1/18
PRELIMINARY DATA
December 1999
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
M48T513Y
M48T513V
3.3V-5V 4 Mbit (512Kb x8) TIMEKEEPER® SRAM
INTEGRATED ULTRA LOW POWER SRAM,
REAL TIME CLOCK, POWER-FAIL CONTROL
CIRCUIT, BATTERY, and CRYSTAL
YEAR 2000 COMPLIA NT
BCD CODED CENTURY, YEAR, MONTH,
DAY, DATE, HOURS, MINUTES, and
SECONDS
BATTERY LOW WARNING FLAG
AUTOMATIC POWER-FAIL CHIP DESELECT
and WRITE P ROTEC T ION
TWO WRITE PROTECT VOLTAGES:
(VPFD = Power-fail Deselect Voltage)
M48T 513Y : 4.2V VPFD 4.5V
M48T 513V : 2.7V VPFD 3.0V
CONVENTIONAL SRAM OPERATION;
UNLIMITED WRITE CYCLES
SOFTWARE CONTROLLED CLOCK
CALIBRATION for HIGH ACCURACY
APPLICATIONS
10 YEARS of DATA RETENTION and CLOCK
OPERATION in the ABSENCE of POWER
SELF CONTAINED BATTERY and CRYSTAL
in DIP PACKAGE
MI CR OPRO C ESSOR POWER- O N RES ET
(Valid even during battery back-up mode)
PR O GRAMM A BLE A L A R M O U TPU T ACTI VE
in BATTERY BACK-UP MODE
DESCRIPTION
The M48T513Y/V TIMEKE EPER R AM is a 512Kb
x 8 non-volatile static RAM and real time clock,
with programm able a larms and a watchdo g t imer.
The special DIP package provides a fu lly integrat-
ed battery back -up memory and real time clock so-
lution. The M48T513Y/V directly replaces industry
standard 512Kb x 8 SRAM. It also provides the
non-volatility of Flash without any req uirement for
special write timing or limitations on the number of
writes that can be performed.
The 36 pin 600 mil DIP Hy brid houses a controller
chip, SRAM , quartz crystal, and a long life lithium
button cell in a single package.
Figure 1. Logic Diagram
AI02308
19
A0-A18 DQ0-DQ7
VCC
M48T513Y
M48T513V
G
VSS
8
E
W RST
IRQ/FT
RSTIN
WDI
36
1
PMLDIP36 (PM)
Module
M48T513Y, M48T513V
2/18
Figu re 2. DIP C on ne ctions
VSS
VCC
AI02307
M48T513Y
M48T513V
10
1
2
5
6
7
8
9
11
12
13
16
17
18
30
29
26
25
24
23
22
21
20
19
3
4
28
27
32
31
14
15
34
33
36
35
A1
A0
DQ0
A7
A4
A3
A2
A6
A5
A13
A10
A8
A9
DQ7
A15
A11
G
E
DQ5DQ1
DQ2 DQ3
DQ4
DQ6
A16
A18
A12
A14 W
A17
RSTIN
RST
IRQ/FT
WDI
Table 2. Absolute Maximum Ratings (1)
Note: 1. Stres ses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the devic e. This i s a stress
rating only and function al opera tion of the device at these or any other con di tions above those indic ated in the operational section
of this spec ificati on is not implied. Ex posure t o the abso lute maximum r ating cond itions for ex tended period s of time may affect
reliability.
2. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
CAUTION: Nega tive unders hoots below –0.3V are not all owed on any pin while i n the Batte ry Ba ck- up m ode.
Symbol Parameter Value Unit
TAAmbient Operating Temperature 0 to 70 °C
TSTG Storage Temperature (VCC Off, Oscillator Off) –40 to 85 °C
VIO Input or Output Voltages –0.3 to VCC +0.3 V
VCC Supply Voltage M48T513Y –0.3 to 7.0 V
M48T513V –0.3 to 4.6 V
IOOutput Current 20 mA
PDPower Dissipation 1 W
Figure 3 illustrates the static memory array and the
quartz controlled clock oscillator. The clock loca-
tions contain the century, year, month, date, day,
hour, minute, and second in 24 hour B CD f orm at.
Corrections for 28, 29 (lea p year), 30, and 31 day
months are made automatically. The nine clock
bytes (7FFFFh-7FFF9h and 7FFF1h) are not the
actual clock counters, they are memory locations
consisting of BiPORT™ read/write memory cells
within the static RAM array.
