REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 03-06. Add U package. Changes 93-02-19 M. A. Frye to Table I and Figures 1, 3, and 4. Editorial changes throughout. REV SHEET REV SHEET REV STATUS REV A A A A A A A A A OF SHEETS SHEET 1 4 5 6 7 9 10 | 11 12 PREPARED BY PMIC N/A Gary L. Gross DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 STANDARDIZED CHECKED BY MILITARY Ray Monnin DRAWING APPROVED ow MICROCIRCUITS, MEMORY, DIGITAL, CMOS THIS DRAWING IS AVAILABLE Michael A. Frye 32K X 8-BIT UVEPROM, MONOLITHIC FOR USE BY ALL DEPARTMENTS SILICON AND AGENCIES OF THE DRAWING APPROVAL DATE DEPARTMENT OF DEFENSE 91-03-29 SIZE CAGE CODE 5962-89817 AMSC N/A REVISION LEVEL A 67268 A SHEET 1 oF 12 4 DESC FORM 108 JuL 91 5962-E074-931. SCOPE 1.1 Scope. This drawing describes device requirements for class 8 microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non~JAN devices". 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 2962-89817 tL x. xX | | | | { | Drawing number Device type Case outline Lead finish per (see 1.2.1) (see 1.2.2) MIL-M-38510 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 32K x 8 UVEPROM 55 ns 02 32K x 8 UVEPROM 45 ns 03 32K x 8 UVEPROM 35 ns 04 32K x 8 UVEPROM 55 ns 05 32K x 8 UVEPROM 45 ns 06 32K x 8 UVEPROM 35 ns 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminais Package style X GD1IP4-T28 or CD1P3-T28 28 Dual~in-line 2/ Y GDFP2-F28 28 Flat pack 2/ Zz cacci-N32 32 Rectangular leadless chip carrier 2/ U GD1IP1-T28 or CDIP2-T28 28 Dual-in-Line 2/ 1.3 Absolute maximum ratings. Supply voltage range - - - ------------- -0.5 V de to +7.0 V de DC voltage applied to outputs in high Z state - -- -0.5 V de to +7.0 V de DC input voltage --------+--------+---- -3.0 V de to +7.0 V de DC program voltage -~--------------- 13.0 V dc Maximum power dissipation (P,) ----------- 1.0W 3/ Lead temperature (soldering, 10 seconds maximum) - - +260C Thermal resistance, junction-to-case Oj -- 7-7 - See MIL-STD-1835 Junction temperature (Tj) ------------- +175C Storage temperature range- - - ----------- ~65C to +150C Temperature under bias - -------------- -55C to +125C Endurance ------+------+------+---- 10 cycles/byte minimum Data Retention ---~+--------------- 10 years/minimum 4.4 Recommended operating conditions. Supply voltage (V..) -- ---------2---- 4.5 V de to 5.5 V de Ground voltage (GND) - ------------+--- 0.0 Vv DC Input high voltage Wy 0 2.0 V de minimum Input Low voltage Wi cer cree ee re eee 0.8 V de maximum Case operating temperature range TQ--- 2-7 - -55C to +125C VU Generic numbers are Listed on the Standardized Military Drawing Source Approval Bulletin and will also be Listed in MIL-BUL-103. 2/ Lid shall be transparent to permit ultraviolet Light erasure. 3/ Must withstand the added Py due to short circuit test; (e.g., Ig5)- STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET A 2 DESC FORM 193A JUL 912. APPLICABLE DOCUMENTS 2.1 Government _specification, standard, and bulletin. Unless otherwise specified, the following specification, standard, and bulletin of the issue Listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MILITARY MIL-M-38510 - Microcircuits, General Specification for. STANDARDS MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-1835 - Microcircuit Case Outlines. BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMD's)~ (Copies of the specification, standard, and bulletin required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL~M-38510 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A, B, C, or D (see 4.3), the devices shall be programmed by the manufacturer prior to test. A minimum of 50 percent of the total number of cells shall be programmed or at least 25 percent of the total number of cells to any altered item drawing. 3.2.3.2 Programmed devices. The truth tables for programmed devices shall be as specified by an attached altered jtem drawing. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table 1. 