© Semiconductor Components Industries, LLC, 2016
December, 2016 − Rev. 12 1Publication Order Number:
MT9M114/D
MT9M114
1/6‐inch 720p
High‐Definition (HD)
System‐On‐a‐Chip (SOC)
Digital Image Sensor
The MT9M114 from ON Semiconductor is a 1/6-inch 1.26 Mp
CMOS digital image sensor with an active-pixel array of 1296 (H) ×
976 (V). It includes sophisticated camera functions such as auto
exposure control, auto white balance, black level control, flicker
avoidance, and defect correction. It is designed for low light
performance. The MT9M114 produces extraordinarily clear, sharp
digital pictures, making it the perfect choice for a wide range of
applications, including mobile phones, PC and notebook cameras, and
gaming systems.
Table 1. KEY PERFORMANCE PARAMETERS
Parameter Typical Value
Optical Format 1/6-inch
Active Pixels 1296 (H) × 976 (V) = 1.26 Mp
Pixel Size 1.9 mm × 1.9 mm
Color Filter Array RGB Bayer
Shutter Electronic Rolling Shutter (ERS)
Input Clock Range 6–54 MHz
Output MIPI Data Rate Maximum 768 Mb/s
Max. Frame Rate 30 fps Full Res
36.7 fps 720p
75 fps VGA
120 fps QVGA (Note 2)
Responsivity 2.24 V/Lux−sec (550 nm)
SNRMAX 37 dB
Dynamic Range 70.8 dB
Supply Voltage
Digital
Analog
I/O
PLL
PHY
1.7−1.95 V
2.5−3.1 V
1.7−1.95 V or 2.5−3.1 V
2.5−3.1 V
1.7−1.95 V
Power Consumption 135 mW (Note 1)
Operating Temperature Range
(Ambient) − TA–30°C to 70°C
Chief Ray Angle 27.7°
Active Imager Size 2.46 mm (H) × 1.85 mm (V),
3.08 mm Diagonal
Package Options Bare Die, CSP
1. Power consumption for typical voltages and 720p output.
2. Reduced FOV.
Features
•Superior Low-light Performance
•Ultra-low Power
•720p HD Video at 30 fps
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•Internal Master Clock Generated by On-ch
ip
Phase-locked Loop (PLL) Oscillator
•Electronic Rolling Shutter (ERS),
Progressive Scan
•Integrated Image Flow Processor (IFP) for
Single-die Camera Module
•Automatic Image Correction and
Enhancement
•Arbitrary Image Scaling with Anti-aliasing
•Two-wire Serial Interface Providing Acces
s
to Registers and Microcontroller Memory
•Selectable Output Data Format: YCbCr,
565RGB, 555RGB, 444RGB, Processed
Bayer, BT656, RAW8− and RAW8+2-bit
•Parallel and MIPI Data Output
•Independently Configurable Gamma
Correction
•Adaptive Polynomial Lens Shading
Correction
•UVC Interface
•Perspective Correction
•Multi-camera Synchronization
A
pplications
•Embedded Notebook, Netbook, and Deskto
p
Monitor Cameras
•Tethered PC Cameras
•Game Consoles
•Cell Phones, Mobile Devices, and Consum
er
Video Communications
•Surveillance, Medical, and Industrial
Applications
See detailed ordering and shipping information on page 2 o
f
this data sheet.
ORDERING INFORMATION
ODCSP55 4.7x3.9
CASE 570BP
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ORDERING INFORMATION
Table 2. AVAILABLE PART NUMBERS
Part Number Product Description Orderable Product Attribute Description
MT9M114D00STCZK24BC1−200 1 MP 1/6″ SOC Die Sales, 200 mm Thickness
MT9M114EBLSTCZ−CR1 1 MP 1/6″ SOC CIS Chip Tray without Protective Film
See the ON Semiconductor Device Nomenclature
document (TND310/D) for a full description of the naming
convention used for image sensors. For reference
documentation, including information on evaluation kits,
please visit our web site at www.onsemi.com.
FUNCTIONAL DESCRIPTION
The MT9M114 from ON Semiconductor is a 1/6-inch
1.26 Mp CMOS digital image sensor with an integrated
advanced camera system. This camera system features
a microcontroller (MCU), a sophisticated image flow
processor (IFP), MIPI and parallel output ports (only one
output port can be used at a time). The microcontroller
manages all functions of the camera system and sets key
operation parameters for the sensor core to optimize the
quality of raw image data entering the IFP. The IFP will be
responsible for processing and enhancing the image.
The entire system-on-a-chip (SOC) has superior low-light
performance that is particularly suitable for PC camera
applications. The MT9M114 features ON Semiconductor’s
breakthrough low-noise CMOS imaging technology that
achieves near-CCD image quality (based on signal-to-noise
ratio and low-light sensitivity) while maintaining the
inherent size, cost, and integration advantages of CMOS.
The MT9M114 can be operated in its default mode or
programmed for frame size, exposure, gain, and other
parameters. The default mode output is a 720p image size at
30 frames per second (fps), assuming a 24 MHz input clock.
It outputs 8-bit data, using the parallel output port.
ARCHITECTURE OVERVIEW
The MT9M114 combines a 1.26 Mp sensor core with an
IFP to form a stand-alone solution for both image
acquisition and processing. Both the sensor core and the IFP
have internal registers that can be controlled by the user. In
normal operation, an integrated microcontroller
autonomously controls most aspects of operation.
The processed image data is transmitted to the host system
either through the parallel or MIPI interface. Figure 1 shows
the major functional blocks of the MT9M114.
Figure 1. MT9M114 Block Diagram
Sensor Core
Pixel Array
POR
Two-wire Serial IF
System Control
Image Flow Processor (IFP)
Color Pipeline
Stats Engine
Internal Register Bus
ROM Microcontroller SRAM
Microcontroller Unit (MCU)
Output Interface
FIFO
Formatter
MIPI
Parallel
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Sensor Core
The MT9M114 has a color image sensor with a Bayer
color filter arrangement and a 1.2 Mp active-pixel array with
electronic rolling shutter (ERS). The sensor core readout is
10 bits and can be flipped and/or mirrored. The sensor core
also supports separate analog and digital gain for all four
color channels (R, Gr, Gb, B).
Image Flow Processor (IFP)
The advanced IFP features and flexible programmability
of the MT9M114 can enhance and optimize the image
sensor performance. Built-in optimization algorithms
enable the MT9M114 to operate with factory settings as
a fully automatic and highly adaptable system-on-a-chip
(SOC) for most camera systems.
These algorithms include black level conditioning,
shading correction, defect correction, color interpolation,
edge detection, color correction, vertical perspective
correction, aperture correction, and image formatting with
cropping and scaling.
Microcontroller Unit (MCU)
The MCU communicates with all functional blocks by
way of an internal ON Semiconductor proprietary bus
interface. The MCU firmware configures all the registers in
the sensor core and IFP.
System Control
The MT9M114 has a phase-locked loop (PLL) oscillator
that can generate the internal sensor clock from a common
wireless system clock. The PLL adjusts the incoming clock
frequency up, allowing the MT9M114 to run at almost any
desired resolution and frame rate within the sensor’s
capabilities. Low-power consumption is a very important
requirement.
The MT9M114 provides power-conserving features
including a soft standby mode. A two-wire serial interface
bus enables read and write access to the MT9M114’s
internal registers and variables. The internal registers
control the sensor core, the color pipeline flow, and the
output interface. Variables are located in the
microcontroller’s RAM memory and are used to configure
and control the auto-algorithms and camera control
functions.
Output Interface
The output interface block can select either raw data or
processed data. Image data is provided to the host system
either by an 8-bit parallel port or by a serial MIPI port.
The parallel output port provides 8-bit RGB data or
extended 10-bit Bayer data.
The MT9M114 also includes programmable I/O slew rate
to minimize EMI.
System Interfaces
Figure 2 shows typical MT9M114 device connections.
For low-noise operation, the MT9M114 requires separate
power supplies for analog and digital sections of the die.
Both power supply rails must be decoupled from ground
using capacitors as close as possible to the die. The use of
inductance filters is not recommended on the power supplies
or output signals.
The MT9M114 provides dedicated signals for digital
core, PHY, and I/O power domains that can be at different
voltages. The PLL and analog circuitry require clean power
sources. Table 3 provides the signal descriptions for the
MT9M114.
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1. This typical configuration shows only one scenario out of multiple possible variations for this sensor.
2. If a MIPI Interface is not required, the following signals must be left floating: DAT A_P, DAT A_N, CLK_P, and CLK_N. The VDD_PHY powe
r
signal must always be connected to the 1.8 V supply.
3. Only one of the output modes (serial or parallel) can be used at any time.
4. ON Semiconductor recommends a 1.5 kW resistor value for the two-wire serial interface RPULL-UP; however, greater values may be used
for slower transmission speed.
5. All inputs must be configured with VDD_IO.
6. RESET_BAR and CONFIG both have internal pull-up resistors and can be left floating.
7. ON Semiconductor recommends that 0.1 mF and 1 mF decoupling capacitors for each power supply are mounted as close as possible to
the pad. Actual values and numbers may vary depending on layout and design considerations.
8. TRST_BAR connects to GND for normal operation.
9. OE_BAR should be connected HIGH when using MIPI interface.
Figure 2. Typical Configuration
I/O
Power5
AGND
SCLK
SDATA
VDD_IO
VDD_IO5,7
Notes:
PIXCLK
DGND
EXTCLK
RESET_BAR
SADDR
Analog
Power
LINE_VALID
FRAME_VALID
DOUT[7:0]
CLK_N
CLK_P
Parallel
Port
MIPI
Serial
Port
OR3
RPULL-UP4
Two-wire
Serial Interface
Active LOW Reset
External Clock In
(6−54 MHz)
GND_PLL
VAA
DATA_N
DATA_P
Digital
Core
Power
VDD
PLL
Power
VDD_PLL
PHY
Power2
VDD_PHY
VDD_PHY2,7 VDD_PLL7VDD7VAA7
CONFIG6
Active HIGH
Default Settings
TRST_BAR8
OE_BAR9
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Table 3. PIN DESCRIPTIONS
Name Type Description
EXTCLK Input Input clock signal
RESET_BAR Input/PU Master reset signal, active LOW. This signal has an internal pull up
OE_BAR Input Parallel interface enable pad, active LOW
SCLK Input Two-wire serial interface clock
SDATA I/O Two-wire serial interface data
SADDR Input Selects device address for the two-wire serial interface
FRAME_VALID (FV) Output Identifies rows in the active image. Data can be sampled with PIXCLK when both LV
and FV are high (except when BT656 is used)
LINE_VALID (LV) Output Identifies pixels in the active line. Data can be sampled with PIXCLK when both LV
and FV are high (except when BT656 is used)
PIXCLK Output Pixel clock
DOUT[7:0] Output DOUT[7:0] for 8-bit image data output or DOUT[9:2] for 10-bit image data output
DOUT_LSB[1:0] Output LSBs when outputting 10-bit image data
CLK_N (Note 2) Output Differential MIPI clock (sub-LVDS, negative)
CLK_P (Note 2) Output Differential MIPI clock (sub-LVDS, positive)
DATA_N (Note 2) Output Differential MIPI data (sub-LVDS, negative
DATA_P (Note 2) Output Differential MIPI data (sub-LVDS, positive)
CONFIG (Note 4) Input/PU If on power-up CONFIG = 1 then the part shall go into streaming (default option, PU
ensures this will occur). If CONFIG = 0 then the part will go to standby state waiting
for host to update
FLASH (Note 2) Output Used as a flash signal
CHAIN (Note 2) Output/PU To synchronize a number of sensors together
TRST_BAR Input Must be tied to GND in normal operation
VDD Supply Digital power
DGND (Note 1) Supply Digital ground
VDD_IO Supply I/O power supply
GND_IO Supply I/O ground
VAA Supply Analog power
AGND (Note 1) Supply Analog ground
VDD_PLL Supply PLL supply
GND_PLL Supply PLL GND
VDD_PHY (Note 3) Supply I/O power supply for the MIPI interface
1. AGND and DGND are not connected internally.
2. To be left floating if not using feature. If not using the feature, then there is no need to bond out the relevant pads.
