LP5904 LP5904 Ultra Low Noise, 200 mA Linear Regulator for RF/Analog Circuits Requires No Bypass Capacitor Literature Number: SNVS637D LP5904 Ultra Low Noise, 200 mA Linear Regulator for RF/Analog Circuits - Requires No Bypass Capacitor General Description Key Specifications The LP5904 is a linear regulator capable of supplying 200 mA output current. Designed to meet the requirements of RF/ Analog circuits, the LP5904 device provides low noise, high PSRR, low quiescent current, and low line transient response figures. Using new innovative design techniques the LP5904 offers class-leading device noise performance without a noise bypass capacitor and the ability for remote output capacitor placement. An internal pulldown resistor of 280 is wired from the output to ground pins to facilitate discharging of the output at device disable. The device is designed to work with a 1.0 F input and a 1.0 F output ceramic capacitor. (No Bypass Capacitor is required.) The device is available in a micro SMD package. For other package options contact your local NSC sales office. This device is available between 1.2V and 4.4V in 25 mV steps. Please contact National Semiconductor Sales for specific voltage option needs. Features Stable with 1.0 F Ceramic Input and Output Capacitors No Noise Bypass Capacitor Required Remote Output Capacitor Placement Thermal-overload and short-circuit protection -40C to +125C junction temperature range for operation Input voltage range Output voltage range Output current Low output voltage noise @ 200 mA PSRR Output voltage tolerance Virtually zero IQ (disabled) Very low IQ (enabled) Startup time Low dropout 2.2V to 5.5V 1.2V to 4.4V 200 mA 6.5 VRMS 75 dB at 1kHz 2% <1 A 11 A 55 s 95 mV typ. Package 4-Bump micro SMD (lead free) 0.815 mm x 0.815 mm x 0.600 mm Applications Cellular phones PDA handsets Wireless LAN devices Typical Application Circuit 30110401 (c) 2011 National Semiconductor Corporation 301104 www.national.com LP5904 Ultra Low Noise, 200 mA Linear Regulator for RF/Analog Circuits - Requires No Bypass Capacitor September 14, 2011 LP5904 Connection Diagrams 4-Bump Thin micro SMD Package NS Package Number TMD04AAA 30110402 The actual physical placement of the package marking will vary from part to part. Pin Descriptions micro SMD Pin No. Symbol A1 VIN Name and Function A2 VOUT Output voltage. A 1.0 F Low ESR capacitor should be connected to this pin. Connect this output to the load circuit. An internal 280 discharge resistor prevents a charge remaining on VOUT when disabled. B1 VEN Enable input; disables the regulator when 0.4V. Enables the regulator when 1.2V. An internal 1m pulldown resistor connects this input to ground. B2 GND Common ground. Input voltage supply. A 1.0 F capacitor should be connected at this input. Ordering Information micro SMD Package (Lead Free) Output Voltage (V) Supplied As 250 tape and reel 3000 tape and reel 1.8* LP5904TME-1.8/NOPB LP5904TMX-1.8/NOPB 2.5* LP5904TME-2.5/NOPB LP5904TMX-2.5/NOPB 2.6* LP5904TME-2.6/NOPB LP5904TMX-2.6/NOPB 2.8 LP5904TME-2.8/NOPB LP5904TMX-2.8/NOPB 2.85 LP5904TME-2.85/NOPB LP5904TMX-2.85/NOPB 3.0* LP5904TME-3.0/NOPB LP5904TMX-3.0/NOPB 3.1 LP5904TME-3.1/NOPB LP5904TMX-3.1/NOPB 3.2* LP5904TME-3.2/NOPB LP5904TMX-3.2/NOPB *Not yet released -- contact NSC sales office for sample availability. **Contact your local NSC Sales Office for availability of other voltage options. www.national.com 2 Operating Ratings 2) VIN: Input Voltage Range VEN: Enable Voltage Range If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. VIN Pin: Input Voltage VOUT Pin: Output Voltage VEN Pin: Enable Input Voltage 2.2V to 5.5V 0 to (VIN + 0.3V) to 5.5V (max) 0 to 200 mA Recommended Load Current (Note 5) Junction Temperature Range (TJ) Ambient Temperature Range (TA) (Note 5) -0.3 to 6.0V -0.3 to (VIN + 0.3V) to 6.0V (max) -0.3 to (VIN + 0.3V) to 6.0V (max) Continuous Power Dissipation (Note 3) Junction Temperature (TJMAX) Storage Temperature Range Maximum Lead Temperature (Soldering, 10 sec.) ESD Rating (Note 4) Human Body Model Machine Model (Note 1), (Note 2) -40C to +125C -40C to +85C Thermal Properties Junction to Ambient Thermal Resistance