NEW PRODUCT
AP2331
0.2A SINGLE CHA NNEL CURRENT-LIMITED LOAD SWITCH
Description
The AP2331 is a single channel current-limited integrated high-
side
power switcher optimized for hot-
swap applications. The devices have
fast short -circuit response t ime for improved
overall system robustness
and
provide a complete protection solution for application subject to
heavy capacitive loads and the prospect of short circuit. It offers
reverse-current blocking, over-current, over-temperature and short-
circuit protection, as well as controlled rise time and under-
voltage
lockout functionality.
The device is available in SOT23, SC59 and U-DFN2020-3 packages.
Features
• Input Voltage Range: 2.7V - 5.2V
• Fas t Short-Circuit Response Time
• 0.4A Accurate Current Limiting
• 250mΩ On-Resistance
• Reverse-Current Blocking
• Built-In Soft-Start with 0. 7ms Typical Turn-On Time
• Over-Current Protection
• Over-Voltage Protection
• Short-Circuit and Thermal Protection
• ESD Protection: 3KV HBM, 300V MM
• Ambient Temperature Range: -40°C to +85°C
• Available in “Green” Molding Compound (No Br, Sb)
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• UL Recognized, File Number E322375
• IEC60950-1 CB Scheme Certified
Applications
• LCD TVs & Monitors
• Set-Top Boxes, Residential Gateways
• Laptops, Deskt ops, Servers
• Printers, Docking Stations, HUBs
• Sma r t Phones, e-Readers
Pin Assignme nts
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead -free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
(Top View)
(Top View)
SC59
SOT23
IN
IN
GND
GND
OUT
OUT
21
GND OUT
IN
( Top View )
DFN2020-3
AP2331
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NEW PRODUCT
AP2331
Typical Application Circuit
0.1µF
IN
GND
OUT
Power Supply
2.7V to 5.2V Load
0.1µF
Pin Descriptions
Pin Name
Pin Number
Functionss
GND
1
GND
OUT
2
Switch Output Pin
IN
3
Voltage Input Pin
Absolute Maximum Ratings (@TA = +25°C, unless otherwise spec ifi ed.)
Symbol
Parameter
Ratings
Units
ESD HBM Human Body Model ESD Protection 3 KV
ESD MM
Machine Model ESD Protection
300
V
VIN Input Voltage Relative to GND 6.5 V
V
OUT
Output Voltage Relative to GND V
IN
+0.3 V
I
LOAD
Maximum Continuous Load Current
Internal Limited
A
TJMAX
Maximum Juncti on Temperat ure
150
°C
TST
Storage Temperature Range (Note 4) -65 to +150 °C
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
Max
Units
VIN
Input Voltage Relati ve t o GND 2.7 5.2 V
IOUT
Output Current
0
0.2
A
TA
Operating Ambient Temperature
-40
+85
°
C
AP2331
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NEW PRODUCT
AP2331
Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified. )
Symbol
Parameter
Test Conditions (Note 5)
Min
Typ
Max
Unit
V
UVLO
Input UVLO V
IN
rising 2.35 2.65 V
I
Q
Input quiescent current Above UVLO, I
OUT
= 0 85 125 µA
IREV
Reverse leakage current
VIN = 0V , V OUT = 5V, IREV at VIN
0.01
0.10
µA
RDS(ON)
Switch on-resistance
VIN = 5V , IOUT = 0.2A
100 250 350 mΩ
ILIMIT
Over-load current l imi t
VIN = 5V , V OUT = 4V
0.3 0.4 0.5 A
IOS
Short-circui t c urrent
OUT shorted to ground
0.3
0.4
0.5
A
IROCP
Reverse-current trigger point
VIN = 5.0V, VOUT = 5. 2V
0.20
0.25
A
TTRIG
Deglitch time from reverse current trigger to
MOSFET turn off
(Note 6) 0.5 0.7 1.0 ms
VOVP Output over-volt age t ri p point (Note 7) 5.3 5.6 V
TOVP Debounce time from out put over-voltage to
MOSFET turn off
15 µs
VREC Recovery after t urn-off from ROCP and
OVP
101% VIN
TON Output turn-on t ime (Not e 8) CL = 0.1µF, RLOAD = 20Ω
(UVLO to 90% VOUT-NOM)
0.7 ms
TSHDN
Thermal shutdown threshold
VIN = 2.7V to 5.2V
150
°
C
THYS Thermal shutdown hysteresis 20 °C
θJA Thermal Resistance Juncti on-to-Ambient
(Note 9)
SOT23 215 °C/W
SC59 255 °C/W
U-DFN2020-3
180
°C/W
Notes: 5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
6. When reverse current triggers at IROCP = 0.20A, the reverse current is continuously clamped at IROCP for 0.7ms deglitch time until MOSFET is turned off.