3. Must always be connected even when not using MIPI.
4. When CONFIG = 1 the EXTCLK must be in the range 20−24 MHz.
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DECOUPLING CAPACITOR RECOMMENDATIONS
It is important to provide clean, well regulated power to
each power supply. The ON Semiconductor
recommendation for capacitor placement and values are
based on our internal demo camera design and verified in
hardware. Note: Because hardware design is influenced by
many factors, such as layout, operating conditions, and
component selection, the customer is ultimately responsible
to ensure that clean power is provided for their own designs.
In order of preference, ON Semiconductor recommends:
1. Mount 0.1 mF and 1 mF decoupling capacitors for
each power supply as close as possible to the pad
and place a 10 mF capacitor nearby off-module.
2. If module limitations allow for only six decoupling
capacitors for a three-regulator design use a 0.1 mF
and 1 mF capacitor for each of the three regulated
supplies. ON Semiconductor also recommends
placing a 10 mF capacitor for each supply
off-module, but close to each supply.
3. If module limitations allow for only three
decoupling capacitors, use a 1 mF capacitor
(preferred) or a 0.1 mF capacitor for each of the
three regulated supplies. ON Semiconductor
recommends placing a 10 mF capacitor for each
supply off-module but close to each supply.
4. Give priority to the VAA supply for additional
decoupling capacitors.
5. Inductive filtering components are not
recommended.
6. Follow best practices when performing physical
layout. Refer to application note AND9503/D.
Output Data Format
The MT9M114 image data is read out in a progressive
scan. Valid image data is surrounded by horizontal blanking
and vertical blanking, as shown in Figure 3.
LINE_VALID is HIGH in the shaded region of the figure.
Figure 3. Spatial Illustration of Image Readout
P0,0 P0,1 P0,2 …P0,n−1 P0,n
P1,0 P1,1 P1,2 …P1,n−1 P1,n
Pm−1,0 Pm−1,1 Pm−1,2 …Pm−1,n−1 Pm−1,n
Pm,0 Pm,1 Pm,2 …Pm,n−1 Pm,n
Valid Image Horizontal Blanking
Vertical/Horizontal
Blanking
Vertical Blanking
00 00 00 …
00 00 00 …
00 00 00
00 00 00
……
00 00 00 …
00 00 00 …
00 00 00
00 00 00
00 00 00 …00 00 00
00 00 00 …00 00 00
00 00 00 …00 00 00
00 00 00 …00 00 00
00 00 00 …00 00 00
00 00 00 …00 00 00
00 00 00 …00 00 00
00 00 00 …00 00 00
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POWER-UP AND POWER-DOWN SEQUENCE
Powering up and powering down the sensor requires
voltages to be applied in a particular order, as seen in
Figure 4. The timing requirements are shown in Table 4.
The sensor includes a power-on reset feature that initiates
a reset upon power up of the sensor
Figure 4. Power-Up and Power-Down Sequence
VDD_IO t1
VAA, VDD_PLL
EXTCLK
SCLK
SDATA
VDD, VDD_PHY
t2
t3
t4
t5
t6
t7
Table 4. POWER-UP AND DOWER-DOWN SIGNAL TIMING
Symbol Parameter Min Typ Max Unit
t1Delay from VDD_IO to VDD and VDD_PHY 0 – 50 ms
t2Delay from VDD_IO to VAA and VDD_PLL 0 – 50 ms
t3EXTCLK Activation t2– – ms
t4First Serial Command (Notes 1, 2) – 44.5 – ms
t5EXTCLK Cutoff t6– – ms
t6Delay from VAA and VDD_PLL to VDD_IO 0 – 50 ms
t7Delay from VDD and VDD_PHY to VDD_IO 0 – 50 ms
1. Under the condition of EXTCLK = 24 MHz and default settings with CONFIG = 1.
2. The host should poll the Command register to determine when the device is initialized.
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Reset
The MT9M114 has 3 types of reset available:
•A hard reset is issued by toggling the RESET_BAR
signal;
•A soft reset is issued by writing commands through the
two-wire serial interface;
•An internal power-on reset.
The output states during hard reset are shown in Table 5.
Table 5. STATUS OF OUTPUT SIGNALS DURING HARD RESET, SOFT STANDBY, AND POWER OFF
Signal Reset Soft Standby
(EXTCLK Running) Soft Standby
(Without EXTCLK) Power Off
DOUT[7:0] High−Z High−Z High−Z High−Z
PIXCLK High−Z High−Z High−Z High−Z
LV High−Z High−Z High−Z High−Z
FV High−Z High−Z High−Z High−Z
DOUT_LSB[1:0] High−Z High−Z High−Z High−Z
DATA_N 0 0 0 High−Z
DATA_P 0 0 0 High−Z
CLK_N 0 0 0 High−Z
CLK_P 0 0 0 High−Z
SCLK Input Active Active (Pads are active, but due to no EXTCLK
serial comms will not work) High−Z
SDATA Input Active Active (Pads are active, but due to no EXTCLK
serial comms will not work) High−Z
A soft reset sequence to the sensor has the same effect as
the hard reset and can be activated by writing to a register
through the two-wire serial interface. On-chip
power-on-reset circuitry can generate an internal reset signal
in case an external reset is not provided. The RESET_BAR
and CONFIG signals have internal pull-up resistors and can
be left floating.
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Hard Reset
The MT9M114 enters the reset state when the external
RESET_BAR signal is asserted LOW, as shown in Figure 5.
All the output signals will be in High-Z state. When
OE_BAR is in HIGH state, the outputs pins will be High-Z
during the internal boot time
Figure 5. Hard Reset Operation
EXTCLK
RESET_BAR
SDATA
All Outputs
Mode
t
1
Reset Internal Boot Time Entering Streaming Mode
Data Active Controlled
by OE_BAR
Data Active
t
4
t2t3
OE_BAR
Table 6. POWER-UP AND DOWER-DOWN SIGNAL TIMING
Symbol Parameter Min Typ Max Unit
t1RESET_BAR Pulse Width 50 – – EXTCLK
cycles
t2Active EXTCLK Required after RESET_BAR Asserted 10 – –
t3Active EXTCLK Required before RESET_BAR De-asserted 10 – –
t4Internal Boot Time (Notes 1, 2) – 44.5 – ms
1. Under the condition of EXTCLK = 24MHz and default settings with CONFIG = 1.
2. The host should poll the Command register to determine when the device is initialized.
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Soft Reset
The host processor can reset the MT9M114 using the
two-wire serial interface by writing to SYSCTL 0x001A.
SYSCTL 0x001A[0] is used to reset the MT9M114 which
is similar to external RESET_BAR signal.
1. Set SYSCTL 0x001A[0] to 0x1 to initiate internal
reset cycle.
2. Reset SYSCTL 0x001A[0] to 0x0 for normal
operation.
3. Delay of 44.5 ms.
Figure 6. Soft Reset Operation
EXTCLK
SDATA
Mode Write Soft
Reset Command Reseting Registers Enter Streaming Mode
SCLK
t
1
Table 7. SOFT RESET SIGNAL TIMING
Symbol Parameter Min Typ Max Unit
t1Soft Reset Time (Notes 1, 2) − 44.5 − ms
1. Under the condition of EXTCLK = 24 MHz and default settings with CONFIG = 1.
2. The host should poll the Command register to determine when the device is initialized.
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Soft Standby Mode
The MT9M114 can enter soft standby mode by receiving
a host command through the two-wire serial interface.
EXTCLK can be stopped to reduce the power consumption
during soft standby mode. However, since two-wire serial
interface requires EXTCLK to operate, ON Semiconductor
recommends that EXTCLK run continuously.
Entering Standby Mode
1. Send the sequence [Enter Standby] to put the
MT9M114 into standby.
2. After the part is in standby for 100 EXTCLK
cycles the EXTCLK can be turned off.
[Enter Standby]
FIELD_WR=SYSMGR_NEXT_STATE, 0x50
//(Optional) First check that the FW is ready to accept a new command
ERROR_IF=COMMAND_REGISTER, HOST_COMMAND_1, !=0, ”Set State cmd bit is already set”
//(Mandatory) Issue the Set State command
//We set the ’OK’ bit so we can detect if the command fails
//Note 0x8002 is equivalent to (HOST_COMMAND_OK | HOST_COMMAND_1)
FIELD_WR=COMMAND_REGISTER, 0x8002
//Wait for the FW to complete the command (clear the HOST_COMMAND_1 bit)
POLL_FIELD=COMMAND_REGISTER, HOST_COMMAND_1, !=0, DELAY=10, TIMEOUT=100
//Check the ’OK’ bit to see if the command was successful
ERROR_IF=COMMAND_REGISTER, HOST_COMMAND_OK, !=1, ”Set State cmd failed”,
//Wait for the FW to fully−enter standby (SYSMGR_CURRENT_STATE=0x52)
POLL_FIELD=SYSMGR_CURRENT_STATE,!=0x52,DELAY=50,TIMEOUT=10
Exiting Standby Mode
1. Turn EXTCLK on.
2. After 100 EXTCLK cycles send the following
sequence entitled [Exit Standby] to bring the
MT9M114 out of standby.
[Exit Standby]
FIELD_WR=SYSMGR_NEXT_STATE, 0x54
//(Optional) First check that the FW is ready to accept a new command
ERROR_IF=COMMAND_REGISTER, HOST_COMMAND_1, !=0, ”Set State cmd bit is already set”
//(Mandatory) Issue the Set State command
//We set the ’OK’ bit so we can detect if the command fails
//Note 0x8002 is equivalent to (HOST_COMMAND_OK | HOST_COMMAND_1)
FIELD_WR=COMMAND_REGISTER, 0x8002
//Wait for the FW to complete the command (clear the HOST_COMMAND_1 bit)
POLL_FIELD=COMMAND_REGISTER, HOST_COMMAND_1, !=0, DELAY=10, TIMEOUT=100
//Check the ’OK’ bit to see if the command was successful
ERROR_IF=COMMAND_REGISTER, HOST_COMMAND_OK, !=1, ”Set State cmd failed”,
ERROR_IF=SYSMGR_CURRENT_STATE, !=0x31, ”System state is not STREAMING”
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IMAGE DATA OUTPUT INTERFACE
The user can select either the 8-bit parallel or serial MIPI
output to transmit the sensor image data to host system. Only
one of the output modes can be used at any time. The
MT9M114 has an output FIFO to retain a constant pixel
output clock independent from the data output rate
variations due to scaling factor.
Parallel Port
The MT9M114 image data is read out in a progressive
scan mode. Valid image data is surrounded by horizontal
blanking and vertical blanking. The amount of horizontal
blanking and vertical blanking are programmable.
MT9M114 output data is synchronized with the PIXCLK
output. When LV is HIGH, one pixel value is output on the
8-bit DOUT port every TWO PIXCLK periods as shown in
Figure 7. PIXCLK is continuously running, even during the
blanking period. (If the user wishes to have PIXCLK turned
off during blanking this is possible through a variable
setting) PIXCLK phase can be varied by 50 percent,
controlled using a register.
