www.altera.com/enpirion
Enpirion® Power Datasheet
EN5335QI 3A PowerSoC
Voltage Mode Synchronous Buck PWM
DC-DC Converter with Integrated Inductor
3-Pin Programmable Output
Description
The EN5335QI is a Power System on a Chip
(PowerSoC). It is specifically designed to meet
the precise voltage and fast transient
requirements of present and future high-
performance, low-power processor, DSP, FPGA,
memory boards and system level applications in
a distributed power architecture. Advanced circuit
techniques, ultra high switching frequency, and
very advanced, high-density, integrated circuit
and proprietary inductor technology deliver high-
quality, ultra compact, non-isolated DC-DC
conversion. Operating this converter requires as
few as three external components that include
small value input and output ceramic capacitors
and a soft-start capacitor.
The Altera Enpirion solution significantly helps in
system design and productivity by offering greatly
simplified board design, layout and
manufacturing requirements. In addition, a
reduction in the number of vendors required for
the complete power solution helps to enable an
overall system cost savings.
All Altera Enpirion products are RoHS compliant
and lead-free manufacturing environment
compatible.
Typical Application Circuit
VID Output
Voltage Select
VOUT
VIN
VSENSE
47F
15nF
VOUT
VS0
VS1
VS2
POK
PGNDAGND
SS
PVIN
AVIN
22F
Figure 1. Simple Layout.
Features
Integrated INDUCTOR, MOSFETS, Controller
Footprint 1/3rd that of competing solutions
Low Part Count: only 3 MLC Capacitors
Up to 10W continuous output power
5MHz operating frequency
High efficiency, up to 93%
VOUT accuracy 3% over line, load and temp
Wide input voltage range of 2.375V to 6.6V
3-pin VID output voltage select to choose one
of 7 pre-programmed voltage levels
Output enable pin and Power OK signal
Programmable soft-start time
Programmable over-current protection
Thermal shutdown, short circuit, and UVLO
Output over-voltage protection
RoHS compliant, MSL level 3, 260C reflow
Applications
Point of load regulation for low-power
processors, network processors, DSPs,
FPGAs, and ASICs
Notebook computers, servers, workstations
Broadband, networking, LAN/WAN, optical
Low voltage, distributed power architectures
with 2.5V, 3.3V or 5V rails
DSL, STB, DVR, DTV, iPC
Ripple sensitive applications
Ordering Information
Part Number
Temp Rating
(°C)
Package
EN5335QI
-40 to +85
44-pin QFN T&R
EVB-EN5335QI
QFN Evaluation Board
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Pin Configuration
Below is a top view diagram of the EN5335QI package.
NOTE: NC pins are not to be electrically connected to each other or to any external signal, ground, or
voltage. However, they must be soldered to the PCB. Failure to follow this guideline may result in
part malfunction or damage.
Figure 2. Pin-out diagram, top view.
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Pin Descriptions
PIN
FUNCTION
1-3
NO CONNECT – Do not electrically connect these pins to each other or to
PCB.
4-6
No Connect. These pins are internally connected to the switch node of the
internal MOSFETs. NC(SW) pins are not to be electrically connected to any
external signal, ground, or voltage.
7
No connect – Do not electrically connect these pins to each other or to PCB.
8-14
Regulated converter output. Connect these pins to the load and place output
capacitor from these pins the PGND pins 17-18
15
No Connect. These pins are internally connected to the switch node of the
internal MOSFETs. NC(SW) pins are not to be electrically connected to any
external signal, ground, or voltage.
16
No connect – Do not electrically connect these pins to each other or to PCB.
17-20
Output power ground. Connect these pins to the ground electrode of the
output filter capacitors. Refer to layout guideline section.
21-24
Input power supply. Connect to input power supply. Decouple with input
capacitor to PGND (pins 19-20).
25-26
No connect – Do not electrically connect these pins to each other or to PCB.
27
Optional Over Current Protection adjust pin. Place ROCP resistor between
this pin and AGND (pin 40) to increase the over current trip point by 50%.
28
Analog voltage input for the controller circuits. Connect this pin to the input
power supply.
29
Analog ground for the controller circuits.
30-31
No connect – Do not electrically connect these pins to each other or to PCB.
32
Voltage select line 2 input. See Table 1.
33
Voltage select line 1 input. See Table 1.
34
Voltage select line 0 input. See Table 1.
35
Power OK is an open drain transistor for power system state indication. POK
is a logic high when VOUT is with -10% to +20% of VOUT nominal.
36
Remote voltage sense input. Connect this pin to the load voltage at the point
to be regulated.
37
Soft-Start node. The soft-start capacitor is connected between this pin and
AGND. The value of this resistor determines the startup timing.
38
Optional Error Amplifier input. Allows for customization of the control loop.
39
Optional Error Amplifier output. Allows for customization of the control loop.
40
Optional Error Amplifier Buffer output. Allows for customization of the control
loop.
41
Input Enable. Applying a logic high, enables the output and initiates a soft-
start. Applying a logic low disables the output.
42-44
No connect – Do not electrically connect these pins to each other or to PCB.
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Block Diagram
(+)
(-)
Error
Amp
VOUT
P-Drive
N-Drive
UVLO
Thermal Limit
Current Limit
Soft Start
Sawtooth
Generator
(+)
(-)
PWM
Comp
PVIN
ENABLE
Compensation
Network
Bandgap
Reference
PGND
Voltage
Selector
VS0
VS1
VS2
VSENSE
EAIN
EAOUT
ROCP
SS Reference
Voltage
selector
COMP
Over Voltage
power
Good
Logic
Over
Voltage VOUT
POK
Figure 3. System block diagram.
Absolute Maximum Ratings
CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond
recommended operating conditions is not implied. Stress beyond Absolute maximum ratings may
cause permanent damage to the device. Exposure to absolute maximum rated conditions for
extended periods may affect device reliability.
Maximum Electrical Ratings
Min
Max
Voltages on: VIN, VOUT
-0.3V
7.0V
Voltages on: VSENSE
-0.3V
VIN + 0.3V
Voltages on: VS0-VS2 (Note 1)
-0.3V
VIN + 0.3V
Voltages on: ENABLE
-0.3V
VIN + 0.3V
Maximum Thermal Ratings
Ambient operating range
-40°C
+85°C
Storage Temperature Range
-65°C
+150°C
Reflow Peak Body Temperature MSL3 (10 Sec)
+260°C
Note 1: VS0-VS2 pins have an internal pull-up resistor, only ground potentials should be placed on them as required.
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Recommended Operating Conditions
PARAMETER
SYMBOL
MIN
MAX
UNITS
Input Voltage Range (for output voltages < 1.2V)
VIN
2.375
5.5
V
Input Voltage Range (for output voltages ≥ 1.2V)
VIN
2.375
6.6
V
EN5335QI Operating Ambient Temperature
TA
-40
+85
°C
Operating Junction Temperature
TJ
-40
+125
°C
Thermal Characteristics
PARAMETER
SYMBOL
TYP
UNITS
Thermal Shutdown
TSD
150
°C
Thermal Shutdown Hysteresis
TSDH
15
°C
Thermal Resistance: Junction to Case (0 LFM) (Note 2)
JC
3
°C/W
Thermal Resistance: Junction to Ambient (0 LFM)
JA
25
°C/W
Note 2: Based on a four-layer board and proper thermal design in line with JEDEC EIJ/JESD 51 Standards.
Electrical Characteristics
NOTE: VIN=5.5V over operating temperature range unless otherwise noted. Typical values are at TA =
25°C.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Operating Input
Voltage (for output
voltages < 1.2V)
VIN
2.375
5.5
V
Operating Input
Voltage (for output
voltages ≥ 1.2V)
VIN
2.375
6.6
V
VOUT Initial Accuracy
VOUT_INIT
TA = 25C, VIN = 5.0V, ILOAD = 0A;
All VID Settings except 0.8V
0.8V
-2
-3
+2
+2
%
VID Output Voltage
Settings
VOUT
VS2 VS1 VS0
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
3.3
2.5
1.8
1.5
1.25
1.2
0.8
reserved
V
Drop out voltage
VIN - VOUT
Drop out voltage at full load
600
mV
Shut-Down Supply
Current
IS
ENABLE=0V
100
A
Switching Frequency
FOSC
5
MHz
VOUT
Output Voltage
Regulation
VOUT
Over line, load and temperature
VID Output Voltage Setting (V):
1.2, 1.25, 1.5, 1.8, 2.5, 3.3
0.8V
-3.0
-4.0
3.0
4.0
%
Maximum Continuous Output Current
Over Current Trip
Piont
IOCP
4.5
A
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PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Enable Operation
Disable Threshold
VDISABLE
Max voltage to ensure the converter is
disabled
0.8
V
Enable Threshold
VENABLE
2.375V ≤ VIN ≤ 5.5V
5.5V < VIN
1.8
2.0
V
Enable Pin Current
IENABLE
VIN = 5.5V
50
A
Voltage Select Operation
VSX Logic Low
Threshold
VSX-Low
Threshold voltage for Logic Low
0.8
V
VSX Logic High
Threshold
VSX-High
Threshold voltage for Logic High
(internally pulled high; can be left
floating to achieve logic high)
1.8
VIN
V
VSX Pin Current
IVSX
(VIN = 5.5V)
VSx = GND
VSx = VIN
VSx = Open
50
0
0
A
Power OK Operation
POK low voltage
VPOK
IPOK = 4mA (sink current)
0.4
V
Max POK Voltage
VPOK
VIN
V
Typical Performance Characteristics
Efficiency versus Load, VIN = 5.0V Efficiency versus Load, VIN = 3.3V
50
55
60
65
70
75
80
85
90
95
0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9
Lo ad Current (A)
Efficiency (%)
VIN=5.0V
VOUT = 3.3V
VOUT = 2.5V
VOUT = 1.8V
VOUT = 1.5V
VOUT = 1.2V
50
55
60
65
70
75
80
85
90
95
0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9
Lo ad Current (A)
Efficiency (%)
VIN=5.0V
VOUT = 3.3V
VOUT = 2.5V
VOUT = 1.8V
VOUT = 1.5V
VOUT = 1.2V
50
55
60
65
70
75
80
85
90
95
0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9
Lo ad Current (A)
Efficiency (%)
VIN=3.3V
VOUT = 0.8V
VOUT = 2.5V
VOUT = 1.8V
VOUT = 1.5V
VOUT = 1.2V
50
55
60
65
70
75
80
85
90
95
0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9
Lo ad Current (A)
Efficiency (%)
VIN=3.3V
VOUT = 0.8V
VOUT = 2.5V
VOUT = 1.8V
VOUT = 1.5V
VOUT = 1.2V
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Load transient, 0 – 3A, VIN/VOUT = 5.5V/1.2V Load transient, 0 – 3A, VIN/VOUT = 5.5V/3.3V
Start-up waveform, VIN/VOUT = 5.5V/1.2V Shut-down waveform, VIN/VOUT = 5.5V/1.2V
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Theory of Operation
Synchronous Buck Converter
The EN5335QI is a synchronous, pin
programmable power supply with integrated
power MOSFET switches and integrated
inductor. The nominal input voltage range is 2.4-
5.0V. The output can be set to common pre-set
voltages by connecting appropriate combinations
of 3 voltage selection pins to ground. The
feedback control loop is a type III voltage-mode
and the part uses a low-noise PWM topology. Up
to 3A of output current can be drawn from this
converter. The 5MHz operating frequency
enables the use of small-size output capacitors.
The power supply has the following protection
features:
Over-current protection (to protect the IC
from excessive load current)
Thermal shutdown with hysteresis
Over-voltage protection
Under-voltage lockout circuit to disable the
converter output when the input voltage is
less than approximately 2.2V
Additional features include:
Soft-start circuit, limiting the in-rush
current when the converter is powered up
Power good circuit indicating whether the
output voltage is within 90% - 120% of the
programmed voltage
Output Voltage Programming
The EN5335QI output voltage is programmed
using a 3-pin voltage-ID or VID selector. Three
binary VID pins allow the user to choose one of
seven pre-set voltages. Refer to Table 1 for the
proper VID pin settings to choose VOUT.
The voltage select pins, VS0, VS1, and VS2, are
pulled-up internally and so will default to a logic
high, or “1”, if left “open”. Connecting the voltage
select pin to ground will result in a logic “0”.
Table 1: Output Voltage Select Table:
VS2*
VS1*
VS0*
Output Voltage
0
0
0
3.3V
0
0
1
2.5V
0
1
0
1.8V
0
1
1
1.5V
1
0
0
1.25V
1
0
1
1.2V
1
1
0
0.8V
1
1
1
Reserved
Input Capacitor Selection
The EN5335QI requires about 20uF of input
capacitance. Low-cost, low-ESR ceramic
capacitors should be used as input capacitors for
this converter. The dielectric must be X5R or
X7R rated. In some applications, lower value
capacitors are needed in parallel with the larger,
capacitors in order to provide high frequency
decoupling. It is recommended to use 10V rated
MLCC capacitors.
Table 2. Recommended input capacitors.
Description
MFG
P/N
10uF, 10V, 10%
X7R, 1206
(2 capacitors needed)
Murata
Taiyo Yuden
GRM31CR71A106KA01L
LMK316B7106KL-T
22uF, 10V, 10%
X7R, 1210
(1 capacitor needed)
Murata
Taiyo Yuden
GRM32ER71A226KE20L
LMK325B7226KM-T
Output Capacitor Selection
The EN5335QI has been optimized for use with
approximately 50μF of output capacitance. Low
ESR ceramic capacitors are required with X5R or
X7R rated dielectric formulation. Y5V or
equivalent dielectric formulations must not be
used as these lose capacitance with frequency,
temperature and bias voltage.
Output ripple voltage is determined by the
aggregate output capacitor impedance. Output
impedance, denoted as Z, is comprised of
effective series resistance, ESR, and effective
series inductance, ESL:
Z = ESR + ESL.
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Placing output capacitors in parallel reduces the
impedance and will hence result in lower ripple
voltage.
nTotal ZZZZ 1
...
111
21
Typical ripple versus capacitance is given below:
Output Capacitor
Configuration
Typical Output Ripple (mVp-p)
(as measured on EN5335QI
Evaluation Board)
1 x 47 uF
30
3 x 22 uF
15
Table 3. Recommended output capacitors.
Description
MFG
P/N
22uF, 6.3V, 10%
X5R, 1206
(3 capacitors needed)
Murata
Taiyo Yuden
GRM31CR60J226KE19L
JMK316BJ226KL-T
47uF, 10V, 10%
X5R, 1210
47uF, 6.3V, 10%
X5R, 1210
(1 capacitor needed)
Murata
AVX
GRM32ER61A476KE20L
12106D476KAT2A
Enable Operation
The ENABLE pin provides a means to shut down
the device, or enable normal operation. A logic
high will enable the converter into normal
operation. When the ENABLE pin is asserted,
the device will undergo a normal soft start. A
logic low will disable the converter and cause it to
shut down. When Enable goes low, circuitry
internal to the device continue to operate to
ensure the output voltage is gradually returned to
zero and the circuits turn off subsequently. A
short low going pulse on Enable is ignored.
Soft-Start Operation
Soft start is a method to reduce in-rush current
when the device is enabled. The output voltage
is ramped up slowly upon start-up. The output
rise time is controlled by choice of a soft-start
capacitor, which is placed between the SS pin
(pin 37) and the AGND pin (pin 29).
Rise Time: TR = Css* 75K
During start-up of the converter, the reference
voltage to the error amplifier is gradually
increased from zero to its final level by an
internal current source of typically 10uA. Typical
soft-start rise time is 1mS to 3mS. The rise time
is measured from the time when AVIN > VUVLO
and the Enable signal crosses its logic high
threshold. Typical SS capacitor values are in the
range of 15nF to 50 nF.
Power-Up/Down Sequencing
During power-up, ENABLE should not be
asserted before PVIN, and PVIN should not be
asserted before AVIN. The PVIN should never
be powered when AVIN is off. During power
down, the AVIN should not be powered down
before the PVIN. Tying PVIN and AVIN or all
three pins (AVIN, PVIN, ENABLE) together
during power up or power down meets these
requirements.
Pre-Bias Start-up
The EN5335QI does not support startup into a
pre-biased condition. Be sure the output
capacitors are not charged or the output of the
EN5335QI is not pre-biased when the EN5335QI
is first enabled.
POK Operation
The POK signal is an open drain signal from the
converter indicating the output voltage is within
the specified range. The POK signal will be a
logic high when the output voltage is within 90% -
120% of the programmed output voltage. If the
output voltage goes outside of this range, the
POK signal will be a logic low until the output
voltage has returned to within this range. In the
event of an over-voltage condition the POK
signal will go low and will remain in this condition
until the output voltage has dropped to 95% of
the programmed output voltage before returning
to the high state (see also: Over-Voltage
Protection).
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Over-Current Protection
The current limit function is achieved by sensing
the current flowing through the sense P-
MOSFET. When the sensed current exceeds the
current limit, both NFET and PFET switches are
turned off. If the over-current condition is
removed, the over-current protection circuit will
enable the PWM operation. This circuit is
designed to provide high noise immunity.
The nominal over current trip point is set to 4.5A.
It is possible to increase the over-current set
point by about 50% by connecting a 7.5k
resistor between ROCP (pin 27) and GND. The
typical voltage at the ROCP pin is 0.75V.
In some cases, such as the start-up of FPGA
devices, it is desirable to blank the over-current
protection feature. In order to disable over-
current protection, the ROCP pin should be tied
to any voltage between 2.5V and PVIN.
Over-Voltage Protection
When the output voltage exceeds 120% of the
programmed output voltage, the PWM operation
stops, the lower N-MOSFET is turned on and the
POK signal goes low. When the output voltage
drops below 95% of the programmed output
voltage, normal PWM operation resumes and
POK returns to its high state.
Thermal Overload Protection
Thermal shutdown will disable operation once
the Junction temperature exceeds approximately
150ºC. Once the junction temperature drops by
approx 25ºC, the converter will re-start with a
normal soft-start.
Input Under-voltage Lock-out
Circuitry is provided to ensure that when the
input voltage is below the specified voltage
range, the converter will not start-up. Circuits for
hysteresis, input de-glitch and output leading
edge blanking are included to ensure high noise
immunity and prevent false tripping.
Compensation
The EN5335QI is internally compensated
through the use of a type 3 compensation
network and is optimized for use with about 50μF
of output capacitance and will provide excellent
loop bandwidth and transient performance for
most applications. (See the section on Capacitor
Selection for details on recommended capacitor
types.) Voltage mode operation provides high
noise immunity at light load.
In some cases modifications to the compensation
may be required. For more information, contact
Altera Power Applications support.
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Layout Recommendation
Figure 4 shows critical components and layer 1
traces of a recommended minimum footprint
EN5335QI layout. Alternate ENABLE
configurations and other small signal pins need
to be connected and routed according to specific
customer application. Please see the Gerber files
on the Altera website www.altera.com/enpirion
for exact dimensions and other layers. Please
refer to Figure 4 while reading the layout
recommendations in this section.
Recommendation 1: Input and output filter
capacitors should be placed on the same side of
the PCB, and as close to the EN5335QI package
as possible. They should be connected to the
device with very short and wide traces. Do not
use thermal reliefs or spokes when connecting
the capacitor pads to the respective nodes. The
+V and GND traces between the capacitors and
the EN5335QI should be as close to each other
as possible so that the gap between the two
nodes is minimized, even under the capacitors.
Recommendation 2: Two PGND pins are
dedicated to the input circuit, and two to the
output circuit. The slit in Figure 4 separating the
input and output GND circuits helps minimize
noise coupling between the converter input and
output switching loops.
Recommendation 3: The system ground plane
should be the first layer immediately below the
surface layer. This ground plane should be
continuous and un-interrupted below the
converter and the input/output capacitors. Please
see the Gerber files on the Altera website
www.altera.com/enpirion.
Recommendation 4: The large thermal pad
underneath the component must be connected to
the system ground plane through as many vias
as possible.
Figure 4: Top PCB Layer Critical Components
and Copper for Minimum Footprint
The drill diameter of the vias should be 0.33mm,
and the vias must have at least 1 oz. copper
plating on the inside wall, making the finished
hole size around 0.20-0.26mm. Do not use
thermal reliefs or spokes to connect the vias to
the ground plane. This connection provides the
path for heat dissipation from the converter.
Please see Figures: 7, 8, and 9.
Recommendation 5: Multiple small vias (the
same size as the thermal vias discussed in
recommendation 4 should be used to connect
ground terminal of the input capacitor and output
capacitors to the system ground plane. It is
preferred to put these vias under the capacitors
along the edge of the GND copper closest to the
+V copper. Please see Figure 4. These vias
connect the input/output filter capacitors to the
GND plane, and help reduce parasitic
inductances in the input and output current loops.
If the vias cannot be placed under CIN and COUT,
then put them just outside the capacitors along
the GND slit separating the two components. Do
not use thermal reliefs or spokes to connect
these vias to the ground plane.
Recommendation 6: AVIN is the power supply
for the internal small-signal control circuits. It
should be connected to the input voltage at a
quiet point. In Figure 4 this connection is made at
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the input capacitor close to the VIN connection.
Recommendation 7: The layer 1 metal under
the device must not be more than shown in
Figure 4. See the section regarding exposed
metal on bottom of package. As with any switch-
mode DC/DC converter, try not to run sensitive
signal or control lines underneath the converter
package on other layers.
Recommendation 8: The VSENSE point should
be just after the last output filter capacitor. Keep
the sense trace as short as possible in order to
avoid noise coupling into the control loop.
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Design Considerations for Lead-Frame Based Modules
Exposed Metal on Bottom of Package
Lead frame offers many advantages in thermal performance, in reduced electrical lead resistance,
and in overall foot print. However, they do require some special considerations.
In the assembly process lead frame construction requires that, for mechanical support, some of the
lead-frame cantilevers be exposed at the point where wire-bond or internal passives are attached.
This results in several small pads being exposed on the bottom of the package.
Only the large thermal pad and the perimeter pads are to be mechanically or electrically connected to
the PC board. The PCB top layer under the EN5335QI should be clear of any metal except for the
large thermal pad. The “grayed-out” area in Figure 5 represents the area that should be clear of any
metal (traces, vias, or planes), on the top layer of the PCB. Figure 6 shows the recommended PCB
footprint for this device.
Figure 5. Lead-Frame exposed metal. Grey area highlights exposed metal that is not to be mechanically or
electrically connected to the PCB.
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Figure 6: EN5335QI PCB Footprint (Top View)
The solder stencil aperture for the thermal pad is shown in blue and is based on Enpirion power product manufacturing
specifications.
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Package Dimensions
Figure 7. Package Dimensions
Contact Information
Altera Corporation
101 Innovation Drive
San Jose, CA 95134
Phone: 408-544-7000
www.altera.com
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00846 October 11, 2013 Rev J