2009-07-07
1
ESD8V0L...
Low Capacitance TVS Diode
• ESD / transient protection of high-speed
data lines in 3.3 / 5 / 12 V applications
according to:
IEC61000-4-2 (ESD): up to ± 25 KV (contact)
IEC61000-4-4 (EFT): 40 A (5/50 ns)
IEC61000-4-5 (surge): up to 2.5 A (8/20 µs)
• Smallest form factor down to 1.0 x 0.6 x 0.4 mm
• Max. working voltage: -8 / +14 V or +8 / -14 V
• Very low capacitance down to 2 pF
• Very low reverse current < 1 nA typ.
• Very low series inductance down to 0.4 nH
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
Applications
• USB 2.0, 10/100 Ethernet, Firewire, DVI
• Mobile communication
• Consumer products (STB, MP3, DVD, DSC...)
• LCD displays, camera
• Notebooks and destop computers, peripherals
ESD8V0L2B-03L
ESD8V0L2B-03LRH
ESD8V0L1B-02LRH
21
2
1
3
D2
D1
Type Package Configuration Marking
ESD8V0L1B-02LRH
ESD8V0L2B-03L
ESD8V0L2B-03LRH*
TSLP-2-17
TSLP-3-1
TSLP-3-7
1 channel, bi-directional
2 channels, bi-directional
2 channels, bi-directional
B3
B3
on request
* Preliminary data
2009-07-07
2
ESD8V0L...
Maximum Ratings at T
A
= 25°C, unless otherwise specified
Parameter Symbol Value Unit
ESD contact discharge1)
ESD8V0L1B-02LRH
ESD8V0L2B..., between all pins
VESD
25
15
kV
Peak pulse current (tp = 8 / 20 µs)2)
ESD8V0L1B-02LRH
ESD8V0L2B...
Ipp
2.5
1
A
Operating temperature range To
p
-55...125 °C
Storage temperature Tst
g
-65...150
1VESD according to IEC61000-4-2
2Ipp according to IEC61000-4-5
2009-07-07
3
ESD8V0L...
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Characteristics
Reverse working voltage VRWM -8 - 14 V
Breakdown voltage
I(BR) = 1 mA, from pin 2 to 1, ESD8V0L1B-02LRH
I(BR) = 1 mA, from pin 1 to 2, ESD8V0L1B-02LRH
I(BR) = 1 mA, from pin 1/2 to 3, ESD8V0L2B...
I(BR) = 1 mA, from pin 3 to 1/2, ESD8V0L2B...
I(BR) = 1 mA, from pin 1 to 2, ESD8V0L2B...
V(BR)
14.5
8.5
14.5
8.5
23
-
-
-
-
-
-
-
-
-
-
Reverse current
VR = 3 V, between all pins
IR- < 1 50 nA
Clamping voltage for ESD8V0L2B...
VESD = +15 kV (contact)1) , from pin 1/2 to 3
VESD = -15 kV (contact)1) , from pin 1/2 to 3
VCL
-
-
26
20
-
-
V
Line capacitance2)
VR = 0 V, f = 1 MHz, ESD8V0L1B-02LRH
VR = 0 V, f = 1 MHz, ESD8V0L2B...,
from pin 1/2 to 3
from pin 1 to 2, pin 3 is not connected
CT
-
-
-
8.5
4
2
13
7
4
pF
Dynamic resistance ( tp=30ns )
ESD8V0L1B-02LRH
ESD8V0L2B...
RD
-
-
0.3
0.6
-
-
Ω
1VESD according to IEC61000-4-2
2Total capacitance line to ground
2009-07-07
4
ESD8V0L...
Reverse current IR = ƒ(VR)
TA = Parameter
0 2 4 6 8 10 V14
VR
-2
10
-1
10
0
10
1
10
nA
IR
TA = 25°C
TA = 85°C
Diode capacitance CT = ƒ (VR)
f = 1MHz
0 5 V15
VR
0
1
2
3
4
5
6
7
8
pF
10
CT
ESD8V0L1B-02LRH
ESD8V0L2B..., pins 1/2 to 3
ESD8V0L2B..., pins 1 to 2
2009-07-07
5
ESD8V0L...
