PSoC® 4: PSoC 4200DS Family
Datasheet
Programmable System-on-Chip (PSoC®)
Cypress Semiconductor Corporation 198 Champion Court San Jose,CA 95134-1709 408-943-2600
Document Number: 001-98044 Rev. *D Revised July 20, 2017
Programmable System-on-C hip (PSoC ®)
General Description
PSoC® 4 is a scalable and reconfigurable platform architecture for a family of programmable embedded system controllers with an
ARM® Cortex™-M0 CPU. It combines programmable and reconfigurable analog and digital blocks with flexible automatic routing. The
PSoC 4200DS product family, based on this platform architecture, is a combination of a microcontroller with digital programmable
logic, programmable interconnect, and standard communication and timing peripherals. The PSoC 4200DS products will be fully
compatible with members of the PSoC 4 platform for new applications and design needs. The programmable digital subsystem allows
flexibility and in-field tuning of the design.
Features
32-bit MCU Subs ys te m
48 MHz ARM Cortex-M0 CPU with single-cycle multiply
Up to 64 kB of flash with Read Accelerator
Up to 8 kB of SRAM
DMA engine
Programmable Digital
Four programmable logic blocks, each with 8 Macrocells and
an 8-bit data path (called universal digital blocks or UDBs)
Programmable I/O block (PRGIO) provides the ability to
perform Boolean functions in the I/O signal path
Cypress-provided peripheral component library, user-defined
state machines, and Verilog input
Low Power 1. 71 to 5.5 V Op era tio n
Low-power Deep Sleep Mode with GPIO pin wakeup
Serial Communication
Three independent run-time reconfigurable serial
communication blocks (SCBs) with reconfigurable I2C, SPI, or
UART functionality
Timin g and Pulse-Width Modulation
Four 16-bit timer/counter pulse-width modulator (TCPWM)
blocks
Center-aligned, Edge, and Pseudo-random modes
Comparator-based triggering of Kill signals for motor drive and
other high-reliability digital logic applications
Packages
25-ball CSP package 2.07 mm × 2.11 mm, 28-pin SSOP
package.
Up to 21 programmable GPIOs
GPIO drive modes, strengths, and slew rates are program-
mable
PSoC Creator Design Environment
Integrated Development Environment (IDE) provides
schematic design entry and build (with analog and digital
automatic routing)
Applications Programming Interface (API component) for all
fixed-function and programmable peripherals
Industry-Standard Tool Compatibility
After schematic entry, development can be done with
ARM-based industry-standard development tools
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 2 of 28
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right PSoC device for your design, and to help you
to quickly and effectively integrate the device into your design. For a comprehensive list of resources, see the knowledge base article
KBA86521, How to Design with PSoC 3, PSoC 4, and PSoC 5LP. Following is an abbreviated list for PSoC 4:
Overview: PSoC Portfolio, PSoC Roadmap
Product Selectors: PSoC 1, PSoC 3, PSoC 4, PSoC 5LP
In addition, PSoC Creator includes a device selection tool.
Application notes: Cypress offers a large number of PSoC
application notes covering a broad range of topics, from basic
to advanced level. Recommended application notes for getting
started with PSoC 4 are:
AN79953: Getting Started With PSoC 4
AN88619: PSoC 4 Hardware Design Considerations
AN86439: Using PSoC 4 GPIO Pins
AN57821: Mixed Signal Circuit Board Layout
AN81623: Digital Design Best Practices
AN73854: Introduction To Bootloaders
AN89610: ARM Cortex Code Optimization
Technical Reference Manual (TRM) is in two documents:
Architecture TRM details each PSoC 4 functional block.
Registers TRM describes each of the PSoC 4 registers.
Development Kits:
CY8CKIT-042, PSoC 4 Pioneer Kit, is an easy-to-use and
inexpensive development platform. This kit includes
connectors for Arduino™ compatible shields and Digilent®
Pmod™ daughter cards.
CY8CKIT-049 is a very low-cost prototyping platform. It is a
low-cost alternative to sampling PSoC 4 devices.
CY8CKIT-001 is a common development platform for any
one of the PSoC 1, PSoC 3, PSoC 4, or PSoC 5LP families
of devices.
The MiniProg3 device provides an interface for flash
programming and debug.
PSoC Creator
PSoC Creator is a free Windows-based Integrated Design Environment (IDE). It enables concurrent hardware and firmware design
of PSoC 3, PSoC 4, and PSoC 5LP based systems. Create designs using classic, familiar schematic capture supported by over 100
pre-verified, production-ready PSoC Components; see the list of component datasheets. With PSoC Creator, you can:
1. Drag and drop component icons to build your hardware
system design in the main design workspace
2. Codesign your application firmware with the PSoC hardware,
using the PSoC Creator IDE C compiler
3. Configure components using the configuration tools
4. Explore the library of 100+ components
5. Review component datasheets
Figure 1. Multiple-Se ns or Example Project in PSoC Creator
3
1
2
4
5
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 3 of 28
Contents
PSoC 4200DS Block Diagram .............. .. ... ... ....................4
Functional Definitio n ........................................................5
CPU and Memory Subsystem .....................................5
System Resources ......................................................5
Analog Block ...............................................................6
Programmable Digital ..................................................6
Fixed Function Digital .................................................. 7
GPIO ........................................................................... 7
Pinouts ..............................................................................8
Power ...............................................................................10
Unregulated External Supply ..................................... 10
Regulated External Supply ........................................ 10
Development Support ......... ... ...................... ..................10
Documentation .......................................................... 10
Online ........................................................................ 10
Tools .......................................................................... 10
Electrical Specifications ................................................11
Absolute Maximum Ratings ....................................... 11
Device Level Specifications .......................................11
Analog Peripherals .................................................... 14
Digital Peripherals ..................................................... 15
Memory ..................................................................... 17
System Resources .................................................... 17
Ordering Information ......................................................20
Part Numbering Conventions .................................... 21
Packaging ........................................................................22
Acronyms ........................................................................24
Document Conventions .................. ... ... .........................26
Units of Measure ....................................................... 26
Revision History ........................................................ .. ...27
Sales, Solutions, and Legal Information ......................28
Worldwide Sales and Design Support ....................... 28
Products .................................................................... 28
PSoC® Solutions ...................................................... 28
Cypress Developer Community ................................. 28
Technical Support ..................................................... 28
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 4 of 28
PSoC 4200DS Block Diagram
The PSoC 4200DS devices include extensive support for
programming, testing, debugging, and tracing both hardware
and firmware.
The ARM Serial_Wire Debug (SWD) interface supports all
programming and debug features of the device.
Complete debug-on-chip functionality enables full-device
debugging in the final system using the standard production
device. It does not require special interfaces, debugging pods,
simulators, or emulators. Only the standard programming
connections are required to fully support debug.
The PSoC Creator Integrated Development Environment (IDE)
provides fully integrated programming and debug support for
PSoC 4200DS devices. The SWD interface is fully compatible
with industry-standard third-party tools. The PSoC 4200DS
family provides a level of security not possible with multi-chip
application solutions or with microcontrollers. This is due to its
ability to disable debug features, robust flash protection, and
because it allows customer-proprietary functionality to be imple-
mented in on-chip programmable blocks.
