PC923L0NSZ0F
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC923L)
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008898 (as model No. PC923L)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Agency approvals/Compliance
1. IGBT/MOSFET gate drive for inverter control
■ Applications
High Speed, Gate Drive DIP 8 pin
∗OPIC Photocoupler
1. 8 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Built-in direct drive circuit for MOSFET / IGBT drive
(IO1P, IO2P : 0.6 A)
4. High speed response (tPHL, tPLH : MAX. 0.5 µs)
5. Wide operating supply voltage range
(VCC=15 to 30 V)
6. High noise immunity due to high instantaneous
common mode rejection voltage (CMH : MIN. −
15kV/µs, CML : MIN. 15kV/µs)
7. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
8. Lead-free and RoHS directive compliant
■ Description
PC923L0NSZ0F Series contains a LED optically
coupled to an OPIC chip.
It is packaged in a 8 pin DIP, available in SMT
gullwing lead form option.
Input-output isolation voltage(rms) is 5.0 kV, High
speed response (tPHL, tPLH : MAX. 0.5 µs).
1Sheet No.: D2-A06002EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC923L0NSZ0F Series
∗
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
■ Internal Connection Diagram
8 7 6 5
1 2 3 4
1
2
3
4
5
6
7
8
Interface
Amp.
NC
Tr.1
Tr.2
Anode
Cathode
NC
GND
O1
O2
VCC
2
Sheet No.: D2-A06002EN
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC923L0NSZ0F] 2. Through-Hole (VDE option) [ex. PC923L0YSZ0F]
Product mass : approx. 0.55gProduct mass : approx. 0.55g
PC923L
Primary side
mark
Date code
SHARP
mark
"S"
2.54±0.25
8 7 6 5
6.5±0.5
0.85±0.2
1.2±0.3
9.66±0.5
3.5
±0.5
0.5±0.1
0.5TYP.
1 2 3 4
3.4±0.5
θ θ
θ:0 to 13˚
7.62±0.3
0.26±0.1
Epoxy resin
VDE Identification mark
2.54±0.25
8 7 6 5
6.5±0.5
0.85±0.2
1.2±0.3
9.66±0.5
3.5
±0.5
0.5±0.1
0.5TYP.
1 2 3
3.4±0.5
θ θ
θ:0 to 13˚
7.62±0.3
0.26±0.1
Epoxy resin
Primary side
mark
Date code
PC923L
4
SHARP
mark
"S"
4
PC923L0NSZ0F Series
■ Truth table
Input
ON
OFF
O2 Terminal output
High level
Low level
Tr. 1
ON
OFF
Tr. 2
OFF
ON
3
Sheet No.: D2-A06002EN
(Unit : mm)
3. SMT Gullwing Lead-Form [ex. PC923L0NIP0F] 4. SMT Gullwing Lead-Form (VDE option)
[ex. PC923L0YIP0F]
Product mass : approx. 0.51gProduct mass : approx. 0.51g
Plating material : SnCu (Cu : TYP. 2%)
PC923L0NSZ0F Series
Primary side
mark
PC923L
SHARP
mark
"S"
0.85±0.2
1.2±0.3
78 6 5
4
6.5±0.5
1 2 3
2.54±0.25
3.5±0.5
1.0+0.4
−0
0.26±0.1
Epoxy resin
10.0+0
−0.5
1.0+0.4
−0
0.35±0.25
7.62±0.3
9.66±0.5 Date code
VDE Identification mark
Primary side
mark
Date code
PC923L
4
SHARP
mark
"S"
0.85±0.2
1.2±0.3
78 6 5
4
6.5±0.5
1 2 3
2.54±0.25
3.5±0.5
1.0+0.4
−0
0.26±0.1
Epoxy resin
10.0+0
−0.5
1.0+0.4
−0
0.35±0.25
7.62±0.3
9.66±0.5
Date code (3 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
55
6
7
8
9
O
N
D
Mark
1
2
3
4
Month
January
February
March
April
May
June
July
August
September
October
November
December
Week
1st
2nd
3rd
4th
5.6th
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
3rd digit
Week of production
1st digit
Year of production
4
repeats in a 20 year cycle
Sheet No.: D2-A06002EN
PC923L0NSZ0F Series
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A06002EN
■ Electro-optical Characteristics*7
Parameter Conditions
Forward voltage
Reverse current
Terminal capacitance
O
1
Low level output voltage
Transfer characteristics
Response time
O
1
leak current
O
2
leak current
High level supply current
Low level supply current
Isolation resistance
"Low→High"
input threshold current
*9
*9
*8
"Low→High" propagation delay time
"High→Low" propagation delay time
Rise time
Fall time
MIN.