Table 1. Signal Names
A0-A18 Address Inputs
DQ0-DQ7 Data Inputs / Outputs
EChip Enable Input
GOutput Enable Input
WWrite Enable Input
WDI Watchdog input
RST Reset Output (open drain)
RSTIN Reset Input
IRQ/FT Interrupt / Frequency Test
Output (open drain)
VCC Supply Voltage
VSS Ground
3/18
M48T513Y, M 48T513V
Figu re 3. Blo ck D ia gra m
AI02584
LITHIUM
CELL
OSCILLATOR AND
CLOCK CHAIN
VPFD
VCC VSS
32,768 Hz
CRYSTAL
VOLTAGE SENSE
AND
SWITCHING
CIRCUITRY
16 x 8
TIMEKEEPER
REGISTERS
524,272 x 8
SRAM ARRAY
A0-A18
DQ0-DQ7
E
W
G
POWER
RST
IRQ/FT
WDI
RSTIN
The M48T513Y/V includes a clock control circuit
which updates the clock bytes with current infor-
mation once per second. The information can be
accessed by t he us er i n t he sa me m anner a s any
other location in the static memory array. Byte
7FFF8h is the clock control register. This byte con-
trols user access to the cl ock inf ormation and also
stores the clock calibration setting.
Byte 7FFF7h contains the watchdog timer set ting.
The watchdog timer can generate either a reset or
an interrupt, depending on the st ate of the Watch-
dog Steering bit (WDS). Bytes 7FFF6h-7FFF2h in-
clude bits that, when programmed, provide for
clock alarm functionality. Alarms are activated
when the register content matches the month,
date, hours, minutes, and seconds of the clock
registers. Byte 7FFF1h contains century informa-
tion. Byte 7FFF0h cont ains additional flag informa-
tion pertaining to the watchdog timer, the alarm
condition and the battery status. The M48T513Y/ V
also has its own Power-Fail Detect circuit. This
control circuitry constantly monitors the supply
voltage for an out of tolerance condition. When
VCC is out of tolerance, the circuit write protects
the TIMEKEEPER register data and external
SRAM, providing data sec urity in the midst of un-
predictable system operation. As VCC falls, the
control circuitry automatically sw itches to t he bat-
tery, maintaining data and clock operation until
valid power is restored.
READ MODE
The M48T513Y/V is in the Read Mode whenever
W (Write Enable) is high and E (Chip Enable) is
low. The unique address specified by the 17 Ad-
dress Inputs defines which one of the 524,272
bytes of data is to be acc ess ed. Vali d data will be
available at the Data I/O pins within tAVQV (Ad-
dress Access Time) after the last address input
signal is stable, providing the E and G access
times are also satisfied. If the E and G access
times are not met, valid dat a will be available after
the latter of the Chi p Enable Access Times (tELQV)
or Output Enable Access Time (tGLQV).
The state of the eight three-state Da ta I/O si gnals
is controlled by E and G. If the outputs are activat-
ed before tAVQV, the data lines will be driven t o an
indeterminate state until tAVQV. If the Add ress In-
puts are changed while E and G remain active,
output data will remain valid for tAXQX (Output
Data Hold Time) but will go indeterminate until the
next Address Access.
M48T513Y, M48T513V
4/18
Table 3. Operating Modes (1)
No te: 1. X = V IH or VIL; VSO = Batte ry Back-up Swit chover Voltage.
2. See Table 7 for details .
Mode VCC E G W DQ0-DQ7 Power
Deselect
4.5V to 5.5V
or
3.0V to 3.6V
VIH X X High Z Standby
Write VIL XVIL DIN Active
Read VIL VIL VIH DOUT Active
Read VIL VIH VIH High Z Active
Deselect VSO to VPFD (min) (2) X X X High Z CMOS Standby
Deselect VSO (2) X X X High Z Battery Back-up Mode
Table 4. AC Measu remen t Conditions
Note that Output Hi-Z is def ined as the point where data is no longer
driven.
Input Rise and Fall Times 5ns
Input Pulse Voltages 0 to 3V
Input and Output Timing Ref. Voltages 1.5V
data and powering the clock. The internal energy
source will maintain data in the M48T513Y/V for
an accumulated per iod of at least 10 years at room
temperature. As system power rises above VSO,
the battery is disconnected, and t he power supply
is switched to external VCC. Deselect continues for
tREC after VCC reaches VPF D (max). For a further
more detailed review of lifetime calculations,
please see Application Note AN10 12.
WRITE MODE
The M48T513Y/V is in the Write Mode whenever
W (Write Enable) and E (Chip Enable) are low
state after the address inputs are stable.
The start of a wri te is referenced from the la tter oc-
curring falling edge of W or E. A wr ite is terminated
by the earlier rising edge of W or E . The addresses
must be held valid throughout the cycle. E or W
must return high f or a minimum of tEHAX fr om Chip
Enable or tWHAX from Write Enable prior to the ini-
tiation of another read or write cycle. Data-in must
be valid tDVWH prior to the end of write and remain
valid for tWHDX afterward. G should be kept high
during write cycles to avoid bus contention; al-
though, if t he out put bus has bee n act ivated by a
low on E and G a low on W will disable the outputs
tWL QZ after W falls.
