MX555ABD100M000
Ultra-Low Jitter 100MHz HCSL XO
ClockWorks® FUSION
General Description
The MX555ABD100M000 is an ultra-low phase jitter
XO with HCSL output optimized for high line rate
applications.
Applications
• PCI-Express Gen 1/2/3/4
• Storage
Features
• 100MHz HCSL
• PCIe Gen1/Gen2/Gen3/Gen4* compliant
*Internal test
• Typical phase noise:
- 97fs (Integration range: 1.875MHz-20MHz)
• ±50ppm total frequency stability
• -40°C to +85°C temperature range
• Industry standard 6-Pin 5mm x 3.2mm LGA
package
Absolute Maximum Ratings¹
Supply Voltage (VIN)..................................................+4.6V
Lead Temperature (soldering, 10s)..............................260°C
Case Temperature........................................................115°C
Storage Temperature (T )............................-65°C to +125°C
S
ESD Machine Model.....................................................200V
ESD Rating (HBM).........................................................2kV
Operating Ratings²
Supply Voltage (VIN).......................+2.375V to +3.63V
Ambient Temperature (TA)....................-40°C to +85°C
Junction Thermal Resistance
LGA (T ) Still Air.....................................58°C/W
JA
Electrical Characteristics
VDD = 2.5V ±5% or 3.3V ±10%, -40°C to +85°C, outputs terminated with 50 Ohms to VSS.³
Symbol Parameter Condition Min. Typ. Max. Units
IDD Supply Current 95 mA
F0 Center Frequency 100 MHz
Frequency Stability Note 4 ±50 ppm
Øj Phase Noise Integration Range (12kHz to 20MHz)
Integration Range (1.875MHz to 20MHz) 166
97 210 fsRMS
Tstart Start-Up Time 10 ms
TR/TF Rise/Fall time 20%-80% 150 300 450 ps
Duty Cycle 48 50 52 %
VOH Output High Voltage HCSL output levels 660 700 850 mV
VOL Output Low Voltage HCSL output levels -150 0 27 mV
VOVS Max Output Including Overshoot VOH + 0.3 V
VUDS Min Output Including Undershoot VOL - 0.3 V
VRB Ringback Voltage 0.2 V
VOX Absolute Crossing Point 250 350 550 mV
Vswing Peak to Peak Output Voltage Swing 640 700 950 mV
Notes:
1. Exceeding the absolute maximum ratings may damage the device.
2. The device is not guaranteed to function outside its operating ratings.
3. Guaranteed after thermal equilibrium.
4. Inclusive of initial accuracy, temperature drift, aging, shock, vibration.
ClockWorks is a registered trademark of Microchip Technology Inc.
Microchip Technology Inc. http://www.microchip.com
November 29, 2018 Revision 1.0
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Microchip Technology Inc. MX555ABD100M000
Ordering Information
Ordering Part Number Marking Line 1 Marking Line 3 Shipping Package
MX555ABD100M000 MX555A BD1000 Tube 6-Pin 5mm x 3.2mm LGA
MX555ABD100M000-TR MX555A BD1000 Tape and Reel 6-Pin 5mm x 3.2mm LGA
Devices are Green and RoHS compliant. Sample material may have only a partial top mark.
Pin Configuration
OE
DNC
GND
VDD
/Q
Q
Pin Description
Pin Number Pin Name Pin Type Pin Level Pin Function
1 OE I, SE LVCMOS Output Enable, disables output to tri-state,
0 = Disabled, 1 = Enabled, 50k Ohms Pull-Up (Internal)
2 DNC Make no connection, leave floating.
3 GND PWR Power Supply Ground
4, 5 Q, /Q O, Diff HCSL Clock Output Frequency = 100MHz
6 VDD PWR Power Supply
Environmental Specifications
Thermal Shock MIL-STD-883, Method 1011, Condition A
Moisture Resistance MIL-STD-883, Method 1004
Mechanical Shock MIL-STD-883, Method 2002, Condition E
Mechanical Vibration MIL-STD-883, Method 2007, Condition C
Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Hazardous Substance Pb-Free / RoHS / Green Compliant
Solderability JESD22-B102-D Method 2 (Preconditioning E)
Terminal Strength MIL-STD-883, Method 2004, Test Condition D
Gross Leak MIL-STD-883, Method 1014, Condition C
Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
Solvent Resistance MIL-STD-202, Method 215
November 29, 2018 2 Revision 1.0
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Microchip Technology Inc. MX555ABD100M000
Package Information and Recommended Land Pattern for 6-Pin LGA³
6-Pin LGA (5x3.2mm)
Note:
3. Package information is correct as of the publication date. For updates and most current information, go to www.microchip.com.
Microchip Technology Inc. http://www.microchip.com
Microchip makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This
information is not intended as a warranty and Microchip does not assume responsibility for its use. Microchip reserves the right to change circuitry,
specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in Microchip's terms and conditions of sale for such products, Microchip
assumes no liability whatsoever, and Microchip disclaims any express or implied warranty relating to the sale and/or use of Microchip products
including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right.
© 2018 Microchip Technology Inc.
November 29, 2018 4 Revision 1.0
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