Feature and Applications UL E223037
• ROHS Compliant & Halogen Free
• Excellent for high density applications
• Surface Mount, 0805, 1206, 1210, 1812, 292 0
• Faster time to trip than standard SMD devices
• Lower resistance than standard SMD devices
• Operation Current: 0.05A ~ 3.0A
• Maximum Voltage: 6V ~ 60V
• Temperature Range: -40ºC to 85ºC
MPTS 0805 L 10
Meritek Series
Size
0805 1206 1210 1812 2920
Current rating
Polymeric PTC MPTS Series
Rev.7
Electrical Characteristics (23ºC)
MPTS0805
Max Time to Trip Resistance Hold
Current Trip
Current Rated
Voltage Max
Current Typical
Power Current Time RMIN R1MAX
Part
Number IH, A IT, A VMAX, Vdc IMAX, A Pd, W Amp Sec Ω Ω
MPTS0805L010 0.10 0.30 15 100 0.5 0.50 1.50 0.700 6.000
MPTS0805L020 0.20 0.50 9 100 0.5 8.00 0.02 0.400 3.500
MPTS0805L035 0.35 0.75 6 100 0.5 8.00 0.10 0.250 1.200
MPTS0805L050R 0.50 1.00 6 100 0.5 8.00 0.10 0.150 0.850
MPTS0805L075R 0.75 1.50 6 40 0.6 8.00 0.20 0.090 0.350
MPTS0805L100R 1.00 1.95 6 40 0.6 8.00 0.30 0.060 0.210
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withsta nd with out damage at it s rated current (I MAX)
I MAX= Maximum fault current device can withstand without dama ge at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
RMIN=Minimum device resistance at 23ºC prior to tripping.
R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad ch aracteristics
Termination pad materi als: Pure Tin
Product Dimensions (Millimeters)
MPTS0805
A B C D E
Part
Number Min Max Min Max Min Max Min Max Min Max
MPTS0805L010 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 0.10 0.45
MPTS0805L020 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 0.10 0.45
MPTS0805L035 2.00 2.30 1.20 1.50 0.45 0.75 0.20 0.60 0.10 0.45
MPTS0805L050R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45
MPTS0805L075R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45
MPTS0805L100R 2.00 2.30 1.20 1.50 0.75 1.80 0.20 0.60 0.10 0.45
Polymeric PTC MPTS Series
Rev.7
Thermal Derating Curve
Typical Time-To-Trip at 23ºC
Polymeric PTC MPTS Series
A =MPTS0805L010
B =MPTS0805L020
C =MPTS0805L035
D =MPTS0805L050R
E =MPTS0805L075R
F =MPTS0805L100R
A B C D E F
0.01
0.1
1
10
100
0.1 1 10
Fault curren t (A )
Time-to-trip (S)
Rev.7
The dimension in the table below provides the recommended pad layout for each MPTS0805 device
Profile Feature Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
Time (tL)
217 ℃
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
20-40 seconds
Ramp-Do wn Rate : 6 ℃/second max.
Time 25 ℃ to Peak Temperature : 8 minutes max.
Polymeric PTC MPTS Series
Pad dimensions (millimeters)
Device A
Nominal B
Nominal C
Nominal
All 0805 Series 1.20 1.00 1.50
Solder reflow
• Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This ma y cause damage to other
components.
• Recommended max solder paste
thickness > 0.25mm.
• Devices can be cleaned using standard
methods and aqueous solvent.
• Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
• Storage Environment : < 30ºC / 60%RH
Caution:
• If reflow temperatures exceed the
recommended profile, devices ma y not
meet the performance requirements.
• Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
Electrical Characteristics (23º)
MPTS1206
Max Time to Trip Resistance
Hold
Current Trip
Current Rated
Voltage Max
Current Typical
Power Current Time RMIN R1MAX
Part
Number IH, A IT, A V MAX, Vdc IMAX, A Pd, W Amp Sec Ω Ω
MPTS1206L005 0.05 0.15 60 10 0.4 0.25 1.50 3.60 50.00
MPTS1206L010 0.10 0.25 60 10 0.4 0.50 1.00 1.60 15.00
MPTS1206L012 0.12 0.39 48 10 0.6 1.00 0.20 1.40 6.50
MPTS1206L016 0.16 0.45 48 10 0.6 1.00 0.30 1.10 5.00
MPTS1206L020 0.20 0.40 30 10 0.4 8.00 0.10 0.600 2.500
MPTS1206L025 0.25 0.50 16 40 0.6 8.00 0.08 0.550 2.300
MPTS1206L035 0.35 0.75 16 40 0.4 8.00 0.10 0.300 1.200
MPTS1206L050 0.50 1.00 8 40 0.4 8.00 0.10 0.150 0.700
MPTS1206L050-24R 0.50 1.00 24 100 0.6 8.00 0.10 0.150 0.750
MPTS1206L075R 0.75 1.50 6 100 0.6 8.00 0.20 0.090 0.290
MPTS1206L075-16R 0.75 1.50 16 100 0.6 8.00 0.20 0.090 0.290
MPTS1206L100R 1.00 1.80 6 100 0.6 8.00 0.30 0.055 0.210
MPTS1206L110R 1.10 2.20 6 100 0.8 8.00 0.30 0.040 0.180
MPTS1206L150R 1.50 3.00 6 100 0.8 8.00 1.00 0.030 0.120
MPTS1206L200R 2.00 3.50 6 100 0.8 8.00 1.50 0.018 0.080
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withst and without damage at its rated current (I MAX)
I MAX= Maximum fault current device can withstand without dama ge at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
RMIN=Minimum device resistance at 23ºC prior to tripping.
R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
Polymeric PTC MPTS Series
Rev.7
Product Dimensions (Millimeters)
MPTS1206
A B C D E
Part
Number Min Max Min Max Min Max Min Max Min Max
MPTS1206L005 3.00 3.50 1.50 1.80 0.45 0.85 0.10 0.75 0.10 0.45
MPTS1206L010 3.00 3.50 1.50 1.80 0.45 0.85 0.10 0.75 0.10 0.45
MPTS1206L012 3.00 3.50 1.50 1.80 0.45 0.85 0.10 0.75 0.10 0.45
MPTS1206L016 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45
MPTS1206L020 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45
MPTS1206L025 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45
MPTS1206L035 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45
MPTS1206L050 3.00 3.50 1.50 1.80 0.25 0.55 0.10 0.75 0.10 0.45
MPTS1206L050-24R 3.00 3.50 1.50 1.80 0.90 1.30 0.25 0.75 0.10 0.45
MPTS1206L075R 3.00 3.50 1.50 1.80 0.45 1.25 0.25 0.75 0.10 0.45
MPTS1206L075-16R 3.00 3.50 1.50 1.80 0.45 1.25 0.25 0.75 0.10 0.45
MPTS1206L100R 3.00 3.50 1.50 1.80 0.45 1.00 0.25 0.75 0.10 0.45
MPTS1206L110R 3.00 3.50 1.50 1.80 0.45 1.00 0.25 0.75 0.10 0.45
MPTS1206L150R 3.00 3.50 1.50 1.80 0.80 1.40 0.25 0.75 0.10 0.45
MPTS1206L200R 3.00 3.50 1.50 1.80 0.85 1.60 0.25 0.75 0.10 0.45
MPTS Series
Polymeric PTC
Rev.7
Thermal Derating Curve
Typical Time-To-Trip at 23º
Polymeric PTC MPTS Series
Z= MPTS1206L005
A= MPTS1206L010
B= MPTS1206L012
C= MPTS1206L016
D= MPTS1206L020
E= MPTS1206L025
F= MPTS1206L035
G= MPTS1206L050
MPTS1206L050-24R
H= MPTS1206L075R
MPTS1206L075-16R
I= MPTS1206L100R
J= MPTS1206L110R
K= MPTS1206L150R
L= MPTS1206L200R
A B C D E F G H I J K L
0.01
0.1
1
10
100
0.1 1 10 100
Fault current (A)
Time-to-trip (S)
Rev.7
The dimension in the table below provides the recommended pad layout for each MPTS1206 device
Profile Feature Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
Time (tL)
217 ℃
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
20-40 seconds
Ramp-Do wn Rate : 6 ℃/second max.