JA (Note 6) JEDEC Board (micro SMD) 119.6C/W (Note 16) 4L Cellphone Board (micro SMD) 186.5C/W Internally Limited 150C -65 to 150C 260C 2kV 200V Electrical Characteristics Limits in standard typeface are for TA = 25C. Limits in boldface type apply over the full operating junction temperature range (-40C TJ +125C). Unless otherwise noted, specifications apply to the LP5904 Typical Application Circuit (pg. 1) with: VIN = VOUT (NOM) + 1.0V, VEN = 1.2V, CIN = 1.0 F, COUT = 1.0 F, IOUT = 1.0 mA. (Note 2, Note 7) Symbol VIN Parameter Output Voltage Tolerance VOUT ILOAD IQ IG Line Regulation Min VIN = (VOUT(NOM) + 1.0V) to 5.5V, IOUT = 1mA to 200 mA Short Circuit Current Limit Power Supply Rejection Ratio (Note 15) Output Noise Voltage (Note 15) TSHUTDOWN Thermal Shutdown 2 % %/V 0.002 %/mA 200 200 VEN = 1.2V, IOUT = 0 mA 11 20 VEN = 1.2V, IOUT = 200 mA 250 325 VEN = 0.3V (Disabled) 0.2 1.0 IOUT = 0 mA (VEN = 1.2V) 12.2 VOUT = 2.8V; IOUT = 100 mA 45 VOUT = 2.8V; IOUT = 200 mA 95 (Note 12) 220 450 f = 100 Hz, IOUT = 200 mA 85 f = 1 kHz, IOUT = 200 mA 75 f = 10 kHz, IOUT = 200 mA 65 f = 100 kHz, IOUT = 200 mA 30 f = 2MHz, IOUT = 200 mA eN -2 0 Maximum Output Current ISC V 0.16 (Note 9) Dropout Voltage (Note 10) Units 5.5 VIN = (VOUT(NOM) + 1.0V) to 5.5V, IOUT = 1 mA IOUT = 1mA to 200 mA Ground Current (Note 13) Typ 0.06 Load Current Quiescent Current (Note 11) Max 2.2 VIN = (VOUT(NOM) + 1.0V) to 5.0V, IOUT = 1 mA Load Regulation VDO PSRR Conditions Input Voltage BW = 10 Hz to 100 kHz A A 150 mV mA dB 30 IOUT = 1mA 10 IOUT = 200 mA 6.5 Temperature 160 Hysteresis 15 3 mA VRMS C www.national.com LP5904 Absolute Maximum Ratings (Note 1, Note LP5904 Symbol Parameter Conditions Min Typ Max Units 0.4 V LOGIN INPUT THRESHOLDS VIL Low Input Threshold (VEN) VIN = 2.2V to 5.5V VIH High Input Threshold (VEN) VIN = 2.2V to 5.5V IEN Input Current at VEN Pin (Note 14) VEN = 5.5V and VIN = 5.5V 5.5 VEN = 0.0V and VIN = 5.5V 0.001 V 1.2 A TRANSIENT CHARACTERISTICS VIN = (VOUT(NOM) + 1.0V) to (VOUT(NOM) + 1.6V) Line Transient (Note 15) VOUT in 30 s, IOUT = 1mA -2 mV VIN = (VOUT(NOM) + 1.6V) to (VOUT(NOM) + 1.0V) 2 in 30 s, IOUT = 1mA Load Transient (Note 15) IOUT = 1mA to 200 mA in 10 s -50 mV IOUT = 200 mA to 1mA in 10 s 50 Overshoot on Startup (Note 15) Stated as a percentage of nominal VOUT 2 % Turn-on Time To 95% of VOUT(NOM) 300 s 55 Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All voltages are with respect to the potential at the GND pin. Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 k resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. MIL-STD-883 3015.7 Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (JA), as given by the following equation: TA-MAX = TJ-MAX-OP - (JA x PD-MAX). See applications section. Note 6: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm. Note 8: CIN, COUT: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. Note 9: The device maintains a stable, regulated output voltage without a load current. Note 10: Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its nominal value. Note 11: Quiescent current is defined here as the difference in current between the input voltage source and the load at VOUT. Note 12: Short Circuit Current is measured with VOUT pulled to 0V and VIN worst case = 6.0V. Note 13: Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device. Note 14: There is a 1M resistor between VEN and ground on the device. Note 15: This specification is guaranteed by design. Note 16: Detailed description of the board can be found in JESD51-7 Output & Input Capacitors Symbol Parameter CIN Input Capacitance (Note 15) COUT Output Capacitance (Note 15) ESR Output/Input Capacitance (Note 15) Conditions Capacitance for stability Min Nom 0.5 1.0 0.5 1.0 5 Max 10 500 Units F m Note: The minimum capacitance should be greater than 0.5 F over the full range of operating conditions. The capacitor tolerance should be 30% or better over the full temperature range. The full range of operating conditions for the capacitor in the application should be considered during device selection to ensure this minimum capacitance specification is met. X7R capacitors are recommended