1 November 01, 2001
UL62H1616B
Preliminary
F65536 x 16 bit static CMOS RAM
F15 and 20 ns Access Time
FCommon data inputs and
data outputs
FThree-state outputs
FStandby curre nt < 50 µA at 1 25°C
FPower supply voltage 2.5 V
FOperating temperature range
K-Type:-40 °C to 85 °C
A-Type:-40 °C to 125 °C
FCECC 90000 Qua lity Standard
FESD protection > 2000 V
(MIL STD 883C M3015.7)
FLatch-up im mun ity >100 mA
FPackage: SOP44 (525 m il)
The UL62H1616B is a static RAM
manufactured using a CMOS pro-
cess technology with the following
operating modes:
- Lower / Upper Byte Read
- Word Read
- Lower / Upper Byte Write
- Word Write
- Standby
- Data Retention
The memory array is based on a
6-Transistor cell.
The circuit is activated by the fal-
ling edge of E. The address and
control inputs open simul taneously.
According to the information of W
and G, the data inputs, or outputs,
are active. During the active state
E = L and W = H each address
change lead s to a new Read cycle.
In a Read cycle, the data outputs
are activated by the falling edge of
G. If LB = L the data lower byte will
be available at the outputs DQ0-
DQ7, on UB = L the data upper
byte appear at the outputs DQ8-
DQ15. After the address change,
the data outputs go High-Z until the
new information is available. The
data outputs have no preferred
st ate. The Read cycle is finished by
the falling edge of W, or by the
rising edge of E, respecti ve ly.
Data retention is guaranteed down
to 2 V. With the exception of E, all
inputs consist of NOR gates, so
that no pull-up/pull-down resistors
are required.
Lo w Voltage Autom o tive Fast 64K x 16 SRAM
Pin Confi gur a tion
Top View
Signal Name Signa l Description
A0 - A15 Address Inputs
DQ0 - DQ15 Data In/Out
EChip Enable
GOutpu t Enable
WWrite Enable
UB Upper Byte Enable
LB Lower Byte Enable
VCC Power Supply Volta ge
VSS Ground
n.c. not connecte d
Pin Description
1
A4
VCC
35
2A3 A6
34
4A1 G
32
5A0 UB
31
3A2 A7
33
6E
A5
30
7DQ0 LB
29
8DQ1 DQ15
28
12VSS
A8
24
9DQ2
DQ9
27
10DQ3
DQ8
26
11VCC
n.c.
25
13DQ4
A9
23
14DQ5
A10
38
SOP
15
16
17
18
19
20
22
21
36
37
39
40
41
42
43
44
DQ7
W
A15
A14
A13
A12
n.c.
DQ6
DQ14
DQ13
DQ12
VSS
DQ11
DQ10
n.c.
A11
Features Description
2 November 01, 200 1
UL62H1616B Preliminary
Operating Mode E W G LB UB DQ0-DQ7 DQ8-DQ15
Standby/not selected H * * * * High-Z High-Z
Internal Read L
LH
*H
**
H*
HHigh-Z High-Z
Lower Byte Read L H L L H Data Outputs Low-Z High-Z
Upper Byte Read L H L H L High-Z Data Outputs Low-Z
Word Read L H L L L Data Outputs Low-Z Data Outputs Low-Z
Lower Byte Write L L * L H Data Inputs High-Z High-Z
Upper Byte Write L L * H L High-Z Data Inputs High-Z
Word Write L L * L L Data Inputs High-Z Data Inp uts Hig h-Z
Truth Tabl e
Block Diagram
Maxim um Rati ngs Symb ol Min. Max. U nit
Power Supply Voltage VCC -0.3 3.6 V
Input Voltage VI-0.3 VCC + 0.3 V
Outp ut Voltage VO-0.3 VCC + 0.3 V
Power Dissipation PD-1W
Operating Temperature K-Type
A-Type Ta-40
-40 85
125 °C
Storage Temperature Tstg -65 150 °C
Outp ut Short-Circuit Current
at VCC = 2.5 V and VO = 0 V** | IOS | 100 mA
Characteristics
**Not more than 1 output should be shorted at the same time. Duration of the short circuit should not exceed 30 s.
All vol tages are referenc ed to VSS = 0 V (ground).
All characteristics are valid in the power supply voltage range and in the operating temperature range specified.
Dynamic measurements are based on a rise and fall time of 5 ns, measured between 10 % and 90 % of VI,as well as
input levels of VIL = 0 V and VIH = 2.5 V. The timing re ference level of all input and output signal s is 1.2 V,
with the exception of the tdis-tim e s an d ten-times, in which cases transition is measured ±200 mV from steady-state voltage.
