MX555ABD100M000 Ultra-Low Jitter 100MHz HCSL XO ClockWorks(R) FUSION General Description Features The MX555ABD100M000 is an ultra-low phase jitter XO with HCSL output optimized for high line rate applications. * 100MHz HCSL * PCIe Gen1/Gen2/Gen3/Gen4* compliant * Typical phase noise: - 97fs (Integration range: 1.875MHz-20MHz) * 50ppm total frequency stability * -40C to +85C temperature range * Industry standard 6-Pin 5mm x 3.2mm LGA package Applications * PCI-Express Gen 1/2/3/4 * Storage *Internal test Absolute Maximum Ratings Operating Ratings Supply Voltage (VIN)..................................................+4.6V Lead Temperature (soldering, 10s)..............................260C Case Temperature........................................................115C Storage Temperature (T )............................-65C to +125C S ESD Machine Model.....................................................200V ESD Rating (HBM).........................................................2kV Supply Voltage (VIN).......................+2.375V to +3.63V Ambient Temperature (TA)....................-40C to +85C Junction Thermal Resistance LGA (T ) Still Air.....................................58C/W JA Electrical Characteristics VDD = 2.5V 5% or 3.3V 10%, -40C to +85C, outputs terminated with 50 Ohms to VSS. Symbol Parameter IDD Supply Current F0 Center Frequency Condition Min. Typ. Max. Units 95 mA 100 Frequency Stability Note 4 Oj Phase Noise Integration Range (12kHz to 20MHz) Integration Range (1.875MHz to 20MHz) Tstart Start-Up Time TR/TF Rise/Fall time 20%-80% Duty Cycle MHz 50 166 97 210 ppm fsRMS 10 ms 150 300 450 ps 48 50 52 % VOH Output High Voltage HCSL output levels 660 700 850 mV VOL Output Low Voltage HCSL output levels -150 0 27 mV VOVS Max Output Including Overshoot VOH + 0.3 V VUDS Min Output Including Undershoot VOL - 0.3 V VRB Ringback Voltage 0.2 V VOX Absolute Crossing Point 250 350 550 mV Vswing Peak to Peak Output Voltage Swing 640 700 950 mV Notes: 1. Exceeding the absolute maximum ratings may damage the device. 2. The device is not guaranteed to function outside its operating ratings. 3. Guaranteed after thermal equilibrium. 4. Inclusive of initial accuracy, temperature drift, aging, shock, vibration. ClockWorks is a registered trademark of Microchip Technology Inc. Microchip Technology Inc. November 29, 2018 MX555AB1-1510 http://www.microchip.com Revision 1.0 tcghelp@microchip.com Microchip Technology Inc. MX555ABD100M000 Ordering Information Ordering Part Number Marking Line 1 Marking Line 3 Shipping Package MX555ABD100M000 MX555A BD1000 Tube 6-Pin 5mm x 3.2mm LGA MX555ABD100M000-TR MX555A BD1000 Tape and Reel 6-Pin 5mm x 3.2mm LGA Devices are Green and RoHS compliant. Sample material may have only a partial top mark. Pin Configuration OE VDD DNC /Q GND Q Pin Description Pin Number Pin Name Pin Type Pin Level 1 OE I, SE LVCMOS 2 DNC 3 GND PWR 4, 5 Q, /Q O, Diff 6 VDD PWR Pin Function Output Enable, disables output to tri-state, 0 = Disabled, 1 = Enabled, 50k Ohms Pull-Up (Internal) Make no connection, leave floating. Power Supply Ground HCSL Clock Output Frequency = 100MHz Power Supply Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition E Mechanical Vibration MIL-STD-883, Method 2007, Condition C Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 November 29, 2018 MX555AB1-1510 2 Revision 1.0 tcghelp@microchip.com Microchip Technology Inc. MX555ABD100M000 Figure 1. HCSL Output 100MHz 1.875MHz-20MHz 97fs Figure 2. HCSL Output 100MHz 12kHz-20MHz 166fs November 29, 2018 MX555AB1-1510 3 Revision 1.0 tcghelp@microchip.com Microchip Technology Inc. MX555ABD100M000 Package Information and Recommended Land Pattern for 6-Pin LGA 6-Pin LGA (5x3.2mm) Note: 3. Package information is correct as of the publication date. For updates and most current information, go to www.microchip.com. Microchip Technology Inc. http://www.microchip.com Microchip makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This information is not intended as a warranty and Microchip does not assume responsibility for its use. Microchip reserves the right to change circuitry, specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Microchip's terms and conditions of sale for such products, Microchip assumes no liability whatsoever, and Microchip disclaims any express or implied warranty relating to the sale and/or use of Microchip products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. (c) 2018 Microchip Technology Inc. November 29, 2018 MX555AB1-1510 4 Revision 1.0 tcghelp@microchip.com