Product Specification PE42850 Product Description The PE42850 is a HaRPTM technology-enhanced SP5T high power RF switch supporting wireless applications up to 1 GHz. It offers maximum power handling of 42.5 dBm continuous wave (CW). It delivers high linearity and excellent harmonics performance. It has both a standard and attenuated RX mode. No blocking capacitors are required if DC voltage is not present on the RF ports. The PE42850 is manufactured on Peregrine's UltraCMOS(R) process, a patented variation of silicon-oninsulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of conventional CMOS. Figure 1. Package Type 32-lead 5 x 5 mm QFN UltraCMOS(R) SP5T RF Switch 30-1000 MHz Features Dual mode operation: SP5T or SP3T HaRPTM technology enhanced Fast settling time No gate and phase lag No drift in insertion loss and phase Up to 45 dBm instantaneous power in 50 Up to 40 dBm instantaneous power < 8:1 VSWR 36 dB TX to RX isolation Low harmonics of 2fo and 3fo = -90 dBc (1.15:1 VSWR) ESD performance 1.5 kV HBM on all pins Figure 2. Functional Diagram of SP3T Configuration ANT can be tied to TX1 and TX2 or TX3 and TX4 Document No. DOC-81084-1 www.psemi.com Figure 3. Functional Diagram of SP5T Configuration SP5T, standard configuration DOC-02178 (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 12 PE42850 Product Specification Table 1. Electrical Specifications @ -40 to +85 C, VDD = 2.3-5.5V, VSS_EXT = 0V or VDD = 3.4-5.5V, VSS_EXT = -3.4V (ZS = ZL = 50), unless otherwise noted1 Parameter Path Condition Min Operating frequency Insertion loss Typ 30 2 ANT-TX Insertion loss2 (un-attenuated state) ANT-RX Max Unit 1000 MHz Active TX port 1, 2, 3 or 4 @ rated power (-40 C, +25 C) 30-520 MHz 520-1000 MHz 0.25 0.35 0.30 0.45 dB dB Active TX port 1, 2, 3 or 4 @ rated power (+85 C) 30-520 MHz 520-1000 MHz 0.30 0.45 0.35 0.55 dB dB Active RX port (-40 C, +25 C) 30-520 MHz 520-1000 MHz 0.50 0.65 0.60 0.80 dB dB Active RX port (+85 C) 30-520 MHz 520-1000 MHz 0.60 0.70 0.70 0.85 dB dB 1 1.2 dB 16.8 1575 MHz for GPS RX, < -10 dBm, +25 C ANT-RX Active RX port 30-1000 MHz 15.2 16 Isolation (supply biased) TX-TX 30-520 MHz 520-1000 MHz 33 29 36 30 dB dB Isolation (supply biased) TX-RX 30-520 MHz 520-1000 MHz 34 29 36 30 dB dB 2 Insertion loss (attenuated state) dB Unbiased isolation VDD, V1, V2, V3 = 0V ANT-TX +27 dBm 6 dB Unbiased isolation VDD, V1, V2, V3 = 0V ANT-RX +27 dBm 14 dB Un-attenuated state 30-520 MHz 520-1000 MHz 22 18 27 22 dB dB Un-attenuated state, 1575 MHz for GPS RX, < -10 dBm, +25 C 10 14 dB Attenuated state, optimized without attenuator engaged 30-520 MHz 520-1000 MHz 16 13 21 18 dB dB 30-520 MHz 520-1000 MHz 21 15 28 17 dB dB Return loss2 ANT-RX Return loss2 ANT-TX 2nd and 3rd harmonic (< 1.15:1 VSWR) TX 30-520 MHz @ +40.0 dBm 521-870 MHz @ +38.5 dBm 871-1000 MHz @ +37.5 dBm -90 -81 dBc 2nd and 3rd harmonic (< 8:1 VSWR) TX 30-520 MHz @ +40.0 dBm (pulsed signal, at 10% duty cycle3) 521-870 MHz @ +38.5 dBm (pulsed signal, at 10% duty cycle3) 871-1000 MHz @ +37.5 dBm (pulsed signal, at 10% duty cycle3) -82 -74 dBc 2nd and 3rd harmonic (50 source/load impedance) TX 30-1000 MHz @ +45.0 dBm (pulsed signal, at 10% duty cycle3) -80 -71 dBc TX 30-1000 MHz @ +42.5 dBm (CW) -84 -75 dBc 2nd and 3rd harmonic (50 source/load impedance) Input 0.1dB compression point IIP3 4 ANT-TX RX 1000 MHz 45.5 Un-attenuated state Attenuated state dBm 42 33 dBm dBm Settling time From 50% control until harmonics within specifications 30 Switching time 50% CTRL to 90% or 10% RF 15 70 s s Notes: 1. In a 2TX-1RX SP3T configuration, TX1 and TX2 are tied and TX3 and TX4 are tied respectively. Refer to Application Note AN35 for SP3T performance data. 2. Narrow trace widths are used near each port to improve impedance matching. Refer to evaluation board layouts (Figure 23) and schematic (Figure 24) for details. 3. 10% of 4620 s period. 4. The input 0.1dB compression point is a linearity figure of merit. Refer to Table 3 for the RF input power PIN. (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 12 Document No. DOC-81084-1 UltraCMOS(R) RFIC Solutions PE42850 Product Specification 25 GND 16 VSS_EXT 26 GND 15 V1 27 GND 14 V2 28 ANT 13 V3 29 GND 12 VDD 30 GND 11 GND 31 GND 10 GND GND 9 32 GND Figure 4. Pin Configuration (Top View)* Note: * Pins 1, 3, 5, 7, 9, 10, 17, 19, 20, 22, 24, 26, 27, 29, 30 and 31 can be N/C if deemed necessary by the customer. Table 2. Pin Descriptions Parameter Symbol Min Typ Max Unit Supply voltage (normal mode, VSS_EXT = 0V) VDD 2.3 5.5 V Supply voltage (bypass mode, VSS_EXT = -3.4V, VDD 3.4V for full spec. compliance) VDD 2.7 5.5 V Negative supply voltage (bypass mode) VSS_EXT -3.6 -3.2 V Supply current (normal mode, VSS_EXT = 0V) IDD 130 200 A Supply current (bypass mode, VSS_EXT = -3.4V) IDD 50 80 A Negative supply current (bypass mode, VSS_EXT = -3.4V) ISS -40 Digital input high (V1, V2, V3) VIH 1.17 3.6 V Digital input low (V1, V2, V3) VIL -0.3 0.6 V 3.4 -16 A TX RF input power2,3 (VSWR 8:1) PIN-TX 40 dBm TX RF input power2,3 (50 source/load impedance) PIN-TX 45 dBm Pin # Pin Name 1, 3, 5-7, 9- 11, 17-20, 22, 24-27, 29-32 GND Ground TX RF input power2 (50 source/load impedance, CW) PIN-TX 42.5 dBm 2 TX12 Transmit pin 1 ANT RF input power, unbiased (VSWR 8:1) PIN-ANT 27 dBm 4 TX21,2 Transmit pin 2 27 dBm RX2 PIN-RX 8 Receive pin RX RF input power2 (VSWR 8:1) 12 VDD Supply voltage (nominal 3.3V) 85 C 13 V3 Digital control logic input 3 135 C 14 V2 Digital control logic input 2 15 V1 Digital control logic input 1 16 VSS_EXT3 21 TX32 Transmit pin 3 23 TX41,2 Transmit pin 4 28 2 ANT Antenna pin Pad GND Exposed pad: ground for proper operation Notes: Description Table 3. Operating Ranges1 External VSS negative voltage control Operating temperature range (case) Operating junction temperature TOP Tj -40 Notes: 1. In a 2TX-1RX SP3T configuration, TX1 and TX2 are tied and TX3 and TX4 are tied respectively. Refer to Application Note AN35 for SP3T performance data. 2. Supply biased. 3. Pulsed, 10% duty cycle of 4620 s period. 1. To operate the part as a 2TX-1RX SP3T, tie TX1 to TX2 and TX3 to TX4 respectively. Refer to Application Note AN35 for SP3T performance data. 2. RF pins 2, 4, 8, 21, 23 and 28 must be at 0 VDC. The RF pins do not require DC blocking capacitors for proper operation if the 0 VDC requirement is met. 3. Use VSS_EXT (pin 16, VSS_EXT = -VDD) to bypass and disable internal negative voltage generator. Connect VSS_EXT (pin 16) to GND (VSS_EXT = 0V) to enable internal negative voltage generator. Document No. DOC-81084-1 www.psemi.com (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 12 PE42850 Product Specification