3.5 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall be marked with the PIN Listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as Listed in MIL-BUL-103 (see 6.6 herein). STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET A 3 DESC FORM 193A JUL 91TABLE 1. Electrical performance characteristics. Conditions Test Symbol -55C S$ Te = +125C Group A Device Limit Unit 4.5 Vs Veg 5-5 V subgroups j type ; unless otherwise specified Min Max Output high voltage Vou Vee = 4.5 V, lon = -2.0 mA, 1,2,3 ALL 2.4 v Vin = Vine Vie Output low voltage VoL Vee = 4-5 V, Io. = 6.0 mA, 0.4 Vin = Vine Vin Input high voltage 1/ Vin 2.0 Input low voitage 1/ Voy 0.8 Input leakage current ly GND < Vin < Vee ~10 +10 HA Output leakage current Ig7 GND Vout S Vee ~40 +40 Vec = BT V Output short circuit Ios Voc 5.5 V, Vout = 0.0 Vv -20 -90 mA current 2/ 3/ Power supply current lee Vee = 5.5 V, Igyt = 0 mA, 130 Vin = 0 to 3.0_V, f= funy 4/ 3/ Standby supply current Ion Veg = 5-9 VY, cs, 2 Vig, 40 Ioyt = O mA, Vin = 2iHy Input capacitance 3/ Cry Vee = 5-0 V, 4 10 pF T= 25C, f = 1 MHz, (see 4.3.1c) Output capacitance 3/ Court Voc = 5.0 V, 4 10 T = 25C, f = 1 MHz (see 4.3.1c) Functional testing See 4.3.1e 7,8 Address to output valid taa See figures 3 and 4 and 9,10,171 01,04 55 ns note 6/ 02,05 45 03,06 35 See footnotes at end of table STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER A 4 DESC FORM 193A JUL 91TABLE I. Electrical performance characteristics - Continued. Conditions Test Symbol ~55C = T. = 4+125C Group A Device Limit Unit 4.5Vs Vec = 5.5 V subgroups | type ; unless otherwise specified Min Max Chip select inactive to tuzcs | See figures 3 and 4 and 9,10,11 01,02 30 ns high Z (Cs, and cS, only) note 6/ 3/ 7 03 25 Output enable inactive to tuz0E 04 30 high Z 3/ 7/ 05,06 35 Chip select active to tacs 01,02 30 output valid (CS, and CS, only) 03 25 04 30 Output enable active to tog output valid 05,06 25 01,04 60 Chip enable inactive to tu7ce high 2 (CE only) 3/ 7/ 02,05 50 03,06 40 01,04 60 Chip enable active to tace output valid (CE only) 02,05 50 03,06 40 Chip enable active to toy ALL 0 power up 3/ Chip enable inactive to tp 01,04 60 power down 3/ 02,05 50 03,06 40 Output hold from address toy ALL 0 change 3/ [> ~ These are absolute vatues with respect to device ground and all overshoots and undershoots due to system or tester noise are included. For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed thirty seconds. Tested initially and after any design or process changes that affect that parameter, and therefore shall be guaranteed to the Limits specified in table I. At f = fyay, the inputs are switching at 1/t,,. _ _ pevices Ui%o3 cE = 0.0 v, CS, = 3.0 V, CS, ="8.0 v; devices 04-06 CE = 0.0 V, OF = 3.0 V. AC tests are performed with input rise and fall times of 5 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 to 3.0 V, and the output load on figure 4, circuit A. Transition is measured at steady-state high level -500 mV or steady-state low Level +500 mV on the output from the 1.5 V level on the input with the output load on figure 4, circuit B. Iw IN ~ ON JON}. ~~~ IN ~ STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET A 5 DESC FORM 193A JUL 91Device Types 01 - 03 04 - 06 Case Out Lines X,Y Zz U z Terminal Number Terminal Symbol Terminal Symbot 1 A NC v NC 2 a3 Ag Mo Vpp 3 A A A A 7 8 7 12 4 A A A A 6 7 6 7 5 A A A A 5 6 5 6 6 A A A A 4 5 4 5 7 A A A A 3 4 3 4 8 A A A A 2 3 2 3 9 Ay Ad Ay A 10 Ag Ay Ag Ay 11 05 A 09 x 12 0} ne 0, N 13 0 % 0 % 14 GND 0, cho 04 15 0 0 0. 16 o cho of cho 17 05 NC 05 NC 18 06 03 % 03 19 07 0, 07 Oo, 20 CE 05 CE 05 21 cs. 0% Ado 06 22 cs, 0, OE 0, 23 A CE A CE 14 11 24 Adz CS5 Ag Aig 25 A cs. A OE 26 Any ne! a, NC 27 Ang Ang Ady, Aang 28 A v A cc 13 cc 9 29 -- Ayo --- Ag 30 Aaa Aas 31 - Ang "- Ang, 32 Yee Vee FIGURE 1. Terminal connections. STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL | SHEET A 6 DESC FORM 193A JUL 91Devices 01 - 03 State Mode CS5 cS, CE Ana ~ Ag Power Outputs Programmed Read Vin Vin Vin x lee Data out Standby xX 4 Vin xX Ign High Z Output disable x Vin x x lee High Z Output disable Vn | Xx x x Tee High Z Blank check Vinp Vop ViLp x lee Ones Unprogrammed | ones Blank check Viep Vpp Vite X