TPA0253
1-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS280D – JANUARY 2000 – REVISED NOVEMBER 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DIdeal for Notebook Computers, PDAs, and
Other Small Portable Audio Devices
D1 W Into 8- From 5-V Supply
D0.3 W Into 8- From 3-V Supply
DStereo Head Phone Drive
DMono (BTL) Signal Created by Summing
Left and Right Signals Internally
DWide Power Supply Compatibility
2.5 V to 5.5 V
DLow Supply Current
– 3.2 mA Typical at 5 V
– 2.7 mA Typical at 3 V
DShutdown Control ...1 µA Typical
DShutdown Pin Is TTL Compatible
D–40°C to 85°C Operating Temperature
Range
DSpace-Saving, Thermally-Enhanced MSOP
Packaging
description
The TPA0253 is a 1-W mono bridge-tied-load (BTL) amplifier designed to drive speakers with as low as 8-
impedance. The mono signal is created by summing left and right inputs internally. The amplifier can be
reconfigured