Time 25 ℃ to Peak Temperature : 8 minutes max.
Polymeric PTC MPTS Series
Pad dimensions (millimeters)
Device A
Nominal B
Nominal C
Nominal
All 1206 Series 2.00 1.00 1.90
Solder reflow
• Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This ma y cause damage to other
components.
• Recommended max solder paste
thickness > 0.25mm.
• Devices can be cleaned using standard
methods and aqueous solvent.
• Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
• Storage Environment : < 30ºC / 60%RH
Caution:
• If reflow temperatures exceed the
recommended profile, devices ma y not
meet the performance requirements.
• Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
Electrical Characteristics (23º)
MPTS1210
Max Time to Trip Resistance
Hold
Current Trip
Current Rated
Voltage Max
Current Typical
Power Current Time RMIN R1MAX
Part
Number IH, A IT, A VMAX, Vdc IMAX, A Pd, W Amp Sec Ω Ω
MPTS1210L005 0.05 0.15 60 10 0.60 0.25 3.00 3.600 50.000
MPTS1210L010 0.10 0.25 60 10 0.60 0.50 1.50 1.600 15.000
MPTS1210L020 0.20 0.40 30 10 0.60 8.00 0.02 0.800 5.000
MPTS1210L035 0.35 0.70 16 40 0.60 8.00 0.20 0.320 1.300
MPTS1210L050 0.50 1.00 16 40 0.60 8.00 0.10 0.250 0.900
MPTS1210L075 0.75 1.50 8 40 0.60 8.00 0.10 0.130 0.400
MPTS1210L110R 1.10 2.20 6 100 0.80 8.00 0.30 0.060 0.210
MPTS1210L150R 1.50 3.00 6 100 0.80 8.00 0.50 0.040 0.110
MPTS1210L175R 1.75 4.00 6 100 0.80 8.00 0.60 0.020 0.080
MPTS1210L200R 2.00 4.00 6 100 0.80 8.00 1.00 0.015 0.070
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withst and without damage at its rated current (I MAX)
I MAX= Maximum fault current device can withstand without dama ge at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
RMIN=Minimum device resistance at 23ºC prior to tripping.
R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
MPTS Series
Polymeric PTC
Rev.7
Product Dimensions (Millimeters)
MPTS1210
A B C D E
Part
Number Min Max Min Max Min Max Min Max Min Max
MPTS1210L005 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 0.10 0.45
MPTS1210L010 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 0.10 0.45
MPTS1210L020 3.00 3.43 2.35 2.80 0.40 0.85 0.25 0.75 0.10 0.45
MPTS1210L035 3.00 3.43 2.35 2.80 0.40 0.80 0.25 0.75 0.10 0.45
MPTS1210L050 3.00 3.43 2.35 2.80 0.30 0.75 0.25 0.75 0.10 0.45
MPTS1210L075 3.00 3.43 2.35 2.80 0.30 0.70 0.25 0.75 0.10 0.45
MPTS1210L110R 3.00 3.43 2.35 2.80 0.60 1.00 0.25 0.75 0.10 0.45
MPTS1210L150R 3.00 3.43 2.35 2.80 0.50 0.90 0.25 0.75 0.10 0.45
MPTS1210L175R 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45
MPTS1210L200R 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45
Polymeric PTC MPTS Series
Rev.7
Thermal Derating Curve
Typical Time-To-Trip at 23ºC
MPTS Series
Polymeric PTC
A =MPTS1210L005
B =MPTS1210L010
C =MPTS1210L020
D =MPTS1210L035
E =MPTS1210L050
F =MPTS1210L075
G =MPTS1210L110R
H =MPTS1210L150R
I= MPTS1210L175R
J =MPTS1210L200R
B C D E F G H I J
0.001
0.01
0.1
1
10
100
0.1 1 10 100
Fau lt current (A)
Time-to-trip (S)
Rev.7
The dimension in the table below provides the recommended pad layout for each MPTS1210 device
Profile Feature Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
Time (tL)
217 ℃
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
20-40 seconds
Ramp-Do wn Rate : 6 ℃/second max.
