BD10KA5WFP - ROHM Co., Ltd.

1/9

www.rohm.com 2009.04 - Rev.A

Secondary LDO Regulator Series for Local Power Supplies

500mA Secondary LDO Regulators

for Local Power Supplies

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

●General Description

The BD□□KA5 series are low-saturation regulators that are available for output currents up to 500mA. The output voltage

precision is ±1%. These secondary LDO regulators are offered in several output voltages and package lineups with or

without ON/OFF switches (that set the circuit current to 0μA at shutdown). This series can be used for a broad spectrum of

applications ranging from TVs and car audio systems to HDDs, PCs, and DVDs. There regulators have a built-in overcurrent

protection circuit that prevents the destruction of the IC, due to output short circuits and a thermal shutdown circuit.

●Features

1) Maximum output current : 500ｍA

2) Output voltage precision : ±1%

3) Low-saturation voltage with PMOS output : 0.12V Typ.(Io=200mA)

4) Built-in over-current protection circuit

5) Built-in thermal shutdown circuit

6) Shutdown switch(BD□□KA5WFP and BD□□KA5WF series)

7) TO252-3,TO252-5 and SOP8 package lineup

8) Operating temperature range : -40℃ to +105℃

9) Ceramic capacitor compatible(recommended capacitance : 1μF or greater)

●Applications

Microcontrollers and all electronic devices that use logic circuits

●Product line up

Part Number 1.0 1.2 1.5 1.8 2.5 3.0 3.3 Variable Package

BD□□KA5WFP ○ ○ ○ ○ ○ ○ ○ ○ TO252-5

BD□□KA5WF ○ ○ ○ ○ ○ ○ ○ ○ SOP8

BD□□KA5FP ○ ○ ○ ○ ○ ○ ○ - TO252-3

Part Number：BD□□KA5□

□

a b c

Symbol Details

a

Output Voltage Designation

□□ Output Voltage(V) □□ Output Voltage(V)

10 1.0V(Typ.) 25 2.5V(Typ.)

12 1.2V(Typ.) 30 3.0V(Typ.)

15 1.5V(Typ.) 33 3.3V(Typ.)

18 1.8V(Typ.) 00 Variable Output Typ

b

Switch

“W” included：Built-in shutdown switch

“W” not included：No shutdown switch

c Package

FP：TO252-5 / TO252-3 F：SOP8

No.09024EAT01

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

Technical Note

2/9

www.rohm.com 2009.04 - Rev.A

●Absolute Maximum Ratings(Ta=25℃)

Parameter Symbol Limits Unit.

Power Supply Voltage Vcc -0.3～+7.0*1 V

Output Control Terminal Voltage VCTL -0.3～Vcc*1 V

Power Dissipation

TO252-3

Pd

1200*2

mW

TO252-5 1300*3

SOP8 687.6*4

Operating Temperature Range Topr -40～+105 ℃

Ambient Storage Temperature Tstg -55～+150 ℃

Maximum Junction Temperature Tjmax 150 ℃

*1 Must not exceed Pd

*2 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 9.6 mW/℃ over 25℃.

*3 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 10.4mW/℃ over 25℃.

*4 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 5.5 mW/℃ over 25℃.

●Recommended Operating Range (Ta=25℃)

Parameter Symbol Min. Max. Unit.

Input Power Supply Voltage Vcc 2.3 5.5 V

Output Current Io 0 500 mA

Output Voltage Configuration Range*5 Vo 1.0 4.0 V

Output Control Terminal Voltage VCTL 0 Vcc V

*5 Only BD00KA5WFP and BD00KA5WF

●Electrical Characteristics (abridged)

BD□□KA5WFP / WF / FP

(Unless specified otherwise,Ta=25℃,VCTL=2V,Vcc=2.5V(Vo=1.0V,1.2V,1.5V,1.8V),Vcc=3.3V(Vo=2.5V),Vcc=5.0V(Vo=3.0V,3.3V))

Parameter Symbol Min. Typ. Max. Unit. Conditions

Output Voltage Vo Vo(T)-0.015 Vo(T) Vo(T)+0.015 V Io＝200mA (Vo=1.0V,1.2V)

Vo(T)×0.99 Vo(T) Vo(T)×1.01 V Io＝200mA (Vo≧1.5V)

Circuit Current at Shutdown Isd - 0 1 μA VCTL =0V,Io=0mA

(during OFF mode)

