BTA208X-600B
3Q Hi-Com Triac
19 September 2018 Product data sheet
1. General description
Planar passivated high commutation three quadrant triac in a SOT186A "full pack" plastic
package intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur.
This "series B" triac will commutate the full rated RMS current at the maximum rated junction
temperature without the aid of a snubber.
2. Features and benefits
3Q technology for improved noise immunity
High commutation capability with maximum false trigger immunity
High immunity to false turn-on by dV/dt
High voltage capability
Isolated mounting base package
Planar passivated for voltage ruggedness and reliability
Triggering in three quadrants only
3. Applications
Electronic thermostats
General purpose motor controls
Rectifier-fed DC inductive loads e.g. DC motors and solenoids
4. Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak off-
state voltage
- - 600 V
IT(RMS) RMS on-state current full sine wave; Th ≤ 73 °C; Fig. 1;
Fig. 2; Fig. 3
- - 8 A
full sine wave; Tj(init) = 25 °C;
tp = 20 ms; Fig. 4; Fig. 5
- - 65 AITSM non-repetitive peak on-
state current
full sine wave; Tj(init) = 25 °C;
tp = 16.7 ms
- - 71 A
Tjjunction temperature - - 125 °C
Static characteristics
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 7
2 18 50 mAIGT gate trigger current
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 7
2 21 50 mA
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 2 / 13
Symbol Parameter Conditions Min Typ Max Unit
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 7
2 34 50 mA
IHholding current VD = 12 V; Tj = 25 °C; Fig. 9 - 31 60 mA
VTon-state voltage IT = 10 A; Tj = 25 °C; Fig. 10 - 1.3 1.65 V
Dynamic characteristics
dVD/dt rate of rise of off-state
voltage
VDM = 402 V; Tj = 125 °C; (VDM = 67%
of VDRM); exponential waveform; gate
open circuit
1000 4000 - V/µs
dIcom/dt rate of change of
commutating current
VD = 400 V; Tj = 125 °C; IT(RMS) = 8 A;
dVcom/dt = 20 V/µs; (snubberless
condition); gate open circuit; Fig. 12
- 14 - A/ms
5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 T1 main terminal 1
2 T2 main terminal 2
3 G gate
mb n.c. mounting base; isolated
321
mb
TO-220F (SOT186A)
sym051
T1
G
T2
6. Ordering information
Table 3. Ordering information
PackageType number
Name Description Version
BTA208X-600B TO-220F plastic single-ended package; isolated heatsink mounted; 1
mounting hole; 3-lead TO-220 "full pack"
SOT186A
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 3 / 13
7. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state
voltage
- 600 V
IT(RMS) RMS on-state current full sine wave; Th ≤ 73 °C; Fig. 1; Fig. 2;
Fig. 3
- 8 A
full sine wave; Tj(init) = 25 °C; tp = 20 ms;
Fig. 4; Fig. 5
- 65 AITSM non-repetitive peak on-
state current
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - 71 A
I2t I2t for fusing tp = 10 ms; SIN - 21 A²s
dIT/dt rate of rise of on-state
current
IG = 0.2 A - 100 A/µs
IGM peak gate current - 2 A
PGM peak gate power - 5 W
PG(AV) average gate power over any 20 ms period - 0.5 W
Tstg storage temperature -40 150 °C
Tjjunction temperature - 125 °C
Th(°C)
- 50 1501000 50
003aaa969
4
6
2
8
10
IT(RMS)
0
73 °C
(A)
Fig. 1. RMS on-state current as a function of heatsink
temperature; maximum values
0
5
10
15
20
25
surge duration (s)
10- 2 10110- 1
003aaa970
IT(RMS)
(A)
f = 50 Hz; Th = 73 °C
Fig. 2. RMS on-state current as a function of surge
duration; maximum values
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 4 / 13
003aaa967
4
8
12
Ptot
0
IT(RMS) (A)
0 1084 62
2
6
10
(W)
71
80
89
107
116
125
98
Th(max)
(°C)
α = 180°
120°
90°
60°
30°
conduction
angle
(degrees)
form
factor
a
30
60
90
120
180
2.816
1.967
1.570
1.329
1.110
α
α = conduction angle
a = form factor = IT(RMS) / IT(AV)
Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values
003aaa968
40
20
60
80
ITSM
0
number of cycles
1 103
102
10
(A)
I
TSM
t
T
T
j(init)
f = 50 Hz
Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 5 / 13
003aab121
tp(ms)
10- 2 102
1010- 1 1
102
103
ITSM
(A)
10
(1)
I
T
S
M
t
I
T
T
j(init)
=
2
5
°
C m
a
x
t
p
tp ≤ 20 ms
(1) dIT/dt limit
Fig. 5. Non-repetitive peak on-state current as a function of pulse width; maximum values
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 6 / 13
8. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
full cycle or half cycle; with heatsink
compound; Fig. 6
- - 4.5 K/WRth(j-h) thermal resistance
from junction to
heatsink full cycle or half cycle; without heatsink
compound; Fig. 6
- - 6.5 K/W
Rth(j-a) thermal resistance
from junction to
ambient free air
in free air - 55 - K/W
003aaf915
10- 1
10- 2
1
10
Zth(j-h)
(K/W)
10- 3
tp(s)
10- 5 1 1010- 1
10- 2
10- 4 10- 3
tp
P
t
(1)
(2)
(3)
(4)
(1) Unidirectional (half cycle) without heatsink compound
(2) Unidirectional (half cycle) with heatsink compound
(3) Bidirectional (full cycle) without heatsink compound
(4) Bidirectional (full cycle) with heatsink compound
Fig. 6. Transient thermal impedance from junction to heatsink as a function of pulse duration
9. Isolation characteristics
Table 6. Isolation characteristics
Symbol Parameter Conditions Min Typ Max Unit