7. During ou tput over-voltage protection, the output draws approximately 60µA current.
8. Since the output turn-on slew rate is dependent on input supply slew rate, this limit is only applicable for input supply sle w rate between VIN/0.2ms to
VIN/1ms.
9. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
AP2331
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NEW PRODUCT
AP2331
Typi cal Perfo rmance Char act eristics
UVLO Increasing
1ms/div
UVLO Decreasing
5ms/div
Over-Load Current Limit
5ms/div
Short-Circuit Current Limit
100µs/div
Deglitch Time from Reverse-Cu rren t Trig ger to MOSFE T Turn-Off
200µs/div
Reverse-Current Limit
200µs/div
550µs
200mA
AP2331
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NEW PRODUCT
AP2331
Typi cal Perfo rmance Char act eristics (cont.)
Output Over-Voltage Trip Point
10ms/div
Output Turn-On Ti me
200µs/div
-40 -20 0 20 40 60 80
AMBIENT TEMPERA T URE ( C)
Fig. 1 Quiescent Suppl y Curren t vs.
Ambient Tem perature
°
0
20
40
60
80
100
120
140
V = 5.2V
IN
V = 5V
IN
V = 3.3V
IN
V = 2.7V
IN
SUPPLY CURRENT (µA)
-40 -20 0 20 40 60 80
AMBIENT TEMPERA T URE ( C)
Fig. 2 Short Circuit Cur rent Limit vs.
Ambient Temperature
°
0.388
0.390
0.392
0.394
0.396
0.398
0.400
0.402
SHORT CIRCUIT CURRENT (mA)
0.404
0.406
0.408
V = 2.7V
IN
V = 3.3V
IN
V = 5V,
IN
V = 5.2V
IN
C = 10µF
L
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Fig. 3 Out put Turn On-Time vs . Input Volta ge
OUTPUT TURN ON-TIME (ms)
0.20
0.25
0.30
0.35
0.40
0.45
C = 1µF
R = 5
L
L
Ω
V = 5.5V
IN
V = 5V
IN
V = 3.3V
IN
V = 2.7V
IN
-40 -20 0 20 40 60 80
AMBIENT TEMPERA T URE ( C)
Fig. 4 Switch On-Resistance vs.
Ambient Temperature
°
0
50
100
150
200
250
300
ON-STATE RESISTANCE (m )Ω
350
400
450
500
OVP at 5.4V
OVP recovery
at 5.1V
C
L
=0.1µF
Rload=20Ω
AP2331
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NEW PRODUCT
AP2331
Typi cal Perfo rmance Char act eristics (cont.)
-40 -20 0 20 40 60 80
AMBIENT TEMPERA T URE ( C)
Fig. 5 Cur rent Limit Trip Threshold vs.
Ambient Te m perature
°
0.388
0.390
0.392
0.394
0.396
0.398
0.400
0.402
SUPPLY CURRENT (µA)
0
50
100
150
200
250
300
REVERSE CURRENT LIMIT (mA)
350
400
450
500
-40 -20 0 20 40 60 80
AMBIENT TEMPERA T URE ( C)
Fig. 6 Revers e Curre nt Limit v s.
Ambient Temperature
°
V = 5V
IN
V = 3.3V
IN
V = 2.7V
IN
AP2331
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NEW PRODUCT
AP2331
Appli cation information
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The UVLO functions only when the
power supply has reached at least 2.5V (TYP). Whenever the input voltage falls below approximately 2.5V, the power switch is turned off. This
facilit at es the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Over-Current and Short-Circuit Protection
An internal sensing FET is employed to check for over current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an over current condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
The different overload conditions and the corresponding response of the AP2331 are outlined below:
S.NO
Conditions
Explanation
Behavior of the AP2331
1
Short
-circuit condition at start-up
Output is shorted before input
voltage is applied or before the
part is powered up.
