_______________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
19-5881; Rev 1; 12/11
Ordering Information
General Description
The MAX17135 is a complete power-management IC for
E-paper displays that provides source- and gate-driver
power supplies, a high-speed VCOM amplifier, and a
temperature sensor.
The source-driver power supplies consist of a boost
converter and an inverting buck-boost converter that
generates +15V (up to +17V) and -15V (up to -17V),
respectively. Both source-driver power supplies can
deliver up to 200mA. The positive source-driver supply
regulation voltage (VPOS) can be set either by using
an I2C interface or by connecting an external resistor-
divider. The negative source-driver supply voltage
(VNEG) is always tightly regulated to -VPOS within Q50mV.
The gate-driver power supplies consist of regulated
charge pumps that generate +22V (up to +40V) and
-20V (up to -40V) and can deliver up to 20mA each.
The IC features a VCOM amplifier output whose output
voltage is controlled by an internal 8-bit digital-to-analog
converter (DAC). The DAC is programmable through an
I2C interface and allows small-voltage-step sizes per
DAC step.
The IC includes a temperature sensor that provides
the ability to read the internal IC temperature and an
external panel temperature with the use of an external
temperature-sensing diode. Temperature output data is
supplied through I2C.
The device is available in a space-saving, 32-pin TQFN
package and is specified over the -40NC to +85NC
extended temperature range.
Applications
E-Book Readers
Features
S Four Regulated Output Voltages for Source- and
Gate-Driver Power Supplies
S VPOS + VNEG = ±50mV Tracking Accuracy
S Measures Internal and Remote Diode Temperature
Sensors
S True Shutdown on All Outputs
S 2.7V to 5.5V IN Supply Voltage Range
S Controlled Inrush Current During Soft-Start
S I2C Serial Interface for Temperature Read, Power
Output Enable, POS Voltage Regulation Set-Point
Adjustment, Power-Up/Power-Down Sequencing
Adjustment, and Fault Monitoring
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
Simplified Operating Circuit
EVALUATION KIT
AVAILABLE
PGVDD
DP
FBPG
DGVDD
DGVEE
DN
PGVEE
FBNG
REF
CEN
EN
POK
FLT
VDD
GND
SCL SDA EP
DXN
DXP
VCOM
LXN
INN
HVINN
NEG
POS
HVINP
FBP
PGND
LXP
IN 2.7V TO 5.5V
INPUT
VPOS
VNEG
2.7V TO 5.5V
INPUT
VVCOM
CONTROLLER
VGVEE
VGVDD
I2C
BUS
MAX17135
PART TEMP RANGE PIN-PACKAGE
MAX17135ETJ+ -40NC to +85NC32 TQFN-EP*
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
IN, EN, CEN, VDD, SDA, SCL, INN, FLT to GND ...-0.3V to +6V
FBPG, FBNG, FBP, DXP, DXN,
REF to GND ..............................................-0.3V to (VIN + 0.3V)
POK to GND ............................................-0.3V to (VVDD + 0.3V)
LXP to PGND ......................................................... -0.3V to +20V
PGVDD, POS to GND ........................... -0.3V to (VHVINP + 0.3V)
LXN to PGND .......................... (VHVINN - 0.3V) to (VINN + 0.3V)
PGVEE, NEG to GND .......................... (VHVINN - 0.3V) to +0.3V
DP to PGND .........................................-0.3V to (VHVINP + 0.3V)
DN to PGND ........................................ (VHVINN - 0.3V) to +0.3V
DGVDD to GND .....................................................-0.3V to +42V
HVINN to PGND ....................................................-20V to +0.3V
DGVEE to GND .....................................................-42V to +0.3V
DGVDD to HVINN ............................................................... +60V
VCOM to GND .................................... (VHVINN - 0.3V) to +0.3V
PGND to GND .....................................................-0.3V to +0.3V
LXP, LXN, INN, PGND RMS Current Rating .......................1.6A
Continuous Power Dissipation (multilayer board)
TQFN (derate 24.9mW/NC above TA = +70NC) ........... 1990mW
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VIN = 3.6V, Typical Operating Circuit of Figure 2, VHVINP = 15V, VNEG = -15V, TA = -40°C to +85°C, unless otherwise noted. Typical
values are at TA = +25NC.)
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
INPUT SUPPLIES AND REFERENCE
IN Voltage Range 2.7 5.5 V
IN UVLO Threshold VIN rising 2.45 2.55 2.65 V
IN UVLO Hysteresis 100 mV
IN Quiescent Current
EN = GND and the SHUTDOWN bit in
the Configuration register = 1 4 10 FA
EN = GND and the SHUTDOWN bit in
the Configuration register = 0 0.8 1.5
mA
VEN = 3.6V, no switching, SHUTDOWN
bit in the Configuration register = 0 2 3.5
VEN = 3.6V, switching, SHUTDOWN bit in
the Configuration register = 0 3
VDD Input Voltage 1.6 5.5 V
VDD UVLO Threshold VDD rising, hysteresis = 150mV 1.2 1.5 V
VDD Quiescent Current EN = GND 4 10 FA
Normal mode 4 10
REF Output Voltage No load 1.238 1.250 1.262 V
REF UVLO Threshold REF rising 1.0 1.2 V
REF UVLO Hysteresis 100 mV
REF Load Regulation 0 < IREF < 100FA 10 mV
REF Line Regulation 2.7V < VIN < 5.5V 2 mV
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
3
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 3.6V, Typical Operating Circuit of Figure 2, VHVINP = 15V, VNEG = -15V, TA = -40°C to +85°C, unless otherwise noted. Typical
values are at TA = +25NC.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
STEP-UP REGULATOR
