ESD8V0L... Low Capacitance TVS Diode * ESD / transient protection of high-speed data lines in 3.3 / 5 / 12 V applications according to: IEC61000-4-2 (ESD): up to 25 KV (contact) IEC61000-4-4 (EFT): 40 A (5/50 ns) IEC61000-4-5 (surge): up to 2.5 A (8/20 s) * Smallest form factor down to 1.0 x 0.6 x 0.4 mm * Max. working voltage: -8 / +14 V or +8 / -14 V * Very low capacitance down to 2 pF * Very low reverse current < 1 nA typ. * Very low series inductance down to 0.4 nH * Pb-free (RoHS compliant) package * Qualified according AEC Q101 Applications * USB 2.0, 10/100 Ethernet, Firewire, DVI * Mobile communication * Consumer products (STB, MP3, DVD, DSC...) * LCD displays, camera * Notebooks and destop computers, peripherals ESD8V0L1B-02LRH ESD8V0L2B-03L ESD8V0L2B-03LRH D1 1 1 2 3 2 D2 Type Package Configuration Marking ESD8V0L1B-02LRH ESD8V0L2B-03L ESD8V0L2B-03LRH* TSLP-2-17 TSLP-3-1 TSLP-3-7 1 channel, bi-directional 2 channels, bi-directional 2 channels, bi-directional B3 B3 on request * Preliminary data 1 2009-07-07 ESD8V0L... Maximum Ratings at TA = 25C, unless otherwise specified Parameter Symbol ESD contact discharge1) VESD Value kV ESD8V0L1B-02LRH 25 ESD8V0L2B..., between all pins 15 Peak pulse current (tp = 8 / 20 s)2) A I pp ESD8V0L1B-02LRH Unit 2.5 ESD8V0L2B... 1 Operating temperature range T op -55...125 Storage temperature T stg -65...150 C 1V ESD according to IEC61000-4-2 2I pp according to IEC61000-4-5 2 2009-07-07 ESD8V0L... Electrical Characteristics at TA = 25C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. -8 - 14 I(BR) = 1 mA, from pin 2 to 1, ESD8V0L1B-02LRH 14.5 - - I(BR) = 1 mA, from pin 1 to 2, ESD8V0L1B-02LRH 8.5 - - I(BR) = 1 mA, from pin 1/2 to 3, ESD8V0L2B... 14.5 - - I(BR) = 1 mA, from pin 3 to 1/2, ESD8V0L2B... 8.5 - - I(BR) = 1 mA, from pin 1 to 2, ESD8V0L2B... 23 - - - <1 50 Characteristics Reverse working voltage VRWM Breakdown voltage V(BR) Reverse current IR V nA VR = 3 V, between all pins Clamping voltage for ESD8V0L2B... V VCL VESD = +15 kV (contact)1) , from pin 1/2 to 3 - 26 - VESD = -15 kV (contact)1) , from pin 1/2 to 3 - 20 - Line capacitance2) pF CT VR = 0 V, f = 1 MHz, ESD8V0L1B-02LRH - 8.5 13 from pin 1/2 to 3 - 4 7 from pin 1 to 2, pin 3 is not connected - 2 4 VR = 0 V, f = 1 MHz, ESD8V0L2B..., Dynamic resistance ( tp=30ns ) RD ESD8V0L1B-02LRH - 0.3 - ESD8V0L2B... - 0.6 - 1V ESD according to IEC61000-4-2 2Total capacitance line to ground 3 2009-07-07 ESD8V0L... Reverse current IR = (VR) TA = Parameter Diode capacitance CT = (VR) f = 1MHz 10 1 10 pF nA 8 TA = 85C ESD8V0L1B-02LRH ESD8V0L2B..., pins 1/2 to 3 ESD8V0L2B..., pins 1 to 2 7 IR CT 10 0 TA = 25C 6 5 4 10 -1 3 2 1 10 -2 0 2 4 6 8 10 V 0 0 14 VR 5 V 15 VR 4 2009-07-07 ESD8V0L... Connector Application example ESD8V0L2B... 2 channels, bi-directional 2 protected signal lines, level up to -8V/+14V or +14V (uni-directional) I/O I/O 1 ESD sensitive device 2 3 The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Pin 3 should be connected directly to a ground plane on the board. Connector Application example ESD8V0L2B... 1 high-speed channel, bi-directional Protected high-speed signal line, level up to 22V (bi-directional) I/O ESD sensitive device 2 3 1 Pin 1 (or pin 2) should be connected directly to a ground plane on the board. Pin 3 is not connected. Connector Application example ESD8V0L1B-02LRH 1 channel, bi-directional Protected signal line, level up to -8/+14V or +8/-14 V I/O ESD sensitive device 2 Pin 1 (or Pin 2) should be connected directly to a ground plane on the board . 1 5 2009-07-07 Package TSLP-2-17 ESD8V0L... Package Outline Top view Bottom view 0.39 +0.01 -0.03 0.6 0.05 0.05 MAX. 1 1 0.25 0.035 1) 2 10.05 0.65 0.05 2 0.5 0.035 1) Cathode marking 1) Dimension applies to plated terminal Foot Print 0.45 Copper Solder mask 0.375 0.35 0.275 1 0.925 0.3 0.35 0.6 0.275 For board assembly information please refer to Infineon website "Packages" Stencil apertures Marking Layout (Example) BAR90-02LRH Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 15.000 Pieces/Reel Reel o330 mm = 50.000 Pieces/Reel (optional) 0.5 Cathode marking 8 1.16 4 0.76 6 2009-07-07 Package TSLP-3-1 ESD8V0L... Package Outline Bottom view 0.4 +0.1 0.6 0.05 0.5 0.035 2 1 0.05 3 0.65 0.05 3 1) 2 1 1) 0.05 MAX. 0.35 0.05 Pin 1 marking 2 x 0.15 0.035 2 x 0.25 0.035 1 0.25 0.035 1) Top view 1) 1) Dimension applies to plated terminal Foot Print R0.1 0.2 0.225 0.2 0.225 0.315 0.35 1 0.3 0.945 0.35 0.45 0.275 0.6 0.355 For board assembly information please refer to Infineon website "Packages" 0.17 0.15 Copper Solder mask Stencil apertures Marking Layout (Example) BFR193L3 Type code Pin 1 marking Laser marking Standard Packing Reel o180 mm = 15.000 Pieces/Reel 0.5 1.16 Pin 1 marking 8 4 0.76 7 2009-07-07 Package TSLP-3-7 ESD8V0L... Package Outline Bottom view 0.39 +0.01 -0.03 0.6 0.05 0.5 0.035 3 0.65 0.05 3 2 2 1 0.35 0.05 Pin 1 marking 2 x 0.15 0.035 2 x 0.25 0.035 1 1) 1 0.05 0.05 MAX. 1) Cathode 2) marking 0.25 0.035 1) Top view 1) 1) Dimension applies to plated terminal 2) Only for diodes, cathode marking on pin 3 Foot Print 0.275 0.6 R0.1 0.2 0.225 0.2 0.225 0.315 0.35 1 0.3 0.945 0.35 0.45 0.355 For board assembly information please refer to Infineon website "Packages" 0.17 0.15 Copper Solder mask Stencil apertures Marking Layout Type code Type code Pin 1 marking Cathode marking Standard Only for diodes, cathode marking on pin 3 Standard Packing Reel o180 mm = 15.000 Pieces/Reel Pin 1 marking 0.76 Cathode marking 8 0.5 8 1.16 1.16 Only for diodes, cathode marking on pin 3 4 8 Standard 4 0.76 2009-07-07 ESD8V0L... Edition 2006-02-01 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 9 2009-07-07