STAC4932F1MR Datasheet 350 W 50 V HF/VHF DMOS in STAC moisture-resistant flangeless package Features 1 1 3 2 3 STAC780-4F Pin connection Pin Connection 1 Drain 2 Source (bottom side) 3 Gate Order code Frequency VDD POUT Gain Efficiency STAC4932F1MR 123 MHz 50 V 450 W 24 dB 60 % * Improved ruggedness V(BR)DSS > 200 V * * Load mismatch 65:1 all phases @ 350 W - 50 V - 123 MHz POUT = 450 W typ. with 24 dB gain at 123 MHz * * In compliance with the 2002/95/EC European directive Moisture resistant package specifically designed to operate in extreme environments Drying recommendation before soldering: - 48 hrs at 125 C Back finishing: - Sn96.5/Ag3/Cu0.5 solder - Base flatness < 0.2 mm - Gold content < 0.1% - Minimum solder thickness > 2 m * * Description The STAC4932F1MR is an N-channel MOS fieldeffect RF power transistor. It is intended for use in 50 V / 80 V ISM applications up to 250 MHz. The STAC4932F1MR benefits from the latest generation of environmentally designed packaging, ruggedized against cyclic high moisture operation and severe storage conditions. This device contains Beryllium oxide (BeO), which is hazardous if inhaled or ingested. Product status link STAC4932F1MR Product summary Order code STAC4932F1MR Marking STAC4932F1MR Package STAC780-4F Packing Box Base / Bulk qty 20 / 80 DS9904 - Rev 2 - April 2020 For further information contact your local STMicroelectronics sales office. www.st.com STAC4932F1MR Electrical data 1 Electrical data 1.1 Maximum ratings Table 1. Absolute maximum ratings (TCASE = 25 C) Symbol V(BR)DSS VDGR VGS TJ TSTG 1.2 Parameter Value Unit Drain source voltage 200 V Drain-gate voltage (RGS = 1 M) 200 V Gate-source voltage 20 V Maximum operating junction temperature 200 C -65 to +150 C Value Unit 0.28 C/W Storage temperature range Thermal data Table 2. Thermal data Symbol RthJC 1.3 Parameter Junction-case thermal resistance ESD protection characteristics Table 3. ESD protection Symbol HBM DS9904 - Rev 2 Test Methodology Human Body Model (per JESD22-A114) Class 1C page 2/16 STAC4932F1MR Electrical characteristics 2 Electrical characteristics TCASE = +25 C (unless otherwise specified) 2.1 Static Table 4. Static Symbol Test conditions Min. Typ. 200 240 Max. Unit Drain - source Breakdown voltage VGS = 0 V, IDS = 100 mA IDSS Zero gate voltage drain leakage current VGS = 0 V, VDS = 100 V IGSS Gate - source leakage current VGS = 20 V, VDS = 0 V VTH Gate - source threshold voltage VDS = 10 V, ID = 250 mA Drain - source on voltage VGS = 10 V, ID = 10 A GFS Forward transconductance VDS = 7 V, ID = 2.5 A CISS Input capacitance COSS Ouput capacitance CRSS Reverse transfer capacitance VTH Gate - source threshold voltage variation ID = 250 mA 0.2 V GFS Forward transconductance variation VDS = 7 V, ID = 2.5 A 0.6 S V(BR)DSS VDS(ON) 2.2 Parameter 2.0 V 1 mA 250 nA 4.0 V 3.6 V 3.0 VGS = 0 V, VDS = 50 V, f = 1 MHz S 580 pF 180 pF 10 pF Dynamic Table 5. Dynamic (1) Symbol POUT Parameter Test conditions Output power Min. Typ. Max. Unit 350 450 - W D Drain efficiency POUT =350 W 60 - % Gps Power gain POUT = 350 W 24 - dB 1. VDD = 50 V, IDQ = 2 x 250 mA, f = 123 MHz DS9904 - Rev 2 page 3/16 STAC4932F1MR Dynamic Table 6. GFS sorts DS9904 - Rev 2 Marking Minimum Maximum A 3.0 3.6 B 3.6 4.2 C 4.2 4.8 D 4.8 5.4 E 5.4 6.0 F 6.0 6.6 G 6.6 7.2 H 7.2 7.8 I 7.8 8.4 J 8.4 9.0 page 4/16 STAC4932F1MR SOA and thermal data 3 SOA and Thermal data Figure 1. Safe operating area 100 ) Max Drain Current - Id (A) on b ted imi y s( Rd nl tio era 10 1ms Op 10ms DC 1 Single Pulse Tcase = +25 C / Tj = +200C 0 1 10 100 1000 Drain supply voltage - Vdd (V) AM01107v1 Figure 2. Transient thermal impedance Single - Repetitive pulse Thermal Impedance Zth j-c (C/W) 0.30 AM06094v1 0.25 single pulse 0.20 0.1 0.2 0.15 0.3 0.4 0.5 0.10 0.6 0.7 0.8 0.05 0.9 0.00 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Rectangular power pulse width (s) DS9904 - Rev 2 page 5/16 STAC4932F1MR SOA and thermal data Figure 3. Transient thermal model R R7 R=0.0142593 Ohm C C8 C=0.0042078 F R R8 R=.0427778 Ohm C C7 C=0.0032727 F R R6 R=.1425926 Ohm C C6 C=0.0444624 F R R5 R=.0803704 Ohm C C5 C=0.2960046 F AM06106v1 DS9904 - Rev 2 page 6/16 STAC4932F1MR Product and environmental safety for toxic materials use 4 Product and environmental safety for toxic materials use This product contains beryllium oxide. The product is entirely safe provided that the BeO base is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never thrown out with general or domestic waste. DS9904 - Rev 2 page 7/16 STAC4932F1MR Recommended heat profile and reflow soldering 5 Recommended heat profile and reflow soldering Figure 4. Reflow profile chart tp Tp Critical Zone Ramp-up Temperature TL TL to Tp Tsmax TL Tsmin Ramp-down ts Preheat 25 IPC-020c-5-1 t 25C to Peak Time Note: tp = 20-40 s, ramp-up = 3 C/s max., tL = 60-150 s, ramp-down = 6 C/s max., TL = 217 C, TS max. = 200 C, TS min. = 150 C, ts = 60 - 180 s, from Tj = 25 C to peak = 8 minutes max., tp = see Table 7. Table 7. Pb-free process - package classification reflow temperatures (1) Package thickness < 1.6 mm 1.6 mm - 2.5 mm 2.5 mm Volume mm3 < 350 260 + 0 C 250 + 0 C Volume mm3 350-2000 Volume mm3 > 2000 260 + 0 C 260 + 0 C 250 + 0 C 240 + 0 C 245 + 0 C 1. Tolerance: the device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means peak reflow temperature + 0 C. For example 260 C + 0 C) at the rated MSL level. Note: The profiling tolerance is + 0 C, -X C (based on machine variation capability) whatever is required to control the profile process but at no time will it exceed - 5 C. The producer assures process compatibility at the peak reflow profile temperatures. Note: Package volume excludes external terminals (balls, bumps, lands, leads) and/or nonintegral heat sinks. Note: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. DS9904 - Rev 2 page 8/16 STAC4932F1MR Evaluation flow 5.1 Evaluation flow Figure 5. Evaluation flow Electrical test Visual + S.A.M. inspection Final external visual Final electr. test Bake 125 C + 5-0 C 24 h Reflow (see below) Moisture soak lev. 3 30 C/60% 192h Final S.A.M. inspection SMD1309131539 Note: The STAC4932F1MR can withstand 3 times reflow. 5.2 Manual leads soldering * * * DS9904 - Rev 2 10 sec max at temperature lower than 260 C 3 sec max at temperature lower than 350 C Use of ESD protected soldering iron (80 W) page 9/16 STAC4932F1MR Acceptable missing solder 5.3 Acceptable missing soldering Figure 6. STAC tinning limit Figure 7. Examples of acceptable missing solder DS9904 - Rev 2 page 10/16 STAC4932F1MR Package information 6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 6.1 STAC780-4F package information Figure 8. STAC780-4F package outline DM00481940-1 DS9904 - Rev 2 page 11/16 STAC4932F1MR STAC780-4F package information Table 8. STAC780-4F mechanical data Ref. DS9904 - Rev 2 Milimeters Min. Typ. Max. A 3.76 3.86 A1 5.03 5.13 B 4.57 5.08 C 9.65 9.91 D 20.17 20.37 E 20.45 20.70 F 0.11 0.17 G 0.97 1.14 H 1.52 1.70 I 3.18 4.32 J 9.52 9.78 q 1.37 r 1.52 s 0.51 CH1 2.03 page 12/16 STAC4932F1MR Marking information 6.2 Marking information LEGEND PACKAGE FACE TOP : Marking Composition Field A - MARKING AREA B - ADDITIONAL INFORMATION (MAX CHAR ALLOWED = 1) A C - STANDARD ST LOGO D - Assy Plant B C D E (PP) F E - FE Sequence (nnn) G H I F - Diffusion Traceability Plant J (WX) G - COUNTRY OF ORIGIN (MAX CHAR ALLOWED = 3) H - Test and Finishing Plant (TF) I - Assy Year (Y) J - Assy Week (WW) 6.3 Packing and shipping specifications Table 9. Packing and shipping data Note: DS9904 - Rev 2 Order codes Packaging Pcs per tray STAC4932F1MR Box (plastic tray) 20 Dry pack humidity < 10% GFS and lot code Two codes max. Dry pack specification in accordance with JEDEC J-STD-033. page 13/16 STAC4932F1MR Revision history Table 10. Document revision history DS9904 - Rev 2 Date Version Changes 24-Oct-2013 1 First release. 17-Apr-2020 2 Updated package information. Added Section 1.3 ESD protection characteristics. page 14/16 STAC4932F1MR Contents Contents 1 2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.3 ESD protection characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 SOA and Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Product and environmental safety for toxic materials use . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 Recommended heat profile and reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 5.1 Evaluation flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.2 Manual leads soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.3 Acceptable missing soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 6.1 STAC780-4F package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.2 Marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.3 Packing and shipping specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 DS9904 - Rev 2 page 15/16 STAC4932F1MR IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2020 STMicroelectronics - All rights reserved DS9904 - Rev 2 page 16/16