Output Voltage Range VHVINP VIN 17 V
VPOS FBP = GND 5 17
Operating Frequency 850 1000 1150 kHz
Oscillator Maximum Duty Cycle 91 95 98 %
Output Voltage Resolution FBP = GND 4 Bits
POS Output Regulation Error FBP = GND, VINN = 2.7V to 5.5V,
1mA < IPOS < 200mA -2 +2 %
FBP Regulation Voltage 1.238 1.250 1.262 V
FBP Load Regulation 1mA < IPOS < 200mA -1 %
FBP Line Regulation VIN = 2.7V to 5.5V -0.08 %/V
FBP Input Bias Current VFBP = 1.25V, TA = +25NC50 125 200 nA
FBP Internal Divider Enable
Threshold FBP rising, hysteresis = 10mV 25 50 mV
LXP On-Resistance ILXP = 0.2A 250 500 mI
LXP Leakage Current EN = GND, VLXP = 18V, TA = +25NC20 FA
LXP Current Limit Duty cycle = 80%1.5 1.8 2.1 A
Soft-Start Period 5 ms
INVERTING REGULATOR
INN Input Voltage Range 2.7 5.5 V
INN Quiescent Current
EN = GND 10 FA
No switching 10
Switching 3 mA
Output Voltage Range VHVINN -17 V
Operating Frequency 850 1000 1150 kHz
Oscillator Maximum Duty Cycle 91 95 98 %
VPOS + VNEG Regulation
Voltage
VINN = 2.7V to 5.5V, 1mA < INEG <
200mA, IPOS = no load, VNEG R -15V,
TA = 0NC to +85NC
-50 +50 mV
VPOS + VNEG Regulation
Voltage
VINN = 2.7V to 5.5V, 1mA < INEG <
200mA, IPOS = no load -70 +70 mV
LXN On-Resistance INN to LXN, ILXN = 0.2A 250 500 mI
LXN Leakage Current VLXN = VHVINN = -18V, TA = +25NC20 FA
LXN Current Limit Duty cycle = 85%1.8 2.1 2.4 A
Soft-Start Period 5 ms
POSITIVE CHARGE-PUMP REGULATOR
PGVDD Operating Voltage
Range VPGVDD 7 VHVINP V
HVINP-DP Current Limit 150 mA
Oscillator Frequency 400 500 600 kHz
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
4
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 3.6V, Typical Operating Circuit of Figure 2, VHVINP = 15V, VNEG = -15V, TA = -40°C to +85°C, unless otherwise noted. Typical
values are at TA = +25NC.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
FBPG Regulation Voltage 1.238 1.250 1.262 V
FBPG Line Regulation VHVINP = 11V to 16V 0.05 %/V
FBPG Load Regulation 0mA < IGVDD < 100mA 0.04 %
FBPG Input Bias Current VFBPG = 1.25V, TA = +25NC-50 +50 nA
DP On-Resistance High IDP = 100mA 3 6 I
DP On-Resistance Low IDP = -100mA 1.5 3 I
Soft-Start Period 10 ms
NEGATIVE CHARGE-PUMP REGULATOR
PGVEE Operating Voltage
Range VPGVEE VHVINN -7 V
HVINN-DN Current Limit 150 mA
Oscillator Frequency 400 500 600 kHz
FBNG Regulation Voltage -12 0 +12 mV
FBNG Line Regulation VNEG = -11V to -16V 0.05 %/V
FBNG Load Regulation 0mA < IGVEE < 100mA -0.03 %
FBNG Input Bias Current VFBNG = 0V, TA = +25NC-50 +50 nA
DN On-Resistance High IDN = 100mA 3 6 I
DN On-Resistance Low IDN = -100mA 1.5 3 I
Soft-Start Period 10 ms
VCOM
Input Supply Range VHVINN -5 V
HVINP Shutdown Current
VEN = GND and the SHUTDOWN bit
in the Configuration register = 1,
VHVINP = 3.6V
10 30 µA
HVINP Quiescent Current VHVINP = 15V, VEN = 3.6V,
Configuration register = 0 0.8 mA
HVINN Quiescent Current VHVINN = -15V, VEN = 3.6V,
Configuration register = 0 2.0 mA
VCOM Voltage High IVCOM = 5mA -25 -50 mV
VCOM Voltage Low IVCOM = -5mA VHVINN
+ 50
VHVINN
+ 25 mV
VCOM Load Regulation
0mA < IVCOM < 30mA, sourcing,
DVR register = 7Fh -1.6 -0.6
%
0mA < IVCOM < 30mA, sinking,
DVR register = 7Fh 0.3 1.3
VCOM Output Current Sourcing 70 mA
Sinking 70
VCOM High Impedance
Leakage CEN = GND, TA = +25NC1FA
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
5
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 3.6V, Typical Operating Circuit of Figure 2, VHVINP = 15V, VNEG = -15V, TA = -40°C to +85°C, unless otherwise noted. Typical
values are at TA = +25NC.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SEQUENCE SWITCHES
POS Output Range VPOS Tracks HVINP VIN 17 V
POS On-Resistance (HVINP - POS), IPOS = 100mA 0.9 1.3 I
POS Charge Current Limit 250 mA
POS Discharge Resistance 200 340 600 I
POS Soft-Start Charge Time 10 ms
NEG Output Range VNEG Tracks HVINN -17 V
NEG On-Resistance (HVINN - NEG), INEG = 100mA 0.6 1 I
NEG Charge Current Limit 250 mA
NEG Discharge Resistance 200 340 600 I
NEG Soft-Start Charge Time 10 ms
PGVDD On-Resistance (HVINP - PGVDD), IPGVDD = 30mA 4 7 I
PGVEE On-Resistance (HVINN - PGVEE), IPGVEE = 30mA 1.5 3 I
DGVDD AND DGVEE
DGVDD Input Voltage Range 7 40 V
DGVDD Discharge Resistance 800 1200 1600 I
DGVEE Input Voltage Range -40 -7 V
DVGEE Discharge Resistance 800 1200 1600 I
VCOM Discharge Resistance 100 170 300 I
FAULT PROTECTION
HVINP Fault Threshold VHVINP falling 75 80 85 %
FBP Fault Threshold VFBP falling 0.95 1.00 1.05 V
FBPG Fault Threshold VFBPG falling 0.95 1.00 1.05 V
HVINN Fault Threshold VHVINN rising -VHVINP
x 0.85
-VHVINP
x 0.8
-VHVINP
x 0.75 V
FBNG Fault Threshold VFBNG rising 200 250 300 mV
Feedback Fault Timer 50 ms
Thermal Shutdown Hysteresis = 15NC160 NC
TEMPERATURE SENSOR
Temperature Resolution Monotonicity guaranteed 8 Bits
LSB 0.5 NC
External Diode Temperature
Error
TA = 0NC to +85NC-4 +4 NC
TA = -40NC to +125NC-8 +8
External Conversion Time 60 ms
Conversion Rate Register 0Fh = 100b 1Conv/s
Register 0Fh = 111b 8
Diode Source Current VDXP = 1.5V - high level 90 100 110 FA
VDXP = 1.5V - low level 9.0 10 11.0
Diode Source Current Ratio VDXP = 1.5V 9.5 10 10.5 A/A
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
6
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 3.6V, Typical Operating Circuit of Figure 2, VHVINP = 15V, VNEG = -15V, TA = -40°C to +85°C, unless otherwise noted. Typical
values are at TA = +25NC.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DXN Source Voltage 0.4 0.7 0.85 V
Diode Short-Circuit Threshold VDXN = 0.7V, VDXP - VDXN 20 65 110 mV
Diode Open-Circuit Threshold VDXN = 0.7V, VDXP - VDXN 1.6 1.9 2.2 V
PROGRAMMABLE
VCOM
CALIBRATOR
VCOM-DAC Voltage Resolution 8 Bits
VCOM-DAC Differential
Nonlinearity Monotonic over temperature -1 +1 LSB
VCOM-DAC Accuracy VCOM_set = 0x7F. TA = 0NC to +85NC-1.5 +1.5 LSB
VCOM-DAC Accuracy VCOM_set = 0x7F. TA = -40NC to +85NC-2.5 +2.5 LSB
VCOM-DAC Accuracy Other setting -4 +4 LSB
Memory Program Voltage HVINP rising, hysteresis = 250mV 6.95 7.1 7.25 V
POS Settling Time To Q0.5 LSB error band 20 Fs
Memory Write Cycles 30 Times
Memory Write Time 110 ms
CONTROL LOGIC
Input Low Voltage EN, CEN 0.3 x
VDD V
Input High Voltage EN, CEN 0.7 x
VDD V
Input Impedance EN, CEN = 3.6V 1MI
POK Logic-High Output
Voltage IPOK = 0.5mA VDD - 0.4 V
POK Logic-Low Output Voltage IPOK = -0.5mA 0.4 V
FLT Leakage Current V/FLT = 5.5V, TA = +25NC1FA
FLT Output Low Voltage I/FLT = 6mA 0.4 V
I2C INTERFACE
Input Capacitance SDA, SCL 5 pF
Input Low Voltage VIL SDA, SCL 0.3 x
VDD V
Input High Voltage VIH SDA, SCL 0.7 x
VDD V
SDA Sink Current VSDA = 0.4V 6 mA
SCL Frequency fSCL DC 400 kHz
SCL High Time tHIGH 600 ns
SCL Low Time tLOW 1300 ns
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
7
Note 1: Holding the SDA line low for a time greater than tTIMEOUT causes the device to reset SDA to the IDLE state of the serial
bus communication (SDA set high).
Note 2: Guaranteed by design, not production tested.
Note 3: All devices are 100% tested at TA = +25°C. Limits over temperature are guaranteed by design.
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 3.6V, Typical Operating Circuit of Figure 2, VHVINP = 15V, VNEG = -15V, TA = -40°C to +85°C, unless otherwise noted. Typical
values are at TA = +25NC.)
Figure 1. Timing Definitions Used in the Electrical Characteristics
SCL
SDA VIH
VIL
tF
tHD;STA tR
tLOW
tHIGH
tHD;DAT tSU;DAT tSU;STA
tSU;STO
tBUF
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SDA, SCL Rise Time tRCBUS = total bus line capacitance (pF)
(Note 2)
20 + 10
x CBUS 300 ns
SDA, SCL Fall Time tFCBUS = total bus line capacitance (pF)
(Note 2)
20 + 10
x CBUS 300 ns
START Hold Time tHD;STA 10% of SDA to 90% of SCL 600 ns
START Setup Time tSU;STA 600 ns
Data Input Hold Time tHD;DAT 0 ns
Data Input Setup Time tSU;DAT 100 ns
STOP Setup Time tSU;STO 600 ns
Bus Free Time tBUF 1300 ns
Input Spike Suppression SDA, SCL (Note 2) 250 ns
SDA Reset Low Time tTIMEOUT (Notes 1, 2) 60 ms
MAX17135
8
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
TOTAL INPUT SUPPLY STANDBY
CURRENT vs. IN SUPPLY VOLTAGE
MAX17135 toc01
VIN (V)
IVIN (uA)
5.55.02.5 3.0 3.5 4.0 4.5
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
2.0
2.0 6.0
VDD = 3.3V,
TEMP SENSOR SHUTDOWN = 1
POS LOAD REGULATION
MAX17135 toc02
LOAD CURRENT (mA)
OUTPUT ERROR (%)
15010050
-0.40
-0.30
-0.20
-0.10
0
-0.50
0 200
VIN = 3.6V
VPOS = 15V
FBP = GND
POS LINE REGULATION
MAX17135 toc03
INPUT VOLTAGE (V)
OUTPUT ERROR (%)
4.84.13.4
-0.15
-0.10
-0.05
0
-0.20
2.7 5.5
VPOS = 15V
IPOS = 100mA
FBP = GND
POS LOAD-TRANSIENT RESPONSE
(50mA TO 150mA)
MAX17135 toc04
IPOS
100mA/div
VPOS (AC-COUPLED)
100mV/div
0mA
0mV
0A
ILX1
1A/div
VIN = 3.6V
VPOS = 15V
FBP = GND
CPOS-GND = 3 x 4.7µF
100µs/div
VPOS + VNEG LINE REGULATION
MAX17135 toc06
VIN (V)
OUTPUT ERROR (mV)
5.55.03.0 3.5 4.0 4.5
-13.0
-11.0
-9.0
-7.0
-5.0
-3.0
-1.0
1.0
-15.0
2.5 6.0
VPOS = 15V
VNEG = -15V
IPOS = INEG = 0mA
VPOS + VNEG LOAD REGULATION
MAX17135 toc05
LOAD CURRENT (mA)
OUTPUT ERROR (mV)
175150125100755025
-15
-10
-5
0
-20
0 200
VPOS = 15V
VNEG = -15V
VIN = 3.6V
FBP = GND
NEG LOAD-TRANSIENT RESPONSE
(50mA TO 150mA)
MAX17135 toc07
INEG
100mA/div
VNEG
100mV/div
(AC-COUPLED)
0mA
0mV
0A
ILX2
1A/div
VIN = 3.6V
VNEG = -VPOS = -15V
CNEG-GND = 3 x 4.7µF
100µs/div
MAX17135
9
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
POWER-UP SEQUENCE OF
ALL SUPPLY OUTPUTS
MAX17135 toc08
0V
0V
0V
0V
0V
20ms/div
POWER-DOWN SEQUENCE OF
ALL SUPPLY OUTPUTS
MAX17135 toc09
0V
0V
0V
0V
0V
20ms/div
GVDD
20V/div
POS
10V/div
NEG
10V/div
GVEE
20V/div
EN
2V/div
GVDD LOAD REGULATION
MAX17135 toc10
LOAD CURRENT (mA)
OUTPUT ERROR (%)
10
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0
1 100
VIN = 3.6V
VHVINP = 15V
VGVDD = 22V
GVEE LOAD REGULATION
MAX17135 toc11
LOAD CURRENT (mA)
OUTPUT ERROR (%)
10
-0.20
-0.15
-0.10
-0.05
0
-0.25
1 100
VIN = 3.6V
VHVINN = -15V
VGVEE = -20V
NEG EFFICIENCY vs. LOAD CURRENT
MAX17135 toc13
LOAD CURRENT (mA)
EFFICIENCY (%)
15010050
60
70
80
90
100
40
50
0 200
VIN = 3.6V
VNEG = 15V
VCOM LOAD REGULATION
MAX17135 toc12
LOAD CURRENT (mA)
OUTPUT ERROR (%)
5 15 2010 25
-0.35
-0.30
-0.25
-0.20
-0.15
-0.10
-0.05
0
-0.40
03
0
VIN = 3.6V
VHVINP = 15V
VCOM AT NO LOAD = -1.77V
POS EFFICIENCY vs. LOAD CURRENT
MAX17135 toc14
LOAD CURRENT (mA)
EFFICIENCY (%)
15010050
60
70
80
90
100
50
0 200
VIN = 3.6V
VPOS = 15V
FBP = GND
MAX17135
10
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
Pin Configuration
Pin Description
MAX17135
TQFN
TOP VIEW
29
30
28
27
12
11
13
PGVDD
DGVDD
POK
DGVEE
REF
14
DP
POS
GND
N.C.