The IC senses the short circuit and immediately clam ps output
current to a certain safe level namely ILIMIT
2
Short
-circuit or Over current
condition
Short-Circuit or Overl oad
conditi on that occurs when the
part is powered up and above
UVLO.
At the instance the overload occurs, higher c urrent may flow for a
very short peri od of t ime before the current limit functi on can react.
After the current limit functi on has tripped (reac hed the over-
current tri p threshold), the devic e switches int o current limiting
mode and the current is clamped at I
LIMIT
.
3
Gradual increas e
from nominal
operating current to I
LIMIT Load increases gradually until
the current-limit threshold.
The current rises until ILIMIT. Once the threshold has been
reached, the device switc hes into its current limit i ng mode and is
clamped at ILIMIT.
Reverse-Curren t P rotection
The USB specification does not allow an output device to source current back into the USB port. In a normal MOSFET switch, current will flow in
reverse direct ion (from the output side to the input side) when the output side voltage is higher than the i nput side. A reverse current l imit feature is
implement ed in the AP2331 to limit such back currents. Reverse current limit is always ac tive in AP2331. Reverse current is l imited at IROCP level
and when the fault exists for more than 700µs, output device is disabled and s hut down. This is c alled the "Degl itch time from revers e current trigger
to MOSFET turn off.” Recovery from IROCP occurs when the output voltage falls to 101% of input voltage.
Over-Vol tage Protection
The device has an output over-voltage protection that triggers when the output voltage reaches 5.3V (MIN). When this fault condition stays on
for longer than 15µs, (This is called the “Debounce time from output over voltage to MOSFET turn off”) output device is disabled and shut down.
Recovery from ROVP occurs when the output voltage falls to 101% of input voltage.
Thermal Protection
Thermal protect i on prevents the IC from dam age when the die temperature exceeds safe margins. This mainl y occurs when heavy-overl oad or short-
circuit faults are present for extended periods of time. The AP2331 implements a thermal sensing to monitor the operating junction temperature of
the power distribut ion switch. Once the die temperature ris es to approximat ely +150°C, the Thermal protection feat ure gets activated as follows: The
internal thermal sense circuitry turns the power switch off thus preventing the power switch from damage. Hysteresis in the thermal sense circuit
allows the device to cool down to approximately +20°C before the output is turned back on. This built-in thermal hysteresis feature is an excellent
feature, as it avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until the load fault is
removed, resulting i n a pulsed output.
Discharge Function
When input voltage falls below UVLO, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a
discharge resistance of 800Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of
the resistance and the output capacit or. Disc harge time is calculat ed when UVLO falli ng thres hol d is reached to output voltage reaching 300mV.
AP2331
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NEW PRODUCT
AP2331
Appli cation information (cont.)
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipati on can be calculated by:
PD = RDS(ON) × I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where: TA= Ambient Temperature °C
RθJA = Thermal Resistance
PD = Total Power Dissipation
Ordering Information
AP 2331 X - 7
7 : Tape & Reel
Package Packing
SA : SOT23
W : SC59
FJ : DFN2020
Part Number Package Code Packaging
(Note 10)
7” Tape and Reel
Quantity
Part Number Suffix
AP2331SA-7
SA
SOT23
3000/Tape & Reel
-7
AP2331W-7 W SC59 3000/Tape & Reel -7
AP2331FJ-7 FJ U-DFN2020-3 3000/Tape & Reel -7
Note: 10. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
Marking Information
(1) SOT23
12
3
XX YW X
( Top View )
XX : Identification code
W : Week : A~Z : 1~26 week;
X : A~Z : Internal code
Y : Year 0~9
a~z : 27~52 week; z represents
52 and 53 week
Device
Package
Identification Code
AP2331SA-7 SOT23 KJ
(2) SC59
1 2
3
XX Y W X
( Top View )
XX : Identific ation code
W : Week : A~Z : 1~26 week;
X : A~Z : Internal code
Y : Year 0~9
a~z : 27~52 week; z represents
52 and 53 week
Device
Package
Identification Code
AP2331W-7
SC59
KN
AP2331
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NEW PRODUCT
AP2331
Marking Information
(3) U-DFN2020-3
( Top View )
XX : Identification code
W : Week : A~Z : 1~26 week;
X : A~Z : Internal code
Y : Year 0~9
a~z : 27~52 week; z represents
52 and 53 week
1
1
GND
GND
OUT
OUT
IN
IN
DFN
DFN
2020
2020
-
-
3
3
XX
XX
Y
Y
W
W
X
X
2
2
3
3
Device
Package
Identification Code
AP2331FJ-7 U-DFN2020-3 FJ
Package Information
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(1) SOT23
(2) SC59
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03
0.915
F
0.45
0.60
0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013
0.10
0.05
K
0.903
1.10
1.00
K1
-
-
0.400
L
0.45
0.61
0.55
M
0.085
0.18
0.11
α
0°
8°
-
All Dimensions in mm
SC59
Dim
Min
Max
Typ
A
0.35
0.50
0.38
B
1.50
1.70
1.60
C
2.70
3.00
2.80
D
-
-
0.95
G
-
-
1.90
H
2.90
3.10
3.00
J
0.013
0.10
0.05
K
1.00
1.30
1.10
L
0.35
0.55
0.40
M
0.10
0.20
0.15
N
0.70
0.80
0.75
α
0°
8°
-
All Dimensions in mm
A
M
JL
D
F
BC
H
K
G
K1
A
M
JL
D
BC
H
K
G
N
AP2331
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NEW PRODUCT
AP2331
Package Information (cont.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(3) U-DFN2020-3
Suggested Pad Layout
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(1) SOT23
(2) SC59
U-DFN2020-3
Dim
Min
Max
Typ
A
0.57
0.63
0.60
A1
0
0.05
0.02
A3
-
-
0.152
b
0.20
0.30
0.25
D
1.950
2.075
2.00
D2
1.10
1.30
1.20
D3
0.325 REF
e
-
-
0.50
E
1.950
2.075
2.00
E2
0.80
1.00
0.90
E3
0.138 REF
L
0.35
0.45
0.40
All Dimensions in mm
Dimensions
Value (in mm)
Z
3.4
X
0.8
Y
1.0
C
2.4
E
1.35
Dimensions
Value (in mm)
Z
3.4
X
0.8
Y
1
C
2.4
E
1.35
XE
Y
C
Z
XE
Y
C
Z
D
D2
E
e
bL
E2
AA1 A3
Seating Plane
Pin #1 ID
R0.200
E3
D3
L
AP2331
Document Number: DS35529 Rev. 5 - 2 10 of 12
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© Diodes Incorporated
NEW PRODUCT
AP2331
Suggested Pad Layout (cont.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(3) U-DFN2020-3
Dimensions
Value (in mm)
C
1.000
G
0.150
X
0.350
X1
0.450
X2
1.400
X3
1.724
Y
0.600
Y1
0.450
Y2
1.100
Y3
0.450
Y4
2.300
Y4
X3
X
Y
G
X1
Y1
R0.200
R0.225
C
Y2
X2
Y3
R0.050
R0.200
AP2331
Document Number: DS35529 Rev. 5 - 2 11 of 12
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© Diodes Incorporated
NEW PRODUCT
AP2331
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICT ION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark ri ghts, nor the rights of others. Any Customer or user of this document or products described herein in such applic ations shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harml ess against all damages.
Diodes Incorporated does not warrant or acc ept any li ability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporat ed products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirect l y, any claim of personal injury or death associat ed with such unintended or unauthorized appl i cat i on.
Products desc ribed herein may be covered by one or m ore United States, i nternational or foreign pat ents pending. Product nam es and markings
noted herein may also be covered by one or more United States, international or f orei gn trademarks.
This document is written i n English but may be transl ated into multiple languages for reference. Only the Englis h version of this document is the
final and determinative f orm at released by Diodes I ncorporat ed.
LIFE SUPPORT
Diodes Incorporated products are specificall y not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Off icer of Diodes I ncorporat ed. As us ed herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perf orm when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectivenes s.
Customers repres ent that they have all necessary expertise i n the safety and regulatory ramif ications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safet y-related requirem ents concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representati ves against any dam ages arising out of the use of Diodes Incorporat ed products i n such safety-critical, life support devic es or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
AP2331
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