lee Zeros zeros Devices 04 - 06 State Mode CE OE Vpp Aaa - Ag Power Outputs Programmed Read Vor Viv x x lee Data out Standby Von x x x Ign High Z Output disable x Vin x x lee High Z Blank check Vinp | Yirp | pp xX Tee Ones Unprogrammed { ones Blank check Viip Vitp Vp x lee Zeros zeros NOTES: 1. X= Don't care 2. High Z = High-impedance state FIGURE 2. Truth table STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL | SHEET A 7 DESC FORM 193A JUL 91oO VN 5 V oO v oO T OUTPUT T CL R2 5 pF R2 (SEE vores (SEE NOTE | Circuit A Circuit B Output load Output load for tuzcs- tyzoE- and tuzce NOTE: Including scope and jig (minimum values). | | Load Circuit A Circuit B | RI 658 658 | | | | R2 403 403 | | cL 30 5 | AC test conditions | Input pulse levels GND to 3.0 V | Input rise and fall times <5ns | Input timing reference Levels | Output reference levels -= = ww << FIGURE 3. Qutput load circuits and test conditions. STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET A 8 DESC FORM 193A JUL 91POWER- DOWN Voc top ] b- toy on CONTROLLED Br_ce SUPPLY - CURRENT * 50% X 50% Ag ~ Ang ADDRESS OE, CE, ae x x CSEE NOTED tan a c HZOE J Le, C OED __ tonal fee HZCSC ED ACSCE) Og - OF PREVIOUS DATA vaLiD DATA VALID HIGH Z NOTES: _ 1. CS4 and CS, are valid for device types 01-03 only. O is valid for device types 04-06 only. 2. tuzog and tog are valid for device types 04-06 only. FIGURE 4. Switching waveforms. STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER A 9 DESC FORM 193A JUL 913.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be Listed as an approved source of supply in MIL-BUL-103 (see 6.6 herein). The certificate of compliance submitted to DESC-ECS prior to Listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-STD-883 (see 3.1 herein) and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 herein) shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DESC-ECS shali be required in accordance with MIL-STD-883 (see 3.1 herein). 3.9 Verification and review. DESC, DESC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing EPROMs. ALL testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer prior to delivery. 3.10.1 Erasure of EPROMs. When specified, devices shall be erased in accordance with the procedures and characteristics specified in 4.4. 3.10.2 Programmability of EPROMs. When specified, devices shall be programmed to the specified pattern using the procedures and characteristics specified in 4.5. 3.10.3 Verification of erasure of programmability of EPROMs. When specified, devices shall be verified as either programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all cells are in the proper state. Any cell that does not verify to be in the proper state shall constitute a device failure, and shall be removed from the Lot. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with section 4 of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD~883. (1) Test condition D using the circuit submitted with the certificate of compliance (see 3.6 herein). (2) Ty = 4125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. c. The percent defective allowable (PDA) shall be as specified in MIL-M-38510. d. A data retention stress test shall be included as part of the screening procedure and shall consist of the following steps: (Steps 1 through 4 may be performed at the wafer Level. The maximum storage temperature shall not exceed 200C for packaged devices or 300C for unassembled devices.) STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET A 10 DESC FORM 193A JUL 91Margin test method. (1) Program a minimum of 50 percent of the total number of bits (see 3.10.2). (2) Bake, unbiased, for 72 hours at +140C or for 48 hours at +150C or for 8 hours a +200C or for 2 hours at +300C for unassembled devices only. (3) Test at +25C (minimum) (see 3.10.3), including a margin test using verify mode at Vu = +4.5 V and loose timing (i.e., ta, = 1 Us). (4) Erase (see 3.10.1). (5) Program at +25C with a 50 percent pattern (checkerboard or equivalent). (6) Perform dynamic burn-in (see 4.2a). (7) Perform electrical tests at To at 25C, including a margin test using read mode at Va = + 5.7 V and Loose timing Ci.e., tana = 1 Us). (8) Perform electrical tests at To = 55C, including a margin test using read mode at Va = + 5.7 V and loose timing Ci.e., ty, = 1 Us). (9) Perform electrical tests at T, = + 125C, including a margin test using read mode at Vy = + 5.7 V and Loose. timing Ci.e., ty, = 1 ys). (10) Erase (see 3.10.1). Devices may be submitted for groups A, B, C, and D testing prior to erasure provided the devices have been 100 percent seal tested in accordance with method 5004 of MIL-STD-883. (11) Verify erasure (see 3.10.3). 