DATA RETENTION MODE
With valid VCC applied, the M48T513Y/V operates
as a conventi onal BYTEWIDE static RAM. Shoul d
the supply voltage de cay, the RAM will automati-
cally deselect, write protecting itself when VCC
falls between VPFD (max), VPFD (min) window. All
outputs become high impedance and all inputs are
treated as "don’t care".
Note: A power failure during a write cycle may cor-
rupt data at the current addressed location, but
does not jeopardize the rest of the RAM’s content.
At vo ltage s belo w VPFD (m in), the memory will be
in a write protected state, provided the VCC fall
time is not less than tF. The M48T5 13Y /V ma y re-
spond to transient noise spik es on VCC th a t cros s
into the deselect window during the time the de-
vice is sampling VCC. Therefore, decoupling of the
power supply lines is recomm ended .
When VCC drops below VSO, the control circuit
switches power t o the internal b attery, preserving
Figure 4. AC Testing Load Circuit
Note: Excluding open drain output pins.
AI01803C
CL = 100pF
CL includes JIG capacitance
650
DEVICE
UNDER
TEST
1.75V
5/18
M48T513Y, M 48T513V
TIMEKEEPER REGISTERS
The M48T513Y/V offers 16 internal registers
which contain TIMEKEEPER, Alarm, Watchdog,
Interrupt, Flag, and Control data. These registers
are memory locations which contain external (user
accessible) and internal copies of the data (us ually
referred to as BiPORT™ TIMEKEEPER cells).
The external copies are independent of internal
functions except t hat they are updated periodically
by the simultaneous transfer of the incremented
in te r n a l copy. TI MEKEEPER a nd Alar m Register s
store data in BCD.
CLOCK OPERATIONS
Reading the Clock
Updates to the TIMEKEEPER registers should be
halted bef ore clock data is read to prevent reading
data in transition. Because the BiPORT TIME-
KEEPER cells i n the R AM a r ra y are onl y d a ta r e g -
isters, and not the actual clock counters, updat ing
the registers can b e halted without disturbing the
clock i tse l f.
Updating is halted when a '1' is written to the
READ bit, D6 i n the Control Register (7FFF8h). As
long as a '1' remains in that position, updating is
halted. After a halt is issued, the registers reflect
the count; that is, the day, dat e, and time that were
current at the moment the halt command was is-
s ued. Al l o f th e TI MEKEEPER r egi ster s are updat-
ed simultaneously. A halt will not interrupt an
update in progress. Updating occ urs 1 second a f-
ter the READ bit is reset to a '0'.
Setting the Clock
Bit D7 of the Control Register (7FFF8h) is the
WRITE bit. Setting the WR ITE bit to a '1', like t he
RE AD b i t, halts u p dates to the TIMEKEEPER re g -
isters. The user can then load them with the cor-
rect day, date, and time data in 24 hour BCD
format (see Table 11).
Resetting the WRITE bit to a '0' then transfers the
values of all time registers (7FFFFh-7FFF9h,
7FFF1h) to th e actual TIMEKEEPER counters and
allows normal operation to resume. After the
WRITE bit is reset, the next clock update will occur
approximately one second later.
Note: Upon power-up following a power failure,
both the WRITE bit and the READ bit will be reset
to '0'.
Stopping and Starting the Oscillator
The oscillator may be stopped at any time. If the
device is going to spend a significant amount of
time on the shelf, the oscillat or can be turned off to
minimize current drain on the battery. The STOP
bit is located at Bit D7 within 7FFF9h. Setting it to
a '1' stops the oscillator. When reset to a '0', the
M48T513 Y/V oscillator starts within one second.
Note: It is not necessary to set the WRITE bit
when setting or resetting the FREQUE NCY TES T
bit (FT) or the STOP bit (ST ).
SETTING ALARM CLOCK
Registers 7F FF6h-7FFF2 h contain t he alarm set-
tings. The alarm can be configured to go off at a
prescribed time on a specific month, date, hour,
minute, or second or repeat every month, day,
hour, minute, or second. It can also be pro-
grammed to go off while the M48T513Y/V is in the
batt ery back-up to serve as a system wake-up call.
Bits RPT5-RPT1 put the alarm in the repeat mode
of operation. Tabl e 12 shows the po ssible config-
urations. Codes not listed in the table default to the
once per secon d m ode t o qu ick ly alert the us er of
an incorrect alarm setting.
Note: User must transition address (or toggle Chip
Enable) to see Flag Bit change.
When the clock information matches the alarm
clock settings based on the match cr iteria d efined
by RPT5-RPT1, the AF (Alarm Flag) is set. If AFE
(Alarm Flag Enable) is also set, the alarm condi-
tion activates the IRQ/FT pin. To disable alarm,
write ’0’ to the Alarm Date register and RPT1-4.
The IRQ/FT output is cleared by a read to the
Flags register as shown in Figure 11. A subse-
quent read of the Flags register will reset the
Alarm Flag (D6; Register 7FFF 0h).