Minimum I/O Voltage

Difference*6 ΔVd - 0.12 0.20 V Io=200mA,Vcc=0.95×Vo

Output Current Capacity Io 500 - - mA

Input Stability*7 Reg.I - 10 35 mV Vcc=Vo+0.5V→5.5V,Io=200mA

Load Stability Reg.L - 25 75 mV Io=0mA→500mA

Output Voltage

Temperature Coefficient*8 Tcvo - ±100 - ppm/℃Io=5mA,Tj=0～125℃

Vo(T)：Preset output voltage value

*6 When Vo≧2.5V

*7 When 1.0≦Vo≦1.8V, Vcc=2.3V→5.5V

*8 Design guarantee(100% shipping inspection not performed)

BD00KA5WFP / WF

(Unless specified otherwise, Ta=25℃, Vcc=2.5V,VL＝2V,R1=30kΩ,R2=30kΩ*9)

Parameter Symbol Min. Typ. Max. Unit. Conditions

Circuit Current at Shutdown Isd - 0 1 μA VCTL =0V, Io=0mA

(during OFF mode)

Reference Voltage VADJ 0.742 0.750 0.758 V Io=50mA

Minimum I/O Voltage

Difference*10 ΔVd - 0.12 0.20 V Io=200mA,Vcc=0.95×Vo

Output Current Capacity Io 500 - - mA

Input Stability Reg.I - 10 35 mV Vcc=Vo+0.5V→5.5V,Io=200mA

Load Stability Reg.L - 25 75 mV Io=0mA→500mA

Output Voltage

Temperature Coefficient*11 Tcvo - ±100 - ppm/℃Io=5mA,Tj=0～125℃

*9 VOUT=VADJ×(R1+R2)÷R1(V)

VADJ×0.75V(Typ.)

*10 When Vo≧2.5V

*11 Design guarantee(100% shipping inspection not performed)

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

Technical Note

3/9

www.rohm.com 2009.04 - Rev.A

●Reference Data (Unless specified otherwise, Vcc=25V,VCTL =2V,and Io=0mA)

Fig.12 Thermal Shutdown

Circuit Characteristics (Io=5mA)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

-40 -20 0 20 40 60 80 100

TEMPERATURE:Ta[℃]

CIRCUIT CURRENT:Icc[mA]

1.4

1.5

1.6

-40 -20 0 20 40 60 80 100

TEMPERATURE:Ta[℃]

OUTPUT VOLTAGE:VOUT[V

]

0

2

4

6

8

10

0.0 0.1 0.2 0.3 0.4 0.5

OUTPUT CURRENT:IOUT[A]

CIRCUIT CURRENT:Icc[mA]

Fig.2 Input Stability Fig.3 Input Stability

Fig.5 Input/Output Voltage Difference Fig.6 Ripple Rejection

（ein=10dBV,Io=100mA）

（Vcc=3.135V）

0.0

0.1

0.2

0.3

0.4

0.5

0 .0 0 .5 1 .0 1 .5 2 .0 2 .5 3 .0 3 .5 4 .0 4 .5 5 .0 5 .5

SUPPLY VOLTAGE:VCC[V]

CIRCUIT CURRENT:ICC[mA]

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

SUPPLY VOLTAGE:VCC[V]

OUTPUT VOLTAGE:VOUT[V

]

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

SUPPLY VOLTAGE:VCC[V]

OUTPUT VOLTAGE:VOUT[V

]

[BD15KA5WFP] [BD15KA5WFP] [BD15KA5WFP]

0

5

10

15

20

25

30

35

40

45

50

55

60

10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90

FREQUENCY:f[Hz]

RIPPLE REJECTION:R.R[dB]

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5

OUTPUT CURRENT:IOUT[A]

OUTPUT VOLTAGE:VOUT[V]

0

50

100

150

200

250

300

0 50 100 150 200 250 300 350 400 450 500

OUTPUT CURRENT:IOUT[mA]

DROPOUT VOLTAGE:ΔVd[mV]

（Io=500mA）

（Io=0mA）

100 1000 10000 100000

[BD15KA5WFP]

[BD15KA5WFP] [BD33KA5WFP]

Fig.1 Circuit current

Fig.4 Load Stability

]

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

100 120 140 160 180 200

TEMPERATURE:[℃]

OUTPUT VOLTAGE:VOUT[V

]

Fig.7 Output Voltage Fig.9 Circuit Current by load Level

[BD15KA5WFP]

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

CONTROL VOLTAGE:VCTL[V]

OUTPUT VOLTAGE:VOUT[V

]

0

20

40

60

80

100

120

140

160

180

200

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

CONTROL VOLTAGE:VCTL[V]

CONTROL CURRENT:ICTL[μA]

Fig.8 Circuit Current

Temperature Characteristics

（Io=5mA）

[BD15KA5WFP] [BD15KA5WFP]

Fig.10 CTL Voltage vs. Output Voltage Fig.11 CTL Voltage vs. Output Current

]

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

Technical Note

4/9

www.rohm.com 2009.04 - Rev.A

●Block diagrams, Standard circuit examples

Pin No. PinName Function

1 CTL Output voltage ON/OFF control

2 Vcc Power supply voltage input

3 N.C. Unconnected terminal

4 OUT Voltage output

5 ADJ

Output voltage configuration terminal

FIN GND GND

Pin No. Pin Name Function

1 OUT Voltage output

2 ADJ

Output voltage configuration terminal

3 N.C. Unconnected terminal

4

5 CTL Output voltage ON/OFF control

6 GND GND

7

8 Vcc Power supply voltage input

Pin No. Pin Name Function

1 CTL Output voltage ON/OFF control

2 Vcc Power supply voltage input

3 N.C. Unconnected terminal

4 OUT Voltage output

5 N.C. Unconnected terminal

FIN GND GND

Pin No. Pin Name Function

1 OUT Voltage output

2

N.C. Unconnected terminal

3

4

5 CTL Output voltage ON/OFF control

6 GND GND

7

8 Vcc Power supply voltage input

Pin No. Pin Name Function

1 Vcc Power supply voltage input

2 N.C. Unconnected terminal

3 OUT Voltage output

FIN GND GND

1

8

4

5

TOP VIEW

SOP8

1

8

4

5

TOP VIEW

SOP8

TOP VIEW

FIN

1

3

2 4 5

TO252-5

TOP VIEW

1

3

2 4 5

TO252-5

TOP VIEW

1 3

2

TO252-3

FIN

N.C. pins are electrically open to the inside of the IC chip.

Driver

OCP

TSD

Vref

GND(FIN)

GND(7PIN)

GND(6PIN) CTL (5PIN)

Vcc(8PIN)

1μF

R1

R2

OUT(1PIN)

N.C.(3PIN) N.C.(3PIN) N.C.(4IN)

1μF

GND(7PIN)

GND(6PIN) CTL (5PIN)

Vcc(8PIN)

1μF

OUT(1PIN)

N.C.(3PIN) N.C.(4IN)

1μF

ADJ(2PIN)

R1 R2

OUT (4PIN)

R1

R2

ADJ(5PIN) N.C.(3PIN)

Vcc (2PIN)

CTL (1PIN)

R2

R1

R2

R1

OUT (4PIN)

N.C.(3PIN)

Vcc (2PIN)

CTL (1PIN) N.C.(5PIN)

1μF 1μF

OUT (3PIN)

N.C.(2PIN)

Vcc (1PIN)

Fig.13

Fig.14

Fig.15

TO252-5(BD00KA5WFP)

[BD00KA5WFP]

＊Output voltage configuration

VOUT=VADJ×（R1+R2）÷R1(V)

：VADJ=0.75V(Typ.)

：A value of approximately 30kΩ

is recommended for R1.

TO252-5(BD□□KA5WFP)

[BD□□KA5WFP]

TO252-5(BD□□KA5FP)

SOP8(BD00KA5WF)

[BD00KA5WF]

SOP8(BD□□KA5WF)

[BD□□KA5WF]

＊Output voltage configuration

VOUT=VADJ×（R1+R2）÷R1(V)

：VADJ=0.75V(Typ.)

：A value of approximately 30kΩ

is recommended for R1.

Fig.16

Fig.17

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

Technical Note

5/9

www.rohm.com 2009.04 - Rev.A

●Input / Output Equivalent Circuit Diagrams

●Thermal Design

When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22.

The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the

maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient

consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal

damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX.

Even when the ambient temperature Ta is a normal temperature(25℃), the chip(junction) temperature Tj may be quite high,

so please operate the IC at temperatures less than the acceptable loss Pd.

The calculation method for power consumption Pc(W) is as follows :

Pc = (Vcc-Vo)×Io+Vcc×Icca

Acceptable loss Pd≧Pc

Solving for the load current IO in order to operate within the acceptable loss,

Io≦

It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design.

Calculation Example

Example 1) When Ta=85℃, Vcc=2.5V, Vo=1.0V

Io≦ θja=96.2℃/W → -10.4mW/℃

Io≦440mA (Icca : 2mA) 25℃=1300mW → 85℃=676mW

Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating

temperature ranges.

The power consumption PC of the IC when there is a short circuit (short between Vo and GND) is :

Pc=Vcc×(Icca+Ishort)

*Ishort : Short circuit current

※ With BD00KA5WFP/WF,R1and R2 are connected

outside the IC between ADJ and GND and

between OUT and ADJ.

Vcc

CTL

Vcc Vcc Vcc

OUT

ADJ

R1

R2

31.25kΩ 2kΩ

25kΩ

(BD00KA5WFP/WF)

Fig.18 Fig.19

Pd – Vcc×Icca

Vcc－Vo

0.676－2.5×Icca

2.5-1.0

BA10KA5WFP（TO252-5 packaging）

0.0

0.4

0.8

1.2

1.6

2.0

0 25 50 75 100 125 150

Ambient temperature：Ta(℃)

Power Dissipation：Pd(W)

0.0

0.4

0.8

1.2

1.6

2.0

0 25 50 75 100 125 150

周囲温度：Ta(℃)

許容損失：Pd(W)

0

200

400

600

800

1000

0 25 50 75 100 125 150

周囲温度：Ta(℃)

許容損失：Pd(W)

1.30 1.20 687.6mW

562.6mW

(1)

(2)

Rohm standard board mounting

Board size：70×70×1.6ｍｍ

Copper foil area：7×7ｍｍ2

θja=96.2(℃/W)

Rohm standard board mounting

Board size：70×70×1.6ｍｍ

Copper foil area：7×7ｍｍ2

θja=104.2(℃/W)

TO252-5 TO252-3 SOP8

Fig.22 Power Dissipation heat

reducing characteristics

(1)When using a standard board:

θj-c=181.8(℃/W)

(2) When using an IC alone

θj-a=222.2(℃/W)

Fig.21 Power Dissipation heat

reducing characteristics

Fig.20 Power Dissipation heat

reducing characteristics

Power Dissipation：Pd(W)

Ambient temperature：Ta ( ℃) Ambient temperature：Ta ( ℃)

Vcc：

Vo：

Io：

Icca：

Input vol

t

age

Output voltage

Load current

Circuit current

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

Technical Note

6/9

www.rohm.com 2009.04 - Rev.A

1μF

●Terminal Vicinity Settings and Cautions

・Vcc Terminal

Please attach a capacitor (greater than 1μF) between Vcc and GND.

The capacitance values differ depending on the application, so chose a capacitor with sufficient margin and verify the

operation on actual board.

・GND Terminal

Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not

arise between them. If a potential difference arises between the set ground and the IC ground, the preset voltage will not

be output properly, causing the system to become unstable. Please reduce the impedance by making the ground patterns

as wide as possible and reducing the distance between the set ground and the IC ground as much as possible.

・CTL Terminal

The CTL terminal is turned ON at 2.0V and higher, and OFF at

0.8V and lower, within the operating power supply voltage

range.The power supply and the CTL terminal may be started

up and shut down in any order without problems.

●Vo Terminal

Please be sure to attach an anti-oscillation capacitor between Vo and GND.

Be sure to place an anti-oscillation capacitor between the output terminal and the GND. Oscillations may arise if the

capacitance value changes, due to factors such as temperature changes. A 1μF capacitor with small internal series

resistance (ESR) such as a ceramic capacitor is recommended as an anti-oscillation capacitor. Ceramic capacitors generally

have favorable temperature characteristics and DC bypass characteristics. When selecting a ceramic capacitor, a high

voltage capacitor (good DC bypass characteristics) with temperature characteristics that are superior to those of X5R or X7R,

is recommended. In applications where input voltage and load fluctuations are rapid, please decide on a capacitor after

sufficiently confirming its properties according to its specifications in the actual application.

CTL

25kΩ

31.25kΩ

Fig.23 Input equivalent circuit

OUT

IC

0.01

0.1

1

10

100

0 100 200 300 400 500

Iout(mA)

ESR (Ω)

安定領域

発振領域

Vcc OUT

CTL GND ADJ

R1

R2

Cin

Vcc

VCTL

2V

1μF

ESR

Io(ROUT)

R1=30kΩ,R2=2kΩ

Fig.24 Output Equivalent Circuit Fig.25 ESR-Io Characteristics

Oscillation region

Stable region

Io(mA)

0

20

40

60

80

100

120

01234

直流バイアスVdc（V)

静電容量変化率(%)

0

20

40

60

80

100

120

01234

直流バイアスVdc（V)

静電容量変化率(%)

0

20

40

60

80

100

120

-250 255075

Temp(℃)

静電容量変化率(%)

50V Max.Input

16V Max.Input

10V Max.Input

16V Max.Input

10V Max.Input

Y5V

X7R

X5R

Vdc=0

Fig.26 :General characteristics of ceramic capacitors

50V Max.Input

DC bypass Vdc(V) DC bypass Vdc(V)

Rate of change in electrostatic capacitance (%)

(a) Capacitance-bypass

characteristics (Y5V)

（b）Capacitance-bypass

characteristics（X5R,X7R）

Tem p ( ℃)

（C）Capacitance-temperature

characteristics（X5R,X7R,Y5V）

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

Technical Note

7/9

www.rohm.com 2009.04 - Rev.A

●Other Caution

○Protection Circuits

Over-current Protection Circuit

A built-in over-current protection circuit corresponding to the current capacity prevents the destruction of the IC when

there are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current

is restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance

capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents,

it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the

over-current protection circuit has negative current capacity characteristics with regard to temperature.

○Thermal Shutdown Circuit (Thermal Protection)

This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As

shown in Fig. 20-22, this must be used within the range of acceptable loss, but if the acceptable loss is continuously

exceeded, the chip temperature Tj increases, causing the thermal shutdown circuit to operate. When the thermal

shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the

chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Figs.12 for the temperatures

at which the temperature protection circuit operates).

There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to

avoid leaving the IC in the overloaded state.

○Reverse Current

In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode

be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.27).

○This IC is BI-CMOS IC that has a P-board (substrate) and P+ isolation between each element, as shown in Fig.28. A P-N

junction is formed between this P-layer and the N-layer of each element, and the P-N junction operates as :

- a parasitic diode when the electric potential relationship is GND> Terminal A, GND> Terminal B, or

- a parasitic transistor when the electric potential relationship is Terminal B > GND> Terminal A.

Parasitic elements are structurally inevitable in the IC. The operation of parasitic elements induces mutual interference

between circuits, causing malfunctions and eventually the destruction of the IC. Take precaution as not to use the IC in

ways that would cause parasitic elements to operate. For example, applying a voltage that is lower than the GND

(P-board) to the input terminal.

Fig. 28 : Basic structure example

Reverse current

OU

T

Vcc

CTL GND

Fig.27 : Bypass diode

GND

N

P

N

P+ P+

Parasitic element

or transistor

(Pin B) BE

Transistor

(

NPN

)

N

P

N

GND

O (Pin A)

GND

N

P+

Resistor

Parasitic element

P

N

PP+

N

(Pin A)

Parasitic element

or transistor

(Pin B)

G

ND

C

B

E

Parasitic element

G

ND

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

Technical Note

8/9

www.rohm.com 2009.04 - Rev.A

●Ordering part number

B D 1 8 K A 5 W F P - E 2

Part numbe

r

Output voltage

00:Variable

Other:Fixed

Current capacity

500mA

Shutdown switch

W : Include

パッケージ

FP ：TO252-3

TO252-5

F ： SOP8

Packaging and forming specification

E2: Embossed tape and reel

(Unit : mm)

TO252-3

21 3

0.8

0.65 0.65

1.5

2.5

0.75

FIN

6.5±0.2

2.3±0.2 2.3±0.2

0.5±0.1

1.0±0.2

2.3±0.2

9.5±0.5

0.5±0.1

5.5±0.2 1.5±0.2

5.1+0.2

-

0.1 C0.5

Direction of feed

1pin

Reel ∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the right hand

2000pcs

E2

( )

(Unit : mm)

TO252-5

123 54

0.8

0.5 1.27

1.5

2.5

FIN

6.5±0.2 2.3±0.2

0.5±0.1

1.0±0.2

9.5±0.5

0.5±0.1

5.5±0.2 1.5±0.2

C0.5

5.1+0.2

-

0.1

Direction of feed

1pin

Reel ∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the right hand

2000pcs

E2

( )

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

Technical Note

9/9

www.rohm.com 2009.04 - Rev.A

(Unit : mm)

SOP8

0.9±0.15

0.3MIN

4

°

+

6

°

−

4

°

0.17 +0.1

-

0.05

0.595

6

43

8

2

5

1

7

5.0±0.2

6.2±0.3

4.4±0.2

(MAX 5.35 include BURR)

1.27

0.11

0.42±0.1

1.5±0.1

S

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

R0039

A

www.rohm.com

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Examples of application circuits, circuit constants and any other information contained herein

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