SDSDQAB016G - SANDISK - Datasheet.Live

agreements

SanDisk® microSD™, microSDHC™

and microSDXC™

OEM Product Manual

Revision 2.6

Document No. 80-36-03335

July 2012

SanDisk Corporation

Corporate Headquarters • 601 McCarthy Blvd. • Milpitas, CA 95035

Phone (408) 801-1000 • Fax (408) 801-8657

www.sandisk.com

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

2.6

Products, samples and prototypes are subject to update and change for technological and manufacturing

purposes.

SanDisk Corporation general policy does not recommend the use of its products in life support applications

wherein a failure or malfunction of the product may directly threaten life or injury. Without limitation to the

foregoing, SanDisk shall not be liable for any loss, injury or damage caused by use of its products in any of

the following applications:

 Special applications such as military related equipment, nuclear reactor control, and aerospace

 Control devices for automotive vehicles, train, ship and traffic equipment

 Safety system for disaster prevention and crime prevention

 Medical-related equipment including medical measurement device

Accordingly, in any use of SanDisk products in life support systems or other applications where failure

could cause damage, injury or loss of life, the products should only be incorporated in systems designed

with appropriate redundancy, fault tolerant or back-up features. Per SanDisk Terms and Conditions of

Sale, the user of SanDisk products in life support or other such applications assumes all risk of such use

and agrees to indemnify, defend and hold harmless SanDisk Corporation and its affiliates against all

damages.

Security safeguards, by their nature, are capable of circumvention. SanDisk cannot, and does not,

guarantee that data will not be accessed by unauthorized persons, and SanDisk disclaims any warranties

to that effect to the fullest extent permitted by law.

This document and related material is for information use only and is subject to change without prior notice.

SanDisk Corporation assumes no responsibility for any errors that may appear in this document or related

material, nor for any damages or claims resulting from the furnishing, performance or use of this document

or related material. SanDisk Corporation explicitly disclaims any express and implied warranties and

indemnities of any kind that may or could be associated with this document and related material, and any

user of this document or related material agrees to such disclaimer as a precondition to receipt and usage

hereof. EACH USER OF THIS DOCUMENT EXPRESSLY WAIVES ALL GUARANTIES AND

WARRANTIES OF ANY KIND ASSOCIATED WITH THIS DOCUMENT AND/OR RELATED MATERIALS,

WHETHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION, ANY IMPLIED WARRANTY

OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR INFRINGEMENT,

TOGETHER WITH ANY LIABILITY OF SANDISK CORPORATION AND ITS AFFILIATES UNDER ANY

CONTRACT, NEGLIGENCE, STRICT LIABILITY OR OTHER LEGAL OR EQUITABLE THEORY FOR

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CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION PHYSICAL INJURY OR DEATH,

PROPERTY DAMAGE, LOST DATA, OR COSTS OF PROCUREMENT OF SUBSTITUTE GOODS,

TECHNOLOGY OR SERVICES.

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translated into any language or computer language, in any form or by any means, electronic, mechanical,

magnetic, optical, chemical, manual or otherwise, without the prior written consent of an officer of SanDisk

Corporation.

All parts of the SanDisk documentation are protected by copyright law and all rights are reserved.

SanDisk and the SanDisk logo are trademarks of SanDisk Corporation, registered in the United States and

other countries. SD, microSD, microSDHC and microSDXC marks and logos are trademarks of SD-3C,

LLC. All other brand names mentioned herein are for identification purposes only and may be the

trademarks of their respective holder(s).

Document No. 80-36-03335 Rev 2.6

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

2.6

Revision History

Date

Revision

Description

July 2008

1.0

First Revision

June 2010

2.0

Added 32 GB

Replaced SD 2.0 with SD 3.0

ACMD41 to ready after power up updated

Updated marking, section 5

Updated Tables 7, 9, and 11 to remove < 1G references

Updated Figure 1 – SD card block diagram

March 2011

2.1

Added speed class to Ordering Information Table

April 2011

2.2

Added 64GB and updated SDA 3.0 to SD3.UHS-I 50

October 2011

2.3

Added SDSDQAC SKUs to Ordering Information.

Updated Figure 7 to add High Performance figure.

November 2011

2.4

Added Ordering Information.

