP Incorporated. All Rights Reserved. Trademark LOC B Form 404-32 1/98ANP High Speed Standard Edge Connectors 4114-11007 2. REFERENCE MATERIAL 2.1. Revision Summary This paragraph is reserved for a revision summary of changes and additions made to this specification. Engineering Change EC 0990-077797 has been used to release this document as Rev O. 2.2. Customer Assistance Reference Part Number 145090 and Product Code 7820 are representative numbers of AMP High Speed Standard Edge Connectors. Use of these numbers will identify the product line and expedite your inquiries through an AMP service network established to help you obtain product information. Such information can be obtained through a local AMP Representative (Field Sales Engineer, Field Applications Engineer, etc) or, after purchase, by calling the Tooling Assistance Genter or the AMP FAX/Product Information Center number at the bottom of page 1. 2.3. Drawings AMP Customer Drawings for each connector are available from the service network. The information contained in Gustomer Drawings takes priority if there is a conflict with this specification or with any technical documentation supplied by AMP Incorporated. 2.4. Bulletins AMP Corporate Bulletin 40152 is available Upon request and can be used as a guide in soldering. This bulletin provides information on various flux types and characteristics along with the commercial designation and flux removal procedures. A checklist is attached to the bulletin as a quide for information on soldering problems. 2.5. Specifications AMP Product Specification 108-1406 provide product performance requirements and test information. 2.6. Instructional Material Instruction Sheet 408-6927 provides design recommendations for pc board support fixtures. 3. REQUIREMENTS 3.1. Storage A. Ultraviolet Light Prolonged exposure to ultraviolet lignt may deteriorate the chemical composition used in the connector housing material. B. Shelf Life The connectors should remain in the shipping containers until ready for use to prevent deformation of the contact solder tines or other damage to the connectors. The connectors should be used on a first in, first out basis to avoid storage contamination. C. Chemical Exposure Do not store connectors near any chemical listed below as they may cause stress corrosion cracks in the contacts. Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds Amines Carbonates Nitrites Sulfur Nitrites Tartrates 3.2. Special Characteristics AMP HSSE Connectors have an operating temperature range of 55 to 105C [-67 to 221F]. All connectors consist of a brown polyphenylene sulfide housing and phosphor bronze contacts. The contact plating is nickel all over with gold on the mating surface and bright tinlead on the solder tines. The card slots on the connector housing mating face have a triple card scoop feature at each end to facilitate mating with daughter boards. Metal holddowns are incorporated into the bottom of the housing. These halddowns stabilize the connector during the soldering process. However, they are not designed to control or counteract the effects of pc board warpage. See Figure 1. 