The IRQ/FT pin can also be activated in the bat-
tery back-up mode. The IRQ/FT will go low if an
alarm occurs and both ABE (Alarm in Battery
Back-up Mode Enable) and AFE are set. The ABE
and AFE bits are reset during power-up, therefore
an alarm generated during power-up will only set
AF. The user can read t he Flag Register at syst em
boot-up to determine if an alarm was generated
while the M48T51 3Y/V was in t he desel ect m ode
during power-up. Figure 12 il l ustrates the back-up
mode alarm timing.
M48T513Y, M48T513V
6/18
Table 5. Capaci tance (1)
(TA = 25 °C, f = 1 MHz)
No te : 1. Effective c apacitance me asured wi th power supply at 5V (M 48T513 Y) or 3.3 V (M48T513V). S ampled only, not 100% tes ted.
2. Outputs desel ected .
Table 6A. DC Characteristics - M48T513Y
(TA = 0 to 70 °C; VCC = 4.5V to 5.5V)
No te : 1. Outputs des el ected .
Table 6B. DC Characteristics - M48T513V
(TA = 0 to 70 °C; VCC = 3.0V to 3.6V)
No te : 1. Outputs des el ected .
Symbol Parameter Test Condition Min Max Unit
CIN Input Capacitance VIN = 0V 20 pF
CIO (2) Input / Output Capacitance VOUT = 0V 20 pF
Symbol Parameter Test Condition Min Max Unit
ILI (1) Input Leakage Current 0V VIN VCC ±2 µA
ILO (1) Output Leakage Current 0V VOUT VCC ±2 µA
ICC Supply Current Outputs open 115 mA
ICC1 Supply Current (Standby) TTL E = VIH 8mA
I
CC2 Supply Current (Standby) CMOS E = VCC – 0.2V 4mA
V
IL Input Low Voltage –0.3 0.8 V
VIH Input High Voltage 2.2 VCC + 0.3 V
VOL Output Low Voltage IOL = 2.1mA 0.4 V
VOH Output High Voltage IOH = –1mA 2.4 V
Symbol Parameter Test Condition Min Max Unit
ILI (1) Input Leakage Current 0V VIN VCC ±2 µA
ILO (1) Output Leakage Current 0V VOUT VCC ±2 µA
ICC Supply Current Outputs open 60 mA
ICC1 Supply Current (Standby) TTL E = VIH 4mA
I
CC2 Supply Current (Standby) CMOS E = VCC – 0.2V 3mA
V
IL Input Low Voltage –0.3 0.4 V
VIH Input High Voltage 2.2 VCC + 0.3 V
VOL Output Low Voltage IOL = 2.1mA 0.4 V
VOH Output High Voltage IOH = –1mA 2.2 V
7/18
M48T513Y, M 48T513V
Table 7. Power Down/Up Trip Points DC Characteristics (1)
(TA = 0 to 70 °C)
Note: 1. All voltages referenced to VSS.
2. At 25° C.
Table 8. Power Down/Up AC Chara cteri stics
(TA = 0 to 70 °C)
Note: 1. VPFD (ma x) to VPFD ( min) fall time of less than tF m ay r e sul t in de sel ec tio n/ wri te pro te cti on not o cc ur ri ng un ti l 200m s af te r VCC p ass-
es VPFD (min) .
2. VPFD (min) to VSS fall time of less than tFB may cause cor ruption of RAM dat a.
Symbol Parameter Min Typ Max Unit
VPFD Power-fail Deselect Voltage M48T513Y 4.2 4.35 4.5 V
M48T513V 2.7 2.9 3.0 V
VSO Battery Back-up Switchover Voltage M48T513Y 3.0 V
M48T513V VPFD –100mV
tDR (2) Expected Data Reten tion Time 10 YEARS
Symbol Parameter Min Max Unit
tF (1) VPFD (max) to VPFD (min) VCC Fall Time 300 µs
tFB (2) VPFD (min) to VSS VCC Fall Time M48T513Y 10 µs
M48T513V 150 µs
tRVPFD (min) to VPFD (max) VCC Rise Time s
t
RB VSS to VPFD (min) VCC Rise Time s
t
REC VPFD (max) to RST High 40 200 ms
Figure 5. Power Down/Up Mode AC Waveforms
AI01805
VCC
INPUTS
OUTPUTS
DON'T CARE
HIGH-Z
tF
tFB
tR
tRB
VALID VALID
RECOGNIZEDRECOGNIZED
VPFD (max)
VPFD (min)
VSO
tREC
RST
M48T513Y, M48T513V
8/18
Table 9. Read Mode AC Characteri stics
(TA = 0 to 70 °C)
Note: 1. CL = 100pF.