January 2012

2.5

Reference to SDA corrections. Added SDSDQAD SKUs to

Ordering Information

July 2012

2.6

Marking info updated with alternate laser marking guide and

Premier microSD product marking info

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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T ab l e o f C o n t e n t s

1 Introduction .......................................................................................... 1

1.1 General Description ........................................................................ 1

1.2 Features ........................................................................................ 2

1.3 Scope ........................................................................................... 2

1.4 SD Card Standard .......................................................................... 2

1.5 Functional Description ..................................................................... 3

1.5.1 Technology Independence ..................................................... 3

1.5.2 Defect and Error Management ............................................... 3

1.5.3 Content Protection ................................................................ 3

1.5.4 Wear Leveling ...................................................................... 3

1.5.5 Automatic Sleep Mode .......................................................... 3

1.5.6 Hot Insertion ....................................................................... 4

1.6 microSD Card Products in SD Bus Mode ............................................ 4

1.7 SPI Mode ....................................................................................... 6

2 Product Specifications ............................................................................ 7

2.1 microSD Card Product Family ........................................................... 7

2.1.1 Typical Card Power Requirements ........................................... 7

2.1.2 System Performance ............................................................. 8

2.1.3 Reliability and Durability ....................................................... 9

2.1.4 Physical Specifications .......................................................... 9

3 Interface Description ............................................................................ 10

3.1 Pins and Registers ........................................................................ 10

3.2 Bus Topology ............................................................................... 11

3.2.1 SD Bus ............................................................................. 11

3.2.2 SPI Bus ............................................................................. 11

3.3 Hot Insertion and Power Protection ................................................. 11

3.4 Electrical Interface ........................................................................ 11

3.4.1 Power Up .......................................................................... 11

3.4.2 Bus Operating Conditions .................................................... 12

3.4.3 Bus Timing ........................................................................ 12

3.5 microSD Card Product Family Registers ........................................... 12

3.5.1 Operation Conditions Register .............................................. 12

3.5.2 Card Identification Register ................................................. 12

3.5.3 Card Specific Data Register ................................................. 13

3.5.4 Card Status Register ........................................................... 15

3.5.5 SD Status Register ............................................................. 16

3.5.6 Relative Card Address Register ............................................ 16

3.5.7 SD Card Configuration Register ............................................ 16

3.5.8 microSD Card Product Family Registers in SPI Mode ............... 16

3.5.9 Data Interchange Format and Card Sizes .............................. 16

4 microSD Card Protocol Description ......................................................... 17

4.1 General Description ...................................................................... 17

4.2 SD Bus Protocol ........................................................................... 17

4.3 Functional Description ................................................................... 17

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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4.3.1 Card Identification Mode ..................................................... 17

4.3.2 Data Transfer Mode ............................................................ 17

4.3.3 Clock Control ..................................................................... 18

4.3.4 Cyclic Redundancy Codes .................................................... 18

4.3.5 Error Conditions ................................................................. 18

4.3.6 Commands ........................................................................ 18

4.3.7 Card State Transition .......................................................... 18

4.3.8 Timing Diagrams and Values................................................ 18

4.3.9 Speed Class Specification .................................................... 18

4.3.10 Erase Timeout Calculation ................................................... 18

5 Marking .............................................................................................. 19

6 Ordering Information ........................................................................... 21

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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1 INTRODUCTION

1.1 General Description

The SanDisk® microSD™, microSDHC™ (High Capacity) and microSDXC™

(Extended Capacity) cards are flash based removable non-volatile memory devices

specifically designed to meet the security, capacity, performance and environmental

requirements inherent in next generation mobile phones and consumer electronic

devices. The SanDisk microSD card is based on the SD™ Card specification.

The SanDisk microSD card includes a content protection system that complies with

the security of the Secure Digital Music Initiative (SDMI) standard and has a higher

memory capacity. In the SanDisk microSD card, card content is protected from

unauthorized use by mutual authentication and a cipher algorithm. Unsecured access

to the user's own content is also available.

microSD cards are based on a 8-pin interface designed to operate in a maximum

operating frequency of 100 MHz. The interface for microSD card products allows for

easy integration into any design, regardless of which type of microprocessor is used.

In addition to the interface, microSD card products offer an alternate communication-

protocol based on the SPI standard.

SanDisk microSD card Product Family provides up to 64 gigabytes (GB)1 of memory

using flash memory chips, which were designed especially for use in mass storage

applications. In addition to the mass storage-specific flash memory chip, cards in the

microSD Card Product Family includes an on-board intelligent controller which

manages interface protocols; security algorithms for content protection; data storage

and retrieval, as well as Error Correction Code (ECC) algorithms; defect handling;

power management; wear leveling, and clock control.

SanDisk

Single Chip

Controller NAND

Data In/Out

Control

SanDisk microSD Card

SD Bus/SPI Bus

Interface

Figure 1: SanDisk microSD Card Block Diagram

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1.2 Features

General features of cards in the SanDisk microSD Memory Card Product Family

include:

 Up to 64 GB1 of data storage

 SD - protocol compatible

 Supports SPI Mode

 Targeted for portable and stationary applications for secured (content protected)

and unsecured data storage

 Voltage range of 2.7 to 3.6V

 Variable clock rate 0-25 MHz (standard), 0-50 MHz (high performance), 0-100

MHz (Ultra High Speed)

 Up to 50 MB/sec* data transfer rate (using four parallel data lines)

 Memory field error correction

 Content protection mechanism that complies with highest security of SDMI

standard

 Password protection

 Built-in write protection features (permanent and temporary)

 Supports card detection (insertion and removal)

 Application-specific commands

1.3 Scope

This document describes key features and specifications of the SanDisk microSD

cards as well as the information required to interface these products to a host system.