2 of 14 Rev O Form 404-33 1/98ANP High Speed Standard Edge Connectors 4114-11007 3.3. PC Board Requirements Nena PC Boards should conform with the standard indusiry requiremenis specified in 1PCJH007. A. Mother Board Material and Thickness The pe board material shall be glass epoxy (FR4 or G10}. The connectors are designed to accommodate a pc board thickness range of 1.4 to 2.4 [.055 to.094]. Call the Product Information number listed at the bottom of page 1 for suitability of other board materials or other board thickness applications not specified on this specification. B. Daughter Board Material and Thickness The pe board material shall be glass epoxy (FR4 or G10) with a thickness range of 1.38 to 1.77 [.054 to .070]. C. PC Board Warpage Maximum allowable bow of the pc board shall be 0.05 mm per 25.4 mm length [.002 in. per inch length] over the length of the connector assembly. D. Mother PC Board Layout The mounting and contact holes in the pc board must be precisely located to ensure proper placement and optimum performance of the socket assembly. The pc board layout dimensions and tolerances shown in Figure 2 must be observed when preparing pc boards for the various connector styles. The layout shows the top (component) side of the board. bie = AVPHSSE Connectors are not designed to function as board stiffeners when soldered to pc boards. ff 2.39-2.49 2, 39-2.48 [.094-, 098] [. 094-, 098] # 0,94-1 09. SF 1S wal GN PS IE woar=. were [Sheers TYF 4 ~ Oo 0 @ --aso0004 $600 0 @ - 00 0 0 0 @ 00 0 @ --9a004 @0200 60 @ - -600 6 o-4_ 4 a o QW ~ -scos Oo 0 0 Oo B-_-scoC0d0 60 00 @--a00 e000 0 GG --e000G ds +0006 @--s000004 T.0T6 3.046 5.08 #000 6--e004 #0000 0 --cao00004 2 PLO 2 PLO 2 PLO lug 1 SPACES af 1.27 RA SPACES af 1.27 2.39-2.46 C.0o94-. 0981 3.0468 C.120] NUMBER OF DIMENSION DUAL POSN. Le RC LA RA T v 50 34.62 [1.363] | 41.99[1.653] 21 27 33.78 [1.330] A4,07-41 22 [1.617-1.623] 60 39.7 [1.563] 49.51 [1.953] 25 33 38.86 [1.530] 48.59-48.84 [1.917-1.923] 70 44.78 [1.763] | 57.23 [2.253] 28 39 43.94 [1.730] 56.31-56.46 [2.217-2.223] 73 47.32 [1.863] 58.5 [2.303] 31 40 46.48 [1.830] 57.58-57.73 [2.267-2.273] 80 52.4 [2.063] 62.31 [2.453] 35 43 51.56 [2.030] 61.39-61.54 [2.417-2.423] 90 57.48 [2.263] | 69.93 [2.753] 39 49 56.64 [2.23] 69.01-69.16 [2.717-2.723] 100 62.56 [2.463] | 77.55 [3.053] 43 55 61.72 [2.430] 76.63-76.78 [3.017-3.023] 110 67.64 [2.663] | 85.17 [3.353] 47 61 66.80 [2.630] 84.25-84.40 [3.317-3.323] 120 72.72 [2.863] | 92.79 [3.653] 54 67 71.88 [2.830] 91.87-92.02 [3.617-3.623] 130 80.34 [3.163] | 97.87 [3.853] 57 71 79.50 [3.130] 96.95-97.10 [3.817-3.823] Figure 2 (contd) Rev 0 3 of 14 Form 404-40 1/98AMP High Speed Standard Edge Connectors of Wut 9.53 tt . (.375] 2 PLE COPTIONALI 2,89-2,94tr} C.116-.116] ($fo.25.0107 Gs[k 2 PLO COPTIONAL sn Wh - i pai2.82-2.92 Ee] SEE DETAIL H ~~ OTH Lo ie -alt- OTM RC - 4114-11007 FCOPTIONAL 3 PLO WOM i 3.467 .1365) LA SP&CES AT ose C.0507 1.27 REF tese| C.050] TYP 4.489 MIN C. 350] TYP 4.32 MIN C.17O] TYP 2,683 .1135) a 1.27 Fa SPACES 4T c.0501 a9. F2-0. 87 (.028-.032) [[0. 250. cor Ok O] TYP TYP TYP 4 4.63-5.08 C.190-. 2600] TYP 1 t 0.34 MIN fie C.O13] ava Lage AREA | FOR VIA HOLE [#[0.150.006) G[J[k DO] | gpl beato. 1 MIN Typ [.006] a! TYP [.025] TYP jen] foeggh 051 MIN .020] [#[o. 150.006) Ols[K O] TYP DETAIL AH Figure 2 (end) RoO.12 MAX C. 0057 5.21-5.46 C.205-.215] Pp I= L 254 MAK [.1907 2 PLO COPTIONALI 4of 14 Rev O Form 404-33 1/98AMP E. Daughter PC Board Layout High Speed Standard Edge Connectors 4114-11007 Several recommended alternative free pc board land and edge configurations are available for customer consideration as shown in Figure 3. Figure 3A is the base format from which all others are derived. The remaining configurations are variations of Figure 3A that are presented to allow customers a wide range of pc board design flexibility when using multilayer boards and alternate grounding patterns. DIMENSION - o po aogagoo eogage oda ong je-2.82-2.90 C.111-.1141 Ef OIMENSTION FCOPTIONSL? SEE DETAIL H a PLO y ao ao o a z or = 5 ee a o 2 TOO oT] [ Toa WL =e t | a _ C.114517 2.54 MAX 2 C100). 