©2014ISSCTechnologiesCorp.
Preliminary
Revision2.0–October24,2014Page1
BM77SPPx3MC2
Bluetooth®4.0 DualModeModule
Features:
Complete,FullyCertified,Embedded2.4GHz
Bluetooth®Version4.0Module
BluetoothClassic(BR/EDR)andLowEnergy(LE)
BluetoothSIGCertified
OnboardembeddedBluetoothStack
TransparentUARTmodeforseamlessserialdataover
UARTinterface
EasytoconfigurewithWindowsGUIordirectbyMCU
FirmwarecanbefieldupgradableviaUART
Compactsurfacemountmodule:22x12x2.4mm
Castellatedsurfacemountpadsforeasyandreliable
hostPCBmounting
Environmentallyfriendly,RoHScompliant
PerfectforPortableBatteryOperatedDevices
InternalBatteryRegulatorCircuitry
Worldwideregulatorycertifications
Operational:
Singleoperatingvoltage:3.2Vto4.3V
Temperaturerange:‐40Cto85CIndustrial
Simple,UARTinterface
Integratedcrystal,internalvoltageregulator,and
matchingcircuitry
MultipleI/Opinsforcontrolandstatus
RF/Analog:
Frequency:2.402to2.480GHz
ReceiveSensitivity:‐90dBm(Classic);‐92dBm(LE)
PowerOutput:2dBm(typ.)
DataThroughput:
3Mbps(Classic)
8Kbps(LE)
MAC/Baseband/HigherLayer:
SecureAES128encryption
GAP,SDP,SPP,GATTprofiles
Antenna:
CeramicChipAntenna(BM77SPPS3MC2)
ExternalAntennaConnectionviaRFPad
(BM77SPP03MC2)
Compliance:
BluetoothSIGQDID:B021961
ModularCertifiedfortheUnitedStates(FCC)and
Canada(IC)
EuropeanR&TTEDirectiveAssessedRadioModule
Australia,NewZealand,Korea,Taiwan,Japan
FIGURE1:
GeneralDescription:
TheBM77isafully‐certifiedBluetooth®Version4.0
(BR/EDR/LE)modulefordesignerswhowanttoeasilyadd
dualmodeBluetooth®wirelesscapabilitytotheirproducts.
DeliveringlocalconnectivityfortheInternetofThings(IoT),
theBM77bridgesyourproducttoSmartPhonesandTablets
forconvenientdatatransfer,controlandaccesstocloud
applications.
ThisBluetoothSIGcertifiedmoduleprovidesacomplete
wirelesssolutionwithBluetoothstackonboard,integrated
antenna,andworldwideradiocertificationsinacompact
surfacemountpackage,22x12x2.4mm.ItsupportsGAP,
SDP,SPP,andGATTprofiles.Dataistransferredoverthe
Bluetoothlinkbysending/receivingdataviatransparent
UARTmode,makingiteasytointegratewithanyprocessor
orMicrocontrollerwithaUARTinterface.Configurationis
madeeasyusingaWindows®basedGUIordirectlyviaUART
byaMCU.
Applications:
MobilePointofSales(mPOS)
LEDlighting
Wearables
DigitalSports
FitnessDevices
HealthCare/Medical
AutomotiveAccessories
HomeAutomation
RemoteControlToys
30077 新竹科學工業園區工業東七路5號5樓
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu 30077, Taiwan, R.O.C.
TEL : 886-3-577-8385 FAX : 886-3-577-8945
www.issc-tech.com
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page2
1.0 DEVICEOVERVIEW
TheBM77isacomplete,fullycertified,embedded2.4GHzBluetooth®version4.0(BR/EDR/LE)wireless
module.Itincorporatesanon‐boardBluetoothstack,cryptographicaccelerator,powermanagement
subsystem,2.4GHztransceiver,andRFpoweramplifier(seeFigure1‐1).WiththeBM77,designerscan
embedBluetoothfunctionalityrapidlyintovirtuallyanydevice.
TheBM77providescostandtime‐to‐marketsavingsasaself‐containedmodulesolution.Themodule
hasbeendesignedtoprovideintegratorswithasimpleBluetoothsolutionthatfeatures:
Easeofintegrationandprogramming
Vastlyreduceddevelopmenttime
Minimumsystemcost
InteroperabilitywithBluetoothhosts
Maximumvalueinarangeofapplications
TheBM77canindependentlymaintainalow‐powerwirelessconnection.Low‐powerusageandflexible
powermanagementmaximizethemodule’slifetimeinbattery‐operateddevices.Awideoperating
temperaturerangeallowsuseinindoorandoutdoorenvironments(industrialtemperaturerange).
TheBM77modulecomesintwovarieties.TheBM77SPPS3MC2isacomplete,fullyregulatorycertified
modulewithintegralceramicchipantennaandshield.TheBM77SPP03MC2isalowercostalternative
withexternalantennaandnoshield.Theintegratorisresponsiblefortheantenna,antennamatching,
andregulatorycertifications.
TheBM77isasmall,compact,surfacemountmodulewithcastellatedpadsforeasyandreliablehost
PCBmounting.Themoduleiscompatiblewithstandardpick‐and‐placeequipment.
TABLE1‐1:BM77MODULEFAMILYTYPES
DeviceAntennaShieldRegulatoryCertifications
BM77SPPS3MC2‐0007AAIntegralceramicchipYesFCC,IC,CE,KCC,NCC,Japan
BM77SPP03MC2‐0007AAExternalNoCE
FIGURE1‐1:BM77BLOCKDIAGRAM
Ceramic Chip Antenna
(BM77SPPS3MC2)
RF Matching
Configurable
Control and
Indication I/O UART
16 MHz
External Ante nn a
(BM77SPP03MC2)
I2C
8Kbit
Serial
EEPROM
IS1677SM
Power
BM77SPPx3MC2
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page3
1.1 InterfaceDescription
TheBM77SPPS3MC2pindiagramisshowninFigure1‐2andtheBM77SPP03MC2isshowninFigure1‐3.
ThepindescriptionsareshowninTable1‐1
FIGURE1‐2:BM77SPPS3MC2PINDIAGRAM
FIGURE1‐3:BM77SPP03MC2PINDIAGRAM
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page4
TABLE1‐1:PINDESCRIPTION
BM77SPPS3MC2
Pin
BM77SPP03MC2
PinSymbolTypeDescription
1 ‐‐ GND PowerGroundreference
2 ‐‐ GND PowerGroundreference
31GND PowerGroundreference
42BAT_IN PowerBatteryInput.Mainpositivesupplyinput.Connectto10
uFlowESRceramiccapacitor.
53SW_BTN DISoftwareButtonH:PowerOn/L:PowerOff
(SeeSection1.6)
64LDO33_O PowerInternal3.3VLDOregulatoroutput.Connectto10uFlow
ESRceramiccapacitor.
75VDD_IO PowerI/Opositivesupplyinput.EnsureVDD_IOandMCUI/O
voltagesarecompatible.
86LDO18_O PowerInternal1.8VLDOregulatoroutput.Connectto10uFlow
ESRceramiccapacitor.
97WAKEUP DIWakeupfromshutdownmode(activelow)
(internalpull‐up)
108PMULDO_O PowerPowermanagementunitoutput.Connectto1uFlowESR
ceramiccapacitor.
119P04 DOStatusIndicator2(STATUS_IND_2).SeeSection1.5
1210P15 DOStatusIndicator1(STATUS_IND_1).SeeSection1.5
1311P12/SCL DOI2CSCL(DoNotConnect)
1412P13/SDA DIOI2CSDA(DoNotConnect)
1513P17/CTS DIOConfigurableControlorIndicationpinorUARTCTS(input)
1614P05 DIOConfigurableControlorIndicationpin
1715P00/RTS DIOConfigurableControlorIndicationpinorUARTRTS
(output)
1816P20 DISystemconfiguration(internalpull‐up)
(SeeSection1.10)
1917P24 DISystemconfiguration(internalpull‐up)
(SeeSection1.10)
2018EAN DISystemconfiguration(internalpull‐down)
(SeeSection1.10)
2119RST_N DIModulereset(activelow)(internalpull‐up)
Applyapulseofatleast63ns.
2220RXD DIUARTdatainput
2321TXD DOUARTdataoutput
2422P31 DIOConfigurableControlorIndicationpin
(whenconfiguredasinput:internalpull‐up)
2523P32 DIOConfigurableControlorIndicationpin
(whenconfiguredasinput:internalpull‐up)
2624P33 DIOConfigurableControlorIndicationpin
(whenconfiguredasinput:internalpull‐up)
2725P34 DIOConfigurableControlorIndicationpin
(whenconfiguredasinput:internalpull‐up)
2826P36 DIO(DoNotConnect)
2927P37 DIOConfigurableControlorIndicationpin
(whenconfiguredasinput:internalpull‐up)
3028LED1 DOStatusLED(SeeSection1.9)
3129GND PowerGroundreference
‐‐ 30BT_RF AIOExternalantennaconnection(50ohm)
32 ‐‐ GND PowerGroundreference
33 ‐‐ GND PowerGroundreference
Note1:Pintypeabbreviation:A=Analog,D=Digital,I=Input,O=Output.
BM77SPPx3MC2
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1.2 ConfiguringtheBM77
ConfiguringtheBM77featurescanbeperformedusingeitherMCUcommandsdocumentedinthe“ISSC
FlashProtocolProgrammer’sGuide,”orwiththe“WindowsUIConfigurationtool”and“WriteEEPROM
tool.”MCUUARTcommandsaredocumentedin“BM77SPPCommandSet.”
1.3 UARTInterface
Figures1‐4and1‐5showPowerandMCUinterfaceexamples.
TheBM77UARTpinsTXDandRXDconnecttotheUARTpinsofthehostMCU.Itishighly
recommendedtousehardwareflowcontrolpinsRTSandCTS.TheBM77hardwareflowcontrolis
disabledbydefaultandmustbeconfiguredtoenable.TheUARTBaudisconfigurable.Theavailable
signalratesarelistedinTable4‐5.
1.4 ControlandIndicationI/OPins
I/OpinsP00,P05,P17,P31,P32,P33,P34andP37areconfigurablecontrolandindicationI/O.Control
signalsareinputtotheBM77.IndicationsignalsareoutputfromtheBM77.Table1‐2shows
configurableI/Opinassignmenttocontrolandindicationsignals.NotethatRTScanonlybeassignedto
P00andCTStoP17.
TABLE1‐2:CONFIGURATIONANDINDICATIONI/OASSIGNMENTS
N/C
UART_RTS
UART_CTS
LOW_BATTERY_IND
LINK_QUALITY_IND
DISCONNECT_CONTROL
UART_RX_IND
DISCOVERY_CONTROL
INQUIRYCONTROL
PROFILE_IND
P00 Default
P05 Default
P17 Default
P31 Default
P32 Default
P33 Default
P34 Default
P37 Default
1.5 StatusIndicationI/OPins
I/OpinsP15andP04areStatusIndicator1and2signalsrespectively.Togethertheyprovidestatus
indicationtotheMCUasshowninTable1‐3.
TABLE1‐3:STATUSINDICATION
P04/STATUS
_
IND
_
2 P15/STATUS
_
IND
_
1Indication
HHPowerdefault/Shutdownstate
HLAccessstate
LHLinkstate(noUARTdatabeingtransmitted)
LLLinkstate(UARTdatabeingtransmitted)
BM77SPPx3MC2
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1.6 SoftwareButton(SW_BTN)
TheSoftwareButton(SW_BTN)inputpinpowerstheBM77on(high)oroff(low)
1.7 WAKEUP(WAKEUP)
TheWakeUp(WAKEUP)inputpinwakestheBM77fromshutdownmode(activelow).
1.8 RESET(RST_N)
TheReset(RST_N)inputpinresetstheBM77(activelowpulseforatleast63ns).
1.9 StatusLED(LED1)
ThestatusLED(LED1)indicates:
Standby
Inquiry
Link
LinkBack
LowBattery
Page
Eachindicationisaconfigurableflashingsequence.LEDbrightnesscanalsobeconfigured.
1.10 SystemConfiguration
I/OpinsP20,P24,andEANplacetheBM77intooperationmodesasshowninTable1‐4.P20andP24
eachhaveinternalpull‐ups.EANhasinternalpull‐down.
TABLE1‐4:SYSTEMCONFIGURATIONSETTINGS
P20P24EANOperationalMode
HighHighLowNormaloperation
LowHighLowTest(WriteEEPROM)
LowLowHighWriteFlash(Firmwareprogramming)
1.11 Power
Figure1‐4showsanexamplepowerschemeusinga3.3voltlow‐dropout(LDO)regulatorsupplying3.3
voltstoboththeBM77(BAT_INandVDD_IO)andMCUVDD.ThispowerschemeensuresthatBM77
andMCUI/Ovoltagesarecompatible.
Figure1‐5showsanexamplepowerschemeusinga3.7voltlithium‐ionbattery.TheBM77hasan
internal3.3voltLDOregulator.BatterypowerisappliedtoBAT_INpin.Theregulated3.3voltsoutput
isontheLDO33_Opin.FromtheLDO33_Opin,voltagecanberoutedtheVDD_IOpinandexternal
circuitryincludingtheMCU.ThispowerschemeensuresthatBM77andMCUI/Ovoltagesare
compatible.
CAUTION:Theinternal3.3voltLDOcurrentsource:50mAmaximum
RecommendedbypasscapacitorlocationandvaluesareshowninFigures1‐4and1‐5.Capacitorscanbe
lowESRceramic.PlacecapacitorsclosetoBM77module.
BM77SPPx3MC2
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FIGURE1‐4:BM77TOMCUINTERFACEEXAMPLE–LDO
P24
EAN
P20
FIGURE1‐5:BM77TOMCUINTERFACEEXAMPLE–BATTERY
BAT_IN
BM77 Module
(3.2 – 4.3V)
LDO33_O
VDD_IO (Note 1)
LDO18_O
SW_BTN
TXD
RXD
WAKEUP
P24
EAN
RST_N
P20
P12/SCL
P13/SDA
P37
P34
P33
P32
P31
P04/STATUS_IND_2
P15/STATUS_IND_1
PMULDO_O
MCU
VDDI/O
CTS
RTS
RX
TX
NC
(2.8 – 3.63V)
Li-ion Battery
System Configuration
P05
P00/RTS
P17/CTS
P36 NC
NC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
(3.7V)
Note 2
Note: 1. Ensure VDD_IO and MCU VDD voltages are compatible.
2. Control and indication ports are configurable.
Note 1
LED1
10uF
10uF
NC
NC
LDO (3.3V)
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page8
1.12 MountingDetails
TheBM77SPPS3MC2physicaldimensionsareshowninFigure1‐6,recommendedhostPCBfootprintin
Figure1‐7,andmountingsuggestioninFigure1‐8.Thereshouldnotbetopcopperlayernearthetest
pinareashowninFigure1‐7.WhenlayingoutthehostPCB,theareasundertheantennashouldnot
containanytop,innerlayer,orbottomcopperasshowninFigure1‐8.Alow‐impedancegroundplane
willensurebestradioperformance(bestrange,lowestnoise).Figure1‐8showsaminimumground
planeareatotheleftandrightofthemoduleforbestantennaperformance.Thegroundplanecanbe
extendedbeyondtheminimumrecommendedasneedforhostPCBEMCnoisereduction.Forbest
rangeperformance,keepallexternalmetalawayfromtheceramicchipantennaatleast31mm.
TheBM77SPP03MC2physicaldimensionsareshowninFigure1‐9,recommendedhostPCBfootprintin
Figure1‐10,andmountingsuggestioninFigure1‐11.ItishighlyrecommendedtolayoutthehostPCBas
suggestedinFigure1‐11.Alow‐impedancegroundplanewillensurebestradioperformance(best
range,lowestnoise).Pin30(BT_RF)isa50ohmconnectiontoanexternalantennaconnector,PCB
traceantenna,orcomponent(ceramicchip)antennathroughahostPCB50ohmmicro‐striptrace.This
tracecanbeextendedtoincludepassivepartsforantennaattenuationpadding,impedancematching,
ortoprovidetestposts.Itisrecommendedthatthemicro‐striptracebeasshortaspossiblefor
minimumlossandbestimpedancematching.Ifthemicro‐striptraceislonger,itshouldbea50ohm
impedance.Figure1‐11showsanexampleconnectiontoU.FLconnector.
1.13 SolderingRecommendations
TheBM77wirelessmodulewasassembledusingstandardlead‐freereflowprofileIPC/JEDECJ‐STD‐020.
ThemodulecanbesolderedtothehostPCBusingstandardleadedandlead‐freesolderreflowprofiles.
Toavoiddamagingthemodule,thefollowingrecommendationsaregiven:
MicrochipTechnologyApplicationNoteAN233SolderReflowRecommendation(DS00233)
providessolderreflowrecommendations
Donotexceedpeaktemperature(TP)of250degC
Refertothesolderpastedatasheetforspecificreflowprofilerecommendations
Useno‐cleanfluxsolderpaste
Donotwashasmoisturecanbetrappedundertheshield
Useonlyoneflow.IfthePCBrequiresmultipleflows,applythemoduleonthefinalflow.
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page9
FIGURE1‐6:BM77SPPS3MCSMODULEDIMENSIONS
FIGURE1‐7:BM77SPPS3MC2RECOMMEDEDPCBFOOTPRINT
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page10
FIGURE1‐8:BM77SPPS3MCSHOSTPCBMOUNTINGSUGGESTION
Top and Bottom Copper
layer keep out area
Top Copper Layer
Bottom Copper Layer
>6.4mm
>4.7mm
Edge of
host PCB
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page11
FIGURE1‐9:BM77SPP03MCSMODULEDIMENSIONS
FIGURE1‐10:BM77SPP03MC2RECOMMEDEDPCBFOOTPRINT
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page12
FIGURE1‐11:BM77SPP03MCSHOSTPCBMOUNTINGSUGGESTION
Top Copper Lay er
B ott om Copper Layer
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page13
2.0 APPLICATIONINFORMATION
2.2 BM77SPPS3MC2CeramicChipAntenna
TheBM77SPPS3MC2modulecontainsanintegralceramicchipantenna.Theantennaperformanceon
themoduleisshowninFigure2‐1.
FIGURE2‐1:BM77SPPS3MC2ANTENNARADIATIONPATTERN
Gain (dBi)
0.0
5.0
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
X-axis
Y-axis
Z-axis
Frequency2450MHz
MaxGain1.63dBi
Efficiency71.55%
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page14
2.3 ExternalConfigurationandProgramming
TheBM77modulecanbeconfiguredandfirmwareprogrammedusinganexternalconfigurationand
programmingtoolavailablefromISSCTechnologies.Figure2‐2showstheconnectionsbetweenthe
BM77andheaderJ1,astandard8‐pin0.100”(2.54mm)spacedheader.Itisrecommendedtoinclude
thisheaderonthehostPCBfordevelopment.
ConfigurationandfirmwareprogrammingmodesareenteredaccordingtothesystemconfigurationI/O
pins(seeSection1.8).
FIGURE2‐2:EXTERNALPROGRAMMINGHEADERCONNECTIONS
CTS/P17
RTS/P00
P24
EAN
RST_N
P20
P05
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page15
3.0 REGULATORYAPPROVAL
ThissectionoutlinestheregulatoryinformationfortheBM77SSPS3MC2moduleforthefollowing
countries:
UnitedStates
Canada
Europe
Australia
NewZealand
Japan
Korea
Taiwan
OtherRegulatoryJurisdictions
3.2 UnitedStates
TheBM77SSPS3MC2modulehasreceivedFederalCommunicationsCommission(FCC)CFR47
Telecommunications,Part15SubpartC“IntentionalRadiators”modularapprovalinaccordancewith
Part15.212ModularTransmitterapproval.ModularapprovalallowstheendusertointegratetheBM77
moduleintoafinishedproductwithoutobtainingsubsequentandseparateFCCapprovalsforintentional
radiation,providednochangesormodificationsaremadetothemodulecircuitry.Changesor
modificationscouldvoidtheuser’sauthoritytooperatetheequipment.Theendusermustcomplywith
alloftheinstructionsprovidedbytheGrantee,whichindicateinstallationand/oroperatingconditions
necessaryforcompliance.
ThefinishedproductisrequiredtocomplywithallapplicableFCCequipmentauthorizationsregulations,
requirementsandequipmentfunctionsnotassociatedwiththetransmittermoduleportion.For
example,compliancemustbedemonstratedtoregulationsforothertransmittercomponentswithinthe
hostproduct;torequirementsforunintentionalradiators(Part15SubpartB“UnintentionalRadiators”),
suchasdigitaldevices,computerperipherals,radioreceivers,etc.;andtoadditionalauthorization
requirementsforthenon‐transmitterfunctionsonthetransmittermodule(i.e.,Verification,or
DeclarationofConformity)(e.g.,transmittermodulesmayalsocontaindigitallogicfunctions)as
appropriate.
3.2.1 LABELINGANDUSERINFORMATIONREQUIREMENTS
TheBM77modulehasbeenlabeledwithitsownFCCIDnumber,andiftheFCCIDisnotvisiblewhen
themoduleisinstalledinsideanotherdevice,thentheoutsideofthefinishedproductintowhichthe
moduleisinstalledmustalsodisplayalabelreferringtotheenclosedmodule.Thisexteriorlabelcanuse
wordingasfollows:
ContainsTransmitterModuleFCCID:A8TBM77SPPSYC2A
or
ContainsFCCID:A8TBM77SPPSYC2A
ThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothe
followingtwoconditions:(1)thisdevicemaynotcauseharmfulinterference,
and(2)thisdevicemustacceptanyinterferencereceived,including
interferencethatmaycauseundesiredoperation
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page16
Auser’smanualforthefinishedproductshouldincludethefollowingstatement:
AdditionalinformationonlabelinganduserinformationrequirementsforPart15devicescanbefound
inKDBPublication784748availableattheFCCOfficeofEngineeringandTechnology(OET)Laboratory
DivisionKnowledgeDatabase(KDB)http://apps.fcc.gov/oetcf/kdb/index.cfm.
3.2.2 RFEXPOSURE
AlltransmittersregulatedbyFCCmustcomplywithRFexposurerequirements.KDB447498GeneralRF
ExposureGuidanceprovidesguidanceindeterminingwhetherproposedorexistingtransmitting
facilities,operationsordevicescomplywithlimitsforhumanexposuretoRadioFrequency(RF)fields
adoptedbytheFederalCommunicationsCommission(FCC).
FromtheFCCGrant:Outputpowerlistedisconducted.Thisgrantisvalidonlywhenthemoduleissold
toOEMintegratorsandmustbeinstalledbytheOEMorOEMintegrators.Thistransmitterisrestricted
forusewiththespecificantenna(s)testedinthisapplicationforCertificationandmustnotbeco‐located
oroperatinginconjunctionwithanyotherantennaortransmitterswithinahostdevice,exceptin
accordancewithFCCmulti‐transmitterproductprocedures.
3.2.3 HELPFULWEBSITES
FederalCommunicationsCommission(FCC):http://www.fcc.gov
FCCOfficeofEngineeringandTechnology(OET)LaboratoryDivisionKnowledgeDatabase(KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
Thisequipmenthasbeentestedandfoundtocomplywiththelimitsfora
ClassBdigitaldevice,pursuanttopart15oftheFCCRules.Theselimitsare
designedtoprovidereasonableprotectionagainstharmfulinterferenceina
residentialinstallation.Thisequipmentgenerates,usesandcanradiateradio
frequencyenergy,andifnotinstalledandusedinaccordancewiththe
instructions,maycauseharmfulinterferencetoradiocommunications.
However,thereisnoguaranteethatinterferencewillnotoccurinaparticular
installation.Ifthisequipmentdoescauseharmfulinterferencetoradioor
televisionreception,whichcanbedeterminedbyturningtheequipmentoff
andon,theuserisencouragedtotrytocorrecttheinterferencebyoneor
moreofthefollowingmeasures:
Reorientorrelocatethereceivingantenna.
Increasetheseparationbetweentheequipmentandreceiver.
Connecttheequipmentintoanoutletonacircuitdifferentfromthat
towhichthereceiverisconnected.
Consultthedealeroranexperiencedradio/TVtechnicianforhelp.
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page17
3.3 Canada
TheBM77SSPS3MC2modulehasbeencertifiedforuseinCanadaunderIndustryCanada(IC)Radio
StandardsSpecification(RSS)RSS‐210andRSS‐Gen.Modularapprovalpermitstheinstallationofa
moduleinahostdevicewithouttheneedtorecertifythedevice.
3.3.1 LABELINGANDUSERINFORMATIONREQUIREMENTS
LabelingRequirementsfortheHostDevice(fromSection3.2.1,RSS‐Gen,Issue3,December2010):The
hostdeviceshallbeproperlylabeledtoidentifythemodulewithinthehostdevice.
TheIndustryCanadacertificationlabelofamoduleshallbeclearlyvisibleatalltimeswheninstalledin
thehostdevice,otherwisethehostdevicemustbelabeledtodisplaytheIndustryCanadacertification
numberofthemodule,precededbythewords“Containstransmittermodule”,ortheword“Contains”,
orsimilarwordingexpressingthesamemeaning,asfollows:
UserManualNoticeforLicense‐ExemptRadioApparatus(fromSection7.1.3RSS‐Gen,Issue3,
December2010):Usermanualsforlicense‐exemptradioapparatusshallcontainthefollowingor
equivalentnoticeinaconspicuouslocationintheusermanualoralternativelyonthedeviceorboth:
ContainstransmittermoduleIC:12246A‐BM77SPPSYC2
ThisdevicecomplieswithIndustryCanadalicense‐exemptRSSstandard(s).
Operationissubjecttothefollowingtwoconditions:(1)thisdevicemaynot
causeinterference,and(2)thisdevicemustacceptanyinterference,including
interferencethatmaycauseundesiredoperationofthedevice.
LeprésentappareilestconformeauxCNRd'IndustrieCanadaapplicablesaux
appareilsradioexemptsdelicence.L'exploitationestautoriséeauxdeux
conditionssuivantes:(1)l'appareilnedoitpasproduiredebrouillage,et(2)
l'utilisateurdel'appareildoitacceptertoutbrouillageradioélectriquesubi,
mêmesilebrouillageestsusceptibled'encompromettrelefonctionnement.
PENDING
BM77SPPx3MC2
©2014ISSCTechnologiesCorp.PreliminaryRevision2.0–October24,2014Page18
TransmitterAntenna(fromSection7.1.2RSS‐Gen,Issue3,December2010):Usermanualsfor
transmittersshalldisplaythefollowingnoticeinaconspicuouslocation:
Theabovenoticemaybeaffixedtothedeviceinsteadofdisplayedintheusermanual.
Usermanualsfortransmittersequippedwithdetachableantennasshallalsocontainthefollowing
noticeinaconspicuouslocation:
Immediatelyfollowingtheabovenotice,themanufacturershallprovidealistofallantennatypes
approvedforusewiththetransmitter,indicatingthemaximumpermissibleantennagain(indBi)and
requiredimpedanceforeach.
3.3.2 RFEXPOSURE
AlltransmittersregulatedbyICmustcomplywithRFexposurerequirementslistedinRSS‐102‐Radio
Frequency(RF)ExposureComplianceofRadiocommunicationApparatus(AllFrequencyBands).
(GetdirectquotefromCertificateandplacehere)
UnderIndustryCanadaregulations,thisradiotransmittermayonlyoperate
usinganantennaofatypeandmaximum(orlesser)gainapprovedforthe
transmitterbyIndustryCanada.Toreducepotentialradiointerferenceto
otherusers,theantennatypeanditsgainshouldbesochosenthatthe
equivalentisotropicallyradiatedpower(e.i.r.p.)isnotmorethanthat
necessaryforsuccessfulcommunication.
Conformémentàlaréglementationd'IndustrieCanada,leprésentémetteur
radiopeutfonctionneravecuneantenned'untypeetd'ungainmaximal(ou
inférieur)approuvépourl'émetteurparIndustrieCanada.Danslebutde
réduirelesrisquesdebrouillageradioélectriqueàl'intentiondesautres
utilisateurs,ilfautchoisirletyped'antenneetsongaindesortequela
puissanceisotroperayonnéeéquivalente(p.i.r.e.)nedépassepasl'intensité
nécessaireàl'établissementd'unecommunicationsatisfaisante.
Thisradiotransmitter(identifythedevicebycertificationnumber,ormodel
numberifCategoryII)hasbeenapprovedbyIndustryCanadatooperatewith
theantennatypeslistedbelowwiththemaximumpermissiblegainand
requiredantennaimpedanceforeachantennatypeindicated.Antennatypes
notincludedinthislist,havingagaingreaterthanthemaximumgain
indicatedforthattype,arestrictlyprohibitedforusewiththisdevice.
Conformémentàlaréglementationd'IndustrieCanada,leprésentémetteur
radiopeutfonctionneravecuneantenned'untypeetd'ungainmaximal(ou
inférieur)approuvépourl'émetteurparIndustrieCanada.Danslebutde
réduirelesrisquesdebrouillageradioélectriqueàl'intentiondesautres
utilisateurs,ilfautchoisirletyped'antenneetsongaindesortequela
puissanceisotroperayonnéeéquivalente(p.i.r.e.)nedépassepasl'intensité
nécessaireàl'établissementd'unecommunicationsatisfaisante.
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3.3.3 HELPFULWEBSITES
IndustryCanada:http://www.ic.gc.ca/
3.4 Europe
TheBM77SPPS3MC2moduleisanR&TTEDirectiveassessedradiomodulethatisCEmarkedandhas
beenmanufacturedandtestedwiththeintentionofbeingintegratedintoafinalproduct.
TheBM77modulehasbeentestedtoR&TTEDirective1999/5/ECEssentialRequirementsforHealthand
Safety(Article(3.1(a)),ElectromagneticCompatibility(EMC)(Article3.1(b)),andRadio(Article3.2)and
aresummarizedinTable3‐1:EuropeanComplianceTesting.ANotifiedBodyOpinionhasalsobeen
issued.AlltestreportsareavailableontheBM77productwebpageat
http://www.microchip.com/bm77.
TheR&TTEComplianceAssociationprovidesguidanceonmodulardevicesindocumentTechnical
GuidanceNote01availableathttp://www.rtteca.com/html/download_area.htm.
3.4.1 LABELINGANDUSERINFORMATIONREQUIREMENTS
ThelabelonthefinalproductwhichcontainstheBM77modulemustfollowCEmarkingrequirements.
TheR&TTEComplianceAssociationTechnicalGuidanceNote01providesguidanceonfinalproductCE
marking.
3.4.2 ANTENNAREQUIREMENTS
FromR&TTEComplianceAssociationdocumentTechnicalGuidanceNote01:
Providedtheintegratorinstallinganassessedradiomodulewithanintegralorspecificantenna
andinstalledinconformancewiththeradiomodulemanufacturer’sinstallationinstructions
requiresnofurtherevaluationunderArticle3.2oftheR&TTEDirectiveanddoesnotrequire
furtherinvolvementofanR&TTEDirectiveNotifiedBodyforthefinalproduct.[Section2.2.4]
TheEuropeanComplianceTestinglistedinTable3‐1wasperformedusingtheintegralceramicchip
antenna.
TABLE3‐1:EUROPEANCOMPLIANCETESTING
CertificationStandardsArticleLaboratoryReportNumberDate
Safety EN60950‐1:2006+A11:2009+A1:2010(3.1(a))
HealthEN50371:2002‐03
EMCEN301489‐1V1.8.1(2008‐04)(3.1(b))
EN301489‐17V2.1.1(2009‐05)
RadioEN300328V1.7.1(2006‐10)(3.2)
NotifiedBody
Opinion
Note:TomaintainconformancetothetestinglistedinTable3‐1:EuropeanComplianceTesting,the
moduleshallbeinstalledinaccordancewiththeinstallationinstructionsinthisdatasheetandshall
notbemodified.
Whenintegratingaradiomoduleintoacompletedproducttheintegratorbecomesthemanufacturer
ofthefinalproductandisthereforeresponsiblefordemonstratingcomplianceofthefinalproduct
withtheessentialrequirementsoftheR&TTEDirective.
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3.4.3 HELPFULWEBSITES
AdocumentthatcanbeusedasastartingpointinunderstandingtheuseofShortRangeDevices(SRD)
inEuropeistheEuropeanRadioCommunicationsCommittee(ERC)Recommendation70‐03E,whichcan
bedownloadedfromtheEuropeanRadioCommunicationsOffice(ERO)at:http://www.ero.dk/.
Additionalhelpfulwebsitesare:
RadioandTelecommunicationsTerminalEquipment(R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
EuropeanConferenceofPostalandTelecommunicationsAdministrations(CEPT):
http://www.cept.org
EuropeanTelecommunicationsStandardsInstitute(ETSI):
http://www.etsi.org
EuropeanRadioCommunicationsOffice(ERO):
http://www.ero.dk
TheRadioandTelecommunicationsTerminalEquipmentComplianceAssociation(R&TTECA):
http://www.rtteca.com/
3.5 Australia
TheAustraliaradioregulationsdonotprovideamodularapprovalpolicysimilartotheUnitedStates
(FCC)andCanada(IC).However,BM77moduleRFtransmittertestreportscanbeusedinpartto
demonstratecomplianceinaccordancewithACMARadiocommunications“ShortRangeDevices”
Standard2004(TheShortRangeDevicesstandardcallsuptheAS/NZS4268:2008industrystandard).
TheBM77moduletestreportscanbeusedaspartoftheproductcertificationandcompliancefolder.
FormoreinformationontheRFtransmittertestreports,contactMicrochipTechnologyAustraliasales
office.
TomeetoverallAustralianfinalproductcompliance,thedevelopermustconstructacompliancefolder
containingallrelevantcompliancetestreportse.g.RF,EMC,electricalsafetyandDoC(Declarationof
Conformity)etc.Itistheresponsibilityoftheintegratortoknowwhatisrequiredinthecompliance
folderforACMAcompliance.AlltestreportsareavailableontheBM77productwebpageat
http://www.microchip.com.FormoreinformationonAustraliacompliance,refertotheAustralian
CommunicationsandMediaAuthoritywebsitehttp://www.acma.gov.au/.
3.5.1 HELPFULWEBSITES
TheAustralianCommunicationsandMediaAuthority:www.acma.gov.au/.
3.6 NewZealand
TheNewZealandradioregulationsdonotprovideamodularapprovalpolicysimilartotheUnitedStates
(FCC)andCanada(IC).However,BM77moduleRFtransmittertestreportscanbeusedinpartto
demonstratecomplianceagainsttheNewZealand“GeneralUserRadioLicenseforShortRange
Devices”.NewZealandRadiocommunications(RadioStandards)Notice2010callsuptheAS/NZS
4268:2008industrystandard.TheBM77moduletestreportscanbeusedaspartoftheproduct
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certificationandcompliancefolder.AlltestreportsareavailableontheBM77productwebpageat
http://www.microchip.com/bm77.FormoreinformationontheRFtransmittertestreports,contact
MicrochipTechnologysalesoffice.
InformationontheNewZealandshortrangedeviceslicensecanbefoundinthefollowingweblinks:
http://www.rsm.govt.nz/cms/licensees/types‐oflicence/general‐user‐licences/short‐range‐devices
and
http://www.rsm.govt.nz/cms/policy‐and‐planning/spectrum‐policy‐overview/legislation/gazette‐
notices/product‐compliance/.
TomeetoverallNewZealandfinalproductcompliance,thedevelopermustconstructacompliance
foldercontainingallrelevantcompliancetestreportse.g.RF,EMC,electricalsafetyandDoC
(DeclarationofConformity)etc.Itistheresponsibilityofthedevelopertoknowwhatisrequiredinthe
compliancefolderforNewZealandRadiocommunications.FormoreinformationonNewZealand
compliance,refertothewebsitehttp://www.rsm.govt.nz/.
3.6.1 HELPFULWEBSITES
RadioSpectrumMinistryofEconomicDevelopment:http://www.rsm.govt.nz/.
3.7 Japan
TheBM77SSPS3MC2modulehasreceivedtypecertificationandislabeledwithitsowntechnical
conformitymarkandcertificationnumberasrequiredtoconformtothetechnicalstandardsregulated
bytheMinistryofInternalAffairsandCommunications(MIC)ofJapanpursuanttotheRadioActof
Japan.
Integrationofthismoduleintoafinalproductdoesnotrequireadditionalradiocertificationprovided
installationinstructionsarefollowedandnomodificationsofthemoduleareallowed.Additionaltesting
mayberequired:
Ifthehostproductissubjecttoelectricalappliancesafety(forexample,poweredfromanAC
mains),thehostproductmayrequireProductSafetyElectricalApplianceandMaterial(PSE)
testing.Theintegratorshouldcontacttheirconformancelaboratorytodetermineifthistesting
isrequired.
ThereisanvoluntaryElectromagneticCompatibility(EMC)testforthehostproduct
administeredbyVCCI:http://www.vcci.jp/vcci_e/index.html
3.7.1 LABELINGANDUSERINFORMATIONREQUIREMENTS
ThelabelonthefinalproductwhichcontainstheBM77modulemustfollowJapanmarking
requirements.TheintegratorofthemoduleshouldrefertothelabelingrequirementsforJapan
availableattheMinistryofInternalAffairsandCommunications(MIC)website.
TheBM77moduleislabeledwithitsowntechnicalconformitymarkandcertificationnumber.Thefinal
productinwhichthismoduleisbeingusedmusthavealabelreferringtothetypecertifiedmodule
inside:
BM77SPPx3MC2
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Revision2.0–October24,2014Page22
3.7.2 HELPFULWEBSITES
MinistryofInternalAffairsandCommunications(MIC):http://www.tele.soumu.go.jp/e/index.htm
AssociationofRadioIndustriesandBusinesses(ARIB):http://www.arib.or.jp/english/
3.8 Korea
TheBM77SSPS3MC2modulehasreceivedcertificationofconformityinaccordancewiththeRadio
WavesAct.Integrationofthismoduleintoafinalproductdoesnotrequireadditionalradiocertification
providedinstallationinstructionsarefollowedandnomodificationsofthemoduleareallowed.
3.8.1 LABELINGANDUSERINFORMATIONREQUIREMENTS
ThelabelonthefinalproductwhichcontainstheBM77modulemustfollowKCmarkingrequirements.
TheintegratorofthemoduleshouldrefertothelabelingrequirementsforKoreaavailableontheKorea
CommunicationsCommission(KCC)website.
TheBM77moduleislabeledwithitsownKCmark.ThefinalproductrequirestheKCmarkand
certificatenumberofthemodule:
3.8.2 HELPFULWEBSITES
KoreaCommunicationsCommission(KCC):http://www.kcc.go.kr
NationalRadioResearchAgency(RRA):http://rra.go.kr
3.9 Taiwan
TheBM77SSPS3MC2modulehasreceivedcomplianceapprovalinaccordancewiththe
TelecommunicationsAct.Customersseekingtousethecomplianceapprovalintheirproductshould
contactMicrochipTechnologysalesordistributionpartnerstoobtainaLetterofAuthority.
Integrationofthismoduleintoafinalproductdoesnotrequireadditionalradiocertificationprovided
installationinstructionsarefollowedandnomodificationsofthemoduleareallowed.
3.9.1 LABELINGANDUSERINFORMATIONREQUIREMENTS
TheBM77moduleislabeledwithitsownNCCmarkandcertificatenumberasbelow:
Containstransmittermodulewithcertificatenumber:
(
Number
)
202‐SMC066
(Number)
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Theuser’smanualshouldcontainbelowwarning(forRFdevice)intraditionalChinese:
注意!
依據低功率電波輻射性電機管理辦法
第十二條經型式認證合格之低功率射頻電機，非經許可，
公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計
之特性及功能。
第十四條低功率射頻電機之使用不得影響飛航安全及干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性
電機設備之干擾。
3.9.2 HELPFULWEBSITES
NationalCommunicationsCommission(NCC):http://www.ncc.gov.tw
3.10 OtherRegulatoryJurisdictions
Shouldotherregulatoryjurisdictioncertificationberequiredbythecustomer,orthecustomerneedto
recertifythemoduleforotherreasons,acertificationutilityisavailable.Forfurtherregulatory
CertificationUtilityanddocumentation,contactISSCTechnologiesCorp.
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4.0 ELECTRICALCHARACTERISTICS
TABLE4‐1:ENVIRONMENTALCONDITIONS
ParameterValue
TemperatureRange(Operating)‐40Cto85C
TemperatureRange(Storage)‐40Cto85C
RelativeHumidity(Operating)10%to90%
RelativeHumidity(Storage)10%to90%
MoistureSensitivityLevel2
TABLE4‐2:ELECTRICALCHARACTERISTICS
ParameterMin.Typ.Max.Units
SupplyVoltage(BAT_IN)3.24.3V
I/OSupplyVoltage(VDD_IO)2.83.33.63V
I/OVoltageLevels
VILinputlogiclevelslow‐0.3 0.8V
VIHinputlogiclevelshigh2.03.6V
VOLoutputlogiclevelslow0.4V
VOHoutputlogiclevelshigh2.4 V
RESET
VTH,resthresholdvoltage1.6 V
InputandTri‐StateCurrentwith
Pull‐upResistor65Kohm
Leakagecurrent‐10 10uA
SupplyCurrent
TXmode70mA
RXmode70mA
TABLE4‐3:SUPPLYCONSUMPTION–CLASSIC(1)
ParameterCurrent
(avg.)UnitsNotes
Standbymode2.543mA
Deeppowerdownmode0.343mA
Connected+Sniff,Master(nodata)0.858mANodatawastransmitted
Sniffinterval=500ms
Connected+Sniff,Slave(nodata)0.864mANodatawastransmitted
Sniffinterval=500ms
Data,Master23.03mA(Datatransmittedat115200bps;block
size=500)
Data,Slave 25.597mA(Datatransmittedat115200bps;block
size=500)
Note1:ClassicBR/EDR,RX_INDFunctionEnabled
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TABLE4‐4:SUPPLYCONSUMPTION–LOWENERGY(1)
ParameterCurrent
(avg.)UnitsNotes
Standbymode(Discoverable&
Connectablemode)1.237mALEfastadvertisinginterval=160ms,
standbyat0~30sec
Standbymode(Discoverable&
Connectablemode)0.765mALEReducedPoweradvertising
interval=961ms,standbyafter30sec
Deeppowerdownmode0.348mA
Connected(Nodata)，connection
interval=500ms0.679mANodatawastransmitted
connectioninterval=500ms,latency=2.
Connected(transferdata)，
connectioninterval=500ms13.073mAConnectioninterval=500ms,latency=2.
Connected(Nodata)，connection
interval=20ms1.648mANodatawastransmitted
connectioninterval=20ms,latency=2.
Connected(transferdata)，
connectioninterval=20ms18.581mAConnectioninterval=20ms,latency=2.
Note1:LowEnergy,RX_INDFunctionEnabled
TABLE4‐5:UARTBAUD
BaudCrystalFrequency
(MHz)ActualBaudErrorRate(%)
92160016941176 2.12
46080016457143 -0.79
30720016307692 0.16
23040016231884 0.64
11520016117647 2.1
576001657145 -0.97
384001638462 0.16
288001628623 -0.62
192001619231 0.16
144001614480 0.55
9600169615 0.16
4800164808 0.16
2400162399 -0.03
BM77SPPx3MC2
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4.0 ORDERINGINFORMATION
TABLE4‐1:ORDERINGINFORMATION
PartNumberDescription
BM77SPPS3MC2‐0007AABluetooth®4.0DualMode,Class2,SurfaceMountmodulewithintegral
antenna,withshield
BM77SPP03MC2‐0007AABluetooth®4.0DualMode,Class2,SurfaceMountmodule,external
antenna,noshield
EV77SPPS3MC2AEvaluationboardfortheBM77SPPS3MC2BluetoothDualModemodule
withUSBcable
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APPENDIXA:REVISIONHISTORY
Revision2.0(October2014)
Addedcontentandediting.
BM77SPPx3MC2
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NOTES:
