TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803
Website: http: //www.microsemi.com
RADIATION HARDENED
NPN SILICON SWITCHING TRANSISTOR
Qualified per MIL-PRF-19500/255
T4-LDS-0042 Rev. 3 (100247) Page 1 of 7
DEVICES LEVELS
2N2221A 2N2222A
JANSM – 3K Rads (Si)
2N2221AL 2N2222AL
JANSD – 10K Rads (Si)
2N2221AUA 2N2222AUA JANSP – 30K Rads (Si)
2N2221AUB 2N2222AUB JANSL – 50K Rads (Si)
2N2221AUBC 2N2222AUBC JANSR – 100K Rads (Si)
JANSF – 300K Rads (Si)
JANSG – 500K Rads (Si)
JANSH – 1MEG Rads (Si)
ABSOLUTE MAXIMUM RATI NG S (T C = +25°C unless otherwise noted)
Parameters / Test Conditions Symbol Value Unit
Collector-Emitter Voltage VCEO 50 Vdc
Collector-Base Voltage VCBO 75 Vdc
Emitter-Base Voltage VEBO 6.0 Vdc
Collector Current IC 800 mAdc
Total Power Dissipation @ TA = +25°C
2N2221A, L
2N2221AUA
2N2221AUB, UBC
2N2222A, L
2N2222AUA
2N2222AUB, UBC
PT 0.5
0.65
0.50
W
Operating & Storage Junction Temperature Range Top, Tstg -65 to +200 °C
THERMAL CHARACTERISTICS
Parameters / Test Conditions Symbol Max. Unit
Thermal Resistance, Junction-to-Ambient
2N2221A, L
2N2221AUA
2N2221AUB, UBC
2N2222A, L
2N2222AUA
2N2222AUB, UBC
RθJA 325
210
325
°C/W
1. Derate linearly 3.08 mW/°C above TA > +37.5°C
2. Derate linearly 4.76 mW/°C above TA > +63.5°C
TO-18 (TO-206AA)
2N2221A, 2N2222A
4 PIN
2N2221AUA, 2N2222AUA
3 PIN
2N2221AUB, 2N2222AUB
2N2221AUBC, 2N2222AUBC
(UBC = Ceramic Lid Version)
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0042 Rev. 3 (100247) Page 2 of 7
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted)
Parameters / Test Conditions Symbol Min. Max. Unit
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage
IC = 10mAdc V(BR)CEO 50 Vdc
Collector-Base Cutoff Current
VCB = 75Vdc
VCB = 60Vdc ICBO 10
10
μAdc
ηAdc
Emitter-Base Cutoff Current
VEB = 6.0Vdc
VEB = 4.0Vdc IEBO 10
10 μAdc
ηAdc
Collector-Emitter Cutoff Current
VCE = 50Vdc ICES 50 ηAdc
ON CHARACTERISTICS (3)
Forward-Current Transfer Ratio
IC = 0.1mAdc, VCE = 10Vdc 2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC 30
50
IC = 1.0mAdc, VCE = 10Vdc 2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC 35
75 150
325
IC = 10mAdc, VCE = 10Vdc 2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC 40
100
IC = 150mAdc, VCE = 10Vdc 2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC 40
100 120
300
IC = 500mAdc, VCE = 10Vdc 2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC
hFE
20
30
Collector-Emitter Saturation Voltage
IC = 150mAdc, IB = 15mAdc
IC = 500mAdc, IB = 50mAdc VCE(sat) 0.3
1.0 Vdc
Base-Emitter Voltage
IC = 150mAdc, IB = 15mAdc
IC = 500mAdc, IB = 50mAdc VBE(sat) 0.6
1.2
2.0 Vdc
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0042 Rev. 3 (100247) Page 3 of 7
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions Symbol Min. Max. Unit
Small-Signal Short-Circuit Forward Current Transfer Ratio
IC = 1.0mAdc, VCE = 10Vdc, f = 1.0kHz 2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC hfe 30
50
Magnitude of Small–Signal Short-Circuit
Forward Current Transfer Ratio
IC = 20mAdc, VCE = 20Vdc, f = 100MHz |hfe| 2.5
Output Capacitance
VCB = 10Vdc, IE = 0, 100kHz ≤ f ≤ 1.0MHz Cobo 8.0 pF
Input Capacitance
VEB = 0.5Vdc, IC = 0, 100kHz ≤ f ≤ 1.0MHz Cibo 25 pF
SWITCHING CHARACTERISTICS
Parameters / Test Conditions Sy mbol Min. Max. Unit
Turn-On Time
See figure 8 of MIL-PRF-19500/255 t
on 35
ηs
Turn-Off Time
See Figure 9 of MIL-PRF-19500/255
toff 300
ηs
(3) Pulse Test: Pulse Width = 300μs, Duty Cycle ≤ 2.0%.