Application example ESD8V0L2B...
2 channels, bi-directional
ESD sensitive
device
I/O
I/O
The protection diode should be placed very
close to the location where the ESD or
other transients can occur to keep loops
and inductances as small as possible.
Pin 3 should be connected directly to a
ground plane on the board .
2 protected signal lines, level up to
-8V/+14V or +14V (uni-directional)
1 2
3
Connector
Application example ESD8V0L2B...
1 high-speed channel, bi-directional
ESD sensitive
device
I/O
Pin 1 (or pin 2) should be
connected directly to a
ground plane on the board.
Pin 3 is not connected.
Connector
Protected high-speed signal line, level up to
±22V (bi-directional)
1
2
3
Application example ESD8V0L1B-02LRH
1 channel, bi-directional
ESD sensitive
device
I/O
2
1
Pin 1 (or Pin 2) should be connected directly to a
ground plane on the board .
Connector
Protected signal line, level up to
-8/+14V or +8/-14 V
2009-07-07
6
ESD8V0L...
Package TSLP-2-17
1
2
±0.05
0.6
1
2
±0.05
0.65
±0.035
0.25 1)
1±0.05
0.05 MAX.
+0.01
0.39-0.03
1) Dimension applies to plated terminal
Cathode
marking
1)
±0.035
0.5
Bottom viewTop view
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
For board assembly information please refer to Infineon website "Packages"
0.45
0.275
0.275
0.375
0.925
Copper Solder mask Stencil apertures
0.35
1
0.6
0.35
0.3
0.76
4
1.16
0.5
Cathode
marking
8
BAR90-02LRH
Type code
Cathode marking
Laser marking
2009-07-07
7
ESD8V0L...
Package TSLP-3-1
2
3
1
0.4
+0.1
BFR193L3
Type code
Pin 1 marking
Laser marking
0.76
4
1.16
0.5
Pin 1
marking
8
Reel ø180 mm = 15.000 Pieces/Reel
For board assembly information please refer to Infineon website "Packages"
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Stencil aperturesCopper Solder mask
0.275
0.2
0.315
0.945
0.45
0.17
0.355
0.2
0.35
0.225
1
0.6
0.225
0.15
0.35
0.3
R0.1
1
2
±0.05
0.35
±0.035
2 x 0.15
1)
Top view Bottom view
1) Dimension applies to plated terminal
±0.035
0.5
1)
±0.05
0.6
3
±0.05
0.65
±0.035
2x
0.25
1)
±0.035
0.25
1)
1
±0.05
Pin 1
marking
0.05 MAX.
2009-07-07
8
ESD8V0L...
Package TSLP-3-7
2
3
1
Reel ø180 mm = 15.000 Pieces/Reel
For board assembly information please refer to Infineon website "Packages"
Package Outline
Foot Print
Marking Layout
Standard Packing
Stencil aperturesCopper Solder mask
0.275
0.2
0.315
0.945
0.45
0.17
0.355
0.2
0.35
0.225
1
0.6
0.225
0.15
0.35
0.3
R0.1
1
2
±0.05
0.35
±0.035
2 x 0.15
1)
Bottom view
±0.035
0.5
1)
±0.05
0.6
3
±0.05
0.65
±0.035
2x
0.25
1)
±0.035
0.25
1)
1
±0.05
+0.01
0.39
-0.03
Pin 1
marking
0.05 MAX.
Top view
1) Dimension applies to plated terminal
2) Only for diodes, cathode marking on pin 3
Cathode
2)
marking
Type code
Pin 1 marking
Type code
Cathode marking
Only for diodes, cathode marking on pin 3Standard
Only for diodes, cathode marking on pin 3Standard
0.76
4
1.16
0.5
Cathode
marking
8
0.76
4
1.16
Pin 1
marking
8
2009-07-07
9
ESD8V0L...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.