This document contains PRELIMINARY information. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible
product. We assume no responsibility for any errors which may appear in this publication. © Copyright 1999, Integrated Silicon Solution, Inc.
IS63LV1024
128K x 8 HIGH-SPEED CMOS STATIC RAM
3.3V REVOLUTIONARY PINOUT
FEATURES
High-speed access times:
10, 12 and 15 ns
High-performance, low-power CMOS process
Multiple center power and ground pins for
greater noise immunity
Easy memory expansion with
CE
and
OE
options
CE
power-down
Fully static operation: no clock or refresh
required
TTL compatible inputs and outputs
Single 3.3V power supply
Packages available:
– 32-pin 300-mil SOJ
– 32-pin 400-mil SOJ
– 32-pin TSOP (Type II)
– 32-pin sTSOP (Type I, 8x13.4)
DESCRIPTION
The ISSI IS63LV1024 is a very high-speed, low power,
131,072-word by 8-bit CMOS static RAM in revolutionary
pinout. The IS63LV1024 is fabricated using ISSI's high-
performance CMOS technology. This highly reliable pro-
cess coupled with innovative circuit design techniques,
yields higher performance and low power consumption
devices.
When
CE
is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down to 250 µW (typical) with CMOS input levels.
The IS63LV1024 operates from a single 3.3V power
supply and all inputs are TTL-compatible.
FUNCTIONAL BLOCK DIAGRAM
A0-A16
CE
OE
WE
128K X 8
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
GND
VCC
I/O
DATA
CIRCUIT
I/O0-I/O7
ISSI
®
Integrated Silicon Solution, Inc.
1
SR010-1F
07/23/99
JULY 1999
IS63LV1024
2
Integrated Silicon Solution, Inc. — 1-800-379-4774
SR010-1F
07/23/99
PIN CONFIGURATION
32-Pin SOJ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A0
A1
A2
A3
CE
I/O0
I/O1
Vcc
GND
I/O2
I/O3
WE
A4
A5
A6
A7
A16
A15
A14
A13
OE
I/O7
I/O6
GND
Vcc
I/O4
I/O4
A12
A11
A10
A9
A8
PIN DESCRIPTIONS
A0-A16 Address Inputs
CE
Chip Enable Input
OE
Output Enable Input
WE
Write Enable Input
I/O0-I/O7 Bidirectional Ports
Vcc Power
GND Ground
ABSOLUTE MAXIMUM RATINGS(1)
Symbol Parameter Value Unit
VTERM Terminal Voltage with Respect to GND –0.5 to Vcc + 0.5 V
TBIAS Temperature Under Bias –55 to +125 °C
TSTG Storage Temperature –65 to +150 °C
PTPower Dissipation 1.0 W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
TRUTH TABLE
Mode
WEWE
WEWE
WE CECE
CECE
CE OEOE
OEOE
OE
I/O Operation Vcc Current
Not Selected X H X High-Z ISB1, ISB2
(Power-down)
Output Disabled H L H High-Z ICC1, ICC2
Read H L L DOUT ICC1, ICC2
Write L L X DIN ICC1, ICC2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A0
A1
A2
A3
CE
I/O0
I/O1
Vcc
GND
I/O2
I/O3
WE
A4
A5
A6
A7
A16
A15
A14
A13
OE
I/o7
I/O6
GND
Vcc
I/O5
I/O4
A12
A11
A10
A9
A8
PIN CONFIGURATION
32-Pin TSOP (Type II) (T) and sTSOP (Type I) (H)
IS63LV1024
Integrated Silicon Solution, Inc. — 1-800-379-4774
3
SR010-1F
07/23/99
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 V
VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA 0.4 V
VIH Input HIGH Voltage 2.2 VCC + 0.3 V
VIL Input LOW Voltage(1) –0.3 0.8 V
ILI Input Leakage GND VIN VCC Com. –1 1 µA
Ind. –5 5
ILO Output Leakage GND VOUT VCC, Outputs Disabled Com. –1 1 µA
Ind. –5 5
Notes:
1. VIL = –3.0V for pulse width less than 10 ns.
CAPACITANCE(1,2)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 6 pF
CI/O Input/Output Capacitance VOUT = 0V 8 pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: TA = 25°C, f = 1 MHz, Vcc = 3.3V.
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-10 ns -12 ns -15 ns
Symbol Parameter Test Conditions Min. Max. Min. Max. Min. Max. Unit
ICC1Vcc Operating VCC = Max.,
CE
= VIL Com. 100 90 80 mA
Supply Current IOUT = 0 mA, f = Max. Ind. 110 100 90
ISB TTL Standby VCC = Max., Com. 40 35 30 mA
Current VIN = VIH or VIL Ind. 40 35 30
(TTL Inputs)
CE
VIH, f = Max
ISB1TTL Standby VCC = Max., Com. 15 15 15 mA
Current VIN = VIH or VIL Ind. 20 20 20
(TTL Inputs)
CE
VIH, f = 0
ISB2CMOS Standby VCC = Max., Com. 5 5 5 mA
Current
CE
VCC – 0.2V, Ind. 10 10 10
(CMOS Inputs) VIN > VCC – 0.2V, or
VIN 0.2V, f = 0
Notes:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
OPERATING RANGE
Range Ambient Temperature VCC
Commercial 0°C to +70°C 3.3V ± 0.3V
Industrial –40°C to +85°C 3.3V ± 0.15V
IS63LV1024
4
Integrated Silicon Solution, Inc. — 1-800-379-4774
SR010-1F
07/23/99
AC TEST LOADS
AC TEST CONDITIONS
Parameter Unit
Input Pulse Level 0V to 3.0V
Input Rise and Fall Times 3 ns
Input and Output Timing 1.5V
and Reference Levels
Output Load See Figures 1a and 1b
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
-10 ns -12 ns -15 ns
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
tRC Read Cycle Time 10 12 15 ns
tAA Address Access Time 10 12 15 ns
tOHA Output Hold Time 3 3 3 ns
tACE
CE
Access Time 10 12 15 ns
tDOE
OE
Access Time 5 6 7 ns
tLZOE
(2)
OE
to Low-Z Output 0 0 0 ns
tHZOE
(2)
OE
to High-Z Output 0 5 0 6 0 7 ns
tLZCE
(2)
CE
to Low-Z Output 3 3 3 ns
tHZCE
(2)
CE
to High-Z Output 0 5 0 6 0 7 ns
tPU
CE
to Power Up Time 0 0 0 ns
tPD
CE
to Power Down Time 10 12 15 ns
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and
C1 output loading specified in Figure 1.
2. Tested with the C2 load in Figure 1. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
Figure 1
OUTPUT
V
T
= 1.5V
Z
OUT
= 50
50
317
5 pF
Including
jig and
scope
351
OUTPUT
3.3V
Figure 2
IS63LV1024
Integrated Silicon Solution, Inc. — 1-800-379-4774
5
SR010-1F
07/23/99
DATA VALID
READ1.eps
PREVIOUS DATA VALID
t
AA
t
OHA
t
OHA
t
RC
D
OUT
ADDRESS
t
RC
t
OHA
t
AA
t
DOE
t
LZOE
t
ACE
t
LZCE
t
HZOE
HIGH-Z DATA VALID
CE_RD2.eps
ADDRESS
OE
CE
D
OUT
t
HZCE
READ CYCLE NO. 2(1,3)
Notes:
1.
WE
is HIGH for a Read Cycle.
2. The device is continuously selected.
OE
,
CE
= VIL.
3. Address is valid prior to or coincident with
CE
LOW transitions.