NEG
N.C.
CEN
12
HVINP
4567
2324 22 20 19 18
LXP
PGND
DXP
SDA
SCL
VDD
FBPG VCOM
3
21
31 10
FBP DN
32 9
IN PGVEE
EP
+
INN
26 15 DXN
LXN
25 16 EN
FBNG FLT
8
17
HVINN
PIN NAME FUNCTION
1 DP Regulated Charge-Pump Driver for GVDD. Connect to flying capacitor.
2 PGVDD Supplies the HVINP Voltage for the Positive Charge Pump. Connect as shown in Figure 2.
3 FBPG Feedback Input for GVDD
4 DGVDD GVDD Discharge. Connect the output of the positive charge pump to DGVDD as shown in Figure 2.
5 POK Power-OK. Driven high when the outputs of the gate- and source-driver power supplies are all in
regulation.
6 DGVEE GVEE Discharge. Connect the output of the negative charge pump to DGVEE as shown in Figure 2.
7 REF Voltage Reference. Bypass to GND with a minimum 0.1FF ceramic capacitor.
8 FBNG Feedback Input for GVEE
9 PGVEE Supplies the HVINN Voltage to the Negative Charge Pump for the GVEE Output. Connect as shown in
Figure 2.
10 DN Regulated Charge-Pump Driver for GVEE. Connect to flying capacitor.
11 VDD Logic Supply Input for the I2C. Bypass to GND through a minimum 0.1FF capacitor.
12 SCL I2C Serial Clock Input
13 SDA I2C Serial Data Input/Output
14 DXP External Temperature-Sensing Diode Anode Connection. Bypass DXP to DXN with a 2200pF ceramic
capacitor.
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
11
Pin Description (continued)
PIN NAME FUNCTION
15 DXN External Temperature-Sensing Diode Cathode Connection
16 EN Enable Pin. Logic-high initiates power-up sequencing. Logic-low initiates power-down sequencing.
17 FLT Fault Indicator. Open-drain output goes low during a fault condition.
18 CEN VCOM Enable. Logic-high enables VCOM output. Logic-low causes the load on the VCOM output to be
discharged.
19, 20 N.C. No Connection
21 GND Analog GND
22 VCOM VCOM Output
23 POS Positive Source-Driver Output Voltage
24 NEG Negative Source-Driver Output Voltage
25 HVINN Input Power for the NEG Voltage Rail. Connect the output of the inverting converter to this pin.
26 LXN DC-DC Inverting Converter Inductor/Diode Connection
27 INN Inverting Converter Power Input. 2.7V to 5.5V. Bypass to PGND with a minimum 10FF ceramic capacitor.
28 HVINP Input Power for the POS Voltage Rail. Connect the output of the step-up converter to this pin.
29 LXP Step-Up Converter Inductor/Diode Connection
30 PGND Power Ground
31 FBP
Feedback Pin for HVINP Output. Connect FBP to GND to set the HVINP regulation voltage to +15V. With
FBP connected to ground, VHVINP can be changed through I2C after power-up by changing the value
stored in the HVINP register. Alternatively, connect an external resistor-divider midpoint to the FBP pin to
set the HVINP regulation voltage.
32 IN Power Input. Bypass to GND through a minimum 1FF capacitor.
— EP Exposed Pad. Connect exposed pad to ground.
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
12
Figure 2. Typical Operating Circuit
PGVDD
D4
D3
C13
0.1µF
25V
C11
1µF
25V
R2
806kI
R3
49.9kI
R6
10I
R7
0.5I
C10
0.1µF
R1
100kI
C9
0.1µF C8
2200pF
Q1
C16
1µF
25V
C15
0.1µF
25V
C14
1µF
25V
R4
332kI
R5
20kI
DP
FBPG
DGVDD
DGVEE
DN
PGVEE
FBNG
REF
CEN
EN
POK
FLT
VDD
GND
SCL SDA EP DXN
DXP
VCOM
LXN
INN
HVINN
NEG
POS
HVINP
FBP
PGND
LXP
IN 2.7V TO 5.5V
INPUT
VPOS = +15V
200mA
C3
4.7µF
25V
D1
L1
4.7µF
C2
10µF
6.3V
C1
1µF
10V
VNEG = -VPOS
200mA
2.7V TO 5.5V
INPUT
C5
4.7µF
25V
C4
4.7µF
25V
C18
4.7µF
25V
C19
4.7µF
25V
C17
4.7µF
25V
VCOM = -0.5V TO -3.05V, 70mA
(ADJUSTABLE IN 10mV STEPS)
L2
4.7µH
C7
4.7µF
25V
C20
4.7µF
25V
D2
C6
10µF
6.3V
CONTROLLER
VGVDD = +22V
20mA
VGVEE = -20V
20mA
C12
4.7µF
50V
I2C
BUS
MAX17135
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
13
Figure 3. Functional Diagram
PGVDD
DP
FBPG
DGVDD
DGVEE
REGULATED
CHARGE
PUMP
DN
PGVEE
FBNG
1.25V
REF
CEN
EN
POK
FLT
VDD
SCL
SDA
GND
DXP
DXN
TEMP
ADC
INTERNAL DIODE
TEMPERATURE SENSOR
VCOM
REGISTER
AND DAC
NON-
VOLATILE
MEMORY
I2C
INTERFACE
ENABLE
CONTROL
AND
FAULT
LOGIC
POWER
RAIL
OUTPUT
CONTROL
1MHz
PWM
INV
NEG
SOFT-
START
POS
SOFT-
START
1MHz
PWM
BST
REGULATED
CHARGE
PUMP
PGND
LXP
IN
2.7V TO 5.5V
INPUT
2.7V TO 5.5V
INPUT
FBP
HVINP
POS
NEG
HVNN
INN
LXN
VCOM TO VCOM
BACKPLANE
VPOS
VNEG
CONTROLLER
I2C
BUS
VGVEE
VGVDD
MAX17135
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
14
Typical Operating Circuit
The IC’s typical operating circuit (Figure 2) generates
Q15V source-driver supplies and +22V and -20V gate-
driver supplies for E-paper displays. The input voltage
range for the IC is from 2.7V to 5.5V. Figure 3 shows the
functional diagram. Table 1 lists recommended compo-
nents and Table 2 lists contact information for compo-
nent suppliers.