The debug circuits are enabled by default and can only be
disabled in firmware. If not enabled, the only way to re-enable
them is to erase the entire device, clear flash protection, and
reprogram the device with new firmware that enables debugging.
Additionally, all device interfaces can be permanently disabled
(device security) for applications concerned about phishing
attacks due to a maliciously reprogrammed device or attempts to
defeat security by starting and interrupting flash programming
sequences. Because all programming, debug, and test inter-
faces are disabled when maximum device security is enabled,
PSoC 4200DS with device security enabled may not be returned
for failure analysis. This is a trade-off the PSoC 4200DS allows
the customer to make.
Peripherals
CPU Subsystem
System Interconnect (Single Layer AHB)
PSoC 4200DS
M0S8
Architecture
IOSS GPIO (4x ports)
I/O Sub s ys te m
Peripheral Interconnect (MMIO)
PCLK
SWD/TC
NVIC, IRQMUX
Cortex
M0
48 MHz
FAST MUL
FLASH
64 KB
Read Accelerator
SPCIF
SRAM
8 KB
SRAM Controller
ROM
8 KB
ROM Controller
32-bit
AHB-Lite
21 x GPIOs
DeepSleep
Active/ Sleep
Power Modes
Digital DFT
Test
Analog DFT
System Resources
Lite
Power
Clock
Reset
Clock Control
IMO
Sleep Control
REFPOR
Reset Control
TestMode Entry
WIC
XRES
WDT
ILO
PWRSYS
2x LP Comparator
High Speed I/ O Matrix & 1x Programmable I/O
DataWire/
DMA
Initiator / MMIO
x4
UDB...
Programmable
Digital
UDB
4x TCPWM
3x SCB-I2C/SPI/UART
Port Interface & Digital System Interconnect (DSI)
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 5 of 28
Functional Definition
CPU and Memory Subsystem
CPU
The Cortex-M0 CPU in the PSoC 4200DS is part of the 32-bit
MCU subsystem, which is optimized for low-power operation
with extensive clock gating. Most instructions are 16 bits in length
and execute a subset of the Thumb-2 instruction set. The
Cypress implementation includes a hardware multiplier that
provides a 32-bit result in one cycle. It includes a nested vectored
interrupt controller (NVIC) block with 32 interrupt inputs and also
includes a Wakeup Interrupt Controller (WIC), which can wake
the processor up from the Deep Sleep mode allowing power to
be switched off to the main processor when the chip is in the
Deep Sleep mode. The Cortex-M0 CPU provides a
Non-Maskable Interrupt (NMI) input, which is made available to
the user when it is not in use for system functions requested by
the user.
The CPU also includes a debug interface, the serial wire debug
(SWD) interface, which is a 2-wire form of JTAG; the debug
configuration used for PSoC 4200DS has four break-point
(address) comparators and two watchpoint (data) comparators.
Flash
The PSoC 4200DS has a flash module with a flash accelerator,
tightly coupled to the CPU to improve average access times from
the flash block. The flash accelerator delivers 85% of
single-cycle SRAM access performance on average. Part of the
flash module can be used to emulate EEPROM operation if
required.
SRAM
8K of SRAM memory is provided.
SROM
A supervisory ROM that contains boot and configuration routines
is provided.
DMA
A DMA engine, with eight channels, is provided that can do 32-bit
transfers and has chainable ping-pong descriptors.
System Resources
Power System
The power system is described in detail in the section Power on
page 10. It provides assurance that voltage levels are as
required for each respective mode and either delay mode entry
(on power-on reset (POR), for example) until voltage levels are
as required for proper function or generate resets (brown-out
detect (BOD)) or interrupts (low-voltage detect (LVD)). The
PSoC 4200D operates with a single external supply over the
range of 1.71 V to 5.5 V and has three different power modes,
transitions between which are managed by the power system.
The PSoC 4200D provides Active, Sleep, and Deep Sleep
modes.
Clock System
The PSoC 4200DS clock system is responsible for providing
clocks to all subsystems that require clocks and for switching
between different clock sources without glitching. In addition, the
clock system ensures that no meta-stable conditions occur.
The clock system for the PSoC 4200DS consists of the IMO (3
to 48 MHz) and the ILO (40-kHz nominal) internal oscillators, and
provision for an external clock.
Figure 2. PSoC 4200DS MCU Clocking Architecture
The clk_hf signal can be divided down to generate synchronous
clocks for the UDBs, and the analog and digital peripherals.
There are a total of six clock dividers for the PSoC 4200DS, each
with 16-bit divide capability, two of which support fractional
baud-rate generation. The 16-bit capability allows a lot of flexi-
bility in generating fine-grained frequency values and is fully
supported in PSoC Creator.
IMO Clock Source
The IMO is the primary source of internal clocking in the
PSoC 4200D. It is trimmed during testing to achieve the
specified accuracy. Trim values are stored in nonvolatile
memory. Trimming can also be done on the fly to allow in-field
calibration. The IMO default frequency is 24 MHz and it can be
adjusted between the range of 24 to 48 MHz. IMO tolerance with
Cypress-provided calibration settings is ±2%. An IMO
post-divider with possible divide values of 2, 4, or 8 can be used
to divide the clock down to 3 MHz if required.
ILO Clock Source
The ILO is a very low power oscillator, nominally 40 kHz, which
is primarily used to generate clocks for peripheral operation in
Deep Sleep mode. ILO-driven counters can be calibrated to the
IMO to improve accuracy. Cypress provides a software
component, which does the calibration.
Watchdog Timer
A watchdog timer is implemented in the clock block running from
the low-frequency clock; this allows watchdog operation during
Deep Sleep and generates a watchdog reset or an interrupt if not
serviced before the timeout occurs. The watchdog reset is
recorded in the Reset Cause register.
dsi _out[3:0]
IMO
ILO
clk_ext
clk_hf
clk_lf
dsi_in[3]
dsi_in[2]
dsi_in[0]
dsi_in[1]
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 6 of 28
Reset
The PSoC 4200DS can be reset from a variety of sources
including a software reset. Reset events are asynchronous and
guarantee reversion to a known state. The reset cause is
recorded in a register, which is sticky through reset and allows
software to determine the cause of the reset. An XRES pin is
reserved for external reset to avoid complications with configu-
ration and multiple pin functions during power-on or reconfigu-
ration.
Analog Block
Low-power Comparators
The PSoC 4200DS has a pair of low-power comparators, with
two different power modes allowing trade-off of power versus
response time.
Programmable Digital
Universal Digital Blocks (UDBs) and Port Interfaces
The PSoC 4200DS has four UDBs; the UDB array also provides
a switched Digital System Interconnect (DSI) fabric that allows
signals from peripherals and ports to be routed to and through
the UDBs for communication and control. The UDB array is
shown in the following figure.
UDBs can be clocked from a clock divider block, from a port
interface (required for peripherals such as SPI), and from the DSI
network directly or after synchronization.
Figure 3. UDB Array
A port interface is defined, which acts as a register that can be
clocked with the same source as the PLDs inside the UDB array.
