Data Sheet 1 2001-12-01
Ternary PIN Photodiode
with integrated Preamplifier IC
SRP00244x
SRP00245x
Fiber Optics
Features
InGaAs/InP PIN photodiode with preamplifier IC
Designed for SONET OC-3 / SDH STM-1
applications in fiber-optics communication
systems
Sensitive receiver for 2nd and 3rd optical window
(1300 nm and 1550 nm)
Suitable for bit rates up to 155 Mbit/s
Module with high optical sensitivity
Fast switching times
Low dark current
Excellent noise immunity
High reverse current stability from planar structure
Hermetically sealed TO46 package
SRP00244x
SRP00245x
Pin Configuration
Data Sheet 2 2001-12-01
Pin Configuration
Figure 1 Receiver with Preamp
1
2
3
4
2.54 mm
Receiver with Preamp (bottom view)
3
Out+
VCC
Out
Pin
Pre-
amp
1
2
4
Pinning
SRP00244x
SRP00245x
Description
Data Sheet 3 2001-12-01
Description
The Infineon optical receiver module has been designed for use in optical networks and
is suitable for bit rates up to max. 2.5 Gbit/s if used without any TIA.
The optical receiver module uses a high-speed PIN photodetector optional coupled with
a hybrid low noise transimpedance amplifier (PIN-TIA). The optical receiver photodiode
can be used for 1310 nm or 1550 nm optical communications.
The PIN photodiode is made of InGaAs/InP and has an active diameter of 75 µm. The
function of the PIN and PIN-TIA optical receiver module is to detect input optical power,
to transduce the incident radiation into current (PIN) and then to convert the current into
a voltage (PIN-TIA).
The low input noise current density of the used transimpedance amplifiers in PIN-TIA’s
provides the optical receiver module, when used with appropriate filtering, with ample
sensitivity for realizing minimum input power requirements. Designers of optical
receivers can use the module in any application that benefits from integration of the
photodiode and TIA into a TO coaxial package. Typical for such applications are
receivers for digital crossconnects, digital loop carriers, add/drop-multiplexers and
optical network units.
Last but not least the fast switching times, low dark currents and the packaging in a
compact and hermetically sealed TO46 make the optical receivers usable in many other
fiber optic receiver applications. One application is the use in a Compact realization of a
transceiver in one module like the so called BIDI® (Figure 2).
Figure 2 Compact Realization of the Transceiver in One Module
TO-Detector
Glass Lens
Fiber
Beam Splitter
TO-
Laser
SRP00244x
SRP00245x
Technical Data
Data Sheet 4 2001-12-01
Technical Data
The electro-optical characteristics described in the following table are only valid for use
within the specified maximum ratings or under the recommended operating conditions.
Characteristics for Pin-Preamp Receivers at TA = 25°C, unless otherwise specified.
Absolute Maximum Ratings
Parameter Symbol Limit Values Unit
min. max.
Module
Operating temperature range at case TC–40 85 °C
Storage temperature range Tstg –40 85
Soldering temperature (tmax = 10 s,
2 mm distance from bottom edge of case)
TS260
Receiver Diode
Reverse Voltage VR20 V
Forward Current IF10 mA
Optical power into the optical port Pport 1mW
Preamp Characteristics
Parameter Symbol Limit Values Unit
min. typ. max.
DC-Characteristics
Supply Voltage VCC 4.5 5 5.5 V
Supply Current ICC 25 26 mA
AC-Characteristics
Optical Sensitivity
(BER 10–9, PN23) S–31 –35 dBm
Linear Bandwidth (–3 dB) BW 180 240 MHz
Optical overload (avg.) Pmax –4 dBm
Transimpedance (single ended) RT8 1012k
Output resistance Rout 40 50 60
Noise current density 3 pa/Hz
Gain (differential) G 10 24 V/mW
Return Loss, λ = 1310 nm RL –27 dB
SRP00244x
SRP00245x
Technical Data
Data Sheet 5 2001-12-01
Some Eye Diagrams
Figure 3 Popt = 0.25 µW avg. (OC-3)
Figure 4 Popt = 10 µW avg. (OC-3)
Figure 5 Popt = 1 µW avg. (OC-3)
Figure 6 Popt = 100 µW avg. (OC-3)
SRP00244x
SRP00245x
Fiber Data
Data Sheet 6 2001-12-01
Fiber Data
The mechanical fiber characteristics are described in the following table.
Fiber Characteristics
Parameter Limit Values Unit
min. typ. max.
Mode Field Diameter 50 µm
Cladding Diameter 123 125 127
Mode Field/Cladding Concentricity Error 1
Cladding Non-circularity 2 %
Mode Field Non-circularity 6
Cut off Wavelength 1270 nm
Jacket Diameter 0.8 1 mm
Bending Radius 30
Tensile Strength Fiber Case 5 N
Length 0.8 1.2 m
SRP00244x
SRP00245x
Package Outlines
Data Sheet 7 2001-12-01
Package Outlines
Figure 7
Dimensions in mm
SRP00244x
SRP00245x
SRP00244x
SRP00245x
Package Outlines
Data Sheet 8 2001-12-01
Other connectors on request
Flange Options
Type Flange
SRP00244x without
SRP00245x with
Connector Options
Model Type
SRP00244H
SRP00245H
MM FC/PC
SRP00244G
SRP00245G
SM FC/PC
SRP00244O
SRP00245O
MM SC/PC 0°
SRP00244N
SRP00245N
SM SC/PC 0°
SRP00244Q
SRP00245Q
MM SC 8° APC
SRP00244P
SRP00245P
SM SC 8° APC
SRP00244W
SRP00245W
MM without connector
SRP00244Z
SRP00245Z
SM without connector
Edition 2001-12-01
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 München, Germany
© Infineon Technologies AG 2002.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
For questions on technology, delivery and prices please contact the Infineon
Technologies Offices in Germany or the Infineon Technologies Companies and
Representatives worldwide: see our webpage at http://www.infineon.com.
SRP00244x
SRP00245x
Revision History: 2001-12-01 DS0
Previous Version:
Page Subjects (major changes since last revision)
Document’s layout has been changed: 2002-Aug.