Detailed Description
Source-Driver Power Supplies
The source-driver power supplies consist of a boost
converter and an inverting buck-boost converter that
generate +15V (+17V max) and -15V (-17V max),
respectively, and can deliver up to 200mA. The positive
source-driver power supply’s regulation voltage (VPOS)
can be set using the external resistor-divider network
shown in Figure 2, or can be programmed through the
I2C interface connecting FBP to GND before power-up.
The negative source-driver supply voltage (VNEG) is
automatically tightly regulated to -VPOS within Q50mV.
VNEG cannot be adjusted independently of VPOS.
Gate-Driver Power Supplies
The positive gate-driver power supply (GVDD) generates
+22V (+40V max) and the negative gate-driver power
supply (GVEE) generates -20V (-40V max). Both supplies
can supply up to 20mA current. The GVDD and GVEE
regulation voltages are both set by using the external
resistor-divider networks shown in Figure 2.
VCOM Amplifier
The IC features a negative output VCOM amplifier whose
voltage is programmed through an I2C interface. An
internal 8-bit digital-to-analog converter (DAC) allows
for a wide VCOM output range of -0.5V to -3.05V and a
10mV change per DAC step. The user can store the DAC
setting in nonvolatile memory. On power-up, the nonvola-
tile memory sets the DAC to the last stored setting.
Temperature Sensor
The IC includes a temperature sensor that reads the
internal IC temperature and the external panel tem-
perature with the use of an external temperature-sensing
diode. Temperature output data is supplied through I2C.
An analog-to-digital converter (ADC) converts the tem-
perature data to 9 bits, two’s-complement format and
stores the conversion results in separate temperature
registers.
Fault Protection
The IC has robust fault and overload protection. If any
of the GVEE, NEG, POS, or GVDD outputs fall more
than 80% (typ) below their intended regulation voltage
for more than 50ms (typ), or if a short-circuit condition
occurs on any output for any duration, then all outputs
latch off and FLT is asserted low. The fault condition is
set in the Fault register, which can be read through the
I2C interface.
True Shutdown
The IC completely disconnects the loads from the input
when in shutdown mode. In most boost converters, the
external rectifying diode and inductor form a DC current
path from the battery to the output. This can drain the
battery even in shutdown if a load was connected at
the boost-converter output. The device has an internal
switch at POS. When this switch turns off during shut-
down, there is no DC path from the input to POS.
Table 1. Component List
Table 2. Component Suppliers
DESIGNATION DESCRIPTION
C2, C6
10FF Q10%, 6.3V X7R ceramic
capacitors (0805)
TDK C2012X7R0J106K
C3, C4, C5,
C7, C17–C20
4.7FF Q10%, 25V X7R ceramic
capacitors (1206)
Murata GRM31CR71E475KA88L
D1, D2 30V, 1A single Schottky diodes (SOD123)
ON Semiconductor MBR130T1
D3, D4 Dual small-signal diodes (SOT23)
Fairchild MMBD4148SE
L1, L2 4.7FH, 1.5A, 45mI inductors
TOKO A915AY-4R7M
Q1 40V npn transistor (SOT23)
Fairchild MMBT3904
SUPPLIER WEBSITE
Fairchild Semiconductor www.fairchildsemi.com
Murata Electronics North
America, Inc. www.murata-northamerica.com
ON Semiconductor www.onsemi.com
TDK Corp. www.component.tdk.com
TOKO America, Inc. www.tokoam.com
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
15
Output Control
The IC’s source-driver and gate-driver outputs (GVEE,
NEG, POS, and GVDD) and VCOM amplifier output
can be controlled by driving the IC’s EN and CEN pins,
respectively. Alternatively, the EN and CEN pins can be
left unconnected or connected to GND such that their
corresponding functions can be controlled by toggling
the EN and CEN bits in the enable register. All outputs are
brought up with soft-start control to limit the inrush current.
Power-On/Power-Off
Sequencing and Timing
The IC allows for flexible power-up/power-down sequenc-
ing and timing of the source-driver and gate-driver
power supplies (GVEE, NEG, POS, and GVDD). Toggling
the EN pin from low to high or setting the EN bit in the
enable register to 1 initiates an adjustable preset power-
up sequence. Toggling the EN pin from high to low or
setting the EN bit in the Enable register to 0 initiates an
adjustable preset power-down sequence. The power-
up/power-down sequence and timing between rails are
determined by the user’s values programmed into the
Timing registers through I2C. The desired sequence and
timing between rails contained in the Timing registers
can also be stored in the nonvolatile memory, such that
desired timing information is loaded into the Timing reg-
isters at power-up.
I2C Interface
The device supports an I2C-compatible, 2-wire digital
interface. SDA is the bidirectional data line and SCL
is the clock line of the 2-wire interface corresponding,
respectively, to the SDA and SCL lines of the I2C bus.
Write to a register by writing the device address byte,
a data pointer byte, and a data byte. Read from the IC
in one of two ways: if the location latched in the Pointer
register is set from the previous read, the new read con-
sists of a device address byte, followed by retrieving the
corresponding number of data bytes. If the Pointer reg-
ister needs to be set to a new address, perform a read
operation by writing the device address byte, pointer
byte, repeat start, and the device address byte again
with the read bit. An inadvertent 8-bit read from a 16-bit
register, with the D7 bit low, can cause the device to stop
in a state where the SDA line is held low. Ordinarily, this
would prevent any further bus communication until the
master sends nine additional clock cycles or SDA goes
high. At that time, a STOP condition resets the device.