This allows faster operation because the inputs and outputs can
be registered at the port interface close to the I/O pins and at the
edge of the array. The port interface registers can be clocked by
one of the I/Os from the same port. This allows interfaces such
as SPI to operate at higher clock speeds by eliminating the delay
for the port input to be routed over DSI and used to register other
inputs. The port interface is shown in Figure 4.
The UDBs can generate interrupts (one UDB at a time) to the
interrupt controller. The UDBs retain the ability to connect to any
pin on the chip through the DSI.
Figure 4. Port Interface
Programmable Digital Subsystem
UDBIF
UDB UDB
UDB UDB
DSI DSI
DSI DSI
BUS IF IRQ IF CLK IF Port IF
Port IF
Port IF
Hi g h -Speed I/O Matrix
CPUSSAHB Bridge Dig CLKS
4 to 8
8 to 32
Scalable array of
UDBs (max=16)
Routing
Channels
Ot h e r Di g i t a l
Signals in Chip
Clock Selector
Block from
UDB
9
Digital
GlobalClocks
3 DSI Signals ,
1 I/O Signal
4
Reset Selector
Block from
UDB
2
2
Input Registers Output Registers
To DSI
8
From DSI
8
8 8
Enables
8
From DSI
4
4
7 6 . . . 0 7 6 . . . 0 3210
High Speed I/O Matrix
To Clock
Tree
[0]
[0]
[1]
[1]
[1]
[1]
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 7 of 28
Fixed Function Digital
Timer/Counter/PWM (TCPWM) Block
The TCPWM block uses a16-bit counter with user-program-
mable period length. There is a Capture register to record the
count value at the time of an event (which may be an I/O event),
a period register which is used to either stop or auto-reload the
counter when its count is equal to the period register, and
compare registers to generate compare value signals, which are
used as PWM duty cycle outputs. The block also provides true
and complementary outputs with programmable offset between
them to allow use as deadband programmable complementary
PWM outputs. It also has a Kill input to force outputs to a prede-
termined state; for example, this is used in motor drive systems
when an overcurrent state is indicated and the PWMs driving the
FETs need to be shut off immediately with no time for software
intervention. The PSoC 4200D has four TCPWM blocks.
Serial Communication Blocks (SCB)
The PSoC 4200D has three SCBs, which can each implement
an I2C, UART, or SPI interface.
I2C Mode: The hardware I2C block implements a full
multi-master and slave interface (it is capable of multimaster
arbitration). This block is capable of operating at speeds of up to
1 Mbps (Fast Mode Plus) and has flexible buffering options to
reduce interrupt overhead and latency for the CPU. It also
supports EzI2C that creates a mailbox address range in the
memory of the PSoC 4200D and effectively reduces I2C commu-
nication to reading from and writing to an array in memory. In
addition, the block supports an 8-deep FIFO for receive and
transmit which, by increasing the time given for the CPU to read
data, greatly reduces the need for clock stretching caused by the
CPU not having read data on time. The FIFO mode is available
in all channels and is very useful in the absence of DMA.
The I2C peripheral is compatible with the I2C Standard-mode,
Fast-mode, and Fast-mode Plus devices as defined in the NXP
I2C-bus specification and user manual (UM10204). The I2C bus
I/O is implemented with GPIO in open-drain modes.
UART Mode: This is a full-feature UART operating at up to
1 Mbps. It supports automotive single-wire interface (LIN),
infrared interface (IrDA), and SmartCard (ISO7816) protocols, all
of which are minor variants of the basic UART protocol. In
addition, it supports the 9-bit multiprocessor mode that allows
addressing of peripherals connected over common RX and TX
lines. Common UART functions such as parity error, break
detect, and frame error are supported. An 8-deep FIFO allows
much greater CPU service latencies to be tolerated. Note that
hardware handshaking is not supported. This is not commonly
used and can be implemented with a UDB-based UART in the
system, if required.
SPI Mode: The SPI mode supports full Motorola SPI, TI SSP
(essentially adds a start pulse used to synchronize SPI Codecs),
and National Microwire (half-duplex form of SPI). The SPI block
can use the FIFO to buffer transfers.
GPIO
The PSoC 4200DS has 21 GPIOs in the 25-ball CSP package.
The GPIO block implements the following:
Eight drive strength modes including strong push-pull, resistive
pull-up and pull-down, weak (resistive) pull-up and pull-down,
open drain and open source, input only, and disabled
Input threshold select (CMOS or LVTTL)
Individual control of input and output disables
Hold mode for latching previous state (used for retaining I/O
state in Deep Sleep mode)
Selectable slew rates for dV/dt related noise control to improve
EMI
The pins are organized in logical entities called ports, which are
8-bit in width. During power-on and reset, the blocks are forced
to the disable state so as not to crowbar any inputs and/or cause
excess turn-on current. A multiplexing network known as a
high-speed I/O matrix is used to multiplex between various
signals that may connect to an I/O pin. Pin locations for
fixed-function peripherals are also fixed to reduce internal multi-
plexing complexity (these signals do not go through the DSI
network). DSI signals are not affected by this and any pin may
be routed to any UDB through the DSI network.
Data output and pin state registers store, respectively, the values
to be driven on the pins and the states of the pins themselves.
Every I/O pin can generate an interrupt if so enabled and each
I/O port has an interrupt request (IRQ) and interrupt service
routine (ISR) vector associated with it (4 for the PSoC 4200DS).
Document Number: 001-98044 Rev. *D Page 8 of 28
PSoC® 4: PSoC 4200DS Family
Datasheet
Pinouts
The following is the pin list for the PSoC 4200DS. Pins 16, 17, and 18 are No-Connects in the 28-pin SSOP package.
Table 1. PSoC 4200DS Pin Description
28-Pin SSOP 25-Ball CSP Alternate Functions for Pins Pin Description
Pin Name Pin Name Analog PRGIO Alt 1 Alt 2 Alt 3 Alt 4
19 P0.0 E4 P0.0 lpcomp.in_p[0] tcpwm.line[2] scb[0].spi_select
1
P0.0, LPC0, TCPWM2, SCB0
20 P0.1 E3 P0.1 lpcomp.in_n[0] tcpwm.line_compl[
2]
scb[0].spi_select
2
P0.1, LPC0, TCPWM2, SCB0
21 P0.2 D3 P0.2 tcpwm.line[3] scb[0].spi_select
3
P0.2, TCPWM3, SCB0
22 P0.4 E2 P0.4 scb[1].uart_rx scb[1].i2c_sc
l
scb[1].spi_mosi P0.4, SCB1
23 P0.5 C4 P0.5 scb[1].uart_tx scb[1].i2c_sd
a
scb[1].spi_miso P0.5, SCB1
24 P0.6 C3 P0.6 ext_clk scb[1].uart_cts scb[1].spi_clk P0.6, Ext Clock, SCB1
25 XRES D2 XRES XRES
26 VCCD E1 VCCD Regulator Output
28 VSSD D1 VSSD Power Supply
27 VDDD C1 VDDD Ground
1P1.0 C2 P1.0 tcpwm.line[2] scb[0].uart_rx scb[0].i2c_sc
l
scb[0].spi_mosi P1.0, TCPWM2, SCB0
2P1.1 B2 P1.1 tcpwm.line_compl[
2]
scb[0].uart_tx scb[0].i2c_sd
a
scb[0].spi_miso P1.1, TCPWM2, SCB0
3P1.2 B1 P1.2 tcpwm.line[3] scb[0].uart_cts scb[0].spi_clk P1.2, TCPWM3, SCB0
4P1.3 A1 P1.3 tcpwm.line_compl[
3]
scb[0].uart_rts scb[0].spi_select
0
P1.3, TCPWM3, SCB0
5P2.2 B3 P2.2 prgio[0].io[2] scb[2].uart_rx scb[2].i2c_sc
l
scb[2].spi_mosi P2.2, PRG, SCB2
6P2.3 A2 P2.3 prgio[0].io[3] scb[2].uart_tx scb[2].i2c_sd
a
scb[2].spi_miso P2.3, PRG. SCB2
7P2.4 B4 P2.4 prgio[0].io[4] tcpwm.line[0] scb[2].uart_cts lpcomp.comp
[0]
scb[2].spi_clk P2.4, PRG, TCPWM0, SCB2,
LPC0
8P2.5 A4 P2.5 prgio[0].io[5] tcpwm.line_compl[
0]
scb[2].uart_rts scb[2].spi_select
0
P2.5, PRG, TCPWM0, SCB2
9P2.6 A3 P2.6 prgio[0].io[6] tcpwm.line[1] scb[2].spi_select
1
P2.6, PRG, TCPWM1, SCB2
10 P2.7 A5 P2.7 prgio[0].io[7] tcpwm.line_compl[
1]
scb[2].spi_select
2
P2.7, PRG, TCPWM1, SCB2
Document Number: 001-98044 Rev. *D Page 9 of 28
PSoC® 4: PSoC 4200DS Family
Datasheet
Descriptions of the power pin functions are as follows:
VDDD: Power supply for the chip.
VSSD: Ground pin.
VCCD: Regulated digital supply (1.8 V ±5% if supplied externally).
11 P3.0 D5 P3.0 tcpwm.line[0] scb[1].uart_rx scb[1].i2c_sc
l
scb[1].spi_mosi P3.0, TCPWM0, SCB1
12 P3.1 C5 P3.1 tcpwm.line_compl[
0]
scb[1].uart_tx scb[1].i2c_sd
a
scb[1].spi_miso P3.1, TCPWM0, SCB1
13 P3.2 E5 P3.2 tcpwm.line[1] scb[1].uart_cts swd_data scb[1].spi_clk P3.2, TCPWM1, SCB1,
SWD_IO
14 P3.3 B5 P3.3 tcpwm.line_compl[
1]
scb[1].uart_rts swd_clk scb[1].spi_select
0
P3.3, TCPWM1, SCB1,
SWD_CLK
15 P3.4 D4 P3.4 scb[1].spi_select
1
P3.4, SCB1
Table 1. PSoC 4200DS Pin Description (continued)
28-Pin SSOP 25-Ball CSP Alternate Functions for Pins Pin Description
Pin Name Pin Name Analog PRGIO Alt 1 Alt 2 Alt 3 Alt 4
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 10 of 28
Power
The supply voltage range is 1.71 to 5.5 V with all functions and
circuits operating over that range.
The PSoC 4200DS family allows two distinct modes of power
supply operation: Unregulated External Supply and Regulated
External Supply modes.
Unregulated External Supply
In this mode, the PSoC 4200DS is powered by an External
Power Supply that can be anywhere in the range of 1.8 to 5.5 V.
This range is also designed for battery-powered operation, for
instance, the chip can be powered from a battery system that
starts at 3.5V and works down to 1.8 V. In this mode, the internal
regulator of the PSoC 4200DS supplies the internal logic and the
VCCD output of the PSoC 4200DS must be bypassed to ground
via an external capacitor.
Bypass capacitors must be used from VDDD to ground, typical
practice for systems in this frequency range is to use a capacitor
in the 1 µF range in parallel with a smaller capacitor (0.1 µF, for
example). Note that these are simply rules of thumb and that, for
critical applications, the PCB layout, lead inductance, and the
Bypass capacitor parasitic should be simulated to design and
obtain optimal bypassing.
Regulated External Supply
In this mode, the PSoC 4200DS is powered by an external power
supply that must be within the range of 1.71 to 1.89 V (1.8 ±5%);
note that this range needs to include power supply ripple. In this
mode, VCCD and VDDD pins are shorted together and
bypassed. The internal regulator should be disabled in firmware.
Development Support
The PSoC 4200DS family has a rich set of documentation, devel-
opment tools, and online resources to assist you during your
development process. Visit www.cypress.com/go/psoc4 to find
out more.
Documentation
A suite of documentation supports the PSoC 4200DS family to
ensure that you can find answers to your questions quickly. This
section contains a list of some of the key documents.
Software User Guide: A step-by-step guide for using
PSoC Creator. The software user guide shows you how the
PSoC Creator build process works in detail, how to use source
control with PSoC Creator, and much more.
Component Datasheets: The flexibility of PSoC allows the
creation of new peripherals (components) long after the device
has gone into production. Component data sheets provide all of
the information needed to select and use a particular component,
including a functional description, API documentation, example
code, and AC/DC specifications.
Application No tes: PSoC application notes discuss a particular
application of PSoC in depth; examples include brushless DC
motor control and on-chip filtering. Application notes often
include example projects in addition to the application note
document.
T echnical Reference Manual: The Technical Reference Manual
(TRM) contains all the technical detail you need to use a PSoC
device, including a complete description of all PSoC registers.
Online
In addition to print documentation, the Cypress PSoC forums
connect you with fellow PSoC users and experts in PSoC from
around the world, 24 hours a day, 7 days a week.
Tools
With industry standard cores, programming, and debugging
interfaces, the PSoC 4200DS family is part of a development tool
ecosystem. Visit us at www.cypress.com/go/psoccreator for the
latest information on the revolutionary, easy to use PSoC Creator
IDE, supported third party compilers, programmers, debuggers,
and development kits.
Power Supply Typical Bypass Capac i tors
VDDD–VSS 0.1-µF ceramic at each pin plus bulk
capacitor 1 to 10 µF.
VCCD–VSS 0.1-µF ceramic capacitor at the VCCD pin
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 11 of 28
Electrical Specifications
Absolute Maximum Ratings
Device Level Specifications
All specifications are valid for -40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted.
Note
1. Usage above the absolute maximum conditions listed in Tab le 2 may cause permanent damage to the device. Exposure to absolute maximum conditions for extended
periods of time may affect device reliability. The maximum storage temperature is 150 °C in compliance with JEDEC Standard JESD22-A103, High Temperature
Storage Life. When used below absolute maximum conditions but above normal operating conditions, the device may not operate to specification.
Table 2. Absolute Maximum Ratings[1]
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID1 VDD_ABS Analog or digital supply relative to VSS
(VSSD = VSSA)
–0.5 – 6 V Absolute maximum
SID2 VCCD_ABS Direct digital core voltage input relative
to VSSD
–0.5 – 1.95 V Absolute maximum
SID3 VGPIO_ABS GPIO voltage; VDDD or VDDA –0.5 VDD+0.
5
V Absolute maximum
SID4 IGPIO_ABS Current per GPIO –25 25 mA Absolute maximum
SID5 IG-PIO_injection GPIO injection current per pin –0.5 0.5 mA Absolute maximum
BID44 ESD_HBM Electrostatic discharge human body
model
2200 V
BID45 ESD_CDM Electrostatic discharge charged device
model
500 V
BID46 LU Pin current for latch-up –140 140 mA
Table 3. DC Specifications
Spec Id# Parameter Description Min Typ Max Units Det ails / Conditions
SID53 VDDD Power supply input voltage unregulated 1.8 5.5 V With on-chip internal
regulator enabled
SID255 VDDD Power supply input voltage externally
regulated
1.71 1.8 1.89 V Externally regulated
within this range
SID54 VCCD Output voltage (for core logic) 1.8 V
SID55 CEFC External regulator voltage bypass 0.1 µF X5R ceramic or
better
SID56 CEXC Power supply decoupling capacitor 1 µF X5R ceramic or
better
Active Mode
SID6 IDD1 Execute from flash; CPU at 6 MHz 2.1 2.85 mA
SID7 IDD2 Execute from flash; CPU at 12 MHz 3.6 4 mA
SID8 IDD3 Execute from flash; CPU at 24 MHz 5.3 6 mA
SID9 IDD4 Execute from flash; CPU at 48 MHz 9.8 13 mA
Sleep Mode
SID21 IDD16 I2C wakeup, WDT, and comparators on.
Regulator off.
–1.451.65mAV
DD = 1.71 to 1.89,
6MHz
SID22 IDD17 I2C wakeup, WDT, and comparators on. 1.8 2.45 mA VDD = 1.8 to 5.5,
6MHz
SID23 IDD18 I2C wakeup, WDT, and comparators on.
Regulator off.
– 1.6 1.9 mA VDD = 1.71 to 1.89,
12 MHz
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 12 of 28
GPIO
SID24 IDD19 I2C wakeup, WDT, and comparators on. 2 2.7 mA VDD = 1.8 to 5.5,
12 MHz
Deep Sleep Mode, -40 °C to + 60 °C (Guaranteed by characterization)
SID30 IDD25 I2C wakeup and WDT on. Regulator off. 2 15 µA VDD = 1.71 to 1.89
SID31 IDD26 I2C wakeup and WDT on. 2 15 µA VDD = 1.8 to 3.6
SID32 IDD27 I2C wakeup and WDT on. 2 15 µA VDD = 3.6 to 5.5
Deep Sleep Mode, +85 °C (Guaranteed by ch aracterization)
SID33 IDD28 I2C wakeup and WDT on. Regulator off. 4 45 µA VDD = 1.71 to 1.89
SID34 IDD29 I2C wakeup and WDT on. 4 45 µA VDD = 1.8 to 3.6
SID35 IDD30 I2C wakeup and WDT on. 4 45 µA VDD = 3.6 to 5.5
XRES current
SID307 IDD_XR Supply current while XRES (Active Low)
asserted
–25mA
Table 3. DC Specifications (continued)
Spec Id# Parameter Description Min Typ Max Units Det ails / Conditions
Table 4. AC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID48 FCPU CPU frequency DC 48 MHz 1.71 VDD 5.5
SID49 TSLEEP Wakeup from sleep mode 0 µs Guaranteed by
characterization
SID50 TDEEPSLEEP Wakeup from Deep Sleep mode 35 µs Guaranteed by
characterization
SID52 TRESETWIDTH External reset pulse width 1 µs Guaranteed by
characterization
Note
2. VIH must not exceed VDDD + 0.2 V.
Table 5. GPIO DC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID57 VIH[2] Input voltage high threshold 0.7 ×
VDDD
V CMOS Input
SID58 VIL Input voltage low threshold 0.3 ×
VDDD
V CMOS Input
SID241 VIH[2] LVTTL input, VDDD < 2.7 V 0.7×
VDDD
–– V
SID242 VIL LVTTL input, VDDD < 2.7 V 0.3 ×
VDDD
V
SID243 VIH[2] LVTTL input, VDDD 2.7 V 2.0 V
SID244 VIL LVTTL input, VDDD 2.7 V 0.8 V
SID59 VOH Output voltage high level VDDD
–0.6
–– VI
OH = 4mA at 3V
VDDD
SID60 VOH Output voltage high level VDDD
–0.5
–– VI
OH = 1 mA at
1.8 V VDDD
SID61 VOL Output voltage low level 0.6 V IOL = 4 mA at
1.8 V VDDD
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 13 of 28
SID62 VOL Output voltage low level 0.6 V IOL = 8mA at 3V
VDDD
SID62A VOL Output voltage low level 0.4 V IOL = 3mA at 3V
VDDD
SID63 RPULLUP Pull-up resistor 3.5 5.6 8.5 k
SID64 RPULLDOWN Pull-down resistor 3.5 5.6 8.5 k
SID65 IIL Input leakage current (absolute value) 2 nA 25 °C, VDDD =
3.0 V
SID66 CIN Input capacitance 7 pF
SID67 VHYSTTL Input hysteresis LVTTL 25 40 mV VDDD 2.7 V
SID68 VHYSCMOS Input hysteresis CMOS 0.05 ×
VDDD
––mV
SID69 IDIODE Current through protection diode to
VDD/Vss
100 µA Guaranteed by
characterization
SID69A ITOT_GPIO Maximum Total Source or Sink Chip
Current
200 mA Guaranteed by
characterization
Table 5. GPIO DC Specifications (continued)
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
Note
3. Simultaneous switching transitions on many fully-loaded GPIO pins may cause ground perturbations depending on several factors including PCB and decoupling
capacitor design. For applications that are very sensitive to ground perturbations, the slower GPIO slew rate setting may be used.
Table 6. GPIO AC Specifications
(Guaranteed by Characterization)[3]
Spec ID # Parameter Description Min Typ Max Units Details/
Conditions
SID70 TRISEF Rise time in fast strong mode 2 12 ns 3.3 V VDDD,
Cload = 25 pF
SID71 TFALLF Fall time in fast strong mode 2 12 ns 3.3 V VDDD,
Cload = 25 pF
SID72 TRISES Rise time in slow strong mode 10 60 ns 3.3 V VDDD,
Cload = 25 pF
SID73 TFALLS Fall time in slow strong mode 10 60 ns 3.3 V VDDD,
Cload = 25 pF
SID74 FGPIOUT1 GPIO Fout;3.3 V VDDD 5.5 V. Fast
strong mode.
33 MHz 90/10%, 25 pF
load, 60/40 duty
cycle
SID75 FGPIOUT2 GPIO Fout;1.7 VVDDD3.3 V. Fast
strong mode.
16.7 MHz 90/10%, 25 pF
load, 60/40 duty
cycle
SID76 FGPIOUT3 GPIO Fout;3.3 V VDDD 5.5 V. Slow
strong mode.