however capacitor types X5R, Y5V and Z5U may be used with consideration of the application and conditions. www.national.com 4 LP5904 Block Diagram 30110406 5 www.national.com Unless otherwise noted, VOUT = 2.8V, VIN = 3.8V, EN = 1.2V, CIN = 1.0 F, COUT = 1.0 F, TA = 25C. Iq vs. VIN Ground Current vs. Temperature 250 50 -40C 25C 85C 125C 45 200 40 30 Dropout Region IIN (A) IQ (A) 35 25 20 150 100 15 50 10 5 0 0 2.2 2.7 3.2 3.7 4.2 VIN (V) 4.7 5.2 0 5.7 50 100 150 IOUT (mA) 200 Ground Current vs. Voltage 350 250 30110461 30110460 VOUT vs. Load Normalized to 100 mA VIN = 3.0V VIN = 3.8V VIN = 4.2V VIN = 5.5V 300 VOUT (V) 250 200 150 100 50 0 0 50 100 150 200 IOUT (mA) 250 300 30110403 30110462 VOUT vs. IOUT VOUT vs. VIN 2.840 2.820 2.840 50 A 500 A 1mA 10 mA 100 mA 200 mA 2.800 2.800 VOUT (V) 2.780 2.780 2.760 2.740 3.5 2.760 4.0 4.5 VIN (V) 5.0 2.740 5.5 30110463 www.national.com VIN = 3.8V VIN = 5.0V VIN = 5.5V 2.820 VOUT (V) LP5904 Typical Performance Curves 0 50 100 IOUT (mA) 150 200 30110464 6 2.840 LP5904 VOUT vs IOUT Startup, No Load -40C 25C 85C 100C 2.820 VOUT (V) 2.800 2.780 2.760 2.740 0 50 100 150 IOUT OVER TEMPERATURE 200 30110442 30110465 Startup, Load = 28 Startup, Load = 14 30110443 30110444 Load Transient Line Transient Load = 1mA, VOUT = 2.8 at VIN Rising Edge 30110445 30110412 7 www.national.com Line Transient Load = 200 mA, VOUT = 2.8 at VIN Rising Edge 30110413 30110414 Line Transient Load = 200 mA, VOUT = 2.8 at VIN Falling Edge Dropout Voltage vs. Load Current 120 100 DROPOUT (mV) LP5904 Line Transient Load = 1mA, VOUT = 2.8 at VIN Falling Edge 80 60 40 20 0 0 50 100 IOUT (mA) 150 200 30110415 30110466 PSRR 30110446 www.national.com 8 10 LP5904 Output Noise Spectral Density, VOUT = 2.8V Turn On Time, 1 mA Load VOUT = 2.8V, VIN = 3.93V (Battery) Load = 0mA Load = 1mA Load = 50mA V/(Hz) 1 .1 .01 .001 10 100 1000 10000 FREQUENCY (Hz) 100000 30110416 30110467 Turn OFF Time, no Load, VOUT = 3.3V Turn OFF Time, 1 mA Load VOUT = 3.3V 30110419 30110418 Turn OFF Time, 200 mA Load VOUT = 3.3V Turn OFF Time, VEN = VIN at No Load VOUT = 3.3V 30110421 30110420 9 www.national.com LP5904 Turn OFF Time, VEN = VIN at 200 mA VOUT = 3.3V Inrush, VIN = (VOUT(NOM)) + 1V, VOUT = 3.3V, IOUT = 100 A 30110422 Inrush, VIN = (VOUT(NOM)) + 1V, VOUT = 3.3V, IOUT = 200 mA 30110423 VEN Ramp Down vs. VOUT at 1mA Load VOUT = 3.3V 30110424 30110425 VEN Ramp Down vs. VOUT at 200 mA Load VOUT = 3.3V Inrush, VIN Ramp at 1mA Load VOUT = 2.8V, VIN = 3.8V, TRISE = 100 ms 30110426 www.national.com 30110417 10 LP5904 Supply Ramping VEN = VIN = (VOUT + 1V) vs. VOUT at IOUT = 200 mA, VOUT = 3.3V Supply Ramping VEN = VIN = (VOUT + 1V) vs. VOUT at IOUT = 100 A, VOUT = 3.3V 30110427 30110428 VEN Ramping vs VOUT at IOUT = 100 A, VIN = (VOUT + 1V), VOUT = 3.3V VEN Ramping vs VOUT at IOUT = 200 mA, VIN = (VOUT + 1V), VOUT = 3.3V 30110429 30110430 High Inrush due to Fast Power-On (VIN = VEN) Such as in Hot-Plug No Inrush Current in Normal Power-On due to System Capacitance Showing VIN Ramping 30110409 30110405 11 www.national.com LP5904 and with ESR between 5m to 500 m, is suitable in the LP5904 application circuit. For this device the output capacitor should be connected between the VOUT pin and a good ground connection. It may also be possible to use tantalum or film capacitors at the device output, VOUT, but these are not as attractive for reasons of size and cost (see CAPACITOR CHARACTERISTICS below). The output capacitor must meet the requirement for the minimum value of capacitance and have an ESR value that is within the range 5m to 500 m for stability. Application Hints POWER DISSIPATION AND DEVICE OPERATION The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus the power dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die and ambient air. As stated in (Note 5) of the electrical characteristics, the allowable power dissipation for the device in a given package can be calculated using the equation: REMOTE CAPACITOR OPERATION The LP5904 requires at least a 1F capacitor at output pin, but there is no strict requirements about the location of the capacitor in regards the LDO output pin. In practical designs