Figure 7. Pixel Data Timing Example
LINE_VALID
PIXCLK
DOUT[7:0] P0(9:2) P0(1:0) P1(9:2) P2(9:2)
P1(1:0) Pn−1(9:2) Pn(9:2) Pn(1:0)
Pn−1(1:0)
Valid Data
Blanking Blanking
Figure 8. Row Timing, FV, and LV Signals
FRAME_VALID
LINE_VALID
Data Modes P1A2Q3AQ A P
Notes:
1. P: Frame start and end blanking time.
2. A: Active data time.
3. Q: Horizontal blanking time.
Serial Port
This section describes how frames of pixel data are
represented on the high-speed MIPI serial interface. The
MIPI output transmitter implements a serial differential
sub-LVDS transmitter capable of up to 768 Mb/s. It supports
multiple formats, error checking, and custom short packets.
MT9M114 is designed to MIPI D-PHY version v1.0.
When the sensor is in the software standby system state,
the MIPI signals (CLK_P, CLK_N, DATA_P, DATA_N)
indicate ultra low-power state (ULPS) corresponding to
(nominal) 0 V levels being driven on CLK_P, CLK_N,
DATA_P, and DAT A_N. This is equivalent to signaling code
LP−00. When the sensor enters the streaming system state,
the interface goes through the following transitions:
1. After the PLL has locked and the bias generator
for the MIPI drivers has stabilized, the MIPI
interface transitions from the ULPS state to the
ULPS-exit state (signaling code LP–10).
2. After a delay (TWAKEUP), the MIPI interface
transitions from the ULPS-exit state to the
TX-stop state (signaling code LP–11).
3. After a short period of time (the programmed
integration time plus a fixed overhead), frames of
pixel data start to be transmitted on the MIPI
interface. Each frame of pixel data is transmitted
as a number of high-speed packets. The transition
from the TX-stop state to the high-speed signaling
states occurs in accordance with the MIPI
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specifications. Between high-speed packets and
between frames, the MIPI interface idles in the
TX-stop state. The transition from the high-speed
signaling states and the TX-stop state takes place
in accordance with the MIPI specifications.
4. If the sensor is reset, any frame in progress is
aborted immediately and the MIPI signals switch
to indicate the ULPS.
5. If the sensor is taken out of the streaming system
state and reset_register[4] = 1 (standby
end-of-frame), any frame in progress is completed
and the MIPI signals switch to indicate the ULPS.
If the sensor is taken out of the streaming system state and
reset_register[4] = 0 (standby end-of-frame), any frame in
progress is aborted as follows:
1. Any long packet in transmission is completed.
2. The end of frame short packet is transmitted.
After the frame has been aborted, the MIPI signals switch
to indicate the ULPS.
Sensor Control
The sensor core of the MT9M114 is a progressive-scan
sensor that generates a stream of pixel data at a constant
frame rate. Figure 9 shows a block diagram of the sensor
core. The timing and control circuitry sequences through the
rows o f the array, resetting and then reading each row in turn.
In the time interval between resetting a row and reading that
row, the pixels in the row integrate incident light.
The exposure is controlled by varying the time interval
between reset and readout. Once a row has been selected, the
data from each column is sequenced through an analog
signal chain, including offset correction, gain adjustment,
and ADC. The final stage of sensor core converts the output
of the ADC into 10-bit data for each pixel in the array.
The pixel array contains optically active and
light-shielded (dark) pixels. The dark pixels are used to
provide data for the offset-correction algorithms (black level
control).
The sensor core contains a set of control and status
registers that can be used to control many aspects of the
sensor behavior including the frame size, exposure, and gain
setting. These registers are controlled by the MCU firmware
and are also accessible by the host processor through the
two-wire serial interface.
The output from the sensor core is a Bayer pattern;
alternate rows are a sequence of either green and red pixels
or blue and green pixels. The offset and gain stages of the
analog signal chain provide per-color control of the pixel
data.
Figure 9. Sensor Core Block Diagram
Sensor Core
Timing
and
Control
Control Registers
Green 1/Green2
Channel Analog
Processing ADC
System Control
Digital
Processing 10-bit
Data Out
G1/G2
R/B
VGA
Active-Pixel
Sensor (APS)
Array
G1/G2
R/B
Red/Blue
Channel
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The sensor core uses a Bayer color pattern, as shown in
Figure 10. The even-numbered rows contain green and red
pixels; odd-numbered rows contain blue and green pixels.
Even-numbered columns contain green and blue pixels;
odd-numbered columns contain red and green pixels.
Figure 10. Pixel Color Pattern Detail (Bottom Left Corner)
Gr
B
Gr
B
R
Gb
R
Gb
R
Gb
R
Gb
Gr
B
Gr
B
Gr
B
Gr
B
Row Readout Direction
First Active Pixel
(Column 8, Row 2) Black and Empty
Pixels
For the MT9M114 the first active pixel is defined as the
first pixel that would be used as part of the demosaic border.
When the sensor is operating in a system, the active
surface of the sensor faces the scene as shown in Figure 11.
When the image is read out of the sensor , it is read one row
at a time, with the rows and columns sequenced.
Figure 11. Imaging a Scene
Lens
Pixel (0,0)
Row
Readout
Order
Column Readout Order
Scene
Sensor (Rear View)
The sensor core supports different readout options to
modify the image before it is sent to the IFP. The readout can
be limited to a specific window size of the original pixel
array.
By changing the readout directions, the image can be
flipped in the vertical direction and/or mirrored in the
horizontal direction.
The image output size is set by programming row and
column start and end address variables.
When the sensor is configured to mirror the image
horizontally, the order of pixel readout within a row is
reversed, so that readout starts from the last column address
and ends at the first column address. Figure 12 shows
a sequence of 3 pixels being read out with normal readout
and reverse readout. This change in sensor core output is
corrected by the IFP.
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Figure 12. Three Pixels in Normal and Column Mirror Readout Mode
G0
(9:2) G0
(1:0) R0
(9:2) R0
(1:0) G1
(9:2) G1
(1:0)
LINE_VALID
Normal Readout
DOUT[7:0]
Reverse Readout
DOUT[7:0] G1
(1:0) G1
(9:2) R0
(1:0) R0
(9:2) G0
(1:0) G0
(9:2)
When the sensor is configured to flip the image vertically,
the order in which pixel rows are read out is reversed, so that
row readout starts from the last row address and ends at the
first row address. Figure 13 shows a sequence of 3 rows
being read out with normal readout and reverse readout. This
change in sensor core output is corrected by the IFP.
Figure 13. Three Rows in Normal and Row Mirror Readout Mode
FRAME_VALID
Normal Readout
DOUT[7:0]
Reverse Readout
DOUT[7:0]
Row0
(9:2) Row0
(1:0) Row1
(9:2) Row1
(1:0) Row2
(9:2) Row2
(1:0)
Row2
(1:0) Row2
(9:2) Row1
(1:0) Row1
(9:2) Row0
(1:0) Row0
(9:2)
The MT9M114 sensor core supports subsampling with
skipping to increase the frame rate. The proper image output
size and cropped size must be programmed before enabling
subsampling mode. Figure 14 shows the readout with 2X
skipping.
Figure 14. Eight Pixels in Normal and Column Skip 2X Readout Modes
LINE_VALID
Normal Readout
DOUT[7:0]
Column Skip
Readout
DOUT[7:0]
G0
(9:2) G0
(1:0)
LINE_VALID
R0
(9:2) R0
(1:0) G1
(9:2) G1
(1:0) R1
(9:2) R1
(1:0) G2
(9:2) G2
(1:0) R2
(9:2) R2
(1:0) G3
(9:2) G3
(1:0) R3
(9:2) R3
(1:0)
G0
(9:2) G0
(1:0) R0
(9:2) R0
(1:0) G2
(9:2) G2
(1:0) R2
(9:2) R2
(1:0)
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Pixel Readouts
The following diagrams show a sequence of data being
read out with no skipping. The effect of the different subsampling on the pixel array readout is shown in
Figure 15 through Figure 20.
Figure 15. Pixel Readout (No Skipping)
X Incrementing
Y Incrementing
Figure 16. Pixel Readout (Column Skipping)
X Incrementing
Y Incrementing
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Binning and Summing
The MT9M114 sensor core supports binning and
summing. Binning has many of the same characteristics as
subsampling but it gathers image data from all pixels in the
active window (rather than a subset of them).
Pixel binning will sample pixels and average the value
together in the analog domain. Summing will add the charge
or voltage values of the neighboring pixels together. (Se
means “charge summing”, Sv means “voltage summing”,
and avg means ”digital averaging (post ADC). The
advantage of using summing is that the pixel data is added
together and up to 4X increase in responsivity is achieved.
Figure 19. Pixel Binning and Summing
2 x 2 Binning and Summing Binning (x-Binnig, y-Summing) Summing (x/y-Summing)
Avg
Avg
SeSe
Sv
Sv
SeSe
Figure 20. Pixel Readout (Column and Row Binning)
X Incrementing
Y Incrementing
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IMAGE FLOW PROCESSOR
Image control processing in the MT9M114 is
implemented in the IFP hardware logic. For normal
operation, the microcontroller automatically adjusts the
operational parameters of the IFP. Figure 21 shows the
image data processing flow within the IFP.
Figure 21. Image Flow Processor
RAW10
IFP
1.2 Mp
Pixel Array
ADC Raw
Bayer 10
Raw Bayer 10
(8+2 Output Format)
MUX
Color Bar
Test Pattern
Generator
Digital
Gain
Control,
Adaptive
Shading
Correction
Default Correction,
Noise Reduction,
Color Interpolation
Statistics
Engine
Color
Correction
Aperture
Correction
Gamma
Correction
(10-to-8 Lookup)
10/12-Bit
RGB
8-Bit
RGB
8-Bit
YUV
RGB to YUV
Color Kill
Scaler/
Perspective
Correction
Hue
Rotate
Output
Formatting
YUV to RGB
TX
FIFO
Output
Interface
MIPI Parallel Output Mux
Parallel Output
MIPI Output
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For normal operation of the MT9M114, streams of raw
image data from the sensor core are continuously fed into the
color pipeline. The MT9M114 features an automatic color
bar test pattern generation function to emulate sensor images
as shown in Table 8. The color bar test pattern is fed to
the IFP for testing the image pipeline without sensor
operation.
Color bar test pattern generation can be selected by
programming variables. To select enter test pattern mode
R0xC84C = 0x02; to exit this mode R0xC84C must be set
to 0x00.
A Change-Config command needs to be issued when
switching to CAM mode to enable test pattern as well as
when exiting.
Table 8. COLOR BAR TEST PATTERN
Test Pattern Registers/Variables Example
Flat Field R0xC84C = 0x02
R0xC84D = 0x01
R0xC84E = 0x01FF
R0xC850 = 0x01FF
R0xC852 = 0x01FF
Load = Change-Config
Changing the values in 0x4E−0x52 will
change the color of the test pattern.
100% Color Bar R0xC84C = 0x02
R0xC84D = 0x04
Load = Change-Config
Pseudo-Random R0xC84C = 0x02
R0xC84D = 0x05
Load = Change-Config
Fade-to-Gray R0xC84C = 0x02
R0xC84D = 0x08
Load = Change-Config
Walking Ones 10-bit R0xC84C = 0x02
R0xC84D = 0x0A
Load = Change-Config
Walking Ones 8-bit R0xC84C = 0x02
R0xC84D = 0x0B
Load = Change-Config
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Digital Gain
Image stream processing starts with multiplication of all
pixel values by a programmable digital gain. Independent
color channel digital gain can be adjusted with registers.
Adaptive PGA (APGA)
Lenses tend to produce images whose brightness is
significantly attenuated near the edges. There are also other
factors causing fixed pattern signal gradients in images
captured b y image sensors. The cumulative result of all these
factors is known as image shading. The MT9M114 has an
embedded shading correction module that can be
programmed to counter the shading effects on each
individual R, Gb, Gr, and B color signal.
In some cases, different illuminants can introduce
different color shading response. The APGA feature on the
MT9M114 will compensate for the dependency of the lens
shading of the illuminant. The MT9M114 will allow for up
to three different illuminants to be compensated.
Color Interpolation and Edge Detection
In the raw data stream fed by the sensor core to the IFP,
each pixel is represented by a 10-bit integer, which can be
considered proportional to the pixel’s response to
a one-color light stimulus, red, green, or blue, depending on
the pixel’s position under the color filter array. Initial data
processing steps, up to and including the defect correction,
preserve the one-color-per-pixel nature of the data stream,
but after the defect correction it must be converted to a
three-colors-per-pixel stream appropriate for standard color
processing. The conversion is done by an edge-sensitive
color interpolation module. The module adds the incomplete
color information available for each pixel with information
extracted from an appropriate set of neighboring pixels.
The algorithm used to select this set and extract the
information seeks the best compromise between preserving
edges and filtering out high-frequency noise in flat field
areas. The edge threshold can be set through variable
settings.
Color Correction and Aperture Correction
To achieve good color fidelity of the IFP output,
interpolated RGB values of all pixels are subjected to color
correction. The IFP multiplies each vector of three pixel
colors by a 3 ×3 color correction matrix. The three
components o f the resulting color vector are all sums of three
10-bit numbers. Since such sums can have up to 12
significant bits, the bit width of the image data stream is
widened to 12 bits per color (36 bits per pixel). The color
correction matrix can either be programmed by the user or
automatically selected by the AWB algorithm implemented
in the IFP.
Traditionally this would have been based off two sets of
CCM, one for Warm light like Tungsten and the other for
Daylight (the part would interpolate between the two
matrixes). This is not an optimal solution for cameras used
in a Cool White Fluorescent (CWF) environment, for
example when using a webcam. A better solution is to
provide three CCMs, which would include a matrix for CWF
(interpolation now between three matrixes). The MT9M114
offers this feature which will give the user improved color
fidelity when under CWF type lighting.
Color correction should ideally produce output colors that
are independent of the spectral sensitivity and color
crosstalk characteristics of the image sensor. The optimal
values of the color correction matrix elements depend on
those sensor characteristics and on the spectrum of light
incident on the sensor. The color correction settings can be
adjusted using variables.
To increase image sharpness, a programmable 2D
aperture correction (sharpening filter) is applied. The gain
and threshold for 2D correction can be defined through
variable settings.
Gamma Correction
The gamma correction curve (as shown in Figure 22) is
implemented as a piecewise linear function with 19 knee
points, taking 12-bit arguments and mapping them to 8-bit
output. The abscissas of the knee points are fixed at 0, 64,
128, 256, 512, 768, 1024, 1280, 1536, 1792, 2048, 2304,
2560, 2816, 3072, 3328, 3584, 3840, and 4096. The 8-bit
ordinates are programmable through variables.
The MT9M114 IFP includes a block for gamma
correction that has the capability to adjust its shape, based on
brightness, to enhance the performance under certain
lighting conditions.
Two custom gamma correction tables may be uploaded,
one corresponding to a contrast curve for brighter lighting
conditions, the other one corresponding to a noise reduction
curve for lower lighting conditions. Also included in this
block is a Fade-to-Black curve which sets all knee points to
zero and causes the image to go black in extreme low light
conditions.
The MT9M114 has the ability to calculate the 19 point
knee points based on a small number of variable inputs from
the host, another option is for the host to program one or both
of the 19 knee points. The diagram below shows how the
gamma feature interacts in MT9M114.
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Figure 22. Gamma Interaction
MT9M114 calculates
Final Gamma Curve
Fade-to-Black
Selection
ll_enable_fade_to_black
ll_gamma_select
cam_ll_mode[1:0]
Gamma Curve
Selection
19 Knee Point
Calculation
Contrast
Enhancement
Contrast
Enhancement
Noise
Reduction
Noise
Reduction
cam_ll_gamma
cam_ll_start_contrast_gradient
cam_ll_stop_contrast_gradient cam_ll_start_contrast_luma_percentage
cam_ll_stop_contrast_luma_percentage
Gamma Knee Point Calculation
The MT9M114 allows for the 19 knee point curves to be
programmed based off a small number of variables.
The table below shows the variables which are required.
Table 9. VARIABLES REQUIRED FOR GAMMA KNEE POINT CALCULATION
Variable Name Function
VAR(0x12,0x0124)
or (R0xC924) cam_ll_llmode 0x00: User will program 19 knee point gamma curves
0x01: MT9M114 will calculate 19 knee point for contrast curve (first
curve or table)
0x02: MT9M114 will calculate 19 knee point for noise reduction curve
(second curve or table)
0x03: MT9M114 will calculate both 19 knee point curves.
VAR(0x12,0x013C)
or (R0xC93C) cam_ll_start_contrast_bm Interpolation start point for first curve
VAR(0x12,0x013E)
or (R0xC93E) cam_ll_stop_contrast_bm Interpolation stop point for second curve
VAR(0x12,0x0140)
or (R0xC940) cam_ll_gamma The value of the gamma curve, this is applied to both 19 knee point
curves. The default is 220, this equates to a gamma of 2.2
VAR(0x12,0x0142)
or (R0xC942) cam_ll_start_contrast_gradient The value of the contrast gradient which would be used for the first
curve
VAR(0x12,0x0143)
or (R0xC943) cam_ll_stop_contrast_gradient The value of the contrast gradient which would be used for the second
curve
VAR(0x12,0x0144)
or (R0xC944) cam_ll_start_contrast_luma_percentage The percentage of target luma for the inflexion point in the first curve
VAR(0x12,0x0145)
or (R0xC945) cam_ll_start_contrast_luma_percentage The percentage of target luma for the inflexion point second curve
VAR(0x12,0x0156)
or (R0xC956) cam_ll_inv_brightness_metric Measure of scene brightness, reference points for
cam_ll_start_contrast_bm and cam_ll_stop_contrast_bm
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The concept of how the variables cam_ll_XX_contrast_
gradient and cam_ll_XX_contrast_luma_percentage
interact to produce a curve is shown below.
Figure 23. Automatic Gamma Curve
256
Inflexion Point
80% Target Luma
Contrast_gradient
Target_luma
Figure 24 shows the interaction of the variables and
cam_ll_inv_brightness_metric.
Figure 24. Gamma Reference Variables against Brightness Metric
cam_ll_inv_brightness_metricBright
Light Low
Light
cam_ll_start_contrast_bm = 230 cam_ll_stop_contrast_bm = 1178
cam_ll_start_contrast_
luma_percentage = 80
cam_ll_start_contrast_gradient = 50
cam_ll_stop_contrast_
luma_percentage = 25
cam_ll_stop_contrast_gradient = 38
ON Semiconductor would recommend that cam_ll_start_
contrast_bm i s set at 100 lux and cam_ll_stop_contrast_bm
is set at 20 lux, but due to the flexibility of the MT9M114 it
is at the discretion of the user.
ON Semiconductor recommends setting cam_ll_mode =
0x03 as this will allow the MT9M114 to calculate both of the
19 knee point curves based on the user inputs, otherwise the
user will have to program both of the 19-knee-point curves.
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Gamma Curve Selection
The MT9M114 allows the user to select between the
two-curve interpolation or either of the curves
Table 10. GAMMA CURVE SELECTION
Variable Name Function
VAR(0x0F,0x0007)
or (R0xBC07) ll_gamma_select 0x00: Auto curve select. The curves will interpolate based on settings of
cam_ll_start_contrast_bm and cam_ll_stop_contrast_bm
0x01: Contrast curve is only used
0x02: Noise reduction curve is only used
Fade to Black Selection
The final stage of the gamma flow is the enabling and use
of Fade-to-Black. The MT9M114 IFP allows for the image
to fade to black under extreme low-light conditions. This
feature enables users to optimize the performance of the
sensor under low-light conditions. It minimizes the
perception of noise and artifacts while the available
illumination is diminishing.
This feature has two user-set points that reference the
brightness of the scene. When the Fade-to-Black starts, it
will interpolate to the end point as the light falls until it gets
to the end point. When at the end point, the image will be
black.
Table 11. FADE-TO-BLACK SELECTION
Variable Name Function
VAR(0x0F,0x0007)
or (R0xBC07) ll_mode When bit 3 = 1, this will enable the Fade-to-Black feature
VAR(0x12,0x014A)
or (R0xC94A) cam_ll_start_fade_to_black_luma Starting point for Fade-to-Black to begin
VAR(0x12,0x014C)
or (R0xC94C) cam_ll_stop_fade_to_black_luma End point for Fade-to-Black, after this point the image will be black
VAR(0x0F,0x003A)
or (R0xBC3A) ll_average_luma_fade_to_black Measure of scene brightness, reference points for
cam_ll_start_fade_to_black_luma and cam_ll_stop_fade_to_black_luma
ON Semiconductor would recommend that
cam_ll_start_fade_to_black_luma is set at 3 lux and
cam_ll_stop_fade_to_black_luma is set at 1 lux, but due to
the flexibility of the MT9M114 it is at the discretion of the
user.
Image Scaling and Cropping
To ensure that the size of images output by the MT9M1 14
can be tailored to the needs of all users, the IFP includes
a scaler module. When enabled, this module performs
rescaling of incoming images − shrinks them to the selected
width (the output widths should be in multiples of 4) and
height without reducing the field of view and without
discarding any pixel values.
By configuring the cropped and output windows to
various sizes, different zooming levels for 4×, 2×, and 1× can
be achieved. The location of the cropped window is
configurable so that panning is also supported. The height
and width definitions for the output window must be equal
to or smaller than the cropped image. The image cropping
and scaler module can be used together to implement
a digital zoom and pan.
Hue Rotate
The MT9M1 14 has integrated hue rotate. This feature will
help for improving the color image quality and give
customers the flexibility for fine color adjustment and
special color effects.
Table 12. HUE CONTROL
Variable Name Function
VAR(0x12,0x73)
or R0xC873 Hue Angle Adjusts the global hue angle adjustment:
0xEA = –22°
0x00 = 0°
0x16 = +22°
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Vertical Perspective Correction
The MT9M114 has vertical perspective correction (VPC)
also known as the Tilt Connection; this allows the user to
correct (within limits) for an off-horizontal axis camera.
Figure 25. Vertical Perspective Correction
Original Image VPC Corrected Image
VPC is performed using a mixture of scale and crop,
the variables that control this are:
Table 13. VERTICAL PERSPECTIVE CORRECTION
Variable Name Function
VAR(0x12,0x005E)
or (R0xC85E) cam_scale_vertical_tc_mode When set, the vertical stretching factor is applied to the center of the
image, so top/bottom lines are cropped. When clear, the crop occurs in
the top or bottom of the scene dependent on the percentage value
(cam_scale_vertical_tc_percentage).
VAR(0x12,0x0060)
or (R0xC860) cam_scale_vertical_tc_percentage The amount of tilt (perspective) correction to be applied. If negative,
this value represents % of FOV reduction with the bottom line
unaffected. If positive, this value represents % of FOV reduction with
the top line unaffected.