7 MHz 90/10%, 25 pF
load, 60/40 duty
cycle
SID245 FGPIOUT4 GPIO Fout;1.7 V VDDD 3.3 V. Slow
strong mode.
3.5 MHz 90/10%, 25 pF
load, 60/40 duty
cycle
SID246 FGPIOIN GPIO input operating frequency;
1.71 V VDDD 5.5 V
48 MHz 90/10% VIO
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 14 of 28
XRES
Analog Peripherals
Comparator
Table 7. XRES DC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID77 VIH Input voltage high threshold 0.7 ×
VDDD
V CMOS Input
SID78 VIL Input voltage low threshold 0.3 ×
VDDD
V CMOS Input
SID79 RPULLUP Pull-up resistor 3.5 5.6 8.5 k
SID80 CIN Input capacitance 3 pF
SID81 VHYSXRES Input voltage hysteresis 100 mV Guaranteed by
characterization
SID82 IDIODE Current through protection diode to
VDDD/VSS
100 µA Guaranteed by
characterization
Table 8. XRES AC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID83 TRESETWIDTH Reset pulse width 1 µs Guaranteed by
characterization
Table 9. Comparator DC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID85 VOFFSET2 Input offset voltage, Common Mode
voltage range from 0 to VDD-1
–– ±4 mV
SID86 VHYST Hysteresis when enabled, Common
Mode voltage range from 0 to VDD -1.
10 35 mV Guaranteed by
characterization
SID87 VICM1 Input common mode voltage in normal
mode
0–V
DDD – 0.1 V Modes 1 and 2.
SID247 VICM2 Input common mode voltage in
low-power mode
0–V
DDD V
SID88 CMRR Common mode rejection ratio 50 dB VDDD 2.7 V.
Guaranteed by
characterization
SID88A CMRR Common mode rejection ratio 42 dB VDDD 2.7 V.
Guaranteed by
characterization
SID89 ICMP1 Block current, normal mode 400 µA Guaranteed by
characterization
SID248 ICMP2 Block current, low power mode 100 µA Guaranteed by
characterization
SID90 ZCMP DC input impedance of comparator 35 MGuaranteed by
characterization
Table 10. Comparator AC Specifications
(Guaranteed by Characterization)
Spec ID # Parameter Description Min Typ Max Units Details/Conditions
SID91 TRESP1 Response time, normal mode 110 ns 50-mV overdrive
SID258 TRESP2 Response time, low power mode 200 ns 50-mV overdrive
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 15 of 28
Digital Peripherals
The following specifications apply to the Timer/Counter/PWM peripheral in timer mode.
Timer/Counter/PWM
I2C
Table 11. TCPWM Specifications
(Guaranteed by Characterization)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID.TCPWM.1 ITCPWM1 Block current consumption at 3 MHz 45 µA All modes
(Timer/Counter/PWM)
SID.TCPWM.2 ITCPWM2 Block current consumption at 12 MHz 155 µA All modes
(Timer/Counter/PWM)
SID.TCPWM.2A ITCPWM3 Block current consumption at 48 MHz 650 µA All modes
(Timer/Counter/PWM)
SID.TCPWM.3 TCPWMFREQ Operating frequency Fc MHz Fc max = Fcpu.
Maximum = 48 MHz
SID.TCPWM.4 TPWMENEXT Input Trigger Pulse Width for all
Trigger Events 2/Fc ns
Trigger Events can be
Stop, Start, Reload,
Count, Capture, or Kill
depending on which
mode of operation is
selected.
SID.TCPWM.5 TPWMEXT Output Trigger Pulse widths 2/Fc ns
Minimum possible
width of Overflow,
Underflow, and CC
(Counter equals
Compare value)
trigger outputs
SID.TCPWM.5A TCRES Resolution of Counter 1/Fc ns
Minimum time
between successive
counts
SID.TCPWM.5B PWMRES PWM Resolution 1/Fc ns Minimum pulse width
of PWM Output
SID.TCPWM.5C QRES Quadrature inputs resolution 1/Fc ns
Minimum pulse width
between Quadrature
phase inputs.
Table 12. Fixed I2C DC Specifications
(Guaranteed by Characterization)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID149 II2C1 Block current consumption at 100 kHz 50 µA
SID150 II2C2 Block current consumption at 400 kHz 135 µA
SID151 II2C3 Block current consumption at 1 Mbps 310 µA
SID152 II2C4 I2C enabled in Deep Sleep mode 1.4 µA
Table 13. Fixed I2C AC Specifications
(Guaranteed by Characterization)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID153 FI2C1 Bit rate 1 Mbps
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 16 of 28
SPI Specifications
Table 14. Fixed UART DC Specifications
(Guaranteed by Characterization)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID160 IUART1 Block current consumption at
100 Kbits/sec
––55µA
SID161 IUART2 Block current consumption at
1000 Kbits/sec
312 µA
Table 15. Fixed UART AC Specifications
(Guaranteed by Characterization)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID162 FUART Bit rate 1 Mbps
Table 16. Fixed SPI DC Specifications
(Guaranteed by Characterization)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID163 ISPI1 Block current consumption at 1 Mbits/sec 360 µA
SID164 ISPI2 Block current consumption at 4 Mbits/sec 560 µA
SID165 ISPI3 Block current consumption at 8 Mbits/sec 600 µA
Table 17. Fixed SPI AC Specifications
(Guaranteed by Characterization)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID166 FSPI SPI operating frequency (master; 6X
oversampling)
–– 8MHz
Table 18. Fixed SPI Ma ster mode AC Specifications
(Guaranteed by Characterization)
Spec ID Parameter Description Min Typ Max Units
SID167 TDMO MOSI valid after Sclock driving edge 15 ns
SID168 TDSI MISO valid before Sclock capturing edge.
Full clock, late MISO Sampling used
20 – – ns
SID169 THMO Previous MOSI data hold time with
respect to capturing edge at Slave
0– ns
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 17 of 28
Memory
System Resources
Power-on-Reset and Brown-out Detect (BOD) Specifications
Table 19. Fixed SPI Slave mode AC Specifications
(Guaranteed by Characterization)
Spec ID Parameter Description Min Typ Max Units
SID170 TDMI MOSI valid before Sclock capturing edge 40 ns
SID171 TDSO MISO valid after Sclock driving edge 42 + 3 ×
(1/FCPU)
ns
SID171A TDSO_ext MISO valid after Sclock driving edge in Ext.