Time 25 ℃ to Peak Temperature : 8 minutes max.
Polymeric PTC MPTS Series
Pad dimensions (millimeters)
Device A
Nominal B
Nominal C
Nominal
All 1210 Series 2.00 1.00 2.80
Solder reflow
• Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This ma y cause damage to other
components.
• Recommended max solder paste
thickness > 0.25mm.
• Devices can be cleaned using standard
methods and aqueous solvent.
• Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
• Storage Environment : < 30ºC / 60%RH
Caution:
• If reflow temperatures exceed the
recommended profile, devices ma y not
meet the performance requirements.
• Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
Electrical Characteristics (23º)
MPTS1812
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withst and without damage at its rated current (I MAX)
I MAX= Maximum fault current device can withstand without dama ge at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
RMIN=Minimum device resistance at 23ºC prior to tripping.
R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
Max Time to Trip Resistance
Hold
Current Trip
Current Rated
Voltage Max
Current Typical
Power Current Time RMIN R1MAX
Part
Number IH, A IT, A VMAX, Vdc IMAX, A Pd, W Amp Sec Ω Ω
MPTS1812L010 0.10 0.30 60 10 0.8 8.0 0.020 1.600 15.00
MPTS1812L014 0.14 0.30 60 10 0.8 8.0 0.008 1.200 6.500
MPTS1812L020 0.20 0.40 30 10 0.8 8.0 0.020 0.800 5.000
MPTS1812L035 0.35 0.70 16 40 0.8 8.0 0.100 0.320 1.500
MPTS1812L050 0.50 1.00 16 40 0.8 8.0 0.150 0.150 1.000
MPTS1812L075 0.75 1.50 16 40 0.8 8.0 0.200 0.110 0.450
MPTS1812L075-24R 0.75 1.50 24 40 1.0 8.0 0.200 0.110 0.290
MPTS1812L075-33R 0.75 1.50 33 40 1.0 8.0 0.200 0.110 0.400
MPTS1812L110 1.10 2.20 8 100 0.8 8.0 0.300 0.040 0.210
MPTS1812L110-16 1.10 2.20 16 100 0.8 8.0 0.500 0.040 0.180
MPTS1812L110-24R 1.10 2.20 24 100 1.0 8.0 0.500 0.060 0.200
MPTS1812L125 1.25 2.50 6 40 0.8 8.0 0.400 0.050 0.140
MPTS1812L150 1.50 3.00 8 100 0.8 8.0 0.500 0.040 0.110
MPTS1812L150-12R 1.50 3.00 12 100 1.0 8.0 0.500 0.040 0.110
MPTS1812L150-24R 1.50 3.00 24 100 1.0 8.0 1.500 0.040 0.120
MPTS1812L160 1.60 3.20 8 100 0.8 8.0 0.500 0.030 0.100
MPTS1812L160-12R 1.60 3.20 12 100 1.0 8.0 1.000 0.030 0.100
MPTS1812L160-16R 1.60 3.20 16 100 1.0 8.0 1.000 0.030 0.100
MPTS1812L200R 2.00 3.50 8 100 1.0 8.0 2.000 0.020 0.070
MPTS1812L260R 2.60 5.00 6 100 1.0 8.0 2.500 0.015 0.047
MPTS1812L260-13R 2.60 5.00 13.2 100 1.3 8.0 5.000 0.015 0.050
MPTS1812L260-16R 2.60 5.00 16 100 1.3 8.0 5.000 0.015 0.050
MPTS1812L300R 3.00 5.00 6 100 1.0 8.0 4.000 0.012 0.040
MPTS Series
Polymeric PTC
Rev.7
Product Dimensions (Millimeters)
MPTS1812
A B C D E
Part
Number Min Max Min Max Min Max Min Max Min Max
MPTS1812L010 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65
MPTS1812L014 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65
MPTS1812L020 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65