AC WAVEFORMS
READ CYCLE NO. 1(1,2)
IS63LV1024
6
Integrated Silicon Solution, Inc. — 1-800-379-4774
SR010-1F
07/23/99
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
-10 ns -12 ns -15 ns
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
tWC Write Cycle Time 10 12 15 ns
tSCE
CE
to Write End 7 8 10 ns
tAW Address Setup Time to 7 8 10 ns
Write End
tHA Address Hold from 0 0 0 ns
Write End
tSA Address Setup Time 0 0 0 ns
tPWE
1(1)
WE
Pulse Width (
OE
High) 7 8 10 ns
tPWE
2(2)
WE
Pulse Width (
OE
Low) 10 12 15 ns
tSD Data Setup to Write End 5 6 7 ns
tHD Data Hold from Write End 0 0 0 ns
tHZWE
(2)
WE
LOW to High-Z Output 5 6 7 ns
tLZWE
(2)
WE
HIGH to Low-Z Output 3 3 3 ns
Notes:
1. Test conditions assume signal transition times of 3ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and
output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of
CE
LOW and
WE
LOW. All signals must be in valid states to initiate a Write,
but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling
edge of the signal that terminates the Write.
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2 (
CE
Controlled,
OE
= HIGH or LOW)
DATA UNDEFINED
t
WC
VALID ADDRESS
t
SCE
t
PWE1
t
PWE2
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE
WE
D
OUT
D
IN DATA
IN
VALID
t
LZWE
t
SD
CE_WR1.eps
IS63LV1024
Integrated Silicon Solution, Inc. — 1-800-379-4774
7
SR010-1F
07/23/99
DATA UNDEFINED
LOW
t
WC
VALID ADDRESS
t
PWE1
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE
WE
D
OUT
D
IN
OE
DATA
IN
VALID
t
LZWE
t
SD
CE_WR2.eps
WRITE CYCLE NO. 2(1)
(
WE
Controlled,
OE
= HIGH during Write Cycle)
WRITE CYCLE NO. 3 (
WE
Controlled:
OE
is LOW During Write Cycle)
DATA UNDEFINED
t
WC
VALID ADDRESS
LOW
LOW
t
PWE2
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE
WE
D
OUT
D
IN
OE
DATA
IN
VALID
t
LZWE
t
SD
CE_WR3.eps
Notes:
1. The internal write time is defined by the overlap of
CE
LOW and
WE
LOW. All signals must be in valid states to initiate a Write,
but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling
edge of the signal that terminates the Write.
2. I/O will assume the High-Z state if
OE
VIH.
IS63LV1024
8
Integrated Silicon Solution, Inc. — 1-800-379-4774
SR010-1F
07/23/99
ISSI
®
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774
Fax: (408) 588-0806
E-mail: sales@issi.com
www.issi.com
ORDERING INFORMATION
Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
10 IS63LV1024-10T TSOP (Type II)
IS63LV1024-10H sTSOP (Type I)
IS63LV1024-10J 300-mil Plastic SOJ
IS63LV1024-10K 400-mil Plastic SOJ
12 IS63LV1024-12T TSOP (Type II)
IS63LV1024-12H sTSOP (Type I)
IS63LV1024-12J 300-mil Plastic SOJ
IS63LV1024-12K 400-mil Plastic SOJ
15 IS63LV1024-15T TSOP (Type II)
IS63LV1024-15H sTSOP (Type I)
IS63LV1024-15J 300-mil Plastic SOJ
IS63LV1024-15K 400-mil Plastic SOJ
ORDERING INFORMATION
Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
12 IS63LV1024-12TI TSOP (Type II)
IS63LV1024-12HI sTSOP (Type I)
IS63LV1024-12JI 300-mil Plastic SOJ
IS63LV1024-12KI 400-mil Plastic SOJ
15 IS63LV1024-15TI TSOP (Type II)
IS63LV1024-15HI sTSOP (Type I)
IS63LV1024-15JI 300-mil Plastic SOJ
IS63LV1024-15KI 400-mil Plastic SOJ