1.2
15
−
−
−
−
−
−
−
5×1010
-15
15
−
−
−
−
−
TYP.
1.5
1.6
−
−
60
0.2
−
−
−
−
1.3
1.3
1011
1.5
0.2
0.2
0.3
0.3
−
MAX.
1.75
10
150
30
0.4
500
500
3.0
3.0
3.0
5.0
0.5
0.5
0.5
0.5
−
−
−
Unit
V
V
µA
pF
V
V
µA
µA
mA
mA
mA
mA
Ω
µs
µs
µs
µs
kV/µs
kV/µs
Symbol
VF1
VF2
IR
Ct
VCC
VO2L
IO1L
IO2L
ICCH
tf
CMH
CML
ICCL
IFLH
RISO
tPLH
tPHL
tr
Instantaneous common mode
rejection voltage
(High level output)
Instantaneous common mode
rejection voltage
(Low level output)
Ta=25˚C, IF=0.2mA
Ta=25˚C, IF=10mA
Ta=25˚C, VR=5V
Ta=25˚C, V=0, f=1MHz
VCC=24V, IF=5mA
Supply voltage −
V
CC1
=12V, V
CC2
=−12V, I
O1
=0.1A, I
F
=5mA
VCC=VO1=35V, IF=0
VCC=VO2=35V, IF=5mA
Ta=25˚C, VCC=24V, IF=5mA
RG=47Ω, CG=3 000pF
Ta=25˚C, VCM=1.5kV(p-p)
IF=5mA, VCC=24V,
∆VO2H=2.0V
Ta=25˚C, VCM=1.5kV(p-p)
IF=0, VCC=24V,
∆VO2L=2.0V
VCC=24V, IF=0
Ta=25˚C, VCC=24V
Ta=25˚C, DC500V, 40 to 60%RH
VCC=24V
(Unless otherwise specified Ta=Topr)
*7 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin
8
) and GND (pin
7
)
near the device, when it measures the transfer characteristics and the output
side
characteristics
*8 IFLH represents forward current when output goes from "Low" to "High" *9 O2 output terminal is set open
O
2
High level output voltage
20
0.2
0.3
22 −
−
V
VO1L
VCC=VO1=24V, IO2=−0.1A, IF=5mA
O
2
Low level output voltage
−0.5 0.8 V
VO2H
VCC=24V, IO2=0.1A, IF=0
InputOutput
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Forward current mA
*2
*2
*3
*1
Reverse voltage V
O
1
output current
A
O
1
Peak output current
A
O
2
output current
A
O
2
Peak output current
A
O
1
output voltage
V
mW
mW
*4 Total power dissipation
Isolation voltage
Operating temperature ˚C
Storage temperature ˚C
*5
*6 Soldering temperature
IF
VR
IO1
IO1P
IO2
IO2P
VO1
PO
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
Rating
20
5
Supply voltage
Power dissipation
VVCC 35
0.1
0.6
0.1
0.6
35
500
550
−40 to +85
−55 to +125
270
5.0 kV
Input
Output
*1 The derating factors of a absolute maximum ratings due to ambient
temperature are shown in Fig.10
*2 Pulse width≤0.15µs, Duty ratio : 0.01
*3, 4 The derating factors of a absolute maximum ratings due to ambient
temperature are shown in Fig.11
*5 AC for 1minute, 40 to 60 %RH, f=60Hz
*6 For 10s
5
PC923L0NSZ0F Series
Sheet No.: D2-A06002EN
■ Model Line-up
PC923L0NSZ0F PC923L0YSZ0F
−−−−−− Approved
Lead Form
Package
Model No.
DIN EN60747-5-2
Sleeve
Through-Hole
50pcs/sleeve
Taping
1 000pcs/reel
SMT Gullwing
PC923L0NIZ0F PC923L0YIZ0F
−−−−−− Approved
PC923L0NIP0F PC923L0YIP0F
−−−−−− Approved
6
Please contact a local SHARP sales representative to inquire about production status.