Visol(RMS) RMS isolation voltage from all terminals to external heatsink;
sinusoidal waveform; clean and dust
free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;
Th = 25 °C
- - 2500 V
Cisol isolation capacitance from main terminal 2 to external
heatsink; f = 1 MHz; Th = 25 °C
- 10 - pF
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 7 / 13
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 7
2 18 50 mA
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 7
2 21 50 mA
IGT gate trigger current
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 7
2 34 50 mA
VD = 12 V; IG = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 8
- 31 60 mA
VD = 12 V; IG = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 8
- 34 90 mA
ILlatching current
VD = 12 V; IG = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 8
- 30 60 mA
IHholding current VD = 12 V; Tj = 25 °C; Fig. 9 - 31 60 mA
VTon-state voltage IT = 10 A; Tj = 25 °C; Fig. 10 - 1.3 1.65 V
VD = 12 V; IT = 0.1 A; Tj = 25 °C;
Fig. 11
- 0.7 1 VVGT gate trigger voltage
VD = 400 V; IT = 0.1 A; Tj = 125 °C;
Fig. 11
0.25 0.4 - V
IDoff-state current VD = 600 V; Tj = 125 °C - 0.1 0.5 mA
Dynamic characteristics
dVD/dt rate of rise of off-state
voltage
VDM = 402 V; Tj = 125 °C; (VDM = 67%
of VDRM); exponential waveform; gate
open circuit
1000 4000 - V/µs
dIcom/dt rate of change of
commutating current
VD = 400 V; Tj = 125 °C; IT(RMS) = 8 A;
dVcom/dt = 20 V/µs; (snubberless
condition); gate open circuit; Fig. 12
- 14 - A/ms
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 8 / 13
Tj(°C)
- 50 1501000 50
003aac888
1
2
3
0
(1)
(2)
(3)
IGT
IGT(25°C)
(1) T2- G-
(2) T2+ G-
(3) T2+ G+
Fig. 7. Normalized gate trigger current as a function of
junction temperature
Tj (°C)
-50 1501000 50
001aab100
1
2
3
0
IL
IL(25°C)
Fig. 8. Normalized latching current as a function of
junction temperature
Tj (°C)
-50 1501000 50
001aab099
1
2
3
0
IH
IH(25°C)
Fig. 9. Normalized holding current as a function of
junction temperature
003aaa971
VT(V)
0 321
10
15
5
20
25
IT
(A)
0
(1) (2) (3)
Vo = 1.264 V; Rs = 0.0378 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig. 10. On-state current as a function of on-state
voltage
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 9 / 13
Tj (°C)
-50 1501000 50
001aab101
0.8
1.2
1.6
0.4
VGT
VGT(25°C)
Fig. 11. Normalized gate trigger voltage as a function of
junction temperature
0
0
3
a
a
a
9
7
3
T
j
(
°
C
)
2
0
1
4
0
1
0
0
60
1
0
2
1
0
1
0
3
dI
c
o
m
/d
t
1
(
A
/
m
s
)
t
y
p
m
i
n
Fig. 12. Rate of change of commutating current as a
function of junction temperature; typical and minimum
values
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 10 / 13
11. Package outline
Fig. 13. Package outline TO-220F (SOT186A)
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 11 / 13
12. Legal information
Data sheet status
Document
status [1][2]
Product
status [3]
Definition
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.ween-semi.com.
Definitions
Draft — The document is a draft version only. The content is still under
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representations or warranties as to the accuracy or completeness of
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with the same product type number(s) and title. A short data sheet is
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detailed and full information. For detailed and full information see the
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Notwithstanding any damages that customer might incur for any reason
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Quick reference data — The Quick reference data is an extract of the
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Applications — Applications that are described herein for any of these
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Customers are responsible for the design and operation of their applications
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
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Semiconductors’ standard warranty and WeEn Semiconductors’ product
specifications.
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 12 / 13
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Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
WeEn Semiconductors BTA208X-600B
3Q Hi-Com Triac
BTA208X-600B All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet 19 September 2018 13 / 13
13. Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Limiting values............................................................. 3
8. Thermal characteristics............................................... 6
9. Isolation characteristics...............................................6
10. Characteristics............................................................ 7
11. Package outline........................................................ 10
12. Legal information..................................................... 11
© WeEn Semiconductors Co., Ltd. 2018. All rights reserved
For more information, please visit: http://www.ween-semi.com
For sales office addresses, please send an email to: salesaddresses@ween-semi.com
Date of release: 19 September 2018