MOUNTING RECOMMENDATIONS
AUTOMATED SMT ASSEMBLY
The following section describes the guidelines for
automated SMT assembly of MLO® RF devices which
are typically Land Grid Array (LGA) packages or side
termination SMT packages.
Control of solder and solder paste volume is critical for
surface mount assembly of MLO® RF devices onto
the PCB.
Stencil thickness and aperture openings should be
adjusted according to the optimal solder volume. The
following are general recommendations for SMT
mounting of MLO® devices onto the PCB.
SMT REFLOW PROFILE
Common IR or convection reflow SMT processes shall
be used for the assembly. Standard SMT reflow
profiles, for eutectic and Pb free solders, can be used
to surface mount the MLO® devices onto the PCB. In
all cases, a temperature gradient of 3°C/sec, or less,
should be maintained to prevent warpage of the
package and to ensure that all joints reflow properly.
Additional soak time and slower preheating time may
be required to improve the out-gassing of solder
paste. In addition, the reflow profile depends on the
PCB density and the type of solder paste used.
Standard no-clean solder paste is generally
recommended. If another type of flux is used,
complete removal of flux residual may be necessary.
Example of a typical lead-free reflow profile is shown
below.
Multilayer Organic (MLO®) Filters
Mechanical Specifications, PCB Layout & Mounting Recommendations
[RETURN TO GENERAL ELECTRICAL SPECIFICATIONS]
Profil e Parameter Pb free, Con vecti o n , IR/Con vecti o n
Ramp-up rate (T smax to Tp) 3°C/second max.
Preheat temperature (Ts m i n t o T s max) 150°C to 200°C
Preheat ti me (ts) 60 - 180 seconds
Tim e above TL, 217°C (tL) 60 - 120 seconds
Peak temperature (T p) 260° C
Tim e withi n 5°C of peak temperature (tp)
Ramp-down rate 10 - 20 seconds
4°C/second max.
Tim e 25° C to peak t emperature 6 minutes max.