Features
n Combined Protection Technology (CPT)
design
n Common mode filter
n ESD protection
n Fast response time
n Low capacitance
n RoHS compliant*
Applications
n USB 2.0
n HDMI
n MIPI
n MHL
ChipGuard® Model CGF0804TFH-R900-2L ESD/EMI Filter
*RoHS Directive 2015/863, Mar 31, 2015 and Annex.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
*RoHS COMPLIANT
LEAD FREE
*RoHS COMPLIANT
VERSIONS
AVAILABLE
LEAD FREE
VERSIONS ARE
RoHS COMPLIANT*
Description
Electrical Characteristics @ 25 °C (unless otherwise noted)
Parameter Min. Typ. Max. Unit
Common Mode Impedance @100 MHz 67.5 90 112.5 Ohms
Cut-off Frequency 3 GHz
DC Resistance 1.8 2.7 3.5 Ohms
Insulation Resistance 10 Megohms
Capacitance @ 1 MHz, Any Pin to Ground 0.6 pF
Leakage Current @ 5 V, Any Pin to Ground 1 µA
The Bourns® ChipGuard® CGF Series utilizes Combined Protection Technology (CPT) to create an ESD protection device and
common mode lter in a single space-saving device. This series features very low capacitance and superior common mode noise
rejection, making it ideal for use in high-speed differential data lines.
Environmental Characteristics
Moisture Sensitivity Level ..................... 1
ESD Classication (HBM).....................6
Absolute Maximum Ratings @ 25 °C (unless otherwise noted)
Parameter Symbol Rating Unit
Maximum DC Operating Voltage VDC 5 V
Maximum DC Operating Current IDC 100 mA
Operating Temperature Range TOPR -40 to +85 °C
Storage Temperature Range TSTG -40 to +85 °C
ESD Protection per IEC 61000-4-2
Contact Discharge
Air Discharge
8
15
kV
How to Order
CG F 0804 TFH - R900 - 2L
ChipGuard®
Product
Designator
Common Mode
Filter Designator
Package
0804 = 0804 Size
Technology
TFH = Thin Film High-Speed
Common Mode Impedance @ 100 MHz
R900 = 90 Ohms
Lines
2L = 2 Lines
Circuit Diagram
GND
43
12
GND
Asia-Pacic:
Tel: +886-2 2562-4117
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® Model CGF0804TFH-R900-2L ESD/EMI Filter
Product Dimensions
DIMENSIONS: MM
(INCHES)
Impedance vs. Frequency Characteristics Insertion Loss vs. Frequency Characteristics
Test Instrument: HP4291A Impedance/Material Analyzer Test Instrument: Agilent E4071C ENA-L Network Analyzer
Impedance (Ohms)
Insertion Loss (dB)
Frequency (MHz) Frequency (MHz)
Differential Mode
Common Mode
Differential Mode
Common Mode
0
-3
-6
-9
-12
-15
-18
-21
-24
-27
-30
-33
-36 110
10
100
100 1000
1000
10000
0.85 ± 0.05
(.033 ± .002)
0.65 ± 0.05
(.026 ± .002)
0.40 ± 0.05
(.016 ± .002)
0.20 ± 0.05
(.008 ± .002)
0.10 ± 0.05
(.004 ± .002)
43
12
0.40 ± 0.05
(.016 ± .002)
0.27 ± 0.05
(.011 ± .002)
0.15 ± 0.05
(.006 ± .002)
0.15 ± 0.05
(.006 ± .002)
0.15 ± 0.05
(.006 ± .002)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® Model CGF0804TFH-R900-2L ESD/EMI Filter
Packaging Dimensions
2.0 ± 0.5
(.079 ± .020)
178 ± 2.0
(7.008 ± .079)
9.0 ± 0.5
(.354 ± .020)
13.0 ± 1.0
(.512 ± .039)
13.0 ± 0.5
(.512 ± .020)
62.0 ± 1.5
(2.441 ± .059)
21.0 ± 0.8
(.827 ± .031)
DIMENSIONS: MM
(INCHES)
REV. A 03/18
8.0 ± 0.1
(.315 ± .004)
1.75 ± 0.05
(.069 ± .002)
3.5 ± 0.05
(.138 ± 0.002)
0.60 ± 0.03
(.024 ± .0012)
1.04 ± 0.03
(.041 ± .0012)
0.78 ± 0.03
(.031 ± .0012)
2.0 ± 0.05
(.079 ± .002)
1.55 ± 0.05
(.061 ± .002)
DIA.
2.0 ± 0.05
(.079 ± .002)
4.0 ± 0.10
(.157 ± .004)
Solder Reow Recommendations
Per J-STD-020C
A 1st Rising The Normal to 30 s to 60 s
Temperature Preheating
Temperature
B Preheating 140 °C to 160 °C 60 s to 120 s
C 2nd Rising Preheating to 200 °C 20 s to 40 s
Temperature
D Main Heating if 220 °C 50 s ~ 60 s
if 230 °C 40 s ~ 50 s
if 240 °C 30 s ~ 40 s
if 250 °C 20 s ~ 40 s
if 260 °C 20 s ~ 40 s
E Regular Cooling 200 °C to 100 °C 1 °C/s ~ 4 °C/s
A
C
TIME
TEMPERATURE OF TERMINATION
D E
B
STANDARD = 10,000 pieces per reel