2 PLO + pe@i SPaceS aT bees) SPACES AT 4 12j502 3 mi [short bay of the connecter] [long Bay of the connecter] 2 PLO Figure 3A e 0.97 MIN [. 0381] Plo. 250.010] Ok O TYP 1.27 REF fe [+= r.050] TYP peea 0.15 [.008] MIN | VIAS TO INSIDE LAYERS q Olme HH RO.12 MAX | .005] TYP 8.89 MIN [. 350] | TYP ' ' so | - SOLDER MASK APPLIED _| 4 5.21-5.46 IN THIS AREA f.205-.215] TYP SOLDER MASK APPLIED IN THIS 4 Prd Rao 280 AREA WHEN VIAS NOT USED 4L.APOIIN Tye TYP ii Go 3.018 MAX AVAILABLE AREA FOR VIA HOLE OF SIGNAL CONTACT fee} begl0 63 [.025] OF GROUND CONTACT Figure 3B Rev 0 5 of 14 Form 404-40 1/98AMF High Speed Standard Edge Connectors 114-11007 | eat 0.71 MIN [.028] TYP 1.27 REFtem {ssa [.050] TYP | pwt 0.15 [.006] MIN L | | VIAS TO INSIDE LAYERS q fi PI! IG LS RO.12 MAX | 2005) TYP 8.89 MIN C.350] | TYP ' \s 5.21-5.46 IN THIS AREA | (208 4,32 MIN P C.??ol HN 1 | 4.63-5.068 Tye C.190-, 200] TYP \ t FF 3.018 MAX AVAILABLE 4 ~~ AREA FOR VIA HOLE t OF GROUND CONTACT 0.28 t OF SIGNAL CONTACT c.011] a te| peg Ss [.025] 0.20 MAX = feem| soa C.008 MAX] plo. 150.008] mM] JK O] TYP Figure 3C all o.71 MIN c,028] [p]o.250.0101 GJ[K O TYP 1.27 REF= | bs} [.059] TYP ra@# 0.15 C.006] MIN a VIAS TO INSIDE LAYERS oO me R O.12 MAX | [.0051 TYP 8.89 MIN ct. 350] | TYP ' y 2 SOLDER MASK APPLIED | 4 i A 5.21-5.46 IN THIS AREA aad Min [.205-.215) : TYP SOLDER MASK APPLIED IN THIS C.170] A WE (18375 ~28 AREA WHEN YIAS NOT USED TP TYP | rath \s.018 MAX AVAILABLE AREA FOR VIA HOLE t OF GROUND CONTACT OF SIGNAL CONTACT Figure 3D 6 of 14 Rev 0 Form 404-33 1/98AMP High Speed Standard Edge Connectors 4114-11007 BACKSET LEADING EDGE OF GROUND LANDS NOT Td BE MACHINED DURING CHAMFERING PROCESS te| at 0.71 NIN 1.27 REF |-s=a- C.o50] TYP it 3 C. 8.69 MIN C. 3501 TYP pt C.028) [elo. 250.0101 G]J]k ) TYP O06] MIN 5.21-5.46 [.2305-. 215) 4.a9-S.o8 TYP [.190-, 200] TYP t | Y 0.38 - one 4 " 0.51 C018 - .0259 @0.020] MAX AVAILABLE AREA FOR VIA HOLE rage S801 t OF GROUND CONTACT o.15 1.005] MIN OF SIGNAL CONTACT 1.07 MIN t OF GROUND LAND SEE oa [.042 MINI et 0.150.006] G[J[k GC] ~ Figure 3E BACKSET LEADING EDGE OF GROUND LaNDS NOT TO BE MACHINED Hy BURING CHAMFERING PROCESS atl oe MIN 1.27 REFt| {aj [.050] TYP a 05 [.006] MIN 8.89 MIN To C.350] Tee T TYP 5.21-5.46 C.205-.215) TYP 4.83-5,08 c.180-. 2003 TYP y "pb Ay | o38 - 0.54 4 A 's C.01S5 .625) O.76 - 1.27 C.030 - .a507 Figure 3F o.51 @Cl.020] MAX AVAILABLE AREA FOR vla HOLE OF GROUND CONTACT t OF SIGNAL CONTACT ( OF GROUND LAND Rev O Form 404-40 1/98 7 of 14AMP High Speed Standard Edge Connectors 4114-11007 | 1.27 REF C.050] TYP a aoe B.88 MIN C. 3501 Tea [1 TYP ~ BaCKSET LEADING EDGE OF GROUND LANDS NOT TO BE MACHINED DURING CHAMFERING PROCESS 0.71 MIN [. 028] e[e2loa Oko TYP ~<a o.15 [.006] MIN 5.21-5.46 [.205-,215] TyP 4.93-5.06 C.190-, 2001] TYP j | | 0.38 - see 4 C.015 - .o025] O.75 - 1.27 C.030 - .Oo50] 0.53 MIN C.022 MINI 1.07 MIN c.042 MINI i f6[o. 180.0067 Ol a[k O] <j o.51 C.020] MAX AVATLABLE AREA FOR VIA HOLE \. t OF GROUND CONTACT t OF SIGNAL CONTACT OF GROUND LAND Figure 3G | a.71 MIN C.028] TYP 1.27 REF {ssa C.050] TYF | ee} i | | g.13 C.906] MIN 5.21-5.48 b.205-.215] 4.93-5.06 TYP C.190-, 200] TYP 8.89 MIN [. 350] | TYP BACKSET LEADING EDGE OF GROUND .035 REF LANDS NOT TO BE MACHINED OURING CHAMFERING PROCESS \ Y ri 0.89 - vat [.035 - .045] 2.03 - 2,28 [.08@ - .990] 1.07 MIN o (.042 MINI P10. 150.006) OLJ[k Oy cL. J Figure 3H o.51 @0.020] MAX AVAILABLE AREA FOR VIA HOLE (OF GROUND CONTACT t OF SIGNAL CONTACT t OF GROUND LAND Rev O Form 404-33 1/98ANP High Speed Standard Edge Connectors 4114-11007 ie et 0.71 MIN C.028] [g]o.25t.o10) Os]k OD] 1.27 REFie |} TYP c.050] TYP paag O.15 [.006] MIN I nnne 8.89 MIN [.a50] TYP oI BACKSET LEADING EDGE OF GROUND fi F LANDS NOT TO BE MACHINED 5.21-5.46 DURING CHAMFERING PROCESS [.205-.215] P 4.83-5.08 \ LEE LL) C Tao 200] | A 1 1.27 - too Ml O.5] c.050 - .070] @C.020] MAX AVAILABLE 2.03 - 2.28 AREA FOR VIA HOLE C.080 - .O907 t OF GROUND CONTACT OF SIGNAL CONTACT o.53 MIN [.022 MINI Bee! 1.0? MIN OF GROUND LAND c.042 MINI a [@]o. 150.008] OLIJE .014) Figure 31 fend) Care should be taken when producing the daughter board edge chamfer. When daughter board chamfers are poorly cut, they may have the copper base melal ripped out from under the nickel underplate. This exposed nickel edge is hard and sharp. It may cut into the mating contact surfaces or may even catch on the conlact mating surface and crush the contact. See Figure 4. Nickel, Overplated with Gold Poorly Gut Chamfer (Sharp, Hard Nickel Edge) Clean Cut Chamfer . Figure 4 Rev O 9 of 14 Form 404-40 1/98ANP High Speed Standard Edge Connectors 4114-11007 3.4. Through Hole Preparation The holes in the pe board must be precisely located to ensure proper placement and optimum performance of the connector, and must be prepared to the requirements provided in Figure 5. 1.4-2.4 [.055-.094] Board Thickness tk Pad Diameter ee 0.94-1.09.037-.043] (As Required) Diameter of Finished Hole Foe After Plating H E Drilled Hole Diameter ea (As Required} Copper Plating (As Required) Tin/Lead Plating (As Required} Figure 5 3.5. Connector Placement ribet Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact fines, When placing through hole connectors on the pe board, make sure the contact solder tines are aligned and started into the matching holes before seating the housing on the pc board. See Figure 6. Holes PC Board Solder Tines Figure 6 10 of 14 Rev O Form 404-33 1/98ANP High Speed Standard Edge Connectors 4114-11007 3.6. Soldering A. Flux Selection Contact solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux must be compatible with the wave solder line, manufacturing, health, and safety requirements. Call the Product Information phone number at the bottom of page 1 for consideration of other types of flux. Some fluxes that are compatible with these connectors are provided in Figure 7. COMMERCIAL DESIGNATION FLUX TYPE ACTIVITY RESIDUE KESTER#3 ALPHA Type RMA . . (Mildly Activated) Mild Noncorrosive 186 611 &8 Product of Kester Solder Co. @ Product of Alphametals Inc. Figure 7 B. Cleaning After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder and flux for recommended cleaning solvents. The following is a listing of common cleaning solvents that will not affect the connectors for the time and temperature specified. See Figure 8. cy Consideration must be given to toxicity and other safely requirements recommended by the solvent manufacturer. Refer to the manufacturers Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners. Trichioroethylene and Methylene Chioride can be used with no harmful affect to the connectors; however AMP does not recommend them because of the harmful occupational and environmental effects. Both are carcinogenic (cancer-causing) and Trichloroethylene is harmful to the earths ozone layer. Rens if you have a particular solvent that is not listed, coniact the Tooling Assistance Center or Product Information number al the bottom of page 1. CLEANER TIME re Madmum) (Minutes) NAME TYPE CELSIUS FAHRENHEIT Alpha 2710m Aqueous 1 132 270 Bioact EC-7@ Solvent 5 100 212 Butyl Carbitole Solvent 1 Room Ambience Isopropyl Alcohol Solvent 5 100 212 Kester 57788 Aqueous 5 100 212 Kester 57798 Aqueous 5 100 212 Loncoterge 520@ Aqueous 5 100 212 Loncoterge 530 Aqueous 5 100 212 Terpene Solvent Solvent 5 100 212 @ Product of Frys Metals, Inc. C. Drying @ Product of Peiroferm, Inc. @ Product of Union Carbide Corp. Figure 8 $3 Product of Litton Systems, Inc. When arying cleaned assemblies and printed circuit boards, make certain that temperature limitations are not exceeded: 55 to 105C [-67 to 221F] for standard temperature products. Excessive temperatures may cause connector degradation. D. Soldering Guidelines AMP High Speed Standard Edge Connectors can be soldered using wave or equivalent soldering techniques. The temperatures and exposure time shall be within the ranges specified in Figure 9. We recommend using SN6O or SN62 solder for these header assemblies. Rev O 11 of 14 Form 404-40 1/98ANP High Speed Standard Edge Connectors 4114-11007 Nena AMP Corporate Bulletin 401-52 provides some guidelines for establishing soldering practices. Refer to Paragraph 2.4, Bulletins. SOLDERING TEMPERATURE TIME PROCESS CELSIUS FAHRENHEIT (At Max Temperature) WAVE SOLDERING 26038 50038 5 Seconds 3 Wave Temperature Figure 9 3.7. Checking Installed Connector All solder joints should conform to those specified in AMP Workmanship Specification 101-21 and all other requirements specified in this document. The connector must be seated on the pc board to the dimensions shown in Figure 10. Connector Connector Must be Flush Against PC Board to 0.13 [.005] Max Mother Board eee eee eee rs eae Solder Tine TT | Figure 10 3.8. Daughter Board Usage Precautions When mating or unmating daughter boards, caution should be taken to prevent the longitudinal rocking of the pc board in respect to the connector. See Figure 11. Angles greater than 5 can cause damage to the housing and misregistration of the contacts on the pc board lands. 5 Max | . | Figure 1f 3.9. Repair /Removal Connectors with damaged contacts cannot be repaired. The connector will require the desoldering of all contact solder tines, removing and discarding the damaged connector, and replacing it with a new one. 12 of 14 Rev O Form 404-33 1/98ANP High Speed Standard Edge Connectors 4114-11007 4, QUALIFICATION The AMP High Speed Standard Edge Connectors are recognized by Underwriters Laboratories Inc. (UL) under File E28476, and investigated by UL to meet the Canadian Standard G22.2 No. 182.3-M1987. 5. TOOLING No special tooling is required when handling connectors for manual placement; however, it is recommended that a support plate be used for application of the connector to the pc board. See Figure 12. The support should be used to prevent bowing of the pc board during the placement of a connector on the board, and it should allow the contact solder tines to go through the pc board without deforming the tines. PC Board Support (Customer Supplied) Holes (Ref) Channel (Ref) Figure 12 Rev O 13 of 14 Form 404-40 1/98ANP High Speed Standard Edge Connectors 4114-11007 6. VISUAL AID Figure 13 shows a typical application of AMP High Speed Standard Edge Gonnectors. This illustration should be used by production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected using the information in the preceding pages of this specification and in the instructional material shipped with the product or tooling. SOLDER FILLETS SHOULD CONFORM TO THE REQUIREMENTS OF IPC SPECIFICATION J-STD-001B, PARAGRAPH 9.2 AND ITS APPROPRIATE SUBPARAGRAPHS, FOR CLASS Il END-ITEM USE CONNECTORS SHOULD BE VISIBLY SEATED ON THE PC BOARD CONNECTORS SHOULD NOT BE DAMAGED FIGURE 13. VISUAL AID 14 of 14 Rev O Form 404-33 1/98