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
VCC VSS W GE
Row Address
Inputs
Column Address
Inputs
Address
Change
Detector
Column Decode r Row Decode r
Sense Ampl ifi er/
Write Control Logic
Clock
Generator
Common Data I/O
Memory Cell
Array
512 Rows x
128 x 16 Col um n s
A0
A1
A2
A3
A10
A5
A6
A7
A8
A9
A4
A11
A12
A13
A14
A15
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
UB LB
*H or L
3 November 01, 2001
UL62H1616B
Preliminary
Recommended
Operating Conditions Symbol Conditions Min. Max. Unit
Power Supply Voltage VCC 2.3 2.7 V
Input Low V ol t age*VIL -0.2 0.6 V
Input High V ol tage VIH 2.0 VCC + 0.2 V
Electrical Characteristic s Symbol Conditions Min. Max. Unit
Suppl y Current - Operating Mode
Suppl y Current - Standby Mode
(CMOS level)
Suppl y Current - Standby Mode
(LVTTL level)
ICC(OP)
ICC(SB)
ICC(SB)1
VCC
VIL
VIH
tcW
tcW
tcW
VCC
VE
VCC
VE
K-Type
A-Type
= 2.7 V
= 0.6 V
= 2.0 V
= 35 ns
= 55 ns
= 60 ns
= 2.7 V
= VCC - 0.2 V
= 2.7 V
= 2.0 V
90
70
60
50
10
20
mA
mA
mA
µA
mA
mA
Outpu t High Vo ltage
Outpu t Low Vol tage
VOH
VOL
VCC
IOH
VCC
IOL
= 2.3 V
=-0.5 mA
= 2.3 V
= 0.5 mA
2.0
0.4
V
V
Input High Leakage Current
Input Low Leakage Current
IIH
IIL
VCC
VIH
VCC
VIL
= 2.7 V
= 2.7 V
= 2.7 V
= 0 V -2
A
µA
Outpu t High Current
Outpu t Low Current
IOH
IOL
VCC
VOH
VCC
VOL
= 2.3 V
= 2.0 V
= 2.3 V
= 0.4 V 0.5
-0.5 mA
mA
Outpu t Leakage Current
High at Three-State Outputs
Low at Three-St ate Outputs
IOHZ
IOLZ
VCC
VOH
VCC
VOL
= 2.7 V
= 2.7 V
= 2.7 V
=0 V -2
A
µA
* -2 V at Pulse Width 10 ns
4 November 01, 200 1
UL62H1616B Preliminary
Switching Characteristics
Read Cycle Symbol 15 20 Unit
Alt. IEC Min. Max. Min. Max.
Read Cycle Time tRC tcR 15 20 ns
Address Access Time to Data Valid tAA ta(A) 15 20 ns
Chip Enable Access Time to Data Valid tACE ta(E) 15 20 ns
G LOW to Data Valid tOE ta(G) 79ns
LB, U B LOW to Data V alid tBta(B) 79ns
E HIGH to Output in High-Z tHZCE tdis(E) 78ns
G HIGH to Output in High-Z tHZOE tdis(G) 78ns
LB, U B HIGH to Output in High-Z tHZB tdis(B) 78ns
E LOW to Output in Low-Z tLZCE ten(E) 44ns
G LOW to Output in Low-Z tLZOE ten(G) 00ns
LB, U B LOW to Output in Low-Z tLZB ten(B) 00ns
Output Hold T i me from Address Change tOH tv(A) 33ns
E LOW to Power-Up Time tPU 00ns
E HIGH to Power-Down Time tPD 15 20 ns
Switching Characteristics
Write Cycle Symbol 15 20 Unit
Alt. IEC Min. Max. Min. Max.
Write Cycle Time tWC tcW 15 20 ns
Write Pulse Width tWP tw(W) 10 12 ns
Write Setup Time tWP tsu(W) 10 12 ns
Address Setup Time tAS tsu(A) 00ns
Address Valid to End of Wri te tAW tsu(A-WH) 10 12 ns
Chip Enable Setup Time tCW tsu(E) 10 12 ns
Byte Enable Set up Time tBW tsu(B) 10 12 ns
Pulse Width Chip Enable to End of Write tCW tw(E) 10 12 ns
Pulse Width Byte Enable to End of Write tBW tw(B) 10 12 ns
Da ta Se tu p Time tDS tsu(D) 79ns
Data Hold Time tDH th(D) 00ns
Address Hold from End of Write tAH th(A) 00ns
W LOW to Output in High-Z tHZWE tdis(W) 78ns
G HIGH to Output in High-Z tHZOE tdis(G) 78ns
W HIGH to Output in Low-Z tLZWE ten(W) 33ns
G LOW to Output in Low-Z t LZOE ten(G) 00ns
5 November 01, 2001
UL62H1616B
Preliminary
Data Retention Mode
E - controlled
Data Retention
2.3 V
tsu(DR) trec
VCC
E
VCC(DR) 1.5 V
0 V
2.0 V
2.0 V
VCC(DR) - 0.2 V VE(DR) VCC(DR) + 0.3 V
Data Retention
Characteristics Symbol Conditions Min. Typ. Max. Unit
Alt. IEC
Data Retention Supply Vol tage VCC(DR) 1.5 2.7 V
Data Retention Supply Current ICC(DR) VCC(DR) = 2 V
VE = VCC(DR) - 0.2 V 30 µA
Data Retention Setup Time tCDR tsu(DR) See Data Retention
Waveforms (above) 0ns
Operating Recovery Ti me tRtrec tcR ns
Tes t Co nfig urat io n f or Fu nc ti onal Chec k
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
VIH
VIL
VSS
VCC
2.5 V
481
255
30 pF1)
VO
Inp ut leve l acco rding to t he
relev ant test me asurement
Simultaneous measure-
m ent of all 16 output pins
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
E
W
G
LB
UB
1) In measurement of tdis(E),tdis(W), ten(E), ten(W), ten(G) the capacitance is 5 p F.
6 November 01, 200 1
UL62H1616B Preliminary
Capacitance Conditions Symbol Min. Max. Unit
Input Capacitance VCC
VI
f
Ta
= 2.5 V
= VSS
= 1 MHz
= 25 °C
CI7pF
Output Capacitance Co7pF
IC Code Numbers
UL62H1616 SA15
Type
Package
S = SOP44 525 mil
Oper ating Temp erature Range
K = -40 to 85 °C
A = -40 to 125 °C
Access Time
15 = 15 ns
20 = 20 ns
The date of manufacture is given by the last 4 digits of the mark, the first 2 digits indicating the year, and the last 2
digits the calendar week.
All pins not under test must be connected with ground by capacitors.
7 November 01, 2001
UL62H1616B
Preliminary
tPU
tdis(G)
tdis(E)
tcR
Previous Data Valid Output Data Valid
Address Valid
Address Valid
tsu(A)
High-Z
ten(E)
ten(G)
ta(G)
ta(E)
Read Cycle 1: Ai-c ontrolle d (during Read Cycle : E = G = VIL, W = VIH)
Read Cycle 2: G-, E-, LB-, U B-controlled (during Read Cycle: W = VIH)
ta(A)
tcR
tv(A)
Ai
DQi
Output
Ai
G
DQi
Output tPD
ICC(OP)
ICC(SB) 50 % 50 %
Output Data Valid
E
tdis(B)
ten(B)
ta(B)
LB, UB
Write Cycl e1: W-controlled
th(D)
Ai
E
LB, UB
W
DQi
G
DQi
Output
tcW
tsu(E) th(A)
tw(W)
tsu(A) tsu(D)
tdis(W) ten(W)
Address Valid
High-Z
Input Input Data Valid
tsu(B)
tsu(A-WH)
8 November 01, 200 1
UL62H1616B Preliminary
Writ e Cy cle 2: E -controlled
Input Data Valid
tsu(A)
th(D)
Ai
E
W
DQi
Input
G
DQi
Output
tcW
tw(E) th(A)
tsu(W)
tsu(D)
tdis(W)
t
en(E)
High-Z
Addres s Vali d
tsu(B)
LB, UB
tdis(G)
Write Cycle 3: LB-, UB-controlled
Input Data Valid
tsu(A)
th(D)
Ai
E
W
DQi
G
DQi
Output
tcW
tw(B) th(A)
tsu(W)
tsu(D)
tdis(W)
t
en(B)
High-Z
Address Valid
tsu(E)
LB, UB
tdis(G)
L- to H-level undefined H- to L-leve l
The information describes the type of component and shall not be considered as assured characteristics.Terms of
delivery and rights to change design rese rved.
Input
Zentrum Mikroelektronik Dresden AG
Grenzstra ße 28 D-01109 Dresden P. O. B. 80 01 34 D-01101 Dresden Germany
Phone: +49 351 8822 306 Fax: +49 351 8822 337 Email: sales@zmd.de http://www.zmd.de
November 01, 2001
UL62H1616B
Preliminary
LIFE S U PP O R T POLI CY
ZMD products are not designed, intended, or authorized for use as components in systems intended for surgical
implant into the body, or o ther application s intended to support or sustain life, or for any other application in which
the failure of the ZMD product could create a situation where personal injury or death may occur.
Componen ts used in life-s upport devices or systems must be expressly authorized by ZMD for such purpose.
LIMITED WARRANTY
The information in this document has been carefully checked and is believed to be reliable. However Zentrum
Mikroelektronik Dresden AG (ZMD) makes no guarantee or warranty concerning the accuracy of said in formation
and shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it.
The inform ation in this docum ent des cribes t he t ype of comp onent and sh all not be c onsidere d as ass ured charac-
teristics.
ZMD does not guarantee that the use of any information contained herei n will not infringe upon the patent, trade-
mark, copyright, mask work right or other rights of third parties, and no patent or licence is implied hereby. This
document does not in any way extent ZMD’s warranty on any product beyond that set forth in its standard terms and
condition s of sale.
ZMD reserves terms of delivery and reserves the right to make changes in the products or specifications, or both,
presented in this publication at any time and without notice.