1. Product profile
1.1 General description
Planar Schottky barrier triple diode with an integrated guard ring for stress protection.
Three electrically isolated Schottky barrier diodes, encapsulated in a SOT666 ultra small
SMD plastic package.
1.2 Features
■Low forward voltage
■High reverse voltage
■Low capacitance
■Ultra small SMD plastic package
■Flat leads: excellent coplanarity and improved thermal behavior.
1.3 Applications
■Ultra high-speed switching
■Voltage clamping
■Line termination
■Inverse-polarity protection
■RF applications (e.g. mixing and demodulation).
1.4 Quick reference data
BAS70VV
70 V, 70 mA Schottky barrier triple isolated diode in SOT666
Rev. 01 — 10 September 2004 Product data sheet
Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VRreverse voltage - - 70 V
IFforward current - - 70 mA
9397 750 13732 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 10 September 2004 2 of 8
Philips Semiconductors BAS70VV
70 V, 70 mA Schottky barrier triple isolated diode in SOT666
2. Pinning information
3. Ordering information
4. Marking
5. Limiting values
Table 2: Discrete pinning
Pin Description Simplified outline Symbol
1 anode (diode 1)
2 anode (diode 2)
3 anode (diode 3)
4 cathode (diode 3)
5 cathode (diode 2)
6 cathode (diode 1)
SOT666
123
456 6
1
5
2
4
3
sym046
Table 3: Ordering information
Type number Package
Name Description Version
BAS70VV - plastic surface mounted package; 6 leads SOT666
Table 4: Marking
Type number Marking code
BAS70VV N1
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRreverse voltage - 70 V
IFforward current - 70 mA
IFRM repetitive peak forward
current tp≤ 1 s; δ≤ 0.5 - 70 mA
IFSM non-repetitive peak forward
current tp < 10 ms - 100 mA
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
9397 750 13732 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 10 September 2004 3 of 8
Philips Semiconductors BAS70VV
70 V, 70 mA Schottky barrier triple isolated diode in SOT666
6. Thermal characteristics
[1] Refer to SOT666 standard mounting conditions.
[2] Reflow soldering is the only recommended soldering method.
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
Table 6: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistancefromjunction
to ambient in free air [1] [2] - - 700 K/W
Table 7: Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage see Figure 1 [1]
IF = 1 mA - - 410 mV
IF = 10 mA - - 750 mV
IF = 15 mA - - 1 V
IRreverse current see Figure 2
VR = 50 V - - 100 nA
VR = 70 V - - 10 µA
Cddiode
capacitance VR = 0 V; f = 1 MHz;
see Figure 4 --2pF
9397 750 13732 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 10 September 2004 4 of 8
Philips Semiconductors BAS70VV
70 V, 70 mA Schottky barrier triple isolated diode in SOT666
(1) Tamb = 125 °C.
(2) Tamb =85°C.
(3) Tamb =25°C.
(4) Tamb =−40 °C.
(1) Tamb = 125 °C.
(2) Tamb =85°C.
(3) Tamb =25°C.
Fig 1. Forward current as a function of forward
voltage; typical values. Fig 2. Reverse current as a function of reverse
voltage; typical values.
f = 10 kHz. f = 1 MHz.
Fig 3. Differential forward resistance as a function of
forward current; typical values. Fig 4. Diode capacitance as a function of reverse
voltage; typical values.
10
0 0.2 0.4 0.6 0.8 1
1
IF
(mA)
VF (V)
mra803
(1) (4)(2) (3)
102
10−1
10−2
mra805
1
10
102
020406080
VR (V)
IR
(µA) (1)
(3)
(2)
10−1
10−2
10−3
10
1110
rdiff
(Ω)
IF (mA)
mra802
10−1102
102
103
0
0.5
1
1.5
2
0 20406080
mra804
Cd
(pF)
VR (V)
9397 750 13732 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 10 September 2004 5 of 8
Philips Semiconductors BAS70VV
70 V, 70 mA Schottky barrier triple isolated diode in SOT666
8. Package outline
Fig 5. Package outline SOT666.
UNIT bpcDE e1HELpw
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
01-01-04
01-08-27
IEC JEDEC EIAJ
mm 0.27
0.17 0.18
0.08 1.7
1.5 1.3
1.1 0.5
e
1.0 1.7
1.5 0.1
y
0.1
DIMENSIONS (mm are the original dimensions)
0.3
0.1
SOT666
bp
pin 1 index
D
e1
e
A
Lp
detail X
HE
E
A
S
0 1 2 mm
scale
A
0.6
0.5
c
X
123
456
Plastic surface mounted package; 6 leads SOT666
YS
wMA
Philips Semiconductors BAS70VV
70 V, 70 mA Schottky barrier triple isolated diode in SOT666
9397 750 13732 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 10 September 2004 6 of 8
9. Packing information
[1] For further information and the availability of packing methods, see Section 14.
10. Revision history
Table 8: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code
[1]
Type number Package Description Packing quantity
4000
BAS70VV SOT666 4 mm pitch, 8 mm tape and reel -115
Table 9: Revision history
Document ID Release date Data sheet status Change notice Order number Supersedes
BAS70VV_1 20040910 Product data sheet - 9397 750 13732 -
Philips Semiconductors BAS70VV
70 V, 70 mA Schottky barrier triple isolated diode in SOT666
9397 750 13732 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 10 September 2004 7 of 8
11. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
13. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data fromthe preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 10 September 2004
Document order number: 9397 750 13732
Published in The Netherlands
Philips Semiconductors BAS70VV
70 V, 70 mA Schottky barrier triple isolated diode in SOT666
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 6
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . . 7
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
14 Contact information . . . . . . . . . . . . . . . . . . . . . 7
