(0,80 mm) .0315"
MECT SERIES
MECT–110–01–M–D–RA1
MECT–135–01–M–D–RA1
MECT–115–01–M–D–RA1
Choice of
three standard
pin counts
Alignment
Pin
2x10, 2x15 and
2x35 position for
XENPAK and XFP
Transceivers
2x10 position for
Small Form Factor
Pluggable (SFP & SFP+)
Fiber Optic Transceivers
WWW.SAMTEC.COM
F-213
No. of Positions x (0,80) .0315 + (3,00) .118
(7,40)
.291
(0,80)
.0315
(0,90)
.035
(1,20)
.047
(9,10)
.358
(0,95)
.037
(2,65)
.104
(5,20)
.205
(1,05)
.041
(3,25)
.128
(1,40)
.055
DIA
No. of Positions x (0,80) .0315 + (1,40) .055
(1,40)
.055
01 02
xDIA
MECT POSITIONS
PER ROW
PLATING
OPTION D
1
10, 15, 35
OTHER
OPTION
–TR
= Tape & Reel
Packaging
RA1
CARD
THICKNESS
–01
= (1 mm) .039"
thick board
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MECT
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Sn or Au over
100µ" (2,54 µm) Ni
Operating Temp Range:
-55°C to +125°C
Current Rating:
2A per contact
@ 80°C ambient
(see website for details)
Voltage Rating:
265 VAC
RoHS Compliant:
Ye s
Processing:
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (10-35)
–M
= 15µ" (0,38 µm) Gold on contact,
Matte Tin on tail
Mates with:
SFP, SFP+, XFP or
XENPAK transceivers
Note: Some sizes, styles and
options are non-standard,
non-returnable.
SPECIFICATIONS
SFP & SFP+ TRANSCEIVER INTERFACES
APPLICATION
MECT
Press Fit, Solder Tail
or PCI Press Fit Cage
Transceiver or Patch Cable
SFPC