PC923L0NSZ0F Series
Sheet No.: D2-A06002EN
7
PC923L0NSZ0F Series
Fig.1 Test Circuit for O1 Low Level Output
Voltage
Fig.2 Test Circuit for O2 High Level Output
Voltage
Fig.5 Test Circuit for O2 Leak Current Fig.6 Test Circuit for High Level / Low Level
Supply Current
Fig.3 Test Circuit for O2 Low Level Output
Voltage
Fig.4 Test Circuit for O1 Leak Current
V
IFVO1L IO1
VCC1
VCC2
2
3
8
5
6
7
V
IF
IO2
VO2H
VCC
2
3
8
5
6
7
VVO2L IO2
VCC
IF
2
3
8
5
6
7
A
VCC
IF
IO1L
2
3
8
5
6
7
A
VCC
IF
2
3
8
5
6
7
IO2L
A
VCC
ICC
IF
2
3
8
5
6
7
Sheet No.: D2-A06002EN
8
PC923L0NSZ0F Series
Fig.7 Test Circuit for "Low→High" Input Threshold Current
Fig.9 Test Circuit for Instantaneous Common Mode Rejection Voltage
Fig.8 Test Circuit for Response Time
V
IFVCC
Variable
2
3
8
5
6
7
VCC
CG
RG
VOUT
VIN
Duty ratio 50%
VIN wave form
VOUT wave form
tPLH tPHL
50%
90%
50%
10%
trtf
t
r
=t
f
=0.01µs
Pulse width 5
µs
2
3
8
5
6
7
V
SW
B
A
GND
GND
VCC
VO2
+−
VCM
VCM
(Peak)
VCM wave form
VO2H
∆VO2H
∆VO2L
VO2L
CMH, VO2 wave form
SW at A, IF=5mA
CML, VO2 wave form
SW at B, IF=0
2
3
8
5
6
7
Sheet No.: D2-A06002EN
9
PC923L0NSZ0F Series
Fig.10 Forward Current vs. Ambient
Temperature
Fig.11 Power Dissipation vs. Ambient
Temperature
Fig.14
"Low→High" Relative Input Threshold
Current vs. Ambient Temperature
Fig.15 O1 Low Level Output Voltage vs.
O1 Output Current
Fig.12 Forward Current vs. Forward Voltage Fig.13
"Low→High" Relative Input Threshold
Current vs. Supply Voltage
60
50
40
30
20
10
0
Forward current IF (mA)
Ambient temperature Ta (°C)
−25 0 25 50 75 85 100 125−40
Forward voltage VF (V)
Forward current IF (mA)
1.0 1.2 1.4 1.6 1.8 2.0 2.2
1
10
100
0.1
50˚C
0˚C
−20˚C
Ta=85˚C
25˚C −40˚C
120
110
100
90
70
15 18 21 24 27 30
80
Ta=25°C
Relative input threshold current (%)
Supply voltage VCC (V)
IFLH=100% at VCC=24V
60
70
80
90
100
110
120
−40 −20 0 20 40 8060 100
Relative input threshold current (%)
VCC=24V
Ambient temperature Ta (˚C)
IFLH=100% at Ta=25˚C
3
2
1
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6
Ta=25°C
VCC1=12V
VCC2=−12V
IF=5mA
O1 low level output voltage VO1L (V)
O1 output current IO1 (A)
Power dissipation PO, Ptot (mW)
0
100
200
300
400
500
600
Ptot
PO
Ambient temperature Ta (°C)
−25 0 25 50 75 85 100 125−40
Sheet No.: D2-A06002EN
10
PC923L0NSZ0F Series
Fig.16 O1 Low Level Output Voltage vs.
Ambient Temperature
Fig.17 O2 Output Voltage Drop vs.
O2 Output Current
Fig.20 O2 Low Level Output Voltage vs.
O2 Output Current
Fig.21 O2 Low Level Output Voltage vs.
Ambient Temperature
Fig.18 O2 High Level Output Voltage vs.
Supply Voltage
Fig.19 O2 High Level Output Voltage vs.