Chapter 2 describes the physical and mechanical properties of cards in the SanDisk

microSD Card Product Family, Chapter 3 contains the pins and register overview, and

Chapter 4 gives a general overview of the SD protocol. Information about SPI

Protocol can be referenced in Section 7 of the SDA Physical Layer Specification,

Version 3.01.

1.4 SD Card Standard

SanDisk microSD memory cards are fully compatible with the SDA Physical Layer

Specification, Version 3.01. This specification is available from the SD Card

Association (SDA).

SD Card Association

2400 Camino Ramon, Suite 375

San Ramon, CA 94583 USA

Telephone: +1 (925) 275-6615

Fax: +1 (925) 886-4870

E-mail: office@sdcard.org

Web site: www.sdcard.org

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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1.5 Functional Description

The family of SanDisk microSD cards contains a high-level, intelligent subsystem as

shown in Figure 1. This intelligent (microprocessor) subsystem provides many

capabilities not found in other types of memory cards. These capabilities include:

 Host independence from details of erasing and programming flash memory

 Sophisticated system for managing defects (analogous to systems found in

magnetic disk drives)

 Sophisticated system for error recovery including a powerful ECC

 Power management for low power operation

1.5.1 Technology Independence

The 512-byte sector size of a card in the SanDisk microSD Card Product Family is the

same as that in an IDE magnetic disk drive. To write or read a sector (or multiple

sectors), the host software simply issues a read or write command to the card. The

command contains the address and number of sectors to write or read. The host

software then waits for the command to complete.

The host software does not get involved in the details of how the flash memory is

erased, programmed or read. This is extremely important because flash devices are

expected to get increasingly complex in the future. Because cards in the SanDisk

microSD Card Product Family use an intelligent on-board controller, host system

software will not need to be updated as new flash memory evolves. In other words,

systems that support the microSD Card Product Family today will be able to access

future SanDisk cards built with new flash technology without having to update or

change host software.

1.5.2 Defect and Error Management

The SanDisk microSD Card Product Family contains a sophisticated defect and error

management system. This system is analogous to the systems found in magnetic disk

drives and in many cases offers enhancements. If necessary, SanDisk microSD Card

Product Family will rewrite data from a defective sector to a good sector. This is

completely transparent to the host and does not consume any user data space.. In the

extremely rare case that a read error does occur, SanDisk microSD Memory Card

Product Family has innovative algorithms to recover the data. These defect and error

management systems, coupled with the solid state construction, give SanDisk

microSD Card Product Family enormous reliability.

1.5.3 Content Protection

A detailed description of the content protection mechanism and related security SD

commands can be found in the SD Security Specification from the SDA. All SD

security-related commands in the SanDisk microSD Card Product Family operate in

the data transfer mode.

1.5.4 Wear Leveling

Wear leveling is an intrinsic part of the erase pooling functionality of cards in the

SanDisk microSD Card Product Family using NAND memory.

1.5.5 Automatic Sleep Mode

A unique feature of cards in the SanDisk microSD Card Product Family is automatic

entrance and exit from sleep mode. Upon completion of an operation, cards enter

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

2.6

sleep mode to conserve power if no further commands are received in less than 5

milliseconds (ms). The host does not have to take any action for this to occur.

However, in order to achieve the lowest sleep current, the host needs to shut down its

clock to the card. In most systems, cards are in sleep mode except when accessed by

the host, thus conserving power.

When the host is ready to access a card in sleep mode, any command issued to it will

cause it to exit sleep, and respond.

1.5.6 Hot Insertion

Support for hot insertion will be required on the host but will be supported through

the connector. Connector manufacturers will provide connectors that have power pins

long enough to be powered before contact is made with the other pins.

1.6 microSD Card Products in SD Bus Mode

The following sections provide valuable information on cards in the SanDisk

microSD Card Product Family in SD Bus mode.

Cards in the SanDisk microSD Card Product Family are fully compliant with the SDA

Physical Layer Specification, Version 3.01. Card Specific Data (CSD) Register

structures are compliant with CSD Structure 1.0 and 2.0.

This section covers Negotiating Operating Conditions, Card Acquisition and

Identification, Card Status, Memory Array Partitioning, Read/Write Operations, Data

Transfer Rate, Data Protection in Flash Cards, Write Protection, Copy Bit, and CSD

Additional practical card detection methods can be found in application notes

pertaining to the SDA Physical Layer Specification, Version 3.01.

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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SanDisk microSD Card

Figure 2: Memory Array Partitioning

Figure 3: Data Transfer Formats

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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Table 1 contains descriptions for each transfer mode.

Table 1: Mode Descriptions

Mode

Description

Single Block

In this mode the host reads or writes one data block in a pre-specified length.

The data block transmission is protected with 16-bit CRC that is generated by

the sending unit and checked by the receiving unit.

The block length for read operations is limited by the device sector size (512

bytes) but can be as small as a single byte. Misalignment is not allowed. Every

data block must be contained in a single physical sector.

The block length for write operations must be identical to the sector size and

the start address aligned to a sector boundary.

Multiple Block

This mode is similar to the single block mode, except for the host can read/

write multiple data blocks (all have the same length) that are stored or retrieved

from contiguous memory addresses starting at the address specified in the

command. The operation is terminated with a stop transmission command.

Misalignment and block length restrictions apply to multiple blocks and are

identical to the single block read/write operations.

1.7 SPI Mode

The SPI Mode is a secondary communication protocol for cards in the SanDisk

microSD Card Product Family. This mode is a subset of the SD Protocol, designed to

communicate with an SPI channel, commonly found in Motorola and other vendors'

microcontrollers. Detailed information about SPI Mode can be found in Section 7 or

the SDA Physical Layer Specification, Version 3.01.

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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2 PRODUCT SPECIFICATIONS

2.1 microSD Card Product Family

This section provides product specifications for the SanDisk microSD Card Product

Family. For more details about the environmental, reliability and durability

specifications, refer the SDA Physical Layer Specification, Version 3.01 and microSD

card addendum v3.0.

2.1.1 Typical Card Power Requirements

The values stated in Table 2 represent the SanDisk microSD Card power

requirements.

Table 2: SanDisk microSD Card Power Requirements

Mode

Maximum Value

Typical Value @ 25C

Standard Mode

(25 MHz)

Sleep

350 uA

Read

100 mA

Write

100 mA

Standard Mode – for

microSDXC card -XPC

bit on (25 MHz)

Host selected XPC bit in

ACMD41

Sleep

350 uA

Read

150 mA

Write

150 mA

High Performance

Mode (50 MHz)

Sleep

350 uA

Read

200 mA

Write

200 mA

UHS-I SDR50 Mode –

(104 MHz)

Sleep

350 uA

Read

400 mA

Write

400 mA

UHS-I DDR50 Mode –

(50 MHz)

Sleep

350 uA

Read

400 mA

Write

400 mA

Note: Current consumption is measured by averaging over one (1) second. Refer to

Section 6.6.3 of the SDA Physical Layer Specification, Version 3.01 for more

information

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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2.1.2 System Performance

This section provides the system performance specifications for the SanDisk microSD

Card Product Family. All performance values in Table 3 were measured under the

following conditions:

 Voltage range 2.7 to 3.6V

 Temperature -25°C to 85°C

 Independent of card clock frequency

Table 3: System Performance

Timing

Maximum Value

Block Read Access Time

100 ms

Block Write Access Time

250 ms for SDHC,

500ms for SDXC

ACMD41 to ready after power-up

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2.1.3 Reliability and Durability

For SanDisk microSD environmental, reliability and durability specifications, refer to

SDA Physical Layer Specification, Version 3.01 and microSD Card Addendum v3.0.

2.1.4 Physical Specifications

Figure 4 and Figure 5 provide the physical dimensions of the SanDisk microSD Card.

For detail dimensions and tolerances refer to SDA microSD Card Addendum,

Mechanical Specification for microSD Memory Card.

Note: Dimensions are in mm.

Figure 4: microSD Card Top View and Side View

Figure 5: microSD Card Bottom View

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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3 INTERFACE DESCRIPTION

3.1 Pins and Registers

The SanDisk microSD™ Card Product Family has exposed contacts on one side. The

host uses a dedicated connector to connect to microSD cards.

In Table 4, pin assignments for the SanDisk microSD Card are described for SD Bus

Mode and SPI Bus Mode

Note: Pin assignments are provided by the SDA Physical Layer Specification,

Version 3.01 and associated addendums (microSD). For more details, refer to Section

3.7 of the SDA Physical Layer Specification, Version 3.01

Table 4: SD Bus Mode Pin Assignment

Pin No.

SD Mode

SPI mode

Name

Type1

Description

Name

Type1

Description

DAT22,5

I/O/PP

Data Line [bit 2]

RSV

Reserved

CD/DAT32

I/O/PP3

Card Detect/Data Line [bit 3]

Chip select (active low)

CMD

Command/Response

DataIn

Data In

VDD

Supply Voltage

VDD

Supply Voltage

CLK

Clock

SCLK

Clock

VSS

Supply voltage ground

VSS

Supply voltage ground

DAT0

I/O/PP

Data Line [bit 1]

DataOUT

O/PP

Data Out

DAT12,4

I/O/PP

Data Line [bit 2]

RSV4

Reserved

Notes: 1. Type Key: S=power supply; I=input; O=output using push-pull drivers; PP=I/O using

push-pull drivers.

2. The extended DAT lines (DAT1-DAT3) are input on power up. They start to

operate as DAT lines after the SET_BUS_WIDTH command. It is the responsibility

of the host designer to connect external pull-up resistors to all data lines even if

only DAT0 is to be used. If not, there may be unexpected high current consumption

due to the floating inputs of DAT1 & DAT2 (if they are not used).

3. At power up this line has a 50KOhm pull-up enabled in the card. This resistor

serves two functions: Card Detection and Mode Selection. For Mode Selection, the

host can drive the line high or let it be pulled high to select SD mode. If the host

wants to select SPI mode, it should drive the line low. For Card Detection, the host

detects that the line is pulled high. The user should disconnect this pull-up with

SET_CLR_CARD_DETECT (ACMD42) command during regular data transfer.

4. DAT1 line may be used as Interrupt Output (from the Card) in SDIO mode during

all the times that it is not in use for data transfer operations.

5. DAT2 line may be used as Read Wait signal in SDIO mode.

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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Each card has a set of information registers. Register descriptions and SDA references

are provided in Section 5.0 of the SDA Physical Layer Specification, Version 3.01.

Table 5: microSD Card Product Family Register Overview

Abbreviation

Width (in bits)

CID

128

Card identification number

RCA

Relative card address

CSD

128

Card specific data

SCR

SD configuration register

OCR

Operation condition register

SSR

512

SD status register

CSR

Card status register

3.2 Bus Topology

The family of SanDisk microSD products supports two communication protocols: SD

and SPI. For more details, refer to Section 3.5 of the SDA Physical Layer

Specification, Version 3.01. Section 6 of the specification contains a bus circuitry

diagram for reference.

3.2.1 SD Bus

For more details, refer to Section 3.5.1 of the SDA Physical Layer Specification,

Version 3.01.

3.2.2 SPI Bus

For more details, refer to Section 3.5.2 of the SDA Physical Layer Specification,

Version 3.01.

3.3 Hot Insertion and Power Protection

Refer to Section 6.1 and Section 6.2 of the SDA Physical Layer Specification,

Version 3.01.

3.4 Electrical Interface

The power scheme of SanDisk microSD products is handled locally in each card and

in the bus master. Refer to Section 6.4 of the SDA Physical Layer Specification,

Version 3.01.

3.4.1 Power Up

Power must be applied to the VDD pin before any I/O pin is set to logic HIGH. In

other words, CMD, CLK, and DAT0-3 must be at zero (0) volts when power is

applied to the VDD pin. For more information, refer to Section 6.4.1 of the SDA

Physical Layer Specification, Version 3.01.

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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Figure 6: Recommended Power Control Scheme

The recommended power control scheme for SanDisk microSD cards is illustrated in

Figure 6. Most card connectors have a card detect switch that signals the SD host

when the card is inserted. After the host is aware of the card insertion, it turns on the

FET switch to apply power to card's VDD pin.

Once the card is inserted and all card pins are making contact, there should be a delay

before the FET switch is turned on.

Note: Because there are clamping diodes on the CMD, CLK, and DAT0-3 pins, it is

crucial to ensure that CLK, CMD, and DAT0-3 are at zero (0) volts during the delay

and before the FET switch is turned on. If any I/O pin, (CMD, CLK, or DAT0-3) goes

above zero volts during the delay and before power reaches the card VDD pin, it will

forward bias the clamping diodes and can cause the card to go into an unknown state.

It is the host's responsibility to make sure power gets to VDD before CMD, CLK, or

DAT0-3 go above zero volts.

3.4.2 Bus Operating Conditions

SPI Mode bus operating conditions are identical to SD Card Bus Mode operating

conditions. For details, see Section 6.6 of the SDA Physical Layer Specification,

Version 3.01.

3.4.3 Bus Timing

See SDA Physical Layer Specification, Version 3.01.

3.5 microSD Card Product Family Registers

There is a set of eight registers within the card interface. However, the DSR Register

is optional and is not used in the SanDisk microSD Card Product Family. For specific

information about all registers, refer to Section 5 of the SDA Physical Layer

Specification, Version 3.01.

3.5.1 Operation Conditions Register

The Operation Conditions Register (OCR) stores a card's VDD voltage profile. Refer

to Section 5.1 of the SDA Physical Layer Specification, Version 3.01 for more

information.

3.5.2 Card Identification Register

The Card Identification (CID) Register is 16 bytes long and contains the unique card

identification number. It is programmed during card manufacturing and cannot be

changed by card hosts. See Table 8.

Card VDD

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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Table 6: CID Register Definitions

Name

Type

Width

CID Value

Comments

Manufacturer ID

(MID)

Binary

0x03

Manufacturer IDs are

controlled and assigned by

the SD-3C, LLC

OEM/Application ID

(OID)

ASCII

SD ASCII Code

0x53, 0x44

Identifies the card OEM

and/or the card contents. The

OID is controlled and

assigned by the SD-3C, LLC

Product Name

(PNM)

ASCII

SU64G

SU32G

SU16G

SU08G

SU04G

SU02G

SU01G

Five-character ASCII string

Product Revision

PRV)

BCD

Product Revision xx

See Section 5.2 in the SDA

Physical Layer Specification,

Version 3.01.

Serial Number

(PSN)

Binary

Product serial

number

32-bit unsigned integer

Reserved

Manufacturer Date

Code (MDT)

BCD

Manufacture date

(for example,

April 2001=0x014)

Manufacturing date–yym

(offset from 2000)

CRC7 Checksum

(CRC)

Binary

CRC7

Calculated

Not used, always 1

3.5.3 Card Specific Data Register

The Card Specific Data (CSD) Register configuration information is required to

access card data. The CSD defines the data format, error correction type, maximum

data access time, etc. The field structures of the CSD Register vary depending on the

physical specifications and card capacity. The CSD_STRUCTURE field in the CSD

as it relates to the CSD structure. Refer to Section 5.3.1 of the SDA Physical Layer

Specification, Version 3.01 for more information.

Table 7: CSD Register Structure

CSD_Structure

CSD Structure Version

Valid for SD Card Physical

Specification / Card Capacity

CSD Version 1.0

Version 1.01 to 1.10

Version 2.00/Standard Capacity

CSD Version 2.0

Version 2.00/High Capacity and

Extended Capacity

2-3

Reserved

Table 8 provides an overview of the CSD Register. More field-specific information

can be found in Section 5.3.2 of the SDA Physical Layer Specification, Version 3.01.

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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Table 8: CSD Register (CSD Version 1.0)

Field

Typical CSD Value

Description

CSD_STRUCTURE

1.0

CSD Structure

Reserved

TAAC

1.5 msec

Data read access-time-1

NSAC

Data read access-time-2 in CLK cycles

(NSAC*100)

TRANS_SPEED

Standard Mode 25 MHz

High Performance Mode 50MHz

Ultra High Speed Mode-I

104MHz

Maximum data transfer rate

CCC

All (inc. WP, lock/unlock)

Card command classes

READ_BL_LEN

2G = 0xA

Up to 1G – 0x9

Maximum read data block length

READ_BL_PARTIAL

Yes

Partial blocks for read allowed

WRITE_BLK_MISALIGN

Write block misalignment

READ_BLK_MISALIGN

Read block misalignment

DSR_IMP

DSR implemented

Reserved

C_SIZE

1 GB

2 GB

Secured

0xF22

0xF24

Device size

VDD_R_CURR_MIN

100 mA

Maximum read current @VDD min

VDD_R_CURR_MAX

80 mA

Maximum read current @VDD max

VDD_W_CURR_MIN

100 mA

Maximum write current @VDD min

VDD_W_CURR_MAX

80 mA

Maximum write current @VDD max

C_SIZE_MULT

2G=2048

1G-1024

Device size multiplier

ERASE_BLK_EN

Yes

Erase single block enable

SECTOR_SIZZE

31 blocks

Erase sector size

WP_GRP_SIZE

127 sectors

Write protect group size

WP_GRP_ENABLE

Yes

Write protect group enable

Reserved

Reserved for MMC compatibility

R2W_FACTOR

X16

Write speed factor

WRITE_BL_LEN

0x9

Maximum write data block length

WRITE_BL_PARTIAL

Partial blocks for write allowed

Reserved

FILE_FORMAT_GRP

File format group

COPY

Has been copied

Copy flag (OTP)

PERM_WRITE_PROTECT

Not protected

Permanent write protection

TMP_WRITE_PROTECT

Not protected

Temporary write protection

FILE_FORMAT

HD w/partition

File format

Reserved

CRC

CRC7

CRC

Not used, always "1"

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

2.6

Refer to Section 5.3.3, Table 5-16 of the SDA Physical Layer Specification, Version

3.01 for more detailed information.

Table 9: CSD Register (CSD Version 2.0)

Field

Typical CSD Value

Description

CSD_STRUCTURE

2.0

CSD Structure

Reserved

TAAC

1.5 msec

Data read access-time

NSAC

Data read access-time-2 in CLK cycles

(NSAC*100)

TRANS_SPEED

Standard Mode 25 MHz

High Performance Mode 50MHz

Ultra High Speed Mode 104MHz

Maximum data transfer rate

CCC

All (inc. WP, lock/unlock)

Card command classes

READ_BL_LEN

Maximum read data block length

READ_BL_PARTIAL

Yes

Partial blocks for read allowed

WRITE_BLK_MISALIGN

Write block misalignment

READ_BLK_MISALIGN

Read block misalignment

DSR_IMP

DSR implemented

Reserved

C_SIZE

See SDA Physical Layer

Specification

Device size

Reserved

ERASE_BLK_EN

Erase single block enable

SECTOR_SIZE

64 blocks

Erase sector size

WP_GRP_SIZE

000000b

Write protect group size

WP_GRP_ENABLE

Write protect group enable

Reserved

Reserved for MMC compatibility

R2W_FACTOR

Write speed factor

WRITE_BL_LEN

Maximum write data block length

WRITE_BL_PARTIAL

Partial blocks for write allowed

Reserved

FILE_FORMAT_GRP

File format group

COPY

Has been copied

Copy flag (OTP)

PERM_WRITE_PROTECT

Not protected

Permanent write protection

TMP_WRITE_PROTECT

Not protected

Temporary write protection

FILE_FORMAT

HD w/partition

File format

Reserved

CRC

CRC7

CRC

Not used, always "1"

3.5.4 Card Status Register

The Card Status Register (CSR) transmits the card's status information (which may be

stored in a local status register) to the host. The CSR is defined in Section 4.10.1 in

the SDA Physical Layer Specification, Version 3.01.

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

2.6

3.5.5 SD Status Register

The SD Status Register (SSR) contains status bits that are related to the microSD Card

proprietary features and may be used for future applications. The SD Status structure

is described in Section 4.10.2 in the SDA Physical Layer Specification, Version 3.01.

3.5.6 Relative Card Address Register

The 16-bit Relative Card Address (RCA) Register carries the card address published

by the card during the card identification. Refer to Section 5.4 in the SDA Physical

Layer Specification, Version 3.01 for more information.

3.5.7 SD Card Configuration Register

The SD Card Configuration Register (SCR) is in addition to the CSD Register. The

SCR provides information about special features in the SanDisk SD Card products.

For more information, refer to Section 5.6 in the SDA Physical Layer Specification,

Version 3.01.

3.5.8 microSD Card Product Family Registers in SPI

Mode

All card registers are accessible in SPI Mode. Their format is identical to the format in

the SD Bus Mode; however a few fields are irrelevant in SPI Mode. In SPI Mode, the

Card Status Register also has a different, shorter format. Refer to Section 7.4 in the

SDA Physical Layer Specification, Version 3.01 for more details.

3.5.9 Data Interchange Format and Card Sizes

In general, a file system provides structure for data in SanDisk microSD Card

products. The SD Card File System Specification, published by the SDA, describes

the file format system that is implemented in the SanDisk microSD Card products. In

general, each card is divided into two separate DOS-formatted partitions as follows:

 User Area–used for secured and non-secured data storage and can be accessed by

the user with regular read/write commands.

 Security Protected Area–used by content protection applications to save security

related data and can be accessed by the host using the secured read/write

command after doing authentication as defined in the SD Security Specification.

The security protected area size is defined by SanDisk as approximately one

percent of the total size of the card.

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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Table 10: Minimum User Area DOS Image Parameters

Capacity1

Total LBAs2

No. of Partition System

Area Sectors2

Total Partition

Sectors2

User Data

Sectors2

User Data

Bytes2

64 GB

125,000,704

66304

124,967,936

124,934,400

63,864,569,856

32GB

62,333,952

16384

62,325,760

62,309,376

31,902,400,512

16 GB

31,116,288

8192

31,108,096

31,099,904

15,923,150,848

8 GB

15,523,840

8192

15,515,648

15,507,456

7,939,817,472

4 GB

7,744,512

8192

7,736,320

7,728,128

3,956,801,536

2 GB

3,862,528

505

3,858,489

3,857,984

1,975,287,808

1 GB

1,930,240

505

1,929,177

1,928,672

987,480,064

1 1 (GB) = 1billion bytes. Some capacity not available for data storage.

2 Total LBAs, Number of Partition System Area Sectors, Total Partition Sectors, User Data Sectors and User Data

Bytes are minimum values. Actual values may vary depending on flash technology used.

4 MICROSD CARD PROTOCOL DESCRIPTION

4.1 General Description

SD™ Protocol information for cards in the SanDisk microSD™ Card Product Family

is contained in this chapter; information includes SD bus protocol, card identification,

and a functional description.

4.2 SD Bus Protocol

Communication over the SD bus is based on command and data-bit streams initiated

by a start bit and terminated by a stop bit. See Section 3.6.1 of the SDA Physical

Layer Specification, Version 3.01 for details.

4.3 Functional Description

In the SanDisk microSD Card Product Family, the host controls all communication

between itself and the cards. This section provides a general overview of the card

identification and data transfer modes; commands; card dependencies; various card

operation modes and restrictions for controlling the clock signal. For SD Card

commands, together with corresponding responses, state transitions, error conditions,

and timings refer to Section 4 of the SDA Physical Layer Specification, Version 3.01.

4.3.1 Card Identification Mode

In Card Identification Mode, the host resets all cards, validates operation voltage

range, identifies and requests cards to publish a relative card address. For more

information see Section 4.2 in the SDA Physical Layer Specification, Version 3.01.

4.3.2 Data Transfer Mode

Functionality of the Data Transfer Mode can be found in Section 4.3 of the SDA

Physical Layer Specification, Version 3.01. This section includes information about

data read and write, erase, write-protect management, card lock/unlock operations,

application-specific commands, switch function command, high-speed mode,

command system, and the Send Interface Condition command (CMD8). CMD8 is part

of identification mode and command functional differences in microSD cards.

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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4.3.3 Clock Control

The host can use the bus clock signal in SanDisk microSD cards to switch them to

energy saving mode or to control data flow on the bus. See Section 4.4 of the SDA

Physical Layer Specification, Version 3.01.

Cyclic Redundancy Codes

The Cyclic Redundancy Check (CRC) protects against transmission errors that may

occur on the bus in SanDisk microSD Card Product Family cards. Detailed

information and examples for CRC7 and CRC16 are provided in Section 4.5 of the

SDA Physical Layer Specification, Version 3.01.

4.3.4 Error Conditions

See Section 4.6 of the SDA Physical Layer Specification, Version 3.01.

4.3.5 Commands

See Section 4.7 of the SDA Physical Layer Specification, Version 3.01 for detailed

information about card commands in the SanDisk microSD Card Product Family.

4.3.6 Card State Transition

In microSD cards, the state transition is dependent on the received command. The

transition is defined in Section 4.8 of the SDA Physical Layer Specification, Version

3.01 along with responses sent on the command line.

4.3.7 Timing Diagrams and Values

See Section 4.12 of the SDA Physical Layer Specification, Version 3.01.

4.3.8 Speed Class Specification

SDA speed class specification classifies card minimum write performance by speed

class number and offers the method to test performance. For more information, refer

to Section 4.13 of the SDA Physical Layer Specification, Version 3.01.

4.3.9 Erase Timeout Calculation

See Section 4.14 of the SDA Physical Layer Specification, Version 3.01.

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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5 MARKING

microSD™ cards have a laser marking indicating details on the manufacture of the

card.

Field 1: CC = Capacity Code, Made in XXXXX = Country of Origin

(China or Taiwan)

Field 2: YYDDDXXXXXL###

YY is year of manufacture, 10=2010

DDD is Day of manufacturer, 001 - 365

X, L, and # are SanDisk internal markings

Field 2 (alternate marking): YWWDMTLLLXXX

Y is year of manufacture, 2=2012

WW is work week of manufacture

D, M, T, LLL, XXX are SanDisk internal markings

Note: Dimensions are in mm.

High Performance microSD cards

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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Figure 7: Marking Specs for

microSD, microSDHC, microSDXC, UHS-I Cards,

High Performance microSD cards (alternate marking)

Premier microSD cards

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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6 ORDERING INFORMATION

To order SanDisk products directly from SanDisk, please contact your local sales

office.

Non-UHS Line

Part Number

Capacity1

Interface

Speed Class

SDSDQ-2048

2GB

SD3.0

N/A

SDSDQ-4096

4GB

SDSDQ-8192

8GB

SDSDQ-016G

16GB

SDSDQ-032G

32GB

1. 1 gigabyte (GB) = 1 billion bytes. Some capacity not available for data storage.

UHS Performance Line

Part Number

Capacity2

Interface

Typical Performance1

SDSDQAB-004G

4GB

SD3.0 UHS-I 50

Sequential Write: 5MB/s

Sequential Read: 20MB/s

Random Write: 100 IOPs

Random Read: 500 IOPs

SDSDQAB-008G

8GB

SDSDQAB-016G

16GB

SDSDQAB-032G

32GB

SDSDQAB-064G

64GB

UHS High Performance Line

Part Number

Capacity2

Interface

Typical Performance1

SDSDQAC-004G

4GB

SD3.0 UHS-I 50

Sequential Write: 7MB/s

Sequential Read: 30MB/s

Random Write: 150 IOPs

Random Read: 500 IOPs

SDSDQAC-008G

8GB

SDSDQAC-016G

16GB

SDSDQAC-032G

32GB

SDSDQAC-064G

64GB

SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual

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UHS Premier Line

Part Number

Capacity2

Interface

Typical Performance1

SDSDQAD-008G

8GB

SD3.0 UHS-I 50

Sequential Write: 10MB/s

Sequential Read: 40MB/s

Random Write: 250 IOPs

Random Read: 1000 IOPs

UHS Speed Class: U1

SDSDQAD-016G

16GB

SDSDQAD-032G

32GB

SDSDQAD-064G

64GB

1. Based on SanDisk internal testing; performance may be lower depending upon host device. 1 megabyte (MB) = 1 million

bytes.

2. 1 gigabyte (GB) = 1 billion bytes. Some capacity not available for data storage.