VAR(0x12,0x0062)
or (R0xC862) cam_scale_vertical_tc_stretch_factor Ratio of vertical stretching against the percentage applied. Vertical
stretching = stretch factor × percentage/2.
The effect of using cam_scale_vertical_tc_percentage
can be seen below.
Figure 26. The Effect of Using CAM_SCALE_VERTICAL_TC_PERCENTAGE
Uncorrected
image
Uncorrected
image
w
90% w
90% w
Corrected vertical planeCorrected vertical plane
Case1: CAM_SCALE_VERTICAL_TC_PERCENTAGE = 10%
Case2: CAM_SCALE_VERTICAL_TC_PERCENTAGE = −10%
w
Vertical plane is tilted-away from the camera – therefore the
bottom row of image represents the nearest point. The near-
est point appears bigger in the uncorrected image, therefore
top/bottom ratio will be greater than 1.0.
Vertical plane is tilted-towards the camera – therefore the top
row of image represents the nearest point. The nearest point
appears bigger in the uncorrected image, therefore the top/
bottom ratio with be less than 1.0
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Cam_scale_vertical_tc_percentage defines how much tilt
needs to be corrected for in percentage terms.
The effect of using cam_scale_vertical_tc_mode can be
seen below.
Figure 27. The Effect of Using CAM_SCALE_VERTICAL_TC_MODE
Original Scene Tilted
MODE_STRETCH_FROM_CENTRE_EN = 0 MODE_STRETCH_FROM_CENTRE_EN = 1
CAMERA CONTROL AND AUTO FUNCTIONS
Auto Exposure
The auto exposure algorithm performs automatic
adjustments o f the image brightness by controlling exposure
time and analog gains of the sensor core as well as digital
gains applied to the image.
Auto exposure is implemented by a firmware driver that
analyzes image statistics collected by the exposure
measurement engine, makes a decision, and programs the
sensor core and color pipeline to achieve the desired
exposure. The measurement engine subdivides the image
into 25 windows organized as a 5 ×5 grid.
Four auto exposure algorithm modes are available:
•Average brightness tracking (ABT) or Average Y
(ae_rule_algo VAR = 9, 0x0004, 0x0000 or
REG = 0xA404, 0x0000)
The average brightness tracking AE uses a constant
average tracking algorithm where a target brightness
value is compared to a current brightness value, and the
gain and integration time are adjusted accordingly to
meet the target requirement.
•Weighted Average Brightness (ae_rule_algo VAR = 9,
0x0004, 0x0001 or REG = 0xA404, 0x0001)
Each of the 25 windows can be assigned a weight
relative to other window weights, which can be
changed independently of each other. For example, the
weights can be set to allow the center of the image to be
weighted higher than the periphery. See Figure 28.
Figure 28. 5 y 5 Grid
W 0,0 W 0,1 W 0,2 W 0,3 W 0,4
W 1,0 W 1,1 W 1,2 W 1,3 W 1,4
W 2,0 W 2,1 W 2,2 W 2,3 W 2,4
W 3,0 W 3,1 W 3,2 W 3,3 W 3,4
W 4,0 W 4,1 W 4,2 W 4,3 W 4,4
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•Adaptive Weighted AE for highlights (ae_rule_algo
VAR = 9, 0x0004, 0x0002 or REG = 0xA404, 0x0002)
The scene will be exposed based on the brightness of
each window, and will adapt to correctly expose the
highlights (brighter windows). This would correctly
expose the foreground of an image when the
background is dark.
•Adaptive Weighted AE for lowlights (ae_rule_algo
VAR = 9, 0x0004, 0x0003 or REG = 0xA404, 0x0003)
The scene will be exposed based on the brightness of
each window, and will adapt to correctly expose the
lowlights. This would correctly expose the foreground
of an image when the background is brighter.
Sample images below show the benefits of the different
AE modes.
Figure 29. Light Background
Average Brightness Tracking or Average Y Weighted Average Brightness (Centre)
Average Weighted Based on Zone Luma
(Highlights) Adaptive Weighted Based on Zone Luma
(Lowlights)
NOTE: This mode is intended to expose the background vs. the
In the use case above the Adaptive weighted for lowlights
exposes the face slightly better when compared to the
Weighted Average Brightness.
However, if the foreground subject is moved off-center:
Figure 30.
Weighted Average Brightness (Centre)
(Lowlights) Adaptive Weighted Based on Zone Luma
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This shows the advantage of using the Adaptive Weighted
AE for lowlights (ae_rule_algo = 0x03); when the face
moves off center it still is exposed correctly.
Figure 31. Dark Background
Average Brightness Tracking or Average Y Weighted Average Brightness (Centre)
Average Weighted Based on Zone Luma
(Highlights) Adaptive Weighted Based on Zone Luma
(Lowlights)
NOTE: This mode is correctly exposing the background of the image, hence you can see
the shadows.
In this use case the Adaptive Weighted AE for highlights
will expose the face the best when compared to the other
options.
AE Track Driver
Other algorithm features include the rejection of fast
fluctuations in illumination (time averaging), control of
speed of response, and control of the sensitivity to the small
changes. While the default settings are adequate in most
situations, the user can program target brightness,
measurement window, and other parameters described
above.
The driver changes AE parameters (integration time,
gains, and so on) to drive scene brightness to the
programmable target.
To avoid unwanted reaction of AE on small fluctuations
of scene brightness or momentary scene changes, the AE
track driver uses a temporal filter for luma and a threshold
around the AE luma target. The driver changes AE
parameters only if the filtered luma is larger than the AE
target step and pushes the luma beyond the threshold.
Auto White Balance
The MT9M114 has a built-in AWB algorithm designed to
compensate for the ef fects of changing spectra of the scene
illumination on the quality of the color rendition.
The algorithm consists of two major parts: a measurement
engine performing statistical analysis of the image and
a driver performing the selection of the optimal color
correction matrix and SOC digital gain. While default
settings of these algorithms are adequate in most situations,
the user can reprogram base color correction matrices, place
limits on color channel gains, and control the speed of both
matrix and gain adjustments. The MT9M114 AWB displays
the current AWB position in color temperature, the range of
which will be defined when programming the CCM
matrixes.
Flicker Avoidance
Flicker occurs when the integration time is not an integer
multiple of the period of the light intensity. The MT9M114
can be programmed to avoid flicker for 50 or 60 Hz. For
integration times below the light intensity period (10 ms for
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50 Hz environment), flicker cannot be avoided. The
MT9M114 supports an indoor AE mode, that will ensure
flicker-free operation (VAR8 = 18, 0x0078[0] = 0x1 or
REG = 0xC878[0] = 0x1). The MT9M114 will calculate all
flicker parameters based on the sensor settings which are
programmed in the Cam Control variables. This means the
user only needs to select if 50- or 60-Hz flicker needs to be
avoided (VAR 0x12, 0x008B or R0xC88B = 50 for 50-Hz
flicker avoidance and 60 for 60-Hz avoidance).
Output Conversion and Formatting
The YUV data stream can either exit the color pipeline as
is or be converted before exit to an alternative YUV or RGB
data format.
Color Conversion Formulas
Y’U’V’:
This conversion is BT 601 scaled to make YUV range
from 0 through 255. This setting is recommended for JPEG
encoding and is the most popular, although it is not well
defined and often misused in various operating systems.
YȀ+0.299 RȀ)0.587 GȀ)0.114 BȀ(eq. 1)
UȀ+0.564 (BȀ*YȀ))128 (eq. 2)
VȀ+0.713 (RȀ*YȀ))128 (eq. 3)
There is an option where 128 is not added to U’V’.
Y’Cb’Cr’ Using sRGB Formulas:
The MT9M114 implements the sRGB standard. This
option provides YCbCr coefficients for a correct 4:2:2
transmission.
NOTE: 16 < Y601< 235; 16 < Cb < 240; 16 < Cr < 240;
and 0 < = RGB < = 255.
YȀ+(0.2126 RȀ)0.7152 GȀ)0.0722 BȀ) (eq. 4)
(219ń256) )16
CbȀ+0.5389 (BȀ*YȀ) (224ń256) )128 (eq. 5)
CrȀ+0.635 (RȀ*YȀ) (224ń256) )128 (eq. 6)
Y’U’V’ Using sRGB Formulas:
These are similar to the previous set of formulas, but have
YUV spanning a range of 0 through 255.
YȀ+0.2126 RȀ)0.7152 GȀ)0.0722 BȀ(eq. 7)
UȀ+0.5389 (BȀ*YȀ))128 +(eq. 8)
+*0.1146 RȀ*0.3854 GȀ)0.5 BȀ)128
VȀ+0.635 (RȀ*YȀ))128 +(eq. 9)
+0.5 RȀ*0.4542 GȀ*0.0458 BȀ)128
There is an option to disable adding 128 to U’V’.
The reverse transform is as follows:
RȀ+Y)1.5748 (V *128) (eq. 10)
GȀ+Y*0.1873 (U *128) *0.4681 (V *128) (eq. 11)
BȀ+Y)1.8556 (U *128) (eq. 12)
Uncompressed YUV/RGB Data Ordering
The MT9M114 supports swapping YCbCr mode, as
illustrated in Table 14.
Table 14. YCbCr OUTPUT DATA ORDERING
Mode Data Sequence
Default (No Swap) CbiYiCriYi+1
Swapped CrCb CriYiCbiYi+1
Swapped YC YiCbiYi+1 Cri
Swapped CrCb, YC YiCriYi+1 Cbi
The RGB output data ordering in default mode is shown
in Table 15. The odd and even bytes are swapped when luma/chroma swap is enabled. R and B channels are bitwise
swapped when chroma swap is enabled.
Table 15. RGB ORDERING IN DEFAULT MODE
Mode (Swap Disabled) Byte D7 D6 D5 D4 D3 D2 D1 D0
565RGB Odd R7 R6 R5 R4 R3 G7 G6 G5
Even G4 G3 G2 B7 B6 B5 B4 B3
555RGB Odd 0 R7 R6 R5 R4 R3 G7 G6
Even G4 G3 G2 B7 B6 B5 B4 B3
444xRGB Odd R7 R6 R5 R4 G7 G6 G5 G4
Even B7 B6 B5 B4 0 0 0 0
x444RGB Odd 0 0 0 0 R7 R6 R5 R4
Even G7 G6 G5 G4 B7 B6 B5 B4
MT9M114
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Uncompressed Raw Bayer Bypass Output
Raw 10-bit Bayer data from the sensor core can be output
in bypass mode by:
1. Using both DOUT[7:0] and DOUT_LSB[1:0].
2. Using only DOUT[7:0] with a special 8 + 2 data
format, shown in Table 16.
3. Using the MIPI interface.
Table 16. 2-BYTE BAYER FORMAT
2-Byte Bayer Format Bits Used Bit Sequence
Odd bytes 8 Data Bits D9 D8 D7 D6 D5 D4 D3 D2
Even bytes 2 Data Bits + 6 Unused Bits 0 0 0 0 0 0 D1 D0
MT9M114
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UVC INTERFACE
The MT9M114 supports a set of UVC (USB Video Class)
controls i n order to simplify the integration of the MT9M114
with a host’s USB bridge (or ISP) device.
The MT9M114 firmware includes a ‘UVC Control’
component that augments the CamControl variables. The
UVC Control component sits above the CamControl
interface ( i n terms of abstraction) and acts as a ‘virtual host’.
The intention is that CamControl and all other components
are unaware of the UVC Control component.
