DS-25SF041–050D–8/2017
High Temperature Operation (125°C)
This data sheet addendum is to be used in conjunction with the existing AT25SF041
datasheet specifications. The Adesto AT25SF041 4Mbit Serial Flash devices will
operate @ 125°C with the following datasheet caveats. All other parameters will meet
the existing datasheet specifications.
The ordering code suffix (CAN# Code) 'HR' or ‘HT’ must be used to ensure correct
operation at this extended temperature range. Adesto will not modify and republish the
current datasheet to reflect the CAN# 'HR' or ‘HT’ ordering code or the above
caveats.The standard AT25SF041 datasheet is available at http://www.adestotech.com.
AT25SF041
4-Mbit, 2.5V Minimum
SPI Serial Flash Memory with Dual-I/O and Quad-I/O Support
DATASHEET (ADDENDUM)
1. Electrical Specifications
1.2 DC Characteristics
1.1 DC and AC Operating Range
AT25SF041-xxxHR
Operating Temperature -40C to +125C
Endurance (Maximum) 10,000 Cycles
Symbol Parameter Condition
2.5V to 3.6V
UnitsMin Typ Max
IDPD Deep Power-Down Current CS, HOLD, WP = VIH10 (1)
1. Industrial temperature limit is 5µA.
µA
ISB Standby Current CS, HOLD, WP = VIH35 (2)
2. Industrial temperature limit is 25µA.
µA
1.3 Program and Erase Characteristics
2. Ordering Code
2.1 Ordering Code Detail
3. Revision History
Symbol Parameter
2.5V to 3.6V
Min Typ Max Units
tPP (1)
1. Maximum values indicate worst-case performance after 100,000 erase/program cycles.
Page Program Time (256 Bytes) 0.7 3.5 ms
tCHPE(1) (2)
2. Not 100% tested (value guaranteed by design and characterization).
Chip Erase Time 412 sec
Ordering Code (1)
1. The shipping carrier option code is not marked on the devices.
Package Operating Voltage
Max. Freq.
(MHz) Operation Range
AT25SF041-SHDHR-T
8S2
2.5V to 3.6V 85MHz Extended
(-40°C to +125°C)
AT25SF041-SHDHR-B
AT25SF041-SSHDHR-T
8S1
AT25SF041-SSHDHR-B
AT25SF041-DWFHT (2)
2. Contact Adesto for mechanical drawing or die sales information.
DWF
Package Type
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S2 8-lead, 0.208" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
DWF Die in Wafer Form
Revision Level – Release Date History
A – August 2014 Initial release.
B – October 2015 Corrected package type in Ordering Code Detail table.
C – August 2016 Added DWF part ordering code.
D – August 2017 Updated corporate address information.
Corporate Office
California | USA
Adesto Headquarters
3600 Peterson Way
Santa Clara, CA 95054
Phone: (+1) 408.400.0578
Email: contact@adestotech.com
© 2017 Adesto Technologies. All rights reserved. / Rev.: DS-25SF041–050D–8/2017
Disclaimer: Adesto Technologies Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Adesto's Terms
and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications
detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Adesto are granted by the
Company in connection with the sale of Adesto products, expressly or by implication. Adesto's products are not authorized for use as critical components in life support devices or systems.