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0042 Rev. 3 (100247) Page 4 of 7
PACKAGE DIMENSIONS
NOTES: Dimensions
1. Dimensions are in inches. Symbol Inches Millimeters Note
2. Millimeters are given for general information only. Min Max Min Max
3. Beyond r (radius) maximum, TL shall be held for a minimum length CD .178 .195 4.52 4.95
of .011 inch (0.28 mm). CH .170 .210 4.32 5.33
4. Dimension TL measured from ma ximum HD. HD .209 .230 5.31 5.84
5. Body contour optional within zone defined by HD, CD, and Q. LC .100 TP 2.54 TP 6
6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) LD .016 .021 0.41 0.53 7,8
below seating plane shall be within .007 inch (0.18 mm) radius of LL .500 .750 12.70 19.05 7,8,13
true position (TP) at maximum material condition (MMC) relative to LU .016 .019 0.41 0.48 7,8
tab at MMC. L1 .050 1.27 7,8
7. Dimension LU applies between L1 and L2. Dimension LD applies L2 .250 6.35 7,8
between L2 and LL minimum. Diameter is uncontrolled in L1 and P .100 2.54
beyond LL minimum. Q .030 0.76 5
8. All three leads. TL .028 .048 0.71 1.22 3,4
9. The collector shall be internally connected to the case. TW .036 .046 0.91 1.17 3
10. Dimension r (radius) applies to both inside corners of tab. r .010 0.25 10
11. In accordance with ASME Y14.5M, diameters are equivalent to φx α 45° TP 45° TP 6
symbology. 1, 2, 9, 11, 12, 13
12. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
13. For L suffix devices, dimension LL = 1.5 inches (38.10 mm) min.
and 1.75 inches (44.45 mm) max.
FIGURE 1. Physical dimensions (similar to TO-18).
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0042 Rev. 3 (100247) Page 5 of 7
NOTES: Dimensions
1. Dimensions are in inches. Symbol Inches Millimeters
Note
2. Millimeters are given for general information only. Min Max Min Max
3. Dimension CH controls the overall package thickness. When a BL .215 .225 5.46 5.71
window lid is used, dimension CH must increase by a minimum of BL2 .225 5.71
.010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm). BW .145 .155 3.68 3.93
4. The corner shape (square, notch, radius) may vary at the BW2 .155 3.93
manufacturer's option, from that shown on the drawing. CH .061 .075 1.55 1.90 3
5. Dimensions LW2 minimum and L3 minimum and the appropriate L3 .003 .007 0.08 0.18 5
castellation length define an unobstructed three-dimensional space LH .029 .042 0.74 1.07
traversing all of the ceramic layers in which a castellation was LL1 .032 .048 0.81 1.22
designed. (Castellations are required on the bottom two layers, LL2 .072 .088 1.83 2.23
optional on the top ceramic layer.) Dimension LW2 maximum and LS .045 .055 1.14 1.39
L3 maximum define the maximum width and depth of the LW .022 .028 0.56 0.71
castellation at any point on its surface. Measurement of these LW2 .006 .022 0.15 0.56 5
dimensions may be made prior to solder dipping.
6. The co-planarity deviation of all terminal contact points, as defined
by the device seating plane, shall not exceed .006 inch (0.15mm) for Pin no. 1 2 3 4
solder dipped leadless chip carriers. Transistor Collector Emitter Base N/C
7. In accordance with ASME Y14.5M, diameters are equivalent to φx
symbology.
FIGURE 2. Physical dimensions, surface mount (UA version).
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0042 Rev. 3 (100247) Page 6 of 7
Dimensions Dimensions
Symbol Inches Millimeters Note Symbol Inches Millimeters
Note
Min Max Min Max Min Max Min Max
BH .046 .056 1.17 1.42 LS1 .036 .040 0.91 1.02
BL .115 .128 2.92 3.25 LS2 .071 .079 1.81 2.01
BW .085 .108 2.16 2.74 LW .016 .024 0.41 0.61
CL .128 3.25
r .008 .203
CW .108 2.74
r1 .012 .305
LL1 .022 .038 0.56 0.96 r2 .022 .559
LL2 .017 .035 0.43 0.89
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Hatched areas on package denote metalized areas.
4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid.
5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
FIGURE 3. Physical dimensions, surface mount (UB version)
UB
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0042 Rev. 3 (100247) Page 7 of 7
Dimensions Dimensions
Symbol Inches Millimeters Note Symbol Inches Millimeters
Note
Min Max Min Max Min Max Min Max
BH .046 .071 1.17 1.80 LS1 .036 .040 0.91 1.02
BL .115 .128 2.92 3.25 LS2 .071 .079 1.81 2.01
BW .085 .108 2.16 2.74 LW .016 .024 0.41 0.61
CL .128 3.25
r .008 .203
CW .108 2.74
r1 .012 .305
LL1 .022 .038 0.56 0.96 r2 .022 .559
LL2 .017 .035 0.43 0.89
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Hatched areas on package denote metalized areas.
4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Connected to the lid braze ring.
5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
FIGURE 4. Physical dimensions, surface mount (UBC version, ceramic lid)
UBC