Table 4. Absolute Maximum Ratings Parameter/Condition Supply voltage Switching Frequency Symbol Min Max Unit VDD -0.3 5.5 V Digital input voltage (V1, V2, V3) VCTRL -0.3 3.6 V TX RF input power1(50 source/load impedance) PIN-TX 45 dBm TX RF input power1 (VSWR 8:1) PIN-TX 40 dBm ANT RF input power, unbiased (VSWR 8:1) PIN-ANT 27 dBm RX RF input power1 (VSWR 8:1) PIN-RX 27 dBm 150 C Storage temperature range TST Maximum case temperature TCASE 85 C Tj 200 C VESD 1500 V VESD 200 V Peak maximum junction temperature (10 seconds max) 2 ESD voltage HBM , all pins 3 ESD Voltage MM , all pins -65 The PE42850 has a maximum 10 kHz switching rate when the internal negative voltage generator is used (pin 16 = GND). The rate at which the PE42850 can be switched is only limited to the switching time (Table 1) if an external negative supply is provided (pin 16 = VSS_EXT). Switching frequency describes the time duration between switching events. Switching time is the time duration between the point the control signal reaches 50% of the final value and the point the output signal reaches within 10% or 90% of its target value. Optional External VSS Control (VSS_EXT) Notes: 1. Supply biased 2. Human Body Model (MIL-STD 883 Method 3015) 3. Machine Model (JEDEC JESD22-A115) Exceeding absolute maximum ratings may cause permanent damage. Operation should be restricted to the limits in the Operating Ranges table. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability. Electrostatic Discharge (ESD) Precautions When handling this UltraCMOS device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the rating specified. For proper operation, the VSS_EXT control pin must be grounded or tied to the Vss voltage specified in Table 3. When the VSS_EXT control pin is grounded, FETs in the switch are biased with an internal voltage generator. For applications that require the lowest possible spur performance, VSS_EXT can be applied externally to bypass the internal negative voltage generator. Spurious Performance The typical spurious performance of the PE42850 is -130 dBm when VSS_EXT = 0V (pin 16 = GND). If further improvement is desired, the internal negative voltage generator can be disabled by setting VSS_EXT = -3.4V. Table 5. Truth Table Path ANT - RX Attenuated V3 V2 V1 L L L ANT - TX1 L L H ANT - TX2 L H L Latch-Up Avoidance ANT - TX1 and TX2* L H H Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up. ANT - RX H L L ANT - TX3 H L H Moisture Sensitivity Level The Moisture Sensitivity Level rating for the 5x5 mm QFN package is MSL3. (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 12 ANT - TX4 H H L ANT - TX3 and TX4* H H H Note: * In a 2TX-1RX SP3T configuration, TX1 and TX2 are tied and TX3 and TX4 are tied respectively. Refer to Application Note AN35 for SP3T performance data. Document No. DOC-81084-1 UltraCMOS(R) RFIC Solutions PE42850 Product Specification Typical Performance Data @ +25 C and VDD = 3.4V, unless otherwise specified Figure 5. Insertion Loss vs. Temp (TX) Figure 6. Insertion Loss vs. VDD (TX) Figure 7. Insertion Loss vs. Temp (RX, Un-Attenuated) Figure 8. Insertion Loss vs. VDD (RX, Un-Attenuated) Figure 9. Insertion Loss vs. Temp (RX, Attenuated) Figure 10. Insertion Loss vs. VDD (RX, Attenuated) Document No. DOC-81084-1 www.psemi.com (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 12 PE42850 Product Specification Typical Performance Data @ +25 C and VDD = 3.4V, unless otherwise specified Figure 11. Return Loss vs. Temp (ANT) Figure 12. Return Loss vs. VDD (ANT) Figure 13. Return Loss vs. Temp (TX) Figure 14. Return Loss vs. VDD (TX) Figure 15. Return Loss vs. Temp (RX, Attenuated) Figure 16. Return Loss vs. VDD (RX, Attenuated) (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 12 Document No. DOC-81084-1 UltraCMOS(R) RFIC Solutions PE42850 Product Specification Typical Performance Data @ +25 C and VDD = 3.4V, unless otherwise specified Figure 17. Return Loss vs. Temp (RX, Un-Attenuated) Figure 18. Return Loss vs. VDD (RX, Un-Attenuated) Figure 19. Isolation vs. Temp (TX-TX) Figure 20. Isolation vs. VDD (TX-TX) Figure 21. Isolation vs. Temp (TX-RX) Figure 22. Isolation vs. VDD (TX-RX) Document No. DOC-81084-1 www.psemi.com (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 7 of 12 PE42850 Product Specification Thermal Data Though the insertion loss for this part is very low, when handling high power RF signals, the junction temperature rises significantly. Table 6. Theta JC Parameter Theta JC (+85 C) Min Typ 20 Max Unit C/W VSWR conditions that present short circuit loads to the part can cause significantly more power dissipation than with proper matching. Special consideration needs to be made in the design of the PCB to properly dissipate the heat away from the part and maintain the +85 C maximum case temperature. It is recommended to use best design practices for high power QFN packages: multi-layer PCBs with thermal vias in a thermal pad soldered to the slug of the package. Special care also needs to be made to alleviate solder voiding under the part. (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 8 of 12 Document No. DOC-81084-1 UltraCMOS(R) RFIC Solutions PE42850 Product Specification Evaluation Kit Figure 23. Evaluation Board Layouts The PE42850 Evaluation Kit board was designed to ease customer evaluation of the PE42850 RF switch. The evaluation board in Figure 23 was designed to test the part in the 5T configuration. DC power is supplied through J10, with VDD on pin 9, and GND on the entire lower row of even numbered pins. To evaluate a switch path, add or remove jumpers on V1 (pin 3), V2 (pin 5), and V3 (pin 7) using Table 5 (adding a jumper pulls the CMOS control pin low and removing it allows the on-board pull-up resistor to set the CMOS control pin high). Pins 11 and 13 of J10 are N/C. The ANT port is connected through a 50 transmission line via the top SMA connector, J1. RX and TX paths are also connected through 50 transmission lines via SMA connectors. A 50 through transmission line is available via SMA connectors J8 and J9. This transmission line can be used to estimate the loss of the PCB over the environmental conditions being evaluated. An open-ended 50 transmission line is also provided at J7 for calibration if needed. Narrow trace widths are used near each part to improve impedance matching. PRT-50283 Document No. DOC-81084-1 www.psemi.com (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 9 of 12 PE42850 Product Specification Figure 24. Evaluation Board Schematic .200 X .012TRACE J1 50 OHM 1 SMA 32 31 30 29 28 27 26 25 2 .200 X .012 TRACE 2 SMA 50 OHM J4 .200 X .012 TRACE 1 2 SMA 50 OHM J6 .200 X .012 TRACE 1 2 3 4 5 6 7 8 GND TX1 GND TX2 GND GND GND RX U1 PE4285 0 9 10 11 12 13 14 15 16 SMA Z1 1 Open Line 1 SMA-DNI J7 2 R1 1M R2 1M R3 1M SMA 24 23 22 21 20 19 18 17 .200 X .012 TRACE 2 Through Lin e 1 1 SMA-DNI SMA-DNI 2 J5 1 2 J10 1 3 5 7 9 11 13 J9 2 J3 50 OHM SMA Z=50 Ohm J8 50 OHM 1 GND TX4 GND TX3 GND GND GND GND GND GND NC VDD V3 V2 V1 VSS 1 2 .200 X .012 TRACE 33 GND 50 OHM 1 GND GND GND GND ANT GND GND GND J2 C4 C3 DNI C5 0.01u C6 100pF C7 100pF 2 4 6 8 10 12 14 2 4 6 8 10 12 14 HEADER14 C8 100pF 1 3 5 7 9 11 13 DNI DOC-14626 Notes: 1. Use 101-0316-02 PCB 2. 32 mil Width, 10 mil Gaps, 28 mil Core, 4.3 Er, and 2.1 mil Cu Notes: 1. USE 101-0316 -02 PCB. 2. All Transmission Lines are 50 Ohms 32mil Width, 10mil Gaps, 28mil Core, 4.3 Er, and 2.1mil Cu (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 10 of 12 Document No. DOC-81084-1 UltraCMOS(R) RFIC Solutions PE42850 Product Specification Figure 25. Package Drawing 32-lead 5x5 mm QFN A 0.10 C (2X) 5.00 3.300.05 B 17 0.50 24 16 5.00 25 3.300.05 8 DETAIL A BOTTOM VIEW TOP VIEW 5.20 RECOMMENDED LAND PATTERN 0.850.05 0.10 C 0.10 0.05 0.05 C C A B C ALL FEATURES SEATING PLANE SIDE VIEW 0.203 Ref. 0.15 5.20 3.35 1 3.50 Pin #1 Corner 3.35 32 9 0.10 C (2X) 0.50 (X28) 0.575 (x32) 3.50 0.240.05 (X32) 0.290 (x32) 0.3750.05 (X32) C 0.05 0.06 0.06 0.22 DOC-01872 135 0.18 135 0.22 0.26 0.15 0.06 0.25 0.15 0.10 DETAIL A Figure 26. Top Marking Specification 42850 YYWW ZZZZZZZ = Pin 1 designator YYWW = Date code, last two digits of the year and work week ZZZZZZ = Seven digits of the lot number DOC-66060 Document No. DOC-81084-1 www.psemi.com (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 11 of 12 PE42850 Product Specification Figure 27. Tape and Reel Drawing Tape Feed Direction Notes: 1. 10 sprocket hole pitch cumulative tolerance 0.02. 2. Camber not to exceed 1 mm in 100 mm. 3. Material: PS + C. 4. Ao and Bo measured as indicated. 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier. 6. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. Ao = 5.25 mm Bo = 5.25 mm Ko = 1.1 mm Pin 1 Top of Device Device Orientation in Tape Table 7. Ordering Information Order Code Description Package Shipping Method PE42850B-X PE42850 SP5T RF switch Green 32-lead 5 x 5 mm QFN 500 units/T&R EK42850-04 PE42850 Evaluation kit Evaluation kit 1/Box Sales Contact and Information For sales and contact information please visit www.psemi.com. Advance Information: The product is in a formative or design stage. The datasheet contains design target specifications for product development. Specifications and features may change in any manner without notice. Preliminary Specification: The datasheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification: The datasheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer Notification Form). The information in this datasheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user's own risk. (c)2012-2016 Peregrine Semiconductor Corp. All rights reserved. Page 12 of 12 No patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party. Peregrine's products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, UltraCMOS and UTSi are registered trademarks and HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com. Document No. DOC-81084-1 UltraCMOS(R) RFIC Solutions