UVC Control exposes a ‘UVC control’ page of shared
variables t o the host. This page contains variables compliant
with the UVC 1.1 specification (where possible). The
variables on this page are named to match the UVC
specification, and have matching data sizes, units and ranges
as required. Each UVC variable is ‘virtual’ − it does not
control any MT9M114 function directly.
MT9M114 therefore provides a ‘dual-personality’ host
interface:
•The primary CamControl interface, this interface
exposes the full feature-set of the device.
•The secondary UVC Control interface, which simplifies
integration of MT9M114 into a PC-Cam application.
More details on this topic can be found in the Developer
Guide.
Table 17. SUMMARY OF UVC COMMANDS
Variable Name
R0xCC00
VAR(0x13,0x0000) UVC_AE_MODE_CONTROL
R0xCC01
VAR(0x13,0x0001) UVC_WHITE_BALANCE_TEMPERATURE_AUTO_CONTROL
R0xCC02
VAR(0x13,0x0002) UVC_AE_PRIORITY_CONTROL
R0xCC03
VAR(0x13,0x0003) UVC_POWER_LINE_FREQUENCY_CONTROL
R0xCC04
VAR(0x13,0x0004) UVC_EXPOSURE_TIME_ABSOLUTE_CONTROL
R0xCC08
VAR(0x13,0x0008) UVC_BACKLIGHT_COMPENSATION_CONTROL
R0xCC0A
VAR(0x13,0x000A) UVC_BRIGHTNESS_CONTROL
R0xCC0C
VAR(0x13,0x000C) UVC_CONTRAST_CONTROL
R0xCC0E
VAR(0x13,0x000E) UVC_GAIN_CONTROL UINT16
R0xCC10
VAR(0x13,0x0010) UVC_HUE_CONTROL
R0xCC12
VAR(0x13,0x0012) UVC_SATURATION_CONTROL UINT16
R0xCC14
VAR(0x13,0x0014) UVC_SHARPNESS_CONTROL
R0xCC16
VAR(0x13,0x0016) UVC_GAMMA_CONTROL
R0xCC18
VAR(0x13,0x0018) UVC_WHITE_BALANCE_TEMPERATURE_CONTROL
R0xCC1C
VAR(0x13,0x001C) UVC_FRAME_INTERVAL_CONTROL
R0xCC20
VAR(0x13,0x0020) UVC_MANUAL_EXPOSURE_CONFIG
R0xCC21
VAR(0x13,0x0021) UVC_FLICKER_AVOIDANCE_CONFIG
MT9M114
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MULTI-CAMERA SYNC
The MT9M114 supports more than one device to be
connected in a “daisy-chain” type configuration. One of the
devices will act as the master and the remainder will be
slaves.
A typical connection diagram is shown in Figure 32. All
of the MT9M114 that are to communicate are:
•Connected in a daisy-chain using SADDR as an input
and CHAIN as an output
•Clocked from a common clock source
•Controlled from a single master, presumed to be under
software control of a host system
Figure 32. Multi-Camera Connection
MT9M114(1)
(Master)
Device = ID0
MT9M114(2)
Device = ID1
MT9M114(3)
Device = ID1
MT9M114(4)
Device = ID1
Logic 1
Logic 1Logic 1GND
HOST
MT9M114
SCLK
SDATA
EXTCLK
SADDR CHAIN
MT9M114
SCLK
SDATA
EXTCLK
SADDR CHAIN
MT9M114
SCLK
SDATA
EXTCLK
SADDR CHAIN
MT9M114
SCLK
SDATA
EXTCLK
SADDR CHAIN
SADDR is normally used as a static input that selects
between two slave device addresses (See Figure 33. In order
to implement the multi-sync function this input now has
additional functionality that does not interfere with its use as
device address selection.
There is a single register to control this function, named
CHAIN_CONTROL (R0x31FC). This register is controlled
by the host. The register field assignment is shown in
Table 18. Figure 33. Normal Use of SADDR
Slave
Device
ID
ID0 (Default: 0x90)
ID1 (Default: 0xBA)
R0x002E
(USER_DEFINED_DEVICE_ADDRESS_IS)
SADDR
Table 18. CHAIN_CONTROL REGISTER
Bit Name Default Description
15 chain_enable 0 0: multi-camera daisy-chain communication function is disabled
1: multi-camera daisy-chain communication function is enabled
The result of toggling this bit while the sensor is streaming is UNDEFINED.
14 sync_enable 0 0: multi-sync function is disabled
1: multi-sync function is enabled
The result of toggling this bit while the sensor is streaming is UNDEFINED.
13 master 0 0: this node is not the master
1: this node is the master
The result of toggling this bit while the sensor is streaming is UNDEFINED.
12 RESERVED
11:8 position 0 A unique value assigned to each device in the daisy-chain. The device
furthest from the master is assigned a position value of 0. The next device
is assigned a position value of 1. For N devices in a daisy-chain, the master
is assigned a position value of N−1.
The result of toggling this bit while the sensor is streaming is UNDEFINED.
7:0 RESERVED
MT9M114
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Configuration
Before the multi-sync function can be used, each
MT9M114 in the daisy-chain must be configured. This
process is performed by the host with no involvement from
MT9M114 firmware. Configuration involves assigning
a unique slave address to each MT9M114 and configuring
the CHAIN_CONTROL register on each MT9M114.
After reset (before configuration) the master MT9M114
has its SADDR input wired to ‘0’ and all other MT9M114 in
the daisy-chain have their SADDR inputs driven to ‘1’.
Therefore, MT9M114 Master will respond to slave address
ID0 (associated with SADDR = 0) and all the other MT9M1 14
in the daisy-chain will respond simultaneously to slave
address ID1. Each MT9M114 has its CHAIN pin configured
as an input. This situation is shown in Figure 32. The host
configures each MT9M114 in sequence, starting with the
master and ending with the farthest slave in the daisy-chain:
•MT9M114(1) Master:
The host uses slave address ID0 (associated with
SADDR = 0) and therefore accesses registers on
MT9M114(1) (the master). It writes to register
(R0x002E) to change the slave addresses associated
with ID0 and ID1 on this device to a single, new,
unique value; call it ID−MT9M114(1). It then writes
(using MT9M114(1) to register PAD_CONTROL
(R0x0032) to configure CHAIN as an output. Finally, it
writes (using MT9M114(1)) to the CHAIN_CONTROL
register to set chain_enable = 1, sync_enable = 1,
master = 1 and position = N–1 (where there are N
devices in the daisy-chain). The effect of enabling TMS
as an output is to drive the TMS output low.
•MT9M114(2):
This MT9M114 now has SADDR = 0 and so will
respond to slave address ID0. The host configures this
in the same way as MT9M114(1) with the exceptions
that it assigns ID−MT9M114(2), sets master = 0 and
position = N−2 (where there are N devices in the
daisy-chain). As before, the effect of enabling CHAIN
as an output is to drive the CHAIN output low.
•MT9M114(3):
As for MT9M114(2): assign ID−MT9M114(3),
master = 0, position = N−3.
•MT9M114(4):
As for MT9M114(2): assign ID−MT9M114(4),
master = 0, position = N−4.
Theory Of Operation
When multiple MT9M114 devices have been connected
and configured as described above, the multi-sync function
operates as follows:
•When the master device is placed in streaming mode
(as the result of a mode change initiated by the host) it
generates an event on its CHAIN output. It then delays
its own streaming until the last of the slave devices has
received an event signal.
•When a slave device is placed in streaming mode
(as the result of a mode change initiated by the host) it
delays streaming until it has received an event on its
SADDR input.
•Each slave in the daisy-chain propagates events
received on its input. Each slave uses its local value of
“position” to delay its respond to an event. This allows
an event propagated down the daisy-chain to be acted
upon simultaneously by all devices in the daisy-chain.
Using Multi-Sync
The host can use the normal mechanism to configure the
MT9M114 and set them streaming. It can do this in any order
provided that it sets the master streaming last.
It is desirable (but not essential) for the master to be taken
out of streaming mode first (by using a host command).
At the time that the MT9M114 are placed in streaming
mode, all MT9M114 must have the same integration time
The recommended mechanism is:
1. Boot each device into standby by enabling
‘host-config’ mode.
2. Reconfigure each device.
3. Wake each device and commence streaming using
the Leave Standby command.
The MT9M114 need not maintain the same integration
time once they are streaming.
All the MT9M114 must be operated with the same
configuration (image size, output format, PLL bypassed and
frame timing). Any time that the configuration is to be
changed, all MT9M114 must be taken out of streaming
mode (using host command), reconfigured, then placed
back in streaming mode (master last). This will allow the
output data to remain in synchronization.
Clocking
The multi-sync mechanism requires that all MT9M114
devices i n the daisy-chain are operated synchronously on the
same input clock. This constraint is imposed in order to
allow the event codes to be propagated synchronously from
the master through to each slave.
Once this constraint has been met, the MT9M114 devices
are required to operate in exact synchronization (such that
a PIXCLK, FRAME_VALID and LINE_VALID out of one
MT9M114 is valid for all MT9M114 in the daisy-chain). In
this ca se, the MT9M114 internal PLL must be bypassed (and
the MT9M114 must be using parallel output data). This
feature can be used with the MIPI interface and PLL
enabled, in that case the signals will be synchronized up to
an accuracy of 2 PIXCLK cycles.
MT9M114
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HARDWARE FUNCTIONS
Two-Wire Serial Interface
The two-wire serial interface bus enables read and write
access t o control and status registers and variables within the
MT9M114.
The interface protocol uses a master/slave model in which
a master controls one or more slave devices. The MT9M114
always operates in slave mode. The host (master) generates
a clock (SCLK) that is an input to the MT9M114 and is used
to synchronize transfers. Data is transferred between the
master and the slave on a bidirectional signal (SDATA).
The host should always ensure that the following
relationship is adhered to.
SCLK vPIXEL CLOCK
22
Protocol
Data transfers on the two-wire serial interface bus are
performed by a sequence of low-level protocol elements, as
follows:
1. a (repeated) start condition
2. a slave address/data direction byte
3. a 16-bit register address (8-bit addresses are not
supported)
4. an (a no) acknowledge bit
5. a 16-bit data transfer (8-bit data transfers are not
supported)
6. a stop condition
The bus is idle when both SCLK and SDATA are HIGH.
Control of the bus is initiated with a start condition, and the
bus is released with a stop condition. Only the master can
generate the start and stop conditions.
A start condition is defined as a HIGH-to-LOW transition
on SDATA while SCLK is HIGH.
At the end of a transfer, the master can generate a start
condition without previously generating a stop condition;
this is known as a repeated start or restart condition.
A stop condition is defined as a LOW-to-HIGH transition
on SDATA while SCLK is HIGH.
Data is transferred serially, 8 bits at a time, with the most
significant bit (MSB) transmitted first. Each byte of data is
followed by an acknowledge bit or a no-acknowledge bit.
This data transfer mechanism is used for the slave
address/data direction byte and for message bytes. One data
bit is transferred during each SCLK clock period. SDATA can
change when SCLK is LOW and must be stable while SCLK
is HIGH.
Slave Address
Bits [7:1] of this byte represent the device slave address
and bit [0] indicates the data transfer direction. A “0” in
bit [0] indicates a WRITE, and a “1” indicates a READ. If
the S ADDR signal is driven LOW, then addresses used by the
MT9M114 are R0x090 (write address) and R0x091 (read
address). If the SADDR signal is driven HIGH, then
addresses used by the MT9M114 are R0x0BA (write
address) and R0x0BB (read address).
Message Byte
Message bytes are used for sending register addresses and
register write data to the slave device and for retrieving
register read data. The protocol used is outside the scope of
the two-wire serial interface specification.
Acknowledge Bit
Each 8-bit data transfer is followed by an acknowledge bit
or a no-acknowledge bit in the SCLK clock period following
the data transfer. The transmitter (which is the master when
writing, or the slave when reading) releases SDATA. The
receiver indicates an acknowledge bit by driving SDATA
LOW. As for data transfers, SDATA can change when SCLK
is LOW and must be stable while SCLK is HIGH.
No-Acknowledge Bit
The no-acknowledge bit is generated when the receiver
does not drive SDATA low during the SCLK clock period
following a data transfer. A no-acknowledge bit is used to
terminate a read sequence.
Stop Condition
A stop condition is defined as a LOW-to-HIGH transition
on SDATA while SCLK is HIGH.
Typical Serial Transfer
A typical read or write sequence begins by the master
generating a start condition on the bus. After the start
condition, the master sends the 8-bit slave address/data
direction byte. The last bit indicates whether the request is
for a read or a write, where a “0” indicates a write and a “1”
indicates a read. If the address matches the address of the
slave device, the slave device acknowledges receipt of the
address by generating an acknowledge bit on the bus.
If the request was a write, the master then transfers the
16-bit register address to which a write should take place.
This transfer takes place as two 8-bit sequences and the slave
sends an acknowledge bit after each sequence to indicate
that the byte has been received. The master then transfers the
data as an 8-bit sequence; the slave sends acknowledge bit
at the end of the sequence. After 8 bits have been transferred,
the slave’s internal register address is automatically
incremented, so that the next 8 bits are written to the next
register address. The master stops writing by generating
a (re)start or stop condition.
If the request was a read, the master sends the 8-bit write
slave address/data direction byte and 16-bit register address,
just as in the write request. The master then generates
a (re)start condition and the 8-bit read slave address/data
direction byte, and clocks out the register data, 8 bits at a
time. The master generates an acknowledge bit after each
8-bit transfer. The slave’s internal register address is
automatically incremented after every 8 bits are transferred.
The data transfer is stopped when the master sends
a no-acknowledge bit.
MT9M114
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35
NOTE: If a customer is using direct memory writes
(XDMA), AND the first write ends on an odd
address boundary AND the second write starts
on an even address boundary AND the first
write is not terminated by a STOP, the write data
can become corrupted. To avoid this, ensure that
a serial write is terminated by a STOP.
Single READ from Random Location
This sequence (see Figure 34) starts with a dummy write
to the 16-bit address that is to be used for the read.
The master terminates the write by generating a restart
condition. The master then sends the 8-bit read slave
address/data direction byte and clocks out one byte of
register data. The master terminates the read by generating
a no-acknowledge bit followed by a stop condition.
Figure 34 shows how the internal register address
maintained by the MT9M114 is loaded and incremented as
the sequence proceeds.
Figure 34. Single READ from Random Location
Previous Reg Address, N Reg Address, M M+1
S0 1 PASr
Slave
Address Reg
Address[15:8] Reg
Address[7:0] Slave Address
S = Start Condition
P = Stop Condition
Sr = Restart Condition
A = Acknowledge
A = No-acknowledge Slave to Master
Master to Slave
A A A A Read Data
Single READ from Current Location
This sequence (Figure 35) performs a read using the
current value of the MT9M114 internal register address. The
master terminates the read by generating a no-acknowledge
bit followed by a stop condition. The figure shows two
independent read sequences.
Figure 35. Single READ from Current Location
Previous Reg Address, N Reg Address, N+1 N+2
S1Slave Address ARead Data
[15:8] S1 PSlave Address AA
Read Data
[15:0]
PA
ARead Data
[7:0]
Sequential READ, Start from Random Location
This sequence (Figure 36) starts in the same way as the
single read from random location (Figure 34). Instead of
generating a no-acknowledge bit after the first byte of data
has been transferred, the master generates an acknowledge
bit, and continues to perform byte reads until L bytes have
been read.
Figure 36. Sequential READ, Start from Random Location
Previous Reg Address, N Reg Address, M
S0Slave Address A AReg Address[15:8]
PA
M+1
A A A1SrReg Address[7:0] Read DataSlave Address
M+LM+L−1M+L−2M+1 M+2 M+3
ARead Data A Read Data ARead Data Read Data
MT9M114
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Sequential READ, Start from Current Location
This sequence (Figure 37) starts in the same way as the
single read from current location (Figure 35). Instead of
generating a no-acknowledge bit after the first byte of data
has been transferred, the master generates an acknowledge
bit, and continues to perform byte reads until L bytes have
been read.
Figure 37. Sequential READ, Start from Current Location
N+LN+L−1N+2N+1Previous Reg Address, N
PAS 1 Read DataASlave Address Read DataRead Data Read DataAAA
Single WRITE to Random Location
This sequence (Figure 38) begins with the master
generating a start condition. The slave address/data
direction byte signals a write and is followed by the high
then low bytes of the register address that is to be written.
The master follows this with the byte of write data. The write
is terminated by the master generating a stop condition.
Figure 38. Single WRITE to Random Location
Previous Reg Address, N Reg Address, M M+1
S0 PSlave Address Reg Address[15:8] Reg Address[7:0] A
A
A
A A Write Data
Sequential WRITE, Start at Random Location
This sequence (Figure 39) starts in the same way as the
single write to random location (Figure 38). Instead of
generating a no-acknowledge bit after the first byte of data
has been transferred, the master generates an acknowledge
bit, and continues to perform byte writes until L bytes have
been written. The write is terminated by the master
generating a stop condition.
Figure 39. Sequential WRITE, Start at Random Location
Previous Reg Address, N Reg Address, M M+1
S0Slave Address A Reg Address[15:8] A A AReg Address[7:0]
M+LM+L−1M+L−2M+1 M+2 M+3
Write Data AA AP
A
Write Data
Write Data
AWrite Data Write Data
PATCH RAM
MT9M114 has Patch Ram, this allows for issues to be
fixed without changing silicon version and also allows for
new features to be added to the silicon.
The patch would come in the format of Load and Apply
sections, the user needs to implement both sections. Below
includes detail of what can be achieved when in different
host states.
STANDBY − LOAD PATCHES ONLY
STREAMING − LOAD AND APPLY PATCHES
SUSPEND − LOAD AND APPLY PATCHES
MT9M114
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CHIEF RAY ANGLE
CRA vs. Image Height Plot
Image Height CRA
(%) (mm) (deg)
CRA (Degrees)
Image Height (%)
MT9M114 CRA Characteristic
0 102030405060708090100110
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
0 0 0
5 0.076 2.51
10 0.152 4.98
15 0.228 7.44
20 0.304 9.89
25 0.380 12.32
30 0.456 14.68
35 0.532 16.94
40 0.608 19.08
45 0.684 21.03
50 0.760 22.78
55 0.836 24.28
60 0.912 25.52
65 0.988 26.49
70 1.064 27.16
75 1.140 27.57
80 1.216 27.70
85 1.292 27.60
90 1.368 27.29
95 1.444 26.81
100 1.520 26.20
Figure 40. Chief Ray Angle
Figure 41. Typical Quantum Efficiency
Quantum Efficiency (%)
Wavelength (nm)
Red
Green (B)
Green (R)
Blue
350 450 550 650 750 850 950 1050 1150
0
5
10
15
20
25
30
35
40
45
50
55
60
65
MT9M114
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ELECTRICAL SPECIFICATIONS
CAUTION: Stresses above those listed in Table 19 may cause permanent damage to the device
Table 19. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
VDD_MAX Core Digital Voltage –0.3 2.4 V
VDD_IO_MAX I/O Digital Voltage –0.3 4.0 V
VAA_MAX Analog Voltage –0.3 4.0 V
VDD_PLL_MAX PLL Supply Voltage –0.3 4.0 V
VDD_PHY_MAX PHY Supply Voltage –0.3 2.4 V
VIN DC Input Voltage –0.3 VDD_IO + 0.3 V
IIN Transient Input Current (0.5 sec. Duration) – 150 mA
TOP Operating Temperature (Measure at Junction) –30 75 °C
TSTG Storage Temperature (Note 1) –40 85 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the product
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Table 20. OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
VDD Core Digital Voltage 1.7 1.8 1.95 V
VDD_IO I/O Digital Voltage 2.5 2.8 3.1 V
1.7 1.8 1.95 V
VAA Analog Voltage 2.5 2.8 3.1 V
VDD_PLL PLL Supply Voltage 2.5 2.8 3.1 V
VDD_PHY PHY Supply Voltage 1.7 1.8 1.95 V
TJOperating Temperature (at Junction) –30 55 70 °C
Table 21. CD ELECTRICAL CHARACTERISTICS
Symbol Parameter Condition Min Max Unit
VIH Input HIGH Voltage (Note 1) VDD_IO * 0.7 – V
VIL Input LOW Voltage (Note 1) – VDD_IO * 0.3 V
IIN Input Leakage Current (Note 2) VIN = 0V or VIN = VDD_IO − 10 mA
VOH Output HIGH Voltage IOH = 2 mA VDD_IO * 0.75 − V
VOL Output LOW Voltage IOH = 2 mA – VDD_IO * 0.25 V
1. VIL and VIH have min/max limitations specified by absolute ratings.
2. Excludes CONFIG and RESET_BAR as they have an internal pull-up resistor.
MT9M114
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Table 22. OPERATING CURRENT CONSUMPTION
(Default Setup Conditions: fEXTCLK = 24 MHz, fPIXCLK = 96 MHz, VAA = VDD_IO = VDD_PLL = 2.8 V, VDD = VDD_PHY = 1.8 V, TJ = 70°C
unless otherwise stated, PN9 enabled, specified under MIPI and Parallel output conditions)
Symbol Conditions Min Typ Max Unit
VDD 1.7 1.8 1.95 V
VAA 2.5 2.8 3.1 V
VDD_PHY 1.7 1.8 1.95 V
VDD_PLL 2.5 2.8 3.1 V
VDD_IO VDD_IO = 2.8 V 2.5 2.8 3.1 V
VDD_IO = 1.8 V 1.7 1.8 1.95 V
IDD Full Resolution 30 fps, Parallel 39 50 mA
720p, 30 fps, Parallel 33 45 mA
VGA Binned, 60 fps, Parallel 25 40 mA
Full Resolution, 30fps, MIPI 39 50 mA
720p, 30 fps, MIPI 33 45 mA
VGA Binned, 60 fps, MIPI 25 40 mA
IAA Full Resolution, 30 fps, Parallel 19 35 mA
720p, 30 fps, Parallel 19 35 mA
VGA Binned, 60 fps, Parallel 19 35 mA
Full Resolution, 30 fps, MIPI 19 35 mA
720p, 30 fps, MIPI 19 35 mA
VGA Binned, 60 fps, MIPI 19 35 mA
IDD_PLL Full Resolution, 30 fps, Parallel 8 20 mA
720p, 30 fps, Parallel 8 20 mA
VGA, 60 fps, Parallel 8 20 mA
Full Resolution, 30f ps, MIPI 25 40 mA
720p, 30 fps, MIPI 25 40 mA
VGA Binned, 60 fps, MIPI 25 40 mA
IDD_PHY Full Resolution, 30 fps, Parallel 0.02 0.5 mA
720p, 30fps, Parallel 0.02 0.5 mA
VGA Binned, 60 fps, Parallel 0.02 0.5 mA
Full Resolution, 30 fps, MIPI 0.18 1 mA
720p, 30 fps, MIPI 0.18 1 mA
VGA Binned, 60 fps, MIPI 0.18 1 mA
Total Power
Consumption
(Note 1)
Full Resolution, 30 fps, Parallel 146 mW
720p, 30fps, Parallel 135 mW
VGA Binned, 60 fps, Parallel 121 mW
Full Resolution, 30 fps, MIPI 194 mW
720p, 30 fps, MIPI 183 mW
VGA Binned, 60 fps, MIPI 169 mW
1. Total power excludes VDD_IO current.
Table 23. STANDBY CURRENT CONSUMPTION (PARALLEL AND MIPI)
(Default Setup Conditions: fEXTCLK = 24 MHz, fPIXCLK = 96 MHz, VAA = VDD_IO = VDD_PLL = 2.8 V, VDD = VDD_PHY = 1.8 V, TJ = 70°C
unless otherwise stated)
Typ Max Unit
Soft Standby
(CLK ON) Total Standby Current in Parallel and MIPI Mode 1.4 3 mA
Total Power Consumption in Parallel and MIPI Mode 2.5 − mW
Soft Standby
(CLK OFF) Total Standby Current in Parallel and MIPI Mode 80 500 mA
Total Power Consumption in Parallel and MIPI Mode 150 − mW
NOTE: All power measurements exclude IO current.
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Table 24. AC ELECTRICAL CHARACTERISTICS
(EXTCLK = 6–54 MHz; VDD = VDD_PHY = 1.8 V; VDD_IO = VAA = VDD_PLL = 2.8 V; TJ = 25°C unless otherwise stated)
Symbol Parameter Condition Min Typ Max Unit
External Input Clock Frequency 6 − 54 MHz
fEXTCLK External Clock Frequency
(Note 1) 6 − 54 MHz
DEXTCLK External Input Clock Duty Cycle 40 50 60 %
tJITTER External Input Clock Jitter
(Note 2) – 500 – ps
tPD PIXCLK to Data Valid – 2 5 ns
tPFH PIXCLK to FV HIGH – 2 5 ns
tPLH PIXCLK to LV HIGH – 2 5 ns
tPFL PIXCLK to FV LOW – 2 5 ns
tPLL PIXCLK to LV LOW – 2 5 ns
tCP EXTCLK TO PIXCLK
Propagation Delay tPIXCLK = PICXCLK Period −0.1 * tPIXCLK − ns
PIXCLK SLEW RATE
Slew = 4
VDD_IO = 2.8 V, PLL Bypass,
6 MHz EXTCLK, CLOAD =35 pF – 0.647 – V/ns
VDD_IO = 1.8 V, PLL Bypass,
6 MHz EXTCLK, CLOAD =35 pF – 0.27 – V/ns
OUTPUT SLEW RATE
Slew = 4
VDD_IO = 2.8 V, PLL Bypass,
6 MHz EXTCLK, CLOAD =35 pF – 0.229 – V/ns
VDD_IO = 1.8 V, PLL Bypass,
6 MHz EXTCLK, CLOAD =35 pF – 0.112 – V/ns
1. VIH/VIL restrictions apply.
2. Based on lab measurements. Could vary with noisier system-level electronics.
Figure 42. Parallel Pixel Bus Timing Diagram
EXTCLK
DOUT[7:0]
LINE_VALID/
FRAME_VALID
tCP
tF
tR
90% 90%
10% 10%
tEXTCLK
PIXCLK
Data Data Data DataData
tPD
tPD
tPFL
tPLL
tPFH
tPLH
Notes:
1. FRAME_VALID leads LINE_VALID by 6 PIXCLKs.
2. FRAME_VALID trails LINE_VALID by 6 PIXCLKs.
3. DOUT[7:0], FRAME_VALID, and LINE_V ALID are shown with respect to the falling edge of PIXCLK. This feature is programmable
and DOUT[7:0], FRAME_VALID, and LINE_VALID can be synchronized to the rising edge of PIXCLK.
4. Propagation delay is measured from 50% of rising and falling edges.
(Note 3)(Note 2)
(Note 4)
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Table 25. TWO-WIRE SERIAL INTERFACE TIMING DATA
(fEXTCLK = 50 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; TJ = 70°C; CLOAD = 68.5 pF)
Symbol Parameter Conditions Min Typ Max Unit
fSCLK Serial Interface Input Clock
Frequency 100 – 400 kHz
tSCLK Serial Interface Input Clock
Period 10 – 2.5 ?s
SCLK Duty Cycle 45 50 55 %
trSCLK/SDATA Rise Time – – 300 ns
tSRTS Start Setup Time Master Write to Slave 600 – –
tSRTH Start Hold Time Master Write to Slave 300 – – ns
tSDH SDATA Hold Master Write to Slave 300 – 650 ns
tSDS SDATA Setup Master Write to Slave 300 – – ns
tSHAW SDATA Hold to Ack Master Write to Slave 150 – – ns
tAHSW Ack Hold to SDATA Master Write to Slave 150 – – ns
tSTPS Stop Setup Time Master Write to Slave 300 – – ns
tSTPH Stop Hold Time Master Write to Slave 600 – – ns
tSHAR SDATA Hold to Ack Master Read from Slave 300 – – ns
tAHSR Ack Hold to SDATA Master Read from Slave 300 – – ns
tSDHR SDATA Hold Master Read from Slave 300 – 650 ns
tSDSR SDATA Setup Master Read from Slave 350 – – ns
Figure 43. Two-wire Serial Bus Timing Parameters
Write Start Ack
Read Start Ack
tSHAR tAHSR tSDHR
tSDSR
Read Sequence
Write Sequence
Read
Address
Bit 7
Read
Address
Bit 0
Register
Value
Bit 7
Register
Value
Bit 0
Write
Address
Bit 7
Write
Address
Bit 0
Register
Value
Bit 7
Register
Value
Bit 0
tSRTS
tSCLK tSDH
tSDS tSHAW
t
Stop
AHSW
STPS
t
tSRTH
Ack
STPH
t
SCLK
SDATA
SCLK
SDATA
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MIPI AC and DC Electrical Characteristics
Table 26. MIPI HIGH-SPEED TRANSMITTER DC CHARACTERISTICS
Symbol Parameter Min Nom Max Unit
VCMTX HS Transmit Static Common-Mode Voltage 150 200 250 mV
|DVCMTX (1,0)| VCMTX Mismatch when Output is Differential-1 or
Differential-0 − − 5 mV
|VOD|HS Transmit Differential Voltage 140 200 270 mV
|DVOD|VOD Mismatch when Output is Differential-1 or
Differential-0 − − 10 mV
VOHHS HS Output High Voltage − − 360 mV
ZOS Single-ended Output Impedance 40 50 62.5 W
DZOS Single-ended Output Impedance Mismatch − − 10 %
Table 27. MIPI HIGH-SPEED TRANSMITTER AC CHARACTERISTICS
Parameter Description Min Nom Max Unit
Data Bit Rate − − 768 Mb/s
tR and tF20%−80% Rise Time and Fall Time − − 0.3 UI
150 − − ps
Table 28. MIPI LOW-POWER TRANSMITTER DC CHARACTERISTICS
Parameter Description Min Nom Max Unit
VOH Thevenin Output High Level 1.1 1.2 1.3 V
VOL Thevenin Output Low Level −50 − 50 mV
ZOLP Output Impedance of LP Transmitter 110 − − W
Table 29. MIPI LOW-POWER TRANSMITTER AC CHARACTERISTICS
Parameter Description Min Nom Max Unit
TRLP/TFLP 15−85% Rise Time and Fall Time − − 25 ns
TLP−PULSE−TX Pulse Width of the LP Exclusive-OR Clock
First LP exclusive-OR clock pulse after Stop state or
last pulse before Stop state
All other pulses
40
20
−
−
−
−
ns
TLP−PER−TX − − − ns
TREOT 30%−85% Rise Time and Fall Time − − 35 ns
dV/dtSR Slew Rate @ CLOAD = 70 pF
Slew Rate @ CLOAD = 0 to 70 pF (Rising Edge Only)
Slew Rate @ CLOAD = 0 to 70 pF (Rising Edge Only)
−
30
30−0.075 *
(VO,INST−700)
−
−
−
150
−
−
mV/ns
CLOAD Load Capacitance 0 − 70 pF
Table 30. CLOCK SIGNAL SPECIFICATION
Symbol Parameter Min Nom Max Unit
UIINST UI Instantaneous − − 12.5 ns
Table 31. DATA-CLOCK TIMING SPECIFICATIONS
Symbol Parameter Min Nom Max Unit
TSKEW Data to Clock Skew (Measured at Transmitter) −0.15 − 0.15 UIINST
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PINOUT
Figure 44. 4.7x3.9 ODCSP 55-Ball Package
Top View
(Ball Down)
A
B
C
D
E
F
G
12345678
VAA
GND
VDD
CONFIG
VDD_IO
EXTCLK
VDD
Reserved
(Note 1)
VAA
OE_BAR
SCLK
CHAIN
PIXCLK
FLASH
DOUT[6]
VDD_IO
AGND
SDATA
Reserved
(Note 1)
GND
VDD
DOUT[4]
DOUT[5]
GND
DOUT[7]
SADDR
TRST_BAR
PGND
(Note 2)
DOUT[2]
DOUT[3]
VDD_IO
Reserved
(Note 1)
RESET_
BAR
DATA_N
PGND
(Note 2)
VDD
GND
FV
DOUT_
LSB1
DOUT_
LSB0
DATA_P
VDD_PLL
DOUT[1]
DOUT[0]
LV
GND
GND
CLK_P
GND_PLL
VDD
VDD_IO
VDD
VDD_PHY
CLK_N
GND_PLL
Notes:
1. Do not use.
2. To be used for EMI shielding.
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PACKAGE DIMENSIONS
Table 32. PACKAGE DIMENSIONS
Parameter Symbo
l
Nominal Min Max Nominal Min Max
Millimeters Inches
Package Body Dimension X A 4.648 4.623 4.673 0.183 0.182 0.184
Package Body Dimension Y B 3.848 3.823 3.873 0.151 0.151 0.152
Package Height C 0.690 0.635 0.745 0.027 0.025 0.029
Cavity height (Glass to Pixel Distance) C4 0.041 0.037 0.045 0.002 0.001 0.002
Glass Thickness C3 0.400 0.390 0.410 0.016 0.015 0.016
Package Body Thickness C2 0.570 0.535 0.605 0.022 0.021 0.024
Ball Height C1 0.120 0.090 0.150 0.005 0.004 0.006
Ball Diameter D 0.230 0.200 0.260 0.009 0.008 0.010
Total Ball Count N 55
Ball Count X axis N1 8
Ball Count Y axis N2 7
UBM U 0.240 0.230 0.250 0.009 0.009 0.010
Pins Pitch X axis J1 0.520
Pins Pitch Y axis J2 0.520
BGA Ball Center to Package Center Offset in X-direction X 0.000 –0.025 0.025 0.000 –0.001 0.001
BGA Ball Center to Package Center Offset in Y-direction Y 0.000 –0.025 0.025 0.000 –0.001 0.001
Edge to Ball Center Distance along X S1 0.504 0.474 0.534 0.020 0.019 0.021
Edge to Ball Center Distance along Y S2 0.364 0.334 0.394 0.014 0.013 0.016
Figure 45. Package Mechanical Drawing (Case 570BP)
A
B
C
D
E
F
G
12 3 4 5678
A
B
C
D
E
F
G
1234567
8
Bottom View
Top View
Cross−section View (E − E)
First Active
Pixel
A
B
J1 S1
J2
S2
C
C2
C3
C4
C1
J2
J1
X
Y
Optical
center
(0.1
(0μm, 0μm)
Note: The orientation of
the figure is with the lens.
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45
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