Ambient Temperature
−40 −20 0 20 40 60 80 100
0.3
0.25
0.2
0.15
0.1
0.05
0
Ambient temperature Ta (°C)
O1 low level output voltage VO1L (V)
VCC1=12V
VCC2=−12V
IF=5mA
IO2=0.1A
Ambient temperature Ta (°C)
−40 −20 0 20 40 60 80 100
20
21
22
23
24
O2 high level output voltage VO2H (V)
VCC=24V
IF=5mA
IO2=nearly 0A
IO2=−0.1A
3
2
1
0
0.0 0.30.1 0.2 0.60.4 0.5
O2 low level output voltage VO2L (V)
O2 output current IO2 (A)
Ta=25°C
VCC=VO1=24V
IF=0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
−40 −20 0 20 40 60 80 100
Ambient temperature Ta (˚C)
O2 low level output voltage VO2L (V)
VCC=24V
IF=0
IO2=0.1A
Supply voltage VCC (V)
15 18 21 24 27 30
12
15
18
21
24
27
30
O2 high level output voltage VO2H (V)
Ta=25°C
IF=5mA
0
−5
−4
−3
−2
−1
0.0 0.1 0.2 0.3 0.4 0.5 0.6
High output voltage drop (VO2H-VCC) (V)
O2 output current IO2 (A)
Ta=25°C
VCC=VO1=24V
IF=5mA
Sheet No.: D2-A06002EN
11
PC923L0NSZ0F Series
Fig.22 High Level Supply Current vs.
Supply Voltage
Fig.23 Low Level Supply Current vs.
Supply Voltage
Fig.26 Propagation Delay Time vs.
Forward Current
Fig.27 Propagation Delay Time vs.
Ambient Temperature
Fig.24 High Level Supply Current vs.
Ambient Temperature
Fig.25 Low Level Supply Current vs.
Ambient Temperature
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
3
0
0.5
1
1.5
2
2.5
High level supply current ICCH (mA)
15 18 21 24 27 30
Supply voltage VCC (V)
Ta=25°C
IF=5mA
Low level supply current ICCL (mA)
15 18 21 24 27 30
Supply voltage VCC (V)
3
0
0.5
1
1.5
2
2.5
Ta=25°C
IF=0
VCC=VO1=24V
RG=47Ω
CG=3 000pF
IF=5mA
0.2
0.4
0.6
0.8
1
0
Propagation delay time tPHL, tPLH (µs)
tPLH
tPHL
−40 −20 0 20 406080100
Ambient temperature Ta (°C)
1
0.2
0.4
0.6
0.8
0
051015 20 25
Forward current IF (mA)
Propagation delay time tPHL, tPLH (µs)
VCC=VO1=24V
RG=47Ω
CG=3 000pF
Ta=85˚C
Ta=85˚C
Ta=−40˚C
Ta=−40˚C
Ta=25˚C
Ta=25˚C
tPHL
tPLH
High level supply current ICCH (mA)
VCC=24V
IF=5mA
−40 −20 0 20 40 60 10080
Ambient temperature Ta (˚C)
3
0
0.5
1
1.5
2
2.5
−40 −20 0 20 40 60 10080
Low level supply current ICCL (mA)
VCC=24V
IF=0
3
0
0.5
1
1.5
2
2.5
Ambient temperature Ta (˚C)
Sheet No.: D2-A06002EN
12
PC923L0NSZ0F Series
■ Design Considerations
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute
design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Notes about static electricity
● Design guide
Parameter
Forward current
Supply voltage
Operating temperature
Symbol
IF
VCC
Topr
MIN.
10
−40
15
TYP.
−
−
−
Unit
mA
˚C
V
MAX.
20
70
30
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
This photocoupler is dedicated to the use for IGBT or MOSFET Gate Drive.
Please do not use this for the other application.
As mentioned below, when the input is on, if DC load (resistor etc.) is connected between O2 output pin 6
and GND pin 7 and if the electric potential VO2 goes approx. 2V below than electric potential VCC pin 8
continuously, supply current ICC may flow more than usually and go beyond power dissipation.
VCC
2V or more
IF
2
3
8
5
6
7
A
● Recommended operating conditions
Sheet No.: D2-A06002EN
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
13
PC923L0NSZ0F Series
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)
into the design consideration.
Please decide the input current which become 2 times of MAX. IFLH.
● Recommended Foot Print (reference)
2.542.54
1.7
2.2
8.2
2.54
(Unit : mm)
Sheet No.: D2-A06002EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
14
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC923L0NSZ0F Series
Sheet No.: D2-A06002EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
● Presence of ODC
15
PC923L0NSZ0F Series
Sheet No.: D2-A06002EN
■ Package specification
16
12.0
6.7
5.8
10.8
520
±2
(Unit : mm)
PC923L0NSZ0F Series
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
Sheet No.: D2-A06002EN
17
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
G
B
H
A
C
Dimensions List (Unit : mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
10.2±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
5˚
MAX.
H
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC923L0NSZ0F Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
18
Sheet No.: D2-A06002EN
■ Important Notices
PC923L0NSZ0F Series
[E234]