MPTS1812L035 4.37 4.73 3.07 3.41 0.40 0.70 0.30 0.95 0.25 0.65
MPTS1812L050 4.37 4.73 3.07 3.41 0.35 0.65 0.30 0.95 0.25 0.65
MPTS1812L075 4.37 4.73 3.07 3.41 0.35 0.65 0.30 0.95 0.25 0.65
MPTS1812L075-24R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65
MPTS1812L075-33R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65
MPTS1812L110 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65
MPTS1812L110-16 4.37 4.73 3.07 3.41 0.25 0.90 0.30 0.95 0.25 0.65
MPTS1812L110-24R 4.37 4.73 3.07 3.41 0.80 1.30 0.25 0.95 0.25 0.65
MPTS1812L125 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65
MPTS1812L150 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65
MPTS1812L150-12R 4.37 4.73 3.07 3.41 0.60 1.10 0.25 0.95 0.25 0.65
MPTS1812L150-24R 4.37 4.73 3.07 3.41 0.60 1.55 0.25 0.95 0.25 0.65
MPTS1812L160 4.37 4.73 3.07 3.41 0.25 0.90 0.30 0.95 0.25 0.65
MPTS1812L160-12R 4.37 4.73 3.07 3.41 0.60 1.35 0.25 0.95 0.25 0.65
MPTS1812L160-16R 4.37 4.73 3.07 3.41 0.60 1.35 0.25 0.95 0.25 0.65
MPTS1812L200R 4.37 4.73 3.07 3.41 0.55 1.20 0.25 0.95 0.25 0.65
MPTS1812L260R 4.37 4.73 3.07 3.41 0.55 1.20 0.25 0.95 0.25 0.65
MPTS1812L260-13R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65
MPTS1812L260-16R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65
MPTS1812L300R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65
MPTS Series
Polymeric PTC
Rev.7
Thermal Derating Curve
Typical Time-To-Trip at 23ºC
Polymeric PTC MPTS Series
A = MPTS181 2L010
B = MPTS1812L014
C = MPTS1812L020
D = MPTS1812L035
E = MPTS1812L050
F = MPTS1812L075
MPTS1812L075-24R
MPTS1812L075-33R
G = MPTS1812L110
MPTS1812L110-16
MPTS1812L110-24R
H = MPTS1812L125
I = MPTS1812L150
MPTS1812L150-12R
MPTS1812L150-24R
J = MPTS1812L160
MPTS1812L160-12R
MPTS1812L160-16R
K = MPTS1812L200R
L = MPTS1812L260R
MPTS1812L260-13R
MPTS1812L260-16R
M = MPTS1812L300R
0.001
0.01
0.1
1
10
100
0.1 1 10 100
Faul t cur re nt (A )
Time-to-trip (S)
A B C D E F GHI J KL M
Rev.7
The dimension in the table below provides the recommended pad layout for each MPTS1812 device
Profile Feature Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
Time (tL)
217 ℃
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
20-40 seconds
Ramp-Do wn Rate : 6 ℃/second max.
Time 25 ℃ to Peak Temperature : 8 minutes max.
Polymeric PTC MPTS Series
Pad dimensions (millimeters)
Device A
Nominal B
Nominal C
Nominal
All 1812 Series 3.45 1.78 3.50
Solder reflow
• Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This ma y cause damage to other
components.
• Recommended max solder paste
thickness > 0.25mm.
• Devices can be cleaned using standard
methods and aqueous solvent.
• Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
• Storage Environment : < 30ºC / 60%RH
Caution:
• If reflow temperatures exceed the
recommended profile, devices ma y not
meet the performance requirements.
• Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
Electrical Characteristics (23ºC)
MPTS2920
Max Time to Trip Resistance
Hold
Current Trip
Current Rated
Voltage Max
Current Typical
Power Current Time RMIN R1MAX
Part
Number IH, A IT, A VMAX,Vdc IMAX, A Pd, W A Sec Ω Ω
MPTS2920L030 0.30 0.60 60 10 1.5 1.5 3.0 1.000 4.800
MPTS2920L050 0.50 1.00 60 10 1.5 2.5 4.0 0.300 1.400
MPTS2920L075 0.75 1.50 33 40 1.5 8.0 0.3 0.180 1.000
MPTS2920L100 1.10 2.20 33 40 1.5
8.0 0.5 0.090 0.410
MPTS2920L125 1.25 2.50 33 40 1.5 8.0 2.0 0.050 0.250
MPTS2920L150 1.50 3.00 33 40 1.5 8.0 2.0 0.050 0.230
MPTS2920L185 1.85 3.70 33 40 1.5 8.0 2.5 0.040 0.150
MPTS2920L200 2.00 4.00 16 40 1.5
8.0 4.5 0.035 0.120
MPTS2920L250 2.50 5.00 16 40 1.5 8.0 16.0 0.025 0.085
MPTS2920L260 2.60 5.20 6 40 1.5 8.0 20.0 0.020 0.075
MPTS2920L300 3.00 5.20 6 40 1.5 8.0 25.0 0.010 0.048
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withst and without damage at its rated current (I MAX)
I MAX= Maximum fault current device can withstand without dama ge at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
RMIN=Minimum device resistance at 23ºC prior to tripping.
R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
MPTS Series
Polymeric PTC
Rev.7
Product Dimensions (Millimeters)
MPTS2920
A B C D E
Part
Number Min Max Min Max Min Max Min Max Min Max
MPTS2920L030 6.73 7.98 4.80 5.44 0.60 1.15 0.50 1.20 0.50 0.90
MPTS2920L050 6.73 7.98 4.80 5.44 0.60 1.15 0.50 1.20 0.50 0.90
MPTS2920L075 6.73 7.98 4.80 5.44 0.40 1.15 0.50 1.20 0.50 0.90
MPTS2920L100 6.73 7.98 4.80 5.44 0.40 1.00 0.50 1.20 0.50 0.90
MPTS2920L125 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90
MPTS2920L150 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90
MPTS2920L185 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90
MPTS2920L200 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90
MPTS2920L250 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90
MPTS2920L260 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90
MPTS2920L300 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90
Polymeric PTC MPTS Series
Rev.7
Thermal Derating Curve
Typical Time-To-Trip at 23ºC
Polymeric PTC MPTS Series
A = MPTS2920L03 0
B = MPTS2920L050
C = MPTS2920L075
D = MPTS2920L100
E = MPTS2920L125
F = MPTS2920L150
G = MPTS2920L185
H = MPTS2920L200
I = MPTS2920L250
J = MPTS2920L260
K= MPTS2920L300
A
B C D E FGHIJK
0.001
0.01
0.1
1
10
100
0.1 1 10 100
Fa u lt c urrent (A)
Ti me-to-trip (S)
Rev.7
The dimension in the table below provides the recommended pad layout for each MPTS2920 device
Profile Feature Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
Time (tL)
217 ℃
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
20-40 seconds
Ramp-Do wn Rate : 6 ℃/second max.
Time 25 ℃ to Peak Temperature : 8 minutes max.
Polymeric PTC MPTS Series
Pad dimensions (millimeters)
Device A
Nominal B
Nominal C
Nominal
All 2920 Series 5.10 2.30 5.60
Solder reflow
• Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This ma y cause damage to other
components.
• Recommended max solder paste
thickness > 0.25mm.
• Devices can be cleaned using standard
methods and aqueous solvent.
• Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
• Storage Environment : < 30ºC / 60%RH
Caution:
• If reflow temperatures exceed the
recommended profile, devices ma y not
meet the performance requirements.
• Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