If the additional clock cycles are not generated by the
master, the IC bus resets and unlocks after the bus time-
out period has elapsed.
The device uses the read and write protocols shown in
Figure 4.
Figure 4. Read/Write Protocols
BYTE READ FROM PRESET POINTER LOCATION
MSB
START SLAVE
ACK STOPd7 d6 d5 d4 d3 d2 d1 d0
LSB MSB LSB
SLAVE ADDRESS DATA BYTE
00100011
POINTER SET FOLLOWED BY IMMEDIATE BYTE READ
SLAVE ADDRESS POINTER BYTE
STOPd7 d6 d5 d4 d3 d2 d1 d0
MSB LSB
SLAVE ADDRESS DATA BYTE
MSB
START SLAVE
ACK
SLAVE
ACK
000p4 p3 p2 p1 p0
LSB MSB LSB
00100001 SLAVE
ACK
LSB
001000 11
REPEAT
START
WORD READ FROM PRESET POINTER LOCATION
SLAVE ADDRESS MOST SIGNIFICANT DATA BYTE LEAST SIGNIFICANT DATA BYTE
MSB LSB MSB LSB
START SLAVE
ACK d7 d6 d5 d4 d3 d2 d1 d0
00100011
MSB
MASTER
ACK STOP
LSB
d7 d6 d5 d4 d3 d2 d1 d0
POINTER SET FOLLOWED BY IMMEDIATE WORD READ
SLAVE ADDRESS POINTER BYTE SLAVE ADDRESS
MSB
START MASTER
ACK 000p4 p3 p2 p1 p0
LSB MSB LSB
00100001
MSB
SLAVE
ACK
LSB
00100011 d7 d6 d5 d4 d3 d2 d1 d0
MSB LSB
MOST SIGNIFICANT DATA BYTE
STOPd7 d6 d5 d4 d3 d2 d1 d0
MSB LSB
LEAST SIGNIFICANT DATA BYTE
SLAVE
ACK
REPEAT
START
MASTER
ACK
BYTE WRITE
SLAVE ADDRESS POINTER BYTE DATA BYTE
MSB LSB MSB LSB
START SLAVE
ACK 000p4p3p2p1p0
00100001
MSB
SLAVE
ACK
LSB
d6 d5 d4 d3 d2 d1 d0d7 STOP
SLAVE
ACK
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
16
I2C Address
The IC is a slave-only device and responds to the 7-bit address 90h. The read and write commands can be distin-
guished by adding 1 more bit (R/W bit) to the end of the 7-bit slave address, with 1 indicating read, and 0 indicating
write.
I2C Registers
The device contains 20 data registers along with an additional Pointer register. The Pointer register selects which of the
other 19 data registers to be read from or written to. At power-up, the Pointer is set to read the External Temperature
register at address 0x00. The Pointer register latches the last location to which it was set.
P4–P0 Register Select
A7 A6 A5 A4 A3 A2 A1 A0
1 0 0 1 0 0 0 R-/W
P7 P6 P5 P4 P3 P2 P1 P0
0 0 0 Register Select
P4–P0 (HEX) REGISTER NO. OF BITS POR STATE
00 External Temperature register (read only) (power-up default) 16 N/A
01 Configuration register (read/write) 8 00h
04 Internal Temperature register (read only) 16 N/A
05 Status register (read only) 8 N/A
06 Product Revision register (read only) 8 00h
07 Product ID Register (read only) 8 4Dh
08 DVR register (R/W) 8 FFh
09 Enable register (R/W) 8 00h
0A Fault register (read only) 8 N/A
0B HVINP register (R/W) 8 0Ah
0C Programming Control register (write only) 8 N/A
0Fh Temperature Conversion Rate register 8 04h
10 t1 Timing register (R/W) 81Eh (factory default)
11 t2 Timing register (R/W) 83Ch (factory default)
12 t3Timing register (R/W) 85Ah (factory default)
13 t4 Timing register (R/W) 878h (factory default)
14 t5 Timing register (R/W) 81Eh (factory default)
15 t6 Timing register (R/W) 83Ch (factory default)
16 t7 Timing register (R/W) 85Ah (factory default)
17 t8 Timing register (R/W) 878h (factory default)
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
17
Configuration Register (01h) (R/W)
After the IN and VDD voltages have risen above
their respective undervoltage-lockout thresholds, the
Shutdown bit (D0) is set to 0 and temperature conver-
sions begin immediately. Temperature conversions are
continually performed every 1s unless the temperature
sensor is put into shutdown mode. Set D0 to 1 to put the
temperature sensor in shutdown mode to reduce supply
current.
D0: SHUTDOWN: When set to 1, the temperature sensor
is shut down.
Status Register (05h), Read Only
The Status register indicates whether the IC’s ADC is in
the process of performing a temperature conversion and
whether there are any fault conditions with the remote
temperature-sensing diode. Any fault condition with the
external temperature-sensing diode causes the external
temperature register to return 7FC0h.
D0: BUSY: Is set to 1 when the ADC is in the process of
performing a temperature conversion.
D1: OPEN: Is set to 1 when any connections from DXN
and DXP to the temperature-sensing diode are open.
D2: SHORT: Is set to 1 when there is a short-circuit con-
dition between DXP and DXN.
External and Internal Temperature Registers
(00h and 04h), Read Only
The temperature data format of the External Temperature
register (00h) and the Internal Temperature register
(04h) are both 9 bits, two’s complement, and are read
out in word format: an upper byte and a lower byte. Bits
D15–D7 contain the temperature data, with the LSB rep-
resenting +0.5NC and the MSB representing the sign bit.
The last 7 bits of the lower byte, bits D6–D0, are don’t
care.
X = Don’t care.
X = Don’t care.
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Sign Bit
1 = Negative
0 = Positive
+64NC +32NC +16NC +8NC +4NC +2NC +1NC +0.5NCXXXXXXX
TEMPERATURE (NC) DIGITAL OUTPUT
BINARY HEX
+125 0111 1101 0XXX XXXX 7D0X
+25 0001 1001 0XXX XXXX 190X
+0.5 0000 0000 1XXX XXXX 008X
0 0000 0000 0XXX XXXX 000X
-0.5 1111 1111 1XXX XXXX FF8X
-25 1110 0111 0XXX XXXX E70X
D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 0 0 0 Shutdown
D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 0 SHORT OPEN BUSY
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
18
Product Revision Register (06h), Read Only
This register contains the product revision 0x00h.
Product Identification Register (07h), Read Only
Maxim is indicated by 0x4Dh.
DVR Register (08h) R/W
The VCOM voltage can be set anywhere between -0.5V
and -3.050V with 10mV per LSB by programming the
DVR register with a corresponding value as shown in the
table below. During power-up, once IN and VDD exceed
their undervoltage-lockout thresholds, the DVR register
is programmed with a value stored in the nonvolatile
memory to set the VCOM voltage. The factory-default
DVR value stored in the nonvolatile memory is 7F. See
the Programming Control Register (0Ch), Write Only sec-
tion for details regarding changing the preset DVR value.
Enable Register (09h) R/W
The output enable functions performed by the EN and
CEN pins can also be performed through I2C commands
by setting the function’s corresponding enable bit in the
Enable register.
Each function’s enable bit is ORed with the status of its
corresponding enable pin to determine whether the func-
tion is to be performed. If I2C control over the EN and
CEN functions is desired, leave the EN and CEN pins
unconnected or connect them to GND such that when:
• The EN bit is set to 1; the GVEE, NEG, POS, and
GVDD power rails begin a power-up sequence. The
sequence order and timing between the startup of
each power rail is determined by the information
stored in the t1–t4 Timing registers at the time the EN
bit is set to 1.
• The EN bit is set to 0; the GVEE, NEG, POS, and
GVDD begin a power-down/discharge sequence
based on the information stored in the Timing reg-
isters. The sequence order and timing between the
power-down of each power rail is determined by the
information stored in the t5–t8 Timing registers at the
time the EN bit is set to 0.
•The CEN bit is set to 1; the VCOM output is
enabled.
•The CEN bit is set to 0; the VCOM output is dis-
charged to ground.
During a fault condition, all bits in the Enable register
are cleared (EN = CEN = 0). Driving the EN or CEN pins
high or low has no effect on the EN or CEN settings in
the Enable register.
D7 D6 D5 D4 D3 D2 D1 D0
00000000
D7 D6 D5 D4 D3 D2 D1 D0
01001101
D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 0 0 CEN EN
D7 D6 D5 D4 D3 D2 D1 D0
MSB Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB
DVR REGISTER VCOM OUTPUT
VOLTAGE (V)
00h -0.50
01h -0.51
… …
7Fh -1.77
… …
FEh -3.04
FFh -3.05
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
19
Fault Register (0Ah) Read Only
During a fault condition, all outputs of the device are
latched off, all bits in the Enable register are set to 0, and
the corresponding bit of the fault condition is set in the
Fault register (see the table below). After the fault condi-
tion is removed, the Fault register is cleared by cycling
the VDD supply.
The POK bit in the Fault register is not a fault indicator,
but rather a status indicator that is asserted to 1 after
FBNG, NEG, POS, and FBPG have all exceeded 80% of
their regulation voltages and all soft-start periods have
completed. The POK bit is set to 0 once the power-down
sequence has been initiated by setting the EN bit to 0 or
once a fault condition has occurred. The status of POK
itself does not directly affect the status of EN or CEN bits.
Note: The temperature sensor DXN/DXP short-circuit
and open-circuit “faults” are not latching faults that
cause the IC to shut down and do not set the CEN or EN
bits’ status.
FBPG = GVDD undervoltage fault
HVINP = HVINP undervoltage fault
HVINN = HVINN undervoltage fault
FBNG = GVEE undervoltage fault
HVINPSC = HVINP short-circuit fault
HVINNSC = HVINN short-circuit fault
OT = Thermal shutdown
POK = Power-OK
HVINP Register (0Bh) R/W
The POS regulation voltage is determined by the boost
converter’s output regulation voltage (VHVINP). The
HVINP regulation voltage is set by using a resistor-divider
network or by programming the corresponding value of
the desired HVINP regulation voltage into the HVINP reg-
ister through I2C (see the table below). Programming the
HVINP register to set the HVINP regulation voltage gives
the flexibility to change the HVINP regulation voltage
between each power-up sequence of the GVEE, NEG,
POS, and GVDD rails and removes external components.
To set the HVINP regulation voltage through I2C, connect
the FBP pin to GND. With FBP connected to GND, the
HVINP register is automatically loaded with 0Ah and the
HVINP regulation voltage is set to +15V after IN and VDD
have exceeded their undervoltage-lockout thresholds.
If another HVINP regulation voltage other than +15V is
desired, write a new value to the HVINP register that cor-
responds to the desired HVINP regulation voltage after
IN and VDD have exceeded their undervoltage-lockout
thresholds, but before EN is asserted high. The new
HVINP regulation voltage is maintained until a new value
is written to the HVINP register or the VDD input power
is cycled. After cycling VDD, the HVINP register is again
reloaded with 0Ah such that it is necessary to rewrite the
HVINP register to change the HVINP regulation voltage
to another voltage other than VHVINP = 15V.
The HVINP register can be programmed to provide a
POS regulation voltage from 00h (VPOS = 5V) to 0Ch
(VPOS = 17V) adjustable in 1V steps.
D7 D6 D5 D4 D3 D2 D1 D0
POK OT HVINNSC HVINPSC FBNG HVINN HVINP FBPG
D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 MSB Bit2 Bit1 LSB
HVINP REGISTER HVINP OUTPUT
VOLTAGE (V)
00h 5
01h 6
... ...
0Ah 15
0Bh 16
0Ch 17
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
20
Conversion Rate Control Byte (0Fh) R/W
The Conversion Rate register (0Fh) programs the time
interval between conversions in the free-running auto-
convert mode of the temperature sensors. This variable-
rate control reduces the supply current in portable-
equipment applications. The conversion rate control
byte’s POR state is 04h. The control mechanism looks
only at the 3 LSBs of this register, so the upper 5 bits
are “don’t care” bits, which should be set to zero. The
conversion rate tolerance is ±25% at any rate setting.
Valid A/D conversion results are available one total con-
version time after the initiating conversion, whether the
conversion is initiated through the Shutdown bit in the
Configuration Register or initial power-up. Changing the
conversion rate can also affect the delay until new results
are available.
t1–t8 Timing Registers (10h–17h) R/W
Figure 5 shows the start-up and shutdown sequence of
the power rails:
• TheHVINPpowerrailbeginsitssoft-startsequence
once EN is driven high or the EN bit in the Enable
register is set to 1.
• TheHVINNpowerrailbeginsitssoft-startsequence
once the HVINP soft-start period has expired.
• The GVEE, NEG, POS, and GVDD power rails start
up t1–t4ms after the expiration of the HVINN soft-start
period.
• POK is asserted high after FBNG, NEG, POS, and
FBPG have all exceeded 80% of their regulation volt-
ages and all the corresponding power rails’ soft-start
periods have expired.
• Once EN is driven low or the EN bit in the Enable
register is set to 0 (while the EN is disconnected
or is connected to GND), POK is asserted low and
each power rail is discharged at a time depending
on the values stored in the timing registers (t5–t8).
Approximately 512ms after EN is driven low, HVINP
and HVINN are powered down but not discharged.
The power-up/power-down sequence and timing
between the GVEE, NEG, POS, and GVDD power rails
can be set by programming the t1–t8 registers with cor-
responding values according to the table below.
The binary value stored in a register directly corresponds
to the time in ms.
During power-up of the device, once IN and VDD exceed
their undervoltage-lockout thresholds, the t1–t8 registers
are loaded with values stored in the nonvolatile memory
to preset the t1–t8 timing. The factory-default timing set-
tings in the nonvolatile memory are:
• t1=t5=30ms
• t2=t6=60ms
• t3=t7=90ms
• t4=t8=120ms
To change the preset t1–t8 timing, see the Programming
Control Register (0Ch), Write Only section.
D7 D6 D5 D4 D3 D2 D1 D0
128ms 64ms 32ms 16ms 8ms 4ms 2ms 1ms
VALUE STORED IN A
TIMING REGISTER (t1–t8) TIME (ms)
00h 0
01h 1
... ...
FEh 254
FFh 255
DATA CONVERSION
RATE (Hz)
AVERAGE SUPPLY
CURRENT OF TEMP-
SENSOR BLOCK (μA)
00h 0.0625 14
01h 0.125 18
02h 0.25 26
03h 0.5 41
04h 1 72
05h 2 133
06h 4 255
07h 8 500
08h to FFh Depends on the
3 LSB Depends on the 3 LSB
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
21
Figure 5. Adjustable Power-Up and Power-Down Sequencing
Programming Control Register (0Ch), Write Only
The Programming Control register (PCR) allows the user
to update the nonvolatile memory containing the values
used to set the DVR and Timing registers after initial
power-up of the IC (after VDD and IN both exceed their
undervoltage-lockout thresholds).
To change the nonvolatile memory values that preset the
VCOM voltage, set EN to high to bring up the power rails.
After POK is asserted high, write the value correspond-
ing to the desired VCOM voltage setting into the DVR
register. After the DVR register has been updated, write
1 to D0 of the PCR to update the nonvolatile memory
with the current value stored in the DVR register. The
nonvolatile memory containing the power-up DVR set-
ting can be changed up to 30 times. The I2C bus returns
NACK if the DVR nonvolatile memory is attempted to be
programmed more than 30 times.
To change the nonvolatile memory values that preset the
power-up and power-down timing between the power
rails, set EN to high to bring up the power rails. After POK
is asserted high, write to all t1–t8 registers with the val-
ues corresponding to the desired t1–t8 timing between
power rails. The t1–t8 values cannot be stored to the
nonvolatile memory independently and all eight Timing
registers must be written to at least once before attempt-
ing to update the nonvolatile memory with any new val-
ues, even if not all values need to be changed from the
current values stored in the nonvolatile memory. Once
all the Timing registers have been written to at least
once, write 1 to D1 of the PCR to update the nonvolatile
memory with the current values stored in all t1–t8 Timing
registers. The nonvolatile memory containing the power-
up and power-down timing settings can be changed up
to three times. The I2C bus returns NACK if the t1–t8
nonvolatile memory is attempted to be programmed
more than three times.
Note: VPOS needs to be greater than 7.3V in order to
successfully program the nonvolatile memory.
HVINP
2
1
3
4
5
GVDD
POS
POK
NEG
GVEE
EN
HVINN
t1 t5
t6
t7
t8
t2
t3
t4
512ms
D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 0 0 Timing DVR
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
22
PCB Layout and Grounding
Careful PCB layout is important for proper operation. Use
the following guidelines for good PCB layout:
• Minimize the inner loop area created by the boost
converter high-switching current connections. Place
D1 and C3 close to the IC such that the traces con-
necting the LXP pin to the anode of D1, the cathode
of D1 to C3, and C3 to the PGND pin are kept as
short as possible to minimize the loop area contained
within these connections. Make these connections
with short, wide traces.
• Minimize the inner loop area created by the buck-
boost converter high-switching current connections.
Place C6, C7, and D2 close to the IC such that the
traces connecting C6 to the INN pin, the LXN pin to
the cathode of D2, the anode of D2 to C7, and C6
ground connection to C7 are kept as short as pos-
sible to minimize the loop area contained within these
connections. Make these connections with short,
wide traces.
• Avoid using vias in the high-current paths. If vias
are unavoidable, use many vias in parallel to reduce
resistance and inductance.
• Create a power ground island (PGND) consisting of
the PGND pin, the input and output capacitor ground
connections, the charge-pump capacitor ground con-
nections, and the buck-boost inductor ground connec-
tion. Connect all these together with short, wide traces
or a small ground plane. Maximizing the width of the
power ground traces improves efficiency and reduces
output-voltage ripple and noise spikes. Create an ana-
log ground plane (GND) consisting of the GND pin,
all the feedback-divider ground connections, the IN,
VDD, and REF bypass capacitor ground connections,
and the device’s exposed backside paddle.
• Connect the GND and PGND islands by connect-
ing the PGND pin directly to the exposed backside
paddle. Make no other connections between these
separate ground planes.
• Placethefeedback-voltage-dividerresistorsasclose
as possible to their respective feedback pins. Keep
the traces connecting the feedback resistors to
their respective feedback pins as short as possible.
Placing the resistors far away causes the feedback
trace to become an antenna that can pick up switch-
ing noise. Care should be taken to avoid running any
feedback trace near the LXP, LXN, DP, or DN switch-
ing nodes.
• Place the IN, VDD, and REF bypass capacitors as
close as possible to the IC. The ground connections
of the IN, VDD, and REF bypass capacitors should
be connected directly to the analog ground plane or
directly to the GND pin with a wide trace.
• Minimize the length and maximize the width of the
traces between the output capacitors and the load for
best transient responses.
• KeepsensitivesignalsawayfromtheLXP,LXN,DP,
and DN switching nodes. Use DC traces as a shield
if necessary.
Refer to the MAX17135 evaluation kit for an example of
proper board layout.
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land pat terns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suf fix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN
NO.
32 TQFN-EP T3255N+1 21-0140 90-0015
MAX17135
Multi-Output DC-DC Power Supply with
VCOM Amplifier and Temperature Sensor for
E-Paper Applications
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 23
© 2011 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 7/11 Initial release —
1 12/11 Typical Operating Circuit values updated 12