Clock mode
– – 48 ns
SID172 THSO Previous MISO data hold time 0 ns
SID172A TSSELSCK SSEL Valid to first SCK Valid edge 100 ns
Table 20. Flash DC Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID173 VPE Erase and program voltage 1.71 5.5 V
Table 21. Flash AC Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID174 TROWWRITE Row (block) write time (erase and
program)
20 ms Row (block) = 256 bytes
SID175 TROWERASE Row erase time 13 ms
SID176 TROWPROGRAM Row program time after erase 7 ms
SID178 TBULKERASE Bulk erase time (64 KB) 35 ms
SID180 TDEVPROG Total device program time 15 seconds Guaranteed by charac-
terization
SID181 FEND Flash endurance 100 K cycles Guaranteed by charac-
terization
SID182 FRET Flash retention. TA 55 °C, 100 K
P/E cycles
20 years Guaranteed by charac-
terization
SID182A Flash retention. TA 85 °C, 10 K
P/E cycles
10 – – years Guaranteed by charac-
terization
Table 22. Power On Reset
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID.CLK#6 SR_POWER_UP Power supply slew rate 1 67 V/ms At power-up
SID185 VRISEIPOR Rising trip voltage 0.80 1.45 V Guaranteed by charac-
terization
SID186 VFALLIPOR Falling trip voltage 0.75 1.4 V Guaranteed by charac-
terization
BID51 Twupo Initialization after Power-On 3 ms
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 18 of 28
SWD Interface
Internal Main Oscillator
Internal Low-Speed Oscillator
Table 23. Brown-out Detect (BOD) for VCCD
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID190 VFALLPPOR BOD trip voltage in active and
sleep modes 1.48 - 1.62 V Guaranteed by
characterization
SID192 VFALLDPSLP BOD trip voltage in Deep Sleep 1.11 - 1.5 V Guaranteed by
characterization
Table 24. SWD Interfa ce Specification s
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID213 F_SWDCLK1 3.3 V VDD 5.5 V 14 MHz SWDCLK 1/3 CPU
clock frequency
SID214 F_SWDCLK2 1.71 V VDD 3.3 V 7 MHz SWDCLK 1/3 CPU
clock frequency
SID215 T_SWDI_SETUP T = 1/f SWDCLK 0.25*T ns Guaranteed by
characterization
SID216 T_SWDI_HOLD T = 1/f SWDCLK 0.25*T ns Guaranteed by
characterization
SID217 T_SWDO_VALID T = 1/f SWDCLK 0.5*T ns Guaranteed by
characterization
SID217A T_SWDO_HOLD T = 1/f SWDCLK 1 ns Guaranteed by
characterization
Table 25. IMO DC Specifications
(Guaranteed by Design)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID218 IIMO1 IMO operating current at 48 MHz 250 µA
SID219 IIMO2 IMO operating current at 24 MHz 180 µA
Table 26. IMO AC Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID223 FIMOTOL1 Frequency variation ±2 %
SID226 TSTARTIMO IMO startup time 7 µs
SID228 TJITRMSIMO2 RMS Jitter at 24 MHz 145 ps
Table 27. ILO DC Specifications
(Guaranteed by Design)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID231 IILO1 ILO operating current 0.3 1.05 µA Guaranteed by
Characterization
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 19 of 28
Table 28. ILO AC Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID234 TSTARTILO1 ILO startup time 2 ms Guaranteed by charac-
terization
SID236 TILODUTY ILO duty cycle 40 50 60 % Guaranteed by charac-
terization
SID237 FILOTRIM1 Operating frequency 20 40 80 kHz
Table 29. External Clock Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID305 ExtClkFreq External clock input frequency 0 48 MHz Guaranteed by
characterization
SID306 ExtClkDuty Duty cycle; Measured at VDD/2 45 55 % Guaranteed by
characterization
Table 30. UDB AC Specifications
(Guaranteed by Characterization)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
Datapath performance
SID249 FMAX-TIMER Max frequency of 16-bit timer in a
UDB pair
––48MHz
SID250 FMAX-ADDER Max frequency of 16-bit adder in a
UDB pair
––48MHz
SID251 FMAX_CRC Max frequency of 16-bit CRC/PRS in
a UDB pair
––48MHz
PLD Performance in UDB
SID252 FMAX_PLD Max frequency of 2-pass PLD
function in a UDB pair
––48MHz
Clock to Output Performance
SID253 TCLK_OUT_UDB1 Prop. delay for clock in to data out at
25 °C, Typ.
–15 ns
SID254 TCLK_OUT_UDB2 Prop. delay for clock in to data out,
Worst case.
–25 ns
Table 31. Block Specs
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID256* TWS48* Number of wait states at 48 MHz 2 CPU execution from
Flash
SID257 TWS24* Number of wait states at 24 MHz 1 CPU execution from
Flash
* Tws48 and Tws24 are guaranteed by Design
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 20 of 28
Ordering Information
The PSoC 4200DS family part numbers and features are listed in the following table.
The nomenclature used in the preceding table is based on the following part numbering convention:
Table 32. PSoC 420 0DS Ordering Information
Category
Marketing Part
Number (MPN)
MAX. CPU Speed
(MHz)
No. of DMA Channels
Flash (KB)
SRAM (KB)
Low-power
Comparators
No. of Universal
Digital Blocks (UDB)
Timer/Counter/PWM
Blocks (TCPWM)
No. of Serial
Communication
Blocks (SCB)
PRGIO
No. of GPIOs
Package Type
4045 CY8C4045PVI-DS402 48 8 32 4 2 - 4 3 1 21 28-pin SSOP
CY8C4045FNI-DS402 48 8 32 4 2 - 4 3 1 21 25-ball WLCSP
4245 CY8C4245PVI-DS402 48 8 32 4 2 4 4 3 1 21 28-pin SSOP
CY8C4245FNI-DS402 48 8 32 4 2 4 4 3 1 21 25-ball WLCSP
4246 CY8C4246PVI-DS402 48 8 64 8 2 4 4 3 1 21 28-pin SSOP
CY8C4246FNI-DS402 48 8 64 8 2 4 4 3 1 21 25-ball WLCSP
Field Description Values Meaning
CY8C Cypress Prefix
4 Architecture 4 PSoC 4
A Family 2 4200 Family
B CPU Speed 4 48 MHz
C Flash Capacity 5 32 KB
664 KB
DE Package Code PV SSOP
FN CSP
F Temperature Range I Industrial
S Silicon Family D PSoC 4D
XYZ Attributes Code 000-999 Code of feature set in the specific family
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 21 of 28
Part Numbering Conventions
The part number fields are defined as follows.
Architecture
Cypress Prefix
Family Group within Architecture
Sp eed Grad e
Flash Capacity
Packag e Co d e
Tem per atu r e R an g e
Attributes Code
CY8C 4 A EDCBFXS-Y
Z
Silicon Family
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 22 of 28
Packaging
The description of the PSoC 4200D package dimensions follows.
Spec Id# Package Description Package Dwg #
PKG_1 28-pin SSOP 28-pin SSOP, 8 mm × 10 mm × 2.0 mm
height with 0.65-mm pitch
51-85079
PKG_2 25-ball CSP 25-ball CSP, 2.07 mm × 2.11 mm ×
0.55 mm height with 0.4-mm pitch
001-97945
Table 33. Package Characteristics
Parameter Description Conditions Min Typ Max Units
TAOperating ambient temperature –40 25 85 °C
TJOperating junction temperature –40 100 °C
TJA Package θJA (28-pin SSOP) 67 °C/Watt
TJC Package θJC (28-pin SSOP) 26 °C/Watt
TJA Package θJA (25-ball CSP) 48 °C/Watt
TJC Package θJC (25-ball CSP) 0.47 °C/Watt
Table 34. Solder Reflow Pea k Temperature
Package Maximum Peak Temperature Maximum Time at Peak Temperature
All packages 260 °C 30 seconds
Table 35. Package Moisture Sen sitivity Le vel (MSL), IPC/JEDEC J-STD-2
Package MSL
28-pin SSOP MSL 3
25-ball CSP MSL 1
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 23 of 28
Figure 5. 28-Pin SSOP Package Outline
Figure 6. 25-b al l CSP 2.07 × 2.11 × 0.55 mm
51-85079 *F
001-97945 **
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 24 of 28
Acronyms
Table 36. Acrony ms Used in this Document
Acronym Description
abus analog local bus
ADC analog-to-digital converter
AG analog global
AHB AMBA (advanced microcontroller bus archi-
tecture) high-performance bus, an ARM data
transfer bus
ALU arithmetic logic unit
AMUXBUS analog multiplexer bus
API application programming interface
APSR application program status register
ARM®advanced RISC machine, a CPU architecture
ATM automatic thump mode
BW bandwidth
CAN Controller Area Network, a communications
protocol
CMRR common-mode rejection ratio
CPU central processing unit
CRC cyclic redundancy check, an error-checking
protocol
DAC digital-to-analog converter, see also IDAC, VDAC
DFB digital filter block
DIO digital input/output, GPIO with only digital
capabilities, no analog. See GPIO.
DMIPS Dhrystone million instructions per second
DMA direct memory access, see also TD
DNL differential nonlinearity, see also INL
DNU do not use
DR port write data registers
DSI digital system interconnect
DWT data watchpoint and trace
ECC error correcting code
ECO external crystal oscillator
EEPROM electrically erasable programmable read-only
memory
EMI electromagnetic interference
EMIF external memory interface
EOC end of conversion
EOF end of frame
EPSR execution program status register
ESD electrostatic discharge
ETM embedded trace macrocell
FIR finite impulse response, see also IIR
FPB flash patch and breakpoint
FS full-speed
GPIO general-purpose input/output, applies to a PSoC
pin
HVI high-voltage interrupt, see also LVI, LVD
IC integrated circuit
IDAC current DAC, see also DAC, VDAC
IDE integrated development environment
I2C, or IIC Inter-Integrated Circuit, a communications
protocol
IIR infinite impulse response, see also FIR
ILO internal low-speed oscillator, see also IMO
IMO internal main oscillator, see also ILO
INL integral nonlinearity, see also DNL
I/O input/output, see also GPIO, DIO, SIO, USBIO
IPOR initial power-on reset
IPSR interrupt program status register
IRQ interrupt request
ITM instrumentation trace macrocell
LCD liquid crystal display
LIN Local Interconnect Network, a communications
protocol.
LR link register
LUT lookup table
LVD low-voltage detect, see also LVI
LVI low-voltage interrupt, see also HVI
LVTTL low-voltage transistor-transistor logic
MAC multiply-accumulate
MCU microcontroller unit
MISO master-in slave-out
NC no connect
NMI nonmaskable interrupt
NRZ non-return-to-zero
NVIC nested vectored interrupt controller
NVL nonvolatile latch, see also WOL
opamp operational amplifier
PAL programmable array logic, see also PLD
PC program counter
PCB printed circuit board
Table 36. Acrony m s Used in this Document (continued)
Acronym Description
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 25 of 28
PGA programmable gain amplifier
PHUB peripheral hub
PHY physical layer
PICU port interrupt control unit
PLA programmable logic array
PLD programmable logic device, see also PAL
PLL phase-locked loop
PMDD package material declaration data sheet
POR power-on reset
PRES precise power-on reset
PRS pseudo random sequence
PS port read data register
PSoC®Programmable System-on-Chip™
PSRR power supply rejection ratio
PWM pulse-width modulator
RAM random-access memory
RISC reduced-instruction-set computing
RMS root-mean-square
RTC real-time clock
RTL register transfer language
RTR remote transmission request
RX receive
SAR successive approximation register
SC/CT switched capacitor/continuous time
SCL I2C serial clock
SDA I2C serial data
S/H sample and hold
SINAD signal to noise and distortion ratio
SIO special input/output, GPIO with advanced
features. See GPIO.
SOC start of conversion
SOF start of frame
SPI Serial Peripheral Interface, a communications
protocol
SR slew rate
SRAM static random access memory
SRES software reset
SWD serial wire debug, a test protocol
SWV single-wire viewer
TD transaction descriptor, see also DMA
Table 36. Acrony ms Used in this Document (continued)
Acronym Description
THD total harmonic distortion
TIA transimpedance amplifier
TRM technical reference manual
TTL transistor-transistor logic
TX transmit
UART Universal Asynchronous Transmitter Receiver, a
communications protocol
UDB universal digital block
USB Universal Serial Bus
USBIO USB input/output, PSoC pins used to connect to
a USB port
VDAC voltage DAC, see also DAC, IDAC
WDT watchdog timer
WOL write once latch, see also NVL
WRES watchdog timer reset
XRES external reset I/O pin
XTAL crystal
Table 36. Acrony m s Used in this Document (continued)
Acronym Description
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 26 of 28
Document Conventions
Units of Measure
Table 37. Units of Measure
Symbol Unit of Measure
°C degrees Celsius
dB decibel
fF femto farad
Hz hertz
KB 1024 bytes
kbps kilobits per second
Khr kilohour
kHz kilohertz
kkilo ohm
ksps kilosamples per second
LSB least significant bit
Mbps megabits per second
MHz megahertz
Mmega-ohm
Msps megasamples per second
µA microampere
µF microfarad
µH microhenry
µs microsecond
µV microvolt
µW microwatt
mA milliampere
ms millisecond
mV millivolt
nA nanoampere
ns nanosecond
nV nanovolt
ohm
pF picofarad
ppm parts per million
ps picosecond
s second
sps samples per second
sqrtHz square root of hertz
Vvolt
PSoC® 4: PSoC 4200DS Family
Datasheet
Document Number: 001-98044 Rev. *D Page 27 of 28
Revision History
Description Title: PSoC® 4: PSoC 4200DS Family Datasheet Programmable System-on-Chip (PSoC®)
Document Number: 001-98044
Revision ECN Orig. of
Change Submission
Date Description of Change
** 4795389 WKA 06/23/2015 New datasheet
*A 4931127 WKA 09/23/2015 Removed 28-pin SSOP package.
Updated Pinouts.
Updated DC Specifications.
Removed SID85A, SID247A, SID259, and SID92.
Added BID51.
*B 4958966 WKA 10/12/2015 Updated package dimensions.
Updated bulk erase time to 64 KB.
Changed SID226 max to 7.
Updated TJA typ to 48 and TJC typ to 0.47.
*C 5759255 WKA 05/31/2017 Added 28-pin SSOP package.
Updated to new template.
*D 5825921 WKA 07/20/2017 Updated Document Title to read as “PSoC® 4: PSoC 4200DS Family Datasheet
Programmable System-on-Chip (PSoC®)”.
Replaced “PSoC 4200D” with “PSoC 4200DS” in all instances across the
document.
Document Number: 001-98044 Rev. *D Revised July 20, 2017 Page 28 of 28
PSoC® 4: PSoC 4200DS Family
Datasheet
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