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL~STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. TABLE II. Electrical test requirements, 1/ 2/ 3/ MIL-STD-883 test requirements Subgroups (per method 5005, table I) Interim electrical parameters 1 (method 5004) Final electrical test 1%,2,3,7k,8 parameters (method 5004) for unprogrammed devices Final electrical test 1%,2,3,7%,8,9 parameters (method 5004) for programmed devices Group A test requirements 1,2,3,4k%,7, (method 5005) 8,9,10,11 Groups C and D end-point 2,3,7,8A,8B electrical parameters (method 5005) 1/ * Indicates PDA applies to subgroups 1 and 7. 2/ Any or all subgroups may be combined when using high-speed testers. 3/ *k see 4.3.1. STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET A ll DESC FORM 193A JUL 914.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (C,,, and C measurements) shall be measured for the initial characterization and after any OUT : . . . process or design changes which may affect capacitance. Sample size is 15 devices with no failures, and all input and output terminals tested. d. ALL devices selected for testing shall be programmed with a checkerboard pattern or equivalent. e. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition D using the circuit submitted with the certificate of compliance (see 3.6 herein). (2) Ty = #125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4 Erasing procedure. The recommended erasure procedure for the device is exposure to shortwave ultraviolet Light which has a wavelength of 2537 angstroms (A). The integrated dose time (i.e., UV intensity x exposure time) for erasure should be a minimum pf 25 Ws/cm. The erasure time with this dosage is approximately 35 minutes using a ultraviolet lamp with a 12,000 pW/cm power rating. The device should be placed within one inch of the lamp tubes during grasure. The maximum integrated dose the device can be exposed to without damage is 7258 Ws/cm (1 week at 12,000 pW/cm). Exposure of devices to high intensity UV Light for long periods may cause permanent damage. 4.5 Programming procedures. The programming procedures shall be as specified by the device manufacturer. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-M-38510. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. When a military specification exists and the product covered by this drawing has been qualified for Listing on QPL-38510, the device specified herein will be inactivated and will not be used for new design. The QPL-38510 product shall be the preferred item for all applications. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMD's. ALL proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-STD-481 using DD Form 1693, Engineering Change Proposal (Short Form). 6.4 Record of users. Military and industrial users shall inform Defense Electronics Supply Center when a system application requires configuration control and the applicable SMD. DESC will maintain a record of users and this List will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DESC-ECS, telephone (513) 296-6021. 6.5 Comments. Comments on this drawing should be directed to DESC-ECS, Dayton, Ohio 45444, or telephone 513-296-5377. 6.6 Approved sources of supply. Approved sources of supply are Listed in MIL-BUL-103. The vendors Listed in MIL-BUL-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DESC-ECS. STANDARDIZED SIZE 5962-89817 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET A 12 DESC FORM 193A JUL 91