2SA2223O - Allegro MicroSystems Europe Ltd.

2SA2223

Description

Sanken LAPT transistors have an innovative design, produced

by adapting advancements in the unique Sanken thin-wafer

production technology. These PNP power transistors achieve

faster power-up by decreasing thermal resistance, and provide

a higher avalanche breakdown voltage rating. The high power-

handling capacity of the TO-3P package allows a smaller

footprint on the circuit board layout. This series of transistors

is very well suited not only for multichannel applications

for AV (audio-visual) amplifiers and receivers, but also for

parallel connection applications for PA (professional audio

system) amplifiers.

Applications include the following:

▪ Single transistors for audio amplifiers

▪ Home audio amplifiers

▪ Professional audio amplifiers

▪ Automobile audio amplifiers

▪ Audio market

▪ Single transistors for general purpose

Features and Benefits

▪ LAPT (High frequency multi emitter transistor)

▪ Small package (TO-3P)

▪ High power handling capacity, 160 W

▪ Improved sound output by reduced on-chip impedance

▪ For professional audio (PA) applications, VCEO = –260 V

versions available

▪ Complementary to 2SC6145

▪ Recommended output driver: 2SA1668A

Audio Amplification T ransistor

Package: 3-Lead TO-3P

Equivalent Circuit

Not to scale

38104

Audio Amplification T ransistor

2SA2223

Absolute Maximum Ratings at TA = 25°C

Characteristic Symbol Remarks Rating Unit

Collector-Base Voltage VCBO –230 V

Collector-Emitter Voltage VCEO –230 V

Emitter-Base Voltage VEBO –5 V

Collector Current IC–15 A

Base Current IB–4 A

Collector Power Dissipation PCTCASE = 25°C 160 W

Junction Temperature TJ150 °C

Storage Temperature Tstg –55 to150 °C

Selection Guide

Part Number Type hFE Rating Packing

2SA2223* PNP

Range R: 40 to 80

30 pieces per tubeRange O: 50 to 100

Range Y: 70 to 140

*Specify hFE range when ordering.

ELECTRICAL CHARACTERISTICS at TA = 25°C

Characteristic Symbol Test Conditions Min. Typ. Max. Unit

Collector-Cutoff Current ICBO VCB = –230 V – – –10 μA

Emitter Cutoff Current IEBO VEB = –5 V – – –10 μA

Collector-Emitter Voltage V(BR)CEO IC = –25 mA –230 – – V

DC Current Transfer Ratio* hFE VCE = –4 V, IC = –5 A 40 – 140 –

Collector-Emitter Saturation Voltage VCE(sat) IC = –5 A, IB = –0.5 A – – –0.5 V

Cutoff Frequency fTVCE = –12 V, IE = 2 A – 35 – MHz

Output Capacitance COB VCB = –10 V, IE = 0 A, f = 1 MHz – 500 – pF

*hFE rating: 40 to 80 (R brand on package), 50 to 100 (O), 70 to 140 (Y).

Allegro MicroSystems, Inc.

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Audio Amplification T ransistor

2SA2223

Performance Characteristics

–V

(V)

–I

(A)

vs. V

CE(sat)

vs. I

vs. V

–V

= 4 V Continuous

–V

(V)

–I

= 5 A

–I

= 10 A

–I

(A)

–V

CE(sat)

(V)

0 0.5 1.0 1.5 2.0

02134

–IB= 20 mA

50 mA

100 mA

200 mA

500 mA

300 mA

1 A

3 A

–I

(A)

0 0.5 1.0 1.5 2.0

125°C

25°C

–30°C

0.01 0.1 1 10 100

0.01

0.10

1.00

10.00

110100

1000

θJA

vs. t

θJA

(°C/W)

t (ms)

vs. I

–VCE = 12 V Continuous

(MHz)

(A)

Typ.

vs. T

100

150

200

0 25 50 75 100 125 150

(°C)

PC (W)

Without Heatsink

With Infinite Heatsink

3.5

vs. I

–VCE = 4 V Continuous

–IC (A)

0.01 0.1 1 10

10 ms

100 ms

100

1000

125°C

25°C

–30°C

1 10 100 1000

–IC (A)

0.1

0.01

1.0

10.0

100.0

–VCE (V)

Safe Operating

Area

= 25°C, single pulse,

no heatsink,

natural cooling

Allegro MicroSystems, Inc.

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Audio Amplification T ransistor

2SA2223

Package Outline Drawing, TO-3P

Leadframe plating Pb-free. Device composition

includes high-temperature solder (Pb >85%),

which is exempted from the RoHS directive.

15.6 ±0.3

Ø3.2 ±0.1

5.0 MAX

2.1 MAX

Terminal dimension at lead tip

1.0 +0.2

–0.1

2+0.2

–0.1

2+0.2

–0.1

1.7+0.2

–0.1

3+0.2

–0.1

0.6 +0.2

–0.1

19.9 ±0.320.0 MIN

1.8 ±0.3

3.5

Branding

Area

XXXXXXXX

XXXXX XXXXX

Branding codes (exact appearance at manufacturer discretion):

1st line, type: A2223

2nd line left, lot: YM

Where: Y is the last digit of the year of manufacture

M is the month (1 to 9, O, N, D)

2nd line right, subtype: H

Where: H is the hFE rating (O, R, or Y; for values see

footnote, Electrical Characteristics table)

12 3

5.45 ±0.1

14.0 ±0.3

13.6 ±0.2

9.6 ±0.2

15.8 ±0.2

2.0 ±0.2

5.0 ±0.2

6.0 ±0.2

Gate burr: 0.3 mm (max.), mold flash may appear at opposite side

Terminal core material: Cu

Terminal treatment: Ni plating and Pb-free solder dip

Leadform: 100

Package: TO-3P (M100)

Approximate weight: 6 g

Dimensions in millimeters

View A

0.7 MAX

View B

0.7 MAX

View A View B

Exposed

heatsink pad

Allegro MicroSystems, Inc.

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Audio Amplification T ransistor

2SA2223

505 10

30 pieces per tube

17 tubes per layer

2 layers per carton

1020 pieces per outer carton

Dimensions in millimeters

525

118

185

Packing Specification

Tube Packing

Allegro MicroSystems, Inc.

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Audio Amplification T ransistor

2SA2223

100 pieces per tray

5 trays per inner carton

4 inner cartons per outer carton

500 pieces maximum per inner carton

2000 pieces maximum per outer carton

Dimensions in millimeters

365

120

340

160

330

Bulk Packing

Allegro MicroSystems, Inc.

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Audio Amplification T ransistor

2SA2223

Because reliability can be affected adversely by improper storage

environments and handling methods, please observe the following

cautions.

Cautions for Storage

• Ensure that storage conditions comply with the standard

temperature (5°C to 35°C) and the standard relative humidity

(around 40 to 75%); avoid storage locations that experience

extreme changes in temperature or humidity.

• Avoid locations where dust or harmful gases are present and

avoid direct sunlight.

• Reinspect for rust on leads and solderability of products that have

been stored for a long time.

Cautions for Testing and Handling

When tests are carried out during inspection testing and other

standard test periods, protect the products from power surges

from the testing device, shorts between adjacent products, and

shorts to the heatsink.

Remarks About Using Silicone Grease with a Heatsink

• When silicone grease is used in mounting this product on a

heatsink, it shall be applied evenly and thinly. If more silicone

grease than required is applied, it may produce stress.

• Coat the back surface of the product and both surfaces of the

insulating plate to improve heat transfer between the product and

the heatsink.

• Volatile-type silicone greases may permeate the product and

produce cracks after long periods of time, resulting in reduced

heat radiation effect, and possibly shortening the lifetime of the

product.

• Our recommended silicone greases for heat radiation purposes,

which will not cause any adverse effect on the product life, are

indicated below:

Type Suppliers

G746 Shin-Etsu Chemical Co., Ltd.

YG6260 Momentive Performance Materials

SC102 Dow Corning Toray Silicone Co., Ltd.

Heatsink Mounting Method

• Torque When Tightening Mounting Screws. Thermal resistance

increases when tightening torque is low, and radiation effects are

decreased. When the torque is too high, the screw can strip, the

heatsink can be deformed, and distortion can arise in the product frame.

To avoid these problems, observe the recommended tightening torques

for this product package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7

to 9 kgf•cm).

• Diameter of Heatsink Hole: < 4 mm. The deﬂ ection of the press mold

when making the hole may cause the case material to crack at the joint

with the heatsink. Please pay special attention for this effect.

Soldering

• When soldering the products, please be sure to minimize the

working time, within the following limits:

260±5°C 10 s

350±5°C 3 s

• Soldering iron should be at a distance of at least 1.5 mm from the

body of the products

Electrostatic Discharge

• When handling the products, operator must be grounded.

Grounded wrist straps worn should have at least 1 MΩ of

resistance to ground to prevent shock hazard.

• Workbenches where the products are handled should be

grounded and be provided with conductive table and floor mats.

• When using measuring equipment such as a curve tracer, the

equipment should be grounded.

• When soldering the products, the head of soldering irons or the

solder bath must be grounded in other to prevent leak voltages

generated by them from being applied to the products.

• The products should always be stored and transported in our

shipping containers or conductive containers, or be wrapped in

aluminum foil.

WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs

that embody these components must conform with applicable safety requirements. Pre cau tions must be

taken to prevent accidental contact with power-line potentials. Do not connect ground ed test equipment.

The use of an isolation transformer is recommended during circuit development and breadboarding.

Allegro MicroSystems, Inc.

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Audio Amplification T ransistor

2SA2223

The products described herein are manufactured in Ja pan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.

Sanken and Allegro reserve the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be re quired to per mit im-

prove ments in the per for mance, reliability, or manufacturability of its prod ucts. Therefore, the user is cau tioned to verify that the in for ma tion in this

publication is current before placing any order.

When using the products described herein, the ap pli ca bil i ty and suit abil i ty of such products for the intended purpose shall be reviewed at the users

responsibility.

Although Sanken undertakes to enhance the quality and reliability of its prod ucts, the occurrence of failure and defect of semi con duc tor products

at a certain rate is in ev i ta ble.

Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems

against any possible injury, death, fires or damages to society due to device failure or malfunction.

Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equip ment or apparatus

(home ap pli anc es, office equipment, tele com mu ni ca tion equipment, measuring equipment, etc.). Their use in any application requiring radiation

hardness assurance (e.g., aero space equipment) is not supported.

When considering the use of Sanken products in ap pli ca tions where higher reliability is re quired (transportation equipment and its control systems

or equip ment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written

confirmation of your spec i fi ca tions.

The use of Sanken products without the written consent of Sanken in applications where ex treme ly high reliability is required (aerospace equip-

ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.

The information in clud ed herein is believed to be accurate and reliable. Ap pli ca tion and operation examples described in this pub li ca tion are

given for reference only and Sanken and Allegro assume no re spon si bil i ty for any in fringe ment of in dus tri al property rights, intellectual property

rights, or any other rights of Sanken or Allegro or any third party that may result from its use.

Anti radioactive ray design is not considered for the products listed herein.

This datasheet is based on Sanken datasheet T01-003JA-081027

Allegro MicroSystems, Inc.

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Audio Amplification T ransistor

2SA2223

Asia-Pacific

China

Sanken Electric Hong Kong Co., Ltd.

Suite 1026, Ocean Centre

Canton Road, Tsimshatsui

Kowloon, Hong Kong

Tel: 852-2735-5262, Fax: 852-2735-5494

Sanken Electric (Shanghai) Co., Ltd.

Room 3202, Maxdo Centre

Xingyi Road 8, Changning District

Shanghai, China

Tel: 86-21-5208-1177, Fax: 86-21-5208-1757

Taiwan Sanken Electric Co., Ltd.

Room 1801, 18th Floor

88 Jung Shiau East Road, Sec. 2

Taipei 100, Taiwan R.O.C.

Tel: 886-2-2356-8161, Fax: 886-2-2356-8261

Japan

Sanken Electric Co., Ltd.

Overseas Sales Headquarters

Metropolitan Plaza Building

1-11-1 Nishi-Ikebukuro, Toshima-ku

Tokyo 171-0021, Japan

Tel: 81-3-3986-6164, Fax: 81-3-3986-8637

Korea

Sanken Electric Korea Co., Ltd.

Samsung Life Yeouido Building 16F

23-10, Yeouido-Dong, Yeongdeungpo-gu

Seoul 150-734, Korea

Tel: 82-2-714-3700, Fax: 82-2-3272-2145

Singapore

Sanken Electric Singapore Pte. Ltd.

150 Beach Road, #14-03 The Gateway West

Singapore 189720

Tel: 65-6291-4755, Fax: 65-6297-1744

Europe

Sanken Power Systems (UK) Limited

Pencoed Technology Park

Pencoed, Bridgend CF35 5HY, United Kingdom

Tel: 44-1656-869-100, Fax: 44-1656-869-162

North America

United States

Allegro MicroSystems, Inc.

115 Northeast Cutoff

Worcester, Massachusetts 01606, U.S.A.

Tel: 1-508-853-5000, Fax: 1-508-853-7895

Allegro MicroSystems, Inc.

14 Hughes Street, Suite B105

Irvine, California 92618, U.S.A.

Tel: 1-949-460-2003, Fax: 1-949-460-7837

Worldwide Contacts

Allegro MicroSystems, Inc.

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com