the output capacitor may be located some 5-10 cm away from the LDO. This means that there is no need to have a special capacitor close to the output pin if there is already respective capacitor(s) in the system (like a capacitor at the input of supplied part). The Remote Capacitor feature helps user to minimize the number of capacitors in the system. As a good design practice, it is good to keep the wiring parasitic inductance at a minimum, which means to use as wide as possible traces from the LDO output to the capacitor(s), keeping the LDO trace layer as close as possible to ground layer and avoiding vias on the path. If there is a need to use vias, implement as many as possible vias between the connection layers. The recommendation is to keep parasitic wiring inductance less than 35 nH. For the applications with fast load transients, it is recommended to use an input capacitor equal to or larger to the sum of the capacitance at the output node for the best load transient performance. The actual power dissipation across the device can be represented by the following equation: PD = (VIN - VOUT) x IOUT This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage drop across the device, and the continuous current capability of the device. These two equations should be used to determine the optimum operating conditions for the device in the application. EXTERNAL CAPACITORS Like any low-dropout regulator, the LP5904 requires external capacitors for regulator stability. The LP5904 is specifically designed for portable applications requiring minimum board space and smallest components. These capacitors must be correctly selected for good performance. INPUT CAPACITOR An input capacitor is required for stability. The input capacitor should be at least equal to, or greater than, the output capacitor for good load transient performance. At least a 1.0 F capacitor has to be connected between the LP5904 input pin and ground for stable operation over full load current range. Basically, it is ok to have more output capacitance than input, as long as the input is at least 1.0 F. This capacitor must be located a distance of not more than 1cm from the input pin and returned to a clean analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input. Important: To ensure stable operation it is essential that good PCB practices are employed to minimize ground impedance and keep input inductance low. If these conditions cannot be met, or if long leads are to be used to connect the battery or other power source to the LP5904, then it is recommended to increase the input capacitor to at least 10 F. Also, tantalum capacitors can suffer catastrophic failures due to surge current when connected to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input, it must be guaranteed by the manufacturer to have a surge current rating sufficient for the application. There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain 1.0 F 30% over the entire operating temperature range. CAPACITOR CHARACTERISTICS The LP5904 is designed to work with ceramic capacitors on the input and output to take advantage of the benefits they offer. For capacitance values in the range of 0.5 F to 10 F, ceramic capacitors are the smallest, least expensive and have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a typical 1.0 F ceramic capacitor is in the range of 20 m to 40 m, which easily meets the ESR requirement for stability for the LP5904. The temperature performance of ceramic capacitors varies by type and manufacturer. Most large value ceramic capacitors (2.2 F) are manufactured with Z5U or Y5V temperature characteristics, which results in the capacitance dropping by more than 50% as the temperature goes from 25C to 85C. A better choice for temperature coefficient in a ceramic capacitor is X7R. This type of capacitor is the most stable and holds the capacitance within 15% over the temperature range. Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance and voltage ratings in the 0.5 F to 10 F range. Another important consideration is that tantalum capacitors have higher ESR values than equivalent size ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about 2:1 as the temperature goes from 25C down to -40C, so some guard band must be allowed. OUTPUT CAPACITOR The LP5904 is designed specifically to work with a very small ceramic output capacitor, typically 1.0 F. A ceramic capacitor (dielectric types X5R or X7R) in the 0.5 F to 10 F range, www.national.com 12 For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the micro SMD device. ENABLE CONTROL The LP5904 may be switched ON or OFF by a logic input at the ENABLE pin. A high voltage at this pin will turn the device on. When the enable pin is low, the regulator output is off and the device typically consumes 3nA. However if the application does not require the shutdown feature, the VEN pin can be tied to VIN to keep the regulator output permanently on. A 1m pulldown resistor ties the VEN input to ground, this ensures that the device will remain off when the enable pin is left open circuit. To ensure proper operation, the signal source used to drive the VEN input must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. MICRO SMD LIGHT SENSITIVITY Exposing the micro SMD device to direct light may cause incorrect operation of the device. Light sources such as halogen lamps can affect electrical performance if they are situated in proximity to the device. Light with wavelengths in the red and infrared part of the spectrum have the most detrimental effect; thus, the fluorescent lighting used inside most buildings has very little effect on performance. MICRO SMD MOUNTING The micro SMD package requires specific mounting techniques, which are detailed in National Semiconductor Application Note AN-1112. 13 www.national.com LP5904 NO-LOAD STABILITY The LP5904 will remain stable and in regulation with no external load. LP5904 Physical Dimensions inches (millimeters) unless otherwise noted 4-Bump Thin micro SMD Package NS Package Number TMD04AAA The dimensions for X1, X2 and X3 are given as: X1 = 0.815 mm 0.030 mm X2 = 0.815 mm 0.030 mm X3 = 0.600 mm 0.075 mm www.national.com 14 LP5904 Notes 15 www.national.com LP5904 Ultra Low Noise, 200 mA Linear Regulator for RF/Analog Circuits - Requires No Bypass Capacitor Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Design Support Amplifiers www.national.com/amplifiers WEBENCH(R) Tools www.national.com/webench Audio www.national.com/audio App Notes www.national.com/appnotes Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns Data Converters www.national.com/adc Samples www.national.com/samples Interface www.national.com/interface Eval Boards www.national.com/evalboards LVDS www.national.com/lvds Packaging www.national.com/packaging Power Management www.national.com/power Green Compliance www.national.com/quality/green Switching Regulators www.national.com/switchers Distributors www.national.com/contacts LDOs www.national.com/ldo Quality and Reliability www.national.com/quality LED Lighting www.national.com/led Feedback/Support www.national.com/feedback Voltage References www.national.com/vref Design Made Easy www.national.com/easy www.national.com/powerwise Applications & Markets www.national.com/solutions Mil/Aero www.national.com/milaero PowerWise(R) Solutions Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors SolarMagicTM www.national.com/solarmagic PLL/VCO www.national.com/wireless www.national.com/training PowerWise(R) Design University THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION ("NATIONAL") PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL'S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS. EXCEPT AS PROVIDED IN NATIONAL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders. Copyright(c) 2011 National Semiconductor Corporation For the most current product information visit us at www.national.com National Semiconductor Americas Technical Support Center Email: support@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Technical Support Center Email: europe.support@nsc.com National Semiconductor Asia Pacific Technical Support Center Email: ap.support@nsc.com National Semiconductor Japan Technical Support Center Email: jpn.feedback@nsc.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated