CUSTOMER HOTLINE 4 800 722-1111 1, INTRODUCTION - This specification covers the requirements for application of the AMP* Card Edge Connectors with contact centerlines on .050 in. They are designed for mother/daughter board applications and will accept a daughterboard of .070 in. maximum thickness {including circuit pads). They can also be used with AMP Edgemate Connectors with which have circuit pads on .050 in centers. The connectors can be positioned on a pe board by hand or by automatic machine application. Connectors are available with 10 through 120 contact positions, All have a polarizing web, two guide/retention pins, standoffs, and an identification mark on the housing that represents the number 1 contact position. See Figure 1 for connector features. NOTE All dimensions in this specification are in inches and have a decimal tolerance of + .005 and an angle tolerance of +3 unless otherwise specified. Metric equivalents (mm) can be calculated by muitiplying the given dimension by 25.4, 2. REFERENCE MATERIAL 2.1. Product Numbers and Product Codes Product part numbers are assigned to each item and a product code is used to designate a group of items of similar design. Continuous product development renders an up-to-date listing of all numbers impractical. The following are reference numbers that have been included to identify the product line and expedite inquires: Product Part Number 650090 and Product Code 5283. Polarizing/Aligning Daughterboard Web \ Slot | i Closed } End (Typ) t-~Qreeneeeneene Motherboard (Ref) Ne. 1 Contact Identification Standoff E CONNECTOR CARD EDG Mark (Typ) Contact solder Tine (Typ) Guide/Retention Pin (Typ) Fig. 1 Product Features * TRADEMARK OF AMP INCORPORATED Copyright 1987 by AMP Incorporated. All International Rights Reserved. ee a APPLICATION AMP INCORPORATED SPECIFICATION AMP | harrisburg, Pa. 17105 ENGINEERING APPROVAL & DATE NO. Howard Andrews 3/29/88 114-26012 PAGE TITLE CARD EDGE CONNECTORS WITH 1 of 6 CONTACTS ON .050 INCH CENTERS LTR REVISION RECORD ee AMP 1250-17 (8/87)2.2. Customer Drawing 2.3. Product Specification Specification 108-14034, 2.4. Related Material 3. REQUIREMENTS 3.1. Printed Circuit Board Layouts A. Motherboard HOLE PATTERN FOR EVEN NUMBER OF DUAL-CONTACT POSITIONS .040 +.003 DIA There are two motherboard layouts provided in Figure 2. hand or automatic machine placement of the connectors. connectors with an even number of dual contact positions and the other for connectors with an odd number of dual contact positions. MOUNTING DIMENSIONS FOR HAND OR MACHINE PLACEMENT IN COMPONENT SIDE OF MOTHERBOARD. An AMP Customer Drawing is available for each part number assigned to this product line. In the event of a variance between this specification and the customer drawing, the customer drawing information will take precedence. The performance of the product during various tests is provided on AMP Product AMP Corporate Bulletin 52 provides some guidelines for soldering and is available upon request through your local AMP Representative. Both can be used for One layout is for HOLE PATTERN FOR ODD NUMBER OF DUAL-CONTACT POSITIONS CIs 008 [eo RCIEG) | ' No. A = The total number of dual contact positions, between position No, 1 and the polarizing web, minus one, times .050, B = The total of dimension "A" plus .150 in. -x- 050 (Typ) [ oY @+ +t t+ + + + + @ @ +--+ ttor.i.aag NOTE IS @. 4. @ _--_+ @ 7 @ritit + + + 4+ --+ @ ++ + + \ f NOTE a + + + ol oe 100 500 096 +.001 |___.075 (Typ) DIA (Typ) (Ref) 050 [-075} 075 (Ref) No. 1 Contact mye? 8 | 1 Contact Position (Ref) Position (Ref) NOTE 1 These hole patterns are the reverse of the ODD position connector. Otherwise all dimensional information is the same for both layouts. Fig. 2 Motherboard Layout _ PAGE NO. n AMP INCORPORATED MP Harrisburg, Pa. 17105 2 114~26012 AMP 1251-15B. Daughterboard Design Figure 3 provides the dimensional requirements of a daughterboard for use in the card edge connectors. Note that a slot must be made at the "12th and 13th" contact pesition to accommodate the connector polarizing web. .0752,.002~yy ty | H+ ma _ Peel! 20 7) ~ t | HP EU thy 250 * (Min) fo | L_-034/.038 Ly A .035 (Typ) (Typ) | .062 +.008 11 Equally Spaced .070 Circuit Pads NOTE 2 SECTION AWA @ .050 Each ~ .034/.038 FT A.O10 x| CTA 902| within Circuit Pad Pattern NOTE 2 Total number of dual contact positions between contact position No. | and the polarizing web, minus one dual contact position, times .050. Fig. 3 Daughterboard Layout 3.2. Polarization The closed ends and polarizing/alignment web provide polarization for the connector. Dimensions for a mating daughterboard are provided in Figure 3. AMP Edgemate connectors that may be used with these connectors have a slot that matches the polarizing/alignment web. 3.3. Limitations Use the product specification referenced in Paragraph 2,3. for testing and limitations that apply to these connectors. 3.4. Storage and Handling Connectors should remain in their shipping container until ready for use to prevent deformation of the solder tines and/or damage to the housing. When handling the connectors, pick them up by the housing only. PAGE NO. AMP INCORPORATED AMP Harrisburg, Pa. 17405 3 114-26012 AMP 1251-153.5. Installation When placing the connector onto the pe board, all solder tines should be aligned with the holes and inserted through the board at the same time. The guide/retention posts will assist in positioning the connector for alignment of the contact solder tines. The standoffs must be seated on the board within the specified tolerance. If robotic equipment is used it will require a total equipment accuracy of +.0015. This includes the gripper and fixture tolerances and equipment repeatability. If tolerances exceed these limits the solder tine tips may stub on the pe board. 90+3 90+3 005 (Max) Fig. 4 Functional Tolerances 3.6, Soidering A. General These connectors are compatible with vapor phase and infared reflow processes provided the temperature does not exceed 220C for more than 3 minutes. For suitability with other reflow techniques, contact the AMP Engineer whose name appears on the front page of this specification. AMP Corporate Bulletin No. 52 is available upon request and can be used as a guide in soldering. This bulletin provides information on various flux types and characteristics along with the commercial designation and flux removal procedures. A checklist is attached to the bulletin which is intended to serve as a guide for obtaining information on soldering. B. Flux Selection The connector solder tines must be fluxed prior to soldering with a medium active rosin base flux, or a medium to highly active organic flux, Selection of the proper flux will depend on the type of pe board and other components mounted on the board. Also, the choice of flux will have to be compatible with the flow solder equipment, manufacturing, and safety requirements. PAGE NO. AMP INCORPORATED AMP Harrisburg, Pa. 17105 4 114-26012 AMP 1251-15* Manufacture's descriptive identifier of listed cleaning solvents. Cc. Cleaning WARNING Considerations must be given to toxicity and other safety requirements recommended by the solder cleaning solvent manufacture. Removing of fluxes, residues and activators is mandatory. Cleaning procedures will depend on the type of flux used on the solder line. The connector housing material is unaffected by most popular cleaning solvents for 5 minutes at 105+F, Included in this group are: Dow Prelete* Allied Geneesol DSX* Freon TA* Perciene* Freon TE* Trichlorethylene Freon TES* Trichlorethane Freon TF* Methylene Chloride Freon TMC* Isopropyl Alcohol Freon TMS* Alpha 1003* 3M FC-70% Contact AMP Engineering to assure compatibility with other solvent that are | not listed on this specification, D. Drying When dry cleaning assemblies and pc boards, make sure the recommended temperature limitation is not exceeded. Excessive temperature may cause housing degradation. AnapP | 4"? inconporatep _ a PAGE NO. Harrisburg, Pa. 17105 5 114~260124. VISUAL AID Figure 5 depicts a typical AMP Card Edge Connector after it has been installed on the motherboard and a typical daughterboard prepared for insertion into the connecter. The illustration describes in general terms the conditions that must exist for the assembler to assume a suitable installation. Dimensional considerations for inspectors are provided throughout the text of this specification. LEAD-IN MUST BE FORMED ON THE LEADING EDGE OF ThH7se THE DAUGHTERBOARD NUMBER "1" CIRCUIT ON DAUGHTERBOARD MUST ALIGN WITH THE NUMBER "L" CIRCUIT OF THE CONNECTOR POLARIZING SLOT MUST ALIGN WITH THE POLARIZING WEB STANDOFFS MUST BE SEATED ON THE MOTHERBOARD SOLDER FILLETS MUST BE FORMED EVENLY AROUND THE BASE OF THE SOLDER TINE Fig. 5 Visual Aid AMP INCORPORATED AMP Harrisburg, Pa. 17105 6 114-26012 PAGE NO. AMP 1251-15