ContaCting - SemiConduCtor
SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
6
0.50mm PitCh
*SoP (Small outline PaCkageS, gullwing leadS)
SerieS overview
SPeCifiCationS
Insulation Resistance: 1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C (for type PSF)
–55°C to +170°C (for type PES & PEI)
Mating Cycles: 10,000 insertions min.
materialS and finiSh
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Part number
SerieS iC51 (ClamShell - th) - SoP, tSoP tyPe i & ii
iC51 - 028 2 - 334-1 - mf
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
MF = Flanged
Unmarked = Not Flanged
SPeCifiCationS
Insulation Resistance: 1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 30mΩ max. at 10mA/20mV max.
Current Rating: 1A max.
Operating Temperature Range: –40°C to +170°C
–40°C to +150°C (type -004*)
Mating Cycles: 10,000 insertions min.
Contact Force: 20g to 80g per pin
materialS and finiSh
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
SerieS iC191 (oPen toP - th) - thin Small outline PaCkage (tSoP tyPe i)
Part number
iC191 - 032 2 - 001 - *
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
Unmarked = With Positioning Pin
Part number
SPeCifiCationS
Insulation Resistance: 1,000MΩ min. at 100V DC, pitch 0.4, 0.5
1,000MΩ min. at 500V DC, pitch 0.65, 0.8,1.27
Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.4, 0.5
500V AC for 1 minute, pitch 0.65
700V AC for 1 minute, pitch 0.8, 1.27
Contact Resistance: 30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
Mating Cycles: 10,000 insertions
Contact Force: 20g to 80g per pin
materialS and finiSh
Housing: Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass-filled
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
SerieS iC189 (oPen toP - th) - SoP, tSoP tyPe i & ii
iC189 - 016 2 - 019 - * *
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
Protection Key**
K = With Protection Key
Unmarked = Without Protectin Key
** Protection Key: Prevents IC from releasing during transportation
ContaCting - SemiConduCtor
SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER 7
Part Number Pin
Count
IC Body
A
IC Socket
and Lid Size
B (max.)
IC
Tip-to-Tip
C
Socket
Dimensions
D x E
Package
Type Note
IC51-778 A104194-001 8 4.40 5.60 6.40 16.0 x 32.0 SOP CL/S
IC51-0162-778 16 4.40 5.60 6.40 16.0 x 32.0 SOP CL/S
IC51-0162-911 16 4.40 5.60 6.40 16.0 x 32.0 SOP CL/FB
IC51-0242-1341 16 4.40 5.60 6.40 16.0 x 32.0 SOP CL/S
IC51-755 KS-7514 16 5.60 6.70 7.60 16.0 x 32.0 SOP CL/S
IC189-0202-038 * 20 6.10 - 8.10 24.0 x 22.5 SOP OT
IC51-0202-779 20 4.40 5.60 6.40 16.0 x 32.0 SOP CL/S
IC51-0202-912 20 4.40 5.60 6.40 16.0 x 32.0 SOP CL/FB
IC51-755 KS-7631 20 5.60 6.70 7.60 16.0 x 32.0 SOP CL/S
IC189-0242-081P 24 6.10 - 7.70 13.6 x 21.5 SOP OT
IC51-0242-761 24 5.60 6.70 7.60 16.0 x 32.0 SOP CL/S
IC51-0242-913 24 5.60 6.70 7.60 16.0 x 32.0 SOP CL/FB
IC51-755 KS-13330 28 5.60 6.70 7.60 16.0 x 32.0 SOP CL/S
IC51-0302-755 30 5.60 6.70 7.60 16.0 x 32.0 SOP CL/S
IC189-0302-121 30 6.10 - 8.10 22.0 x 24.0 SOP OT
IC51-0302-914 30 5.60 6.70 7.60 16.0 x 32.0 SOP CL/FB
IC189-0382-037 * 38 6.10 - 8.10 24.0 x 22.5 SOP OT
IC51-0402-1347 40 5.50 6.70 7.80 16.0 x 32.0 SOP CL/S
IC51-0402-1396 40 6.30 7.20 8.20 16.0 x 32.0 SOP CL/S
IC189-0482-047N 48 8.00 - 10.00 24.0 x 22.5 SOP OT
IC51-0482-1163 48 7.60 9.60 10.16 21.0 x 36.0 SOP CL/S
0.50mm PitCh
IC189 Series
IC191 Series
SO package orientation
SO package
Clamshell Type Sockets
Open Top Type Sockets
Type I Type II
IC235 Series
D
D
D
B
D
E
E
E
E
A
AA
CC
B
C
A = Body width
B = id size forL IC
C = Tip-to-Tip
IC51 Series
SoP (Small outline PaCkageS, gullwing leadS) aPPliCable dimenSionS
Part Number Pin
Count
IC Body
A
IC Socket
and Lid Size
B (max.)
IC
Tip-to-Tip
C
Socket
Dimensions
D x E
Package
Type Note
IC51-0242-1006-1 24 14.30 15.20 16.00 15.0 x 40.0 TSOP I CL/FB
IC51-0302-2037 30 4.40 5.70 6.40 18.0 x 38.0 SOP CL/FB
IC191-0322-001 *-* 32 18.40 - 20.00 40.0 x 16.0 TSOP I OT
IC51-0322-1031-1 32 12.00 13.30 14.00 16.0 x 33.5 TSOP I CL/FB
IC51-0322-1207-1 32 18.40 19.30 20.00 18.0 x 44.0 TSOP I CL/FB
IC51-0322-883-1 32 14.00 14.50 16.00 16.0 x 39.0 TSOP I CL/FB
IC51-0382-2036 38 4.40 5.70 6.40 25.0 x 38.0 SOP CL/FB
IC189-0402-068 * 40 18.40 - 20.00 40.0 x 16.0 TSOP I OT
IC191-0402-002 *-* 40 18.40 - 20.00 18.0 x 40.0 TSOP I OT
IC51-0402-1174-1 40 18.40 19.30 20.00 18.0 x 44.0 TSOP I CL/FB
IC51-0402-1557 40 12.00 13.40 14.00 20.0 x 44.0 TSOP I CL/FB
IC189-0482-066 * 48 16.40 - 18.00 36.0 x 20.0 TSOP I OT
IC189-0482-077 * 48 18.40 - 20.00 40.0 x 18.0 TSOP I OT
IC189-0482-094 * 48 6.10 - 8.10 28.1 x 18.2 SOP OT
IC191-0482-004 *-* 48 18.40 - 20.00 40.0 x 20.0 TSOP I OT
IC51-0482-1099 48 16.40 17.60 18.00 20.0 x 44.0 TSOP I CL/FB
IC51-0482-1513 48 6.10 7.20 8.10 22.0 x 38.0 SOP CL/FB
IC51-0482-2018 48 18.40 19.15 20.00 20.0 x 44.0 TSOP I CL/FB
IC53-0502-912 50 4.40 - 6.40 24.3 x 34.0 SOP NO LID
IC189-0562-067 * 56 18.40 - 20.00 40.0 x 20.0 TSOP I OT
IC191-0562-003 * 56 18.40 - 20.00 21.5 x 40.0 TSOP I OT
IC51-0562-1514 56 6.10 7.20 8.10 29.0 x 38.0 SOP CL/FB
IC53-0642-911 64 6.10 - 8.10 30.0 x 34.0 SOP NO LID
C L = Clamshell, OT = Open Top, S = Seperator, FB = Floating Base
*SoP (Small outline PaCkageS, gullwing leadS)
SerieS iC51
ContaCt StyleS
SPeCialitieS
SerieS iC (kelvin)
SerieS iC189 / iC191 SerieS iC235
SerieS iC (two Point ContaCt)