2. CL = 5pF .
Symbol Parameter
M48T513Y M48T513V
Unit-70 -85
Min Max Min Max
tAVAV Read Cycle Time 70 85 ns
tAVQV (1) Address Valid to Output Valid 70 85 ns
tELQV (1) Chip Enable Low to Output Valid 70 85 ns
tGLQV (1) Output Enable Low to Output Valid 40 55 ns
tELQX (2) Chip Enable Low to Output Transition 5 5 ns
tGLQX (2) Output Enable Low to Output Transition 5 5 ns
tEHQZ (2) Chip Enable High to Output Hi-Z 25 30 ns
tGHQZ (2) Output Enable High to Output Hi-Z 25 30 ns
tAXQX (1) Address Transition to Output Transition 10 5 ns
Figure 6. Address Controlled, Read Mode AC Waveforms
AI02324
tAVAV
tAVQV
tAXQX
DATA VALID
A0-A16
DQ0-DQ7
VALID
DATA VALID
9/18
M48T513Y, M 48T513V
Table 10. Write Mode AC Characteristics
(TA = 0 to 70 °C)
Note: 1. CL = 5pF.
2. If E goes low simultaneously wit h W going low , t he outputs rem ai n in the hi gh i m peda nce state.
Symbol Parameter
M48T513Y M48T513V
Unit-70 -85
Min Max Min Max
tAVAV Write Cycle Time 70 85 ns
tAVWL Address Valid to Write Enable Low 0 0 ns
tAVEL Address Valid to Chip Enable Low 0 0 ns
tWLWH Write Enable Pulse Width 50 60 ns
tELEH Chip Enable Low to Chip Enable High 55 65 ns
tWHAX Write Enable High to Address Transition 5 5 ns
tEHAX Chip Enable High to Address Transition 10 15 ns
tDVWH Input Valid to Write Enable High 30 35 ns
tDVEH Input Valid to Chip Enable High 30 35 ns
tWHDX Write Enable High to Input Transition 5 5 ns
tEHDX Chip Enable High to Input Transition 10 15 ns
tWLQZ (1, 2) Write Enable Low to Output Hi-Z 25 30 ns
tAVWH Address Valid to Write Enable High 60 70 ns
tAVEH Address Valid to Chip Enable High 60 70 ns
tWHQX (1, 2) Write Enable High to Output Transition 5 5 ns
WATCHDOG TI MER
The watchdog timer can be used to detect an out-
of-control microprocessor. The us er program s the
watchdog timer by setting the desired amount of
time-out into the Watchdog Register, address
7FFF7h. Bits BMB4-BMB0 store a binary multiplier
and the two lower order bits RB1-RB0 select the
resolution, where 00 = 1/16 second, 01 = 1/4 sec-
ond, 10 = 1 second, and 11 = 4 seconds. The
amount of time-out is then determined to be the
multiplication of t he five bit m ultiplier value with the
resolution. (For example: writing 00001110 in the
Watchdog Register = 3*1 or 3 s econds).
Note: Accuracy of timer is within ± the selected
resolution.
If the processor does not reset the timer within the
specified period, the M48T513Y/V sets the WDF
(Watchdog Fl ag) and generates a watchdog inter-
rupt or a microprocessor reset. WDF is reset by
reading the Flags Register (Address 7FFF0h). The
most significant bit of the Watchdog Register is the
Watchdog Steering Bit (WDS). When set to a '0 ',
the watchdog will activate the IRQ/FT pin when
timed-out. When WDS is set to a '1', the watc hdog
will out put a negative pulse on th e R S T pin for 40
to 200 ms. The Watchdog register and the F T bit
will reset to a '0' at the end of a Watchdog time-out
when the WDS bi t is set to a '1'. The watchdog ti m-
er can be reset by two methods: 1) a transition
(high-to-low or low-to-high) can be applied to the
Watchdog Input pin (WDI) or 2) the microproces-
sor can perform a write of the Watchdog Regist er.
The time-out period then starts over. The WDI pin
should be tied to VSS if not used. The watchdog
will be reset on each transition (edge) seen by the
WDI pin. In the order to perform a software reset
of the watchdog timer, the original time-out period
can be written into the Watchdog Register, effec-
tively restarting the count-down cycle.
Should the wat chdog t imer time-out, and the WDS
bit is programmed to output an interrupt , a value of
00h needs to be written to the Watchdog Register
in order to clear the IRQ/FT pin. This will also dis-
able the watchdog function until it is again pro-
grammed correctly. A read of the Flags Register
will reset the Watchdog Flag (Bit D7; Register
7FFF0h).
M48T513Y, M48T513V
10/18
Figure 7. Chip Enable or Outp ut Enab le Controll ed, Read Mode AC Waveforms
Figure 8. Write Enable Controlled, Write AC Wavefo rms
AI01197
tAVAV
tAVQV tAXQX
tELQV
tELQX
tEHQZ
tGLQV
tGLQX
tGHQZ
DATA OUT
A0-A16
E
G
DQ0-DQ7
VALID
AI02382
tAVAV
tWHAX
tDVWH
DATA INPUT
A0-A16
E
W
DQ0-DQ7
VALID
tAVWH
tAVEL
tWLWH
tAVWL
tWLQZ
tWHDX
tWHQX
11/18
M48T513Y, M 48T513V
The watchdog function is automatically disabled
upon power-down and the Watchdog Register is
cleared. If the watchdog function i s set t o output to
the IRQ /FT pin and the frequency test function is
activated, the watchdog or alarm function prevails
and the frequency test function is denied.
POWER-ON RESET
The M48T513Y/V continuously monitors VCC.
When V CC falls to the power fail detect trip point,
the RST pull s low (open drain) and remains low on
power-up for 40 t o 200ms after VCC pa sse s VPFD.
The RST pin is an open drain output and an appro-
priate pull-up resist or to VCC shoul d be cho sen t o
control the rise time.
RESET I NPU T ( RSTIN)
The M48T513Y/V provides an independent input
which can generate an out put reset. The duration
and function of this reset is identical to a reset gen-
erated by a power cycle. Table 13 and Figure 13
illu strat e the AC rese t ch ara cteris tics of t his f unc-
tion. Pulses short er t han tR will not gene ra te a re-
set condition. RSTIN is in te rn a lly pu lled up to VCC
through a 100K resistor.
CALIBRATING THE CLOCK
The M48T513Y/V is driven by a quartz controlled
oscillator with a nominal frequency of 32,768Hz.
The devices are factory calibrated at 25°C and
tested for accuracy. Clock accuracy will not ex-
ceed 35 ppm (parts per million) oscillator frequen-
cy error at 25°C, which equates to about * 1.53
minutes per mont h. When the Calibration circuit is
properly employed, accuracy improves to better
than 4 ppm at 25°C. The osci llation rate of crystals
changes with temperature. The M48T513Y/V de-
sign employs periodic counter correction. The cal-
ibration circuit adds or subtracts counts from the
oscillator di vider circuit at the divide by 256 stage,
as shown in Figure 10.
The number of times pulses which are blanked
(subtracted, negative calibration) or split (added,
positive calibration) depends upon the value load-
ed into the five Calibration bits found in the Control
Register. Adding counts speeds the cl ock up, sub-
tracting counts slows the cl ock down. The Calibra-
tion bits occupy the five lower order bit s (D4-D0) in
the Control Register 7FFF8h. These bits can be
set to represent any value between 0 and 31 in bi-
nary form. Bit D5 is a Si gn bi t; '1' indicates positive
calibration, '0' indicates negati ve c alibration. Cali-
bration occurs within a 64 minute cycle. The first
62 minutes in the cycle may, once per minute,
have one second either shortened by 128 or
lengthene d by 256 oscillator cycles.
Figure 9. Chip Enable Controlled, Write AC Waveforms
AI02582
tAVAV
tEHAX
tDVWH
A0-A16
E
W
DQ0-DQ7
VALID
tAVEL
tAVWL
tELEH
tWHDX
DATA INPUT
M48T513Y, M48T513V
12/18
Figu re 10. Ca l ibr ati on W aveform
AI00594B
NORMAL
POSITIVE
CALIBRATION
NEGATIVE
CALIBRATION
Table 11. TIMEKEEPER Register M ap
Address Data Function/Range
BCD Format
D7 D6 D5 D4 D3 D2 D1 D0
7FFFFh 10 Years Year Year 00-99
7FFFEh 0 0 0 10 M Month Month 01-12
7FFFDh 0 0 10 Date Date Date 01-31
7FFFCh 0 FT 0 0 0 Day of Week Day 01-07
7FFFBh 0 0 10 Hours Hours (24 Hour Format) Hour 00-23
7FFFAh 0 10 Minutes Minutes Minutes 00-59
7FFF9h ST 10 Seconds Seconds Secon ds 00-59
7FFF8h W R S Calibration Control
7FFF7h WDS BMB4 BMB3 BMB2 BMB1 BMB0 RB1 RB0 Watchdog
7FFF6h AFE 0 ABE Al 10M Alarm Month A Month 01-12
7FFF5h RPT4 RPT5 Al 10 Date Alarm Date Al Date 01-31
7FFF4h RPT3 0 Al 10 Hours Alarm Hours A Hours 00-23
7FFF3h RPT2 Al 10 Minutes Alarm Minutes A Min 00-59
7FFF2h RPT1 Al 10 Seconds Alarm Seconds A Sec 00-59
7FFF1h 1000 Year 100 Year Century 00-99
7FFF0hWDFAF0BLYYYY Flag
Key s: S = SIGN Bit
FT = FREQUENCY TEST Bit
R = READ Bit
W = WRI T E Bi t
ST = STOP Bit
0 = Must be set to ’0’
Y = '1' or '0'
BL = Battery Low
AF = Alarm F la g
WDS = Wat chdog Steering Bit
BMB0-BMB 4 = Watchd og M ultipli er Bits
R B0-RB1 = Watchdog Resolution Bits
AFE = Alarm Flag Enable
ABE = Alarm in Battery Back-up Mode Enable
R PT1- R PT5 = A l arm Repe at Mode Bit s
WDF = Wat chdog Fl ag
13/18
M48T513Y, M 48T513V
Figure 11. Alarm Interrupt Reset Waveform
Figure 12. Back-up M ode Alarm Waveform s
AI02581
AD0-AD7
ACTIVE FLAG BIT
ADDRESS 1FF0h
IRQ/FT
HIGH-Z
15ns Min
AI01678C
VCC
IRQ/FT
HIGH-Z
VPFD (max)
VPFD (min)
AFE bit in Interrupt Register
AF bit in Flags Register
HIGH-Z
VSO
tREC
If a binary ’1’ is loaded into the register, only the
first 2 minutes in the 64 minute cycle will be modi-
fied; if a binary 6 is loaded, the first 12 will be af-
fected, and so on. Therefore, each calibration step
has the eff ect of adding 512 or subtracting 256 os-
cill ator cycles for every 125, 829, 120 actual oscil-
lator cycles, that is +4.068 or –2.034 ppm of
adjustment per calibration step in the calibration
registe r. Assum ing that the oscilla tor is running at
exactly 32,768Hz, each of the 31 increments in the
Calibration byte would represent +10.7 or –5.35
seconds per month which corresponds to a total
range of +5.5 or –2.75 minutes per month. Figure
10 illustrates a TIMEKEEPER calibration wave-
form.
Two methods are available for ascertaining how
much calibration a given M48T513Y/V may re-
quire. The first involves se tting the clock, letting it
run for a month and compari ng i t to a known accu-
rate reference and recording deviation over a fixed
period of time.
Calibration values, including the number of sec-
onds lost or gained in a given peri od, can be found
in Application Note: TIMEKEEPER CALIBRA-
TION.
M48T513Y, M48T513V
14/18
Table 12. Alarm Repeat Mode
RPT4 RPT3 RPT2 RPT1 Alarm Activated
1 1 1 1 Once per Second
1 1 1 0 Once per Minute
1 1 0 0 Once per Hour
1 0 0 0 Once per Day
1 0 0 0 Once per Month
Figure 13. Supply Voltage Protection
AI02169
VCC
0.1µF DEVICE
VCC
VSS
This allows the designer to give the end user the
ability to cali brate the clock as the environment re-
quires, even if the final product is packaged in a
non-user serviceable enclosure. The designer
could provide a simple utility that accesses the
Calibrat i on byte .
The second approach is better suited to a manu-
facturing envi ronment, and involves the use of the
IRQ/FT pin. The pin wil l toggle at 512Hz, when the
Stop bit (ST, D7 of 7FFF9h) is ’0’, the Frequency
Test bit (FT, D6 of 7FFFCh) is ’1’, the Alarm Fl ag
Enable bit (AFE, D7 of 7FFF6h) is ’0’, and the
Watchdog Steering bit (WDS, D7 of 7FFF7h) is ’ 1’
or the Watchdog Register (7FFF7h = 0) is reset.
Note: A 4 second settling time must be allowed
before reading the 512Hz output.
Any deviation from 512Hz indicates the degree
and direction of oscillator frequency shift at the test
temperature. For example, a reading of
512.010124Hz would indicate a +20 ppm oscillator
frequency error, requiring a –10 (WR001010) to be
loaded into the Calibration Byte for correction.
Note that setting or ch anging the Calibration Byte
does not affect the Frequency test output frequen-
cy.
The IRQ/FT pin is an open d rain out put which re-
quires a pull-up resistor for proper operation. A
500-10k resistor is recommended in order to
control the r ise time. The FT bit is cleared on pow-
er-up.
BATTERY LOW WARNING
The M48T513Y/V automatically performs battery
voltage monitoring upo n power-up and at factory-
programmed time intervals of approximately 24
hours. The Battery Low (BL) bit, Bit D4 of Flags
Register 7FFF0h, will be asserted if the battery
voltage is found to be less than approximately
2.5V.
If a battery low is generated during a power-up se-
quence, this indicates that the battery is below ap-
proximately 2.5 volts and may not be able to
maintain data integrity in the SRAM. Data should
be considered suspect and verified as correct.
If a battery low indication is genera ted during the
24-hour interval check, this indicates that the bat-
tery is near end of life. However, data is not com-
promised due to the fact that a nominal VCC is
supplied.
The M48T513Y/V onl y monitors the battery when
a nominal VCC is applied to the device. Thus appli-
cations which require extensive durations in the
battery back- up mode should be powered-up peri-
odically (at least once every few mont hs) in order
for this technique to be beneficial. Additionally, i f a
battery low is indicated, data integrity should be
verified upon power-up via a checksum or other
technique.
POWER-ON DEFAULTS
Upon application of power to the device, the fol-
lowing register bits are set to a '0' state: WDS,
BMB0 - BMB4, R B0 ,RB1, AF E, ABE, W, R a n d F T .
15/18
M48T513Y, M 48T513V
Table 13. Reset AC Characteristics
(TA = 0 to 70 °C, VCC = 3.0V to 3.6V or VCC = 4.5V to 5.5V)
Note: 1. CL = 5pF (see Fi gure 4)
Symbol Parameter Min Max Unit
tRRSTIN Low to RST Low 20 100 ms
tRHRZ (1) RSTIN High to RST Hi-Z 40 200 ms
Figure 14. RSTIN Timing Waveform
AI02585
tRHRZ
RSTIN
RST
tR
Hi-Z Hi-Z
POWER SUPPLY DECOUPLING
and UNDERSHOO T PROTECTION
Note: ICC tr ansients , includi ng t hose produced by
output switching, can produce voltage fluctua-
tions, resulting in spikes on the VCC bus. These
transients can be reduced if capacitors are used to
store energy, which stabilizes the VCC bus. The
energy stored in the bypass c apacitors will be re-
leased as low going spikes are generat ed or ener-
gy will be absorbed when overshoots occur. A
ceramic by pass capacitor v alue of 0. 1 microfarad
is recommended in order to provide the needed fil-
tering. In addition t o transients that are c aused by
normal SRAM operation, power cycling can gener-
ate negative v ol tage s pikes on VCC that drive it to
values be low VSS by as m uch as one volt. These
negative spikes can cause data corruption in the
SRAM while in battery backup mode. To protect
from these voltage spikes, ST recommends con-
necting a schottky diode from VCC to VSS (cathode
connected to VCC, anode to VSS). (Schottky diode
1N5817 is recommended for through hole and
MBRS120T3 i s recommended for surface mount).
M48T513Y, M48T513V
16/18
Table 14. Ordering Information Scheme
For a list of availabl e options (S peed, P ack age, et c...) or for further information on any aspect of this de-
vice, pleas e contact the ST Sales Office nearest to you.
Example: M48T513Y -70 PM 1
Device Type
M48T
Supply Voltage and Write Protect Voltage
513Y = VCC = 4.5V to 5.5V; VPFD = 4.2V to 4.5V
513V = VCC = 3.0V to 3.6V; VPFD = 2.7V to 3.0V
Speed
-70 = 70ns
-85 = 85 ns
Package
PM = PMLDIP36
Temperature Range
1 = 0 to 70 °C
Table 15. Revision History
Date Revision Details
July 1998 First Issue
12/01/99
M48T513Y: VPFD (Min) changed
Paragraph "SETTING ALARM CLOCK" changed
M48T513Y: ICC Max changed (Table 6A)
M48T513V: ICC Max changed (Table 6B)
Figure 4 changed
tFB changed (Figure 5, Table 8)
tREC added (Figure 5, Table 8)
Paragraph "WATCHDOG TIMER" changed
Paragraph "POWER-ON RESET" changed
Paragraph "BATTE RY LOW WAR NING " changed
Figure 12 change d
Table Title changed (Table 13)
17/18
M48T513Y, M 48T513V
Table 16. PMLDIP36 - 36 pin Long Plastic Module DIP, Package Me chanic al Data
Symb mm inches
Typ Min Max Typ Min Max
A 9.27 9.52 0.365 0.375
A1 0.38 0.015
B 0.43 0.59 0.017 0.023
C 0.20 0.33 0.008 0.013
D 52.58 53.34 2.070 2.100
E 18.03 18.80 0.710 0.740
e1 2.30 2.81 0.090 0.110
e3 38.86 47.50 1.530 1.870
eA 14.99 16.00 0.590 0.630
L 3.05 3.81 0.120 0.150
S 4.45 5.33 0.175 0.210
N36 36
Figure 15. PMLDIP36 - 36 pin Long Plas tic Module DIP, Packag e Outline
Drawing is not to scale.
PMDIP
A1
A
L
Be1
D
E
N
1
eA
e3
S
C
M48T513Y, M48T513V
18/18
Info rm ation furnished is bel i eved to be ac curate an d rel i able. However, STMicro el ectro ni cs assumes no responsibility for the consequences
of use of such information nor for any inf ringement of patents or other rights of third parties which may result from its use. No license is grant ed
by i m pl i cation or oth erwise under any pat ent or paten t ri ghts of STMic roelec tr onics. Speci fications ment i oned in this publicati on are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as c ri t i cal comp onents in l i f e support devices or systems without express writ ten appr oval of STM i croelectronics.
The ST logo is re gi stered trade m ark of STMi croelectronics
1999 STMicroelectronics - All Right s Reserv ed
All other na m es are the property of their respectiv e owners.
STMic ro electro n ics GR O UP OF COMPANIES
Australia - Brazil - China - Finland - F rance - Germany - Hong K o ng - India - It al y - Japan - Ma la ysia - Malta - Morocco -
Sin gapore - S pai n - Sweden - Swit zerland - United Kingdom - U.S. A.
http://www.st.com