MA4FCP200 - M/A-COM Technology Solutions, Inc.

MA4FCP200

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Flip Chip PIN Diode Rev. V3

Features

♦ Low Series Resistance

♦ Low Capacitance

♦ Fast Switching Speed

♦ Silicon Nitride Passivation

♦ Polymer Scratch Protection

♦ RoHS Compliant

Description

M/A-COM Technology Solutions MA4FCP200 is a

silicon flip chip PIN diode fabricated using a patented

HMIC process which provides for repeatable electrical

characteristics. This diode is fabricated on epitaxial

wafers using a process designed for extremely low

parasitics. The diode is fully passivated with silicon

nitride to minimize leakage current. The chip also has

an additional polymer layer for impact and scratch

protection to prevent damage to the active area

during handling.

Applications

The small outline and low 0.05pS RC product, make

the device useful in multi-throw switches and switched

phase shifter circuits requiring <20nS switching

speeds at operating frequencies up to 18GHz.

Absolute Maximum Ratings1

TAMB = +25°C (unless otherwise specified)

1. Exceeding any of these limits may cause permanent

damage to the chip.

• Backside metal contacts: 0.1μM thick gold.

• Yellow hatched areas indicate backside, mounting,

ohmic, gold contacts.

Parameter Absolute Maximum

Forward Current 100mA

Reverse Voltage - 70V

Operating Temperature - 55°C to + 125°C

Storage Temperature - 55°C to + 150°C

Dissipated Power

RF plus DC 100mW

Mounting Temperature +300°C for 10 seconds

1264 Outline

Dim.

Inches Millimeters

Min. Max. Min. Max.

A 0.014 0.015 0.356 0.381

B 0.008 0.009 0.203 0.229

C 0.004 0.005 0.102 0.127

D 0.003 0.004 0.076 0.102

E 0.002 0.003 0.175 0.225

F 0.008 0.010 0.203 0.254

G 0.004 0.006 0.102 0.152

MA4FCP200

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Flip Chip PIN Diode Rev. V3

Electrical Specifications @ TAMB +25°C

1. Total capacitance is equivalent to the sum of junction capacitance, Cj, plus the die parasitic capacitance, Cp.

2. The series resistance, RS, is equal to the total diode resistance which also includes the resistance of the

junction, Rj.

3. Rs and Cp measured on an HP4291A with die mounted in an ODS-186 package.

4. Steady-state Thermal Resistance measured with die mounted in an ODS-186 package.

ESD

These devices very susceptible to ESD and are rated Class 0 (0-199V) per HBM MIL-STD-883, method 3015.7

[C = 100pF ±10%, R = 1.5kW ±1%]. Even though die survived ESD testing to 100V , they should be handled in a

static free environment.

Parameters @ Conditions Symbol Units Min. Typ. Max.

Total Capacitance @ -40V, 1MHz1 CT pF —— 0.025 0.030

Total Capacitance @ -40V, 1GHz1,3 CT pF —— 0.020 ——

Series Resistance @ +50mA2,3, 100MHz RS Ω —— 2.4 3.0

Series Resistance @ +50mA2,3, 1GHz RS Ω —— 2.8 ——

Forward Voltage @ +100mA VF V —— 1.25 1.5

Reverse Voltage @ -10μA VR V 70 —— ——

Reverse Current @ -70V IR μA —— —— 10

Lifetime @ IF = +10mA / IREV = -6mA TL nS —— 100 ——

Steady State Thermal Resistance4 θ °C/W —— 900 ——

186

MA4FCP200

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Flip Chip PIN Diode Rev. V3

MA4FCP200 Rs vs I

1.0

10.0

100.0

1000.0

0.01 0.10 1.00 10.00 100.00

I ( mA )

Rs ( Ohms )

Rs_50 MHz

Rs_100 MHz

Rs_500 MHz

Typical Performance @ TAMB +25°C

0 200 400 600 800 1000

F ( MHz )

Rs ( Ohms )

10mA

50mA

100mA

MA4FCP200 Rs vs Frequency

MA4FCP200

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Flip Chip PIN Diode Rev. V3

Typical Performance @ TAMB +25°C

MA4FCP200

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Flip Chip PIN Diode Rev. V3

MA4FCP200 SPICE Model

PinDiodeModel

NLPINM1

Ffe= 1.0

Af=1.0

Kf=0.0

Imax= 1.0 E+5 A/m^2

Fc= 0.5

M= 0.5

Vj= 0.7 V

Cj0= 0.03 pF

Rs(I)= Rc + Rj(I) = 0.05 Ohm + Rj(I)

Tau= 0.10 usec

Cjmin= 0.02 pF

Rr= 10 K Ohms

Wi= 5.0 um

Un= 900 cm^2/V-sec

Vi=0.0 V

Is=1.0E-14 A

wPmax= 100 mW

wBv= 70 V

_ +

Ls = 0.6nH

MA4FCP200

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Flip Chip PIN Diode Rev. V3

Handling Procedures

All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin

oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.

Bulk handling should insure that abrasion and mechanical shock are minimized.

Bonding Techniques

These devices were designed for insertion onto hard or soft substrates with the junction (pad) side down. They

can be mounted with electrically conductive epoxy or with a eutectic solder preform. However, tin rich solders

will scavenge gold from the bottom contacts and are not recommended. Indalloy or 80/20, Au/Sn, solders

are acceptable. Maximum soldering temperature must be <300°C for <10 sec. These chips are designed to

be inserted onto hard or soft substrates with the junction side down. They should be mounted onto silk-

screened circuits using electrically conductive Ag epoxy, approximately 1-2 mils in thickness and cured at

approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times, >30 minutes,

temperatures must be kept below 200°C. The die can also be assembled using non conductive epoxy with the

junction side up, and wire or ribbon bonds made to the pads.

Circuit Mounting Dimensions ( Inches )

Ordering Information

0.012” (2) PL

0.008”

(2) PL

0.013”

Part Number Packaging

MA4FCP200 Die in Gel Pack

MA4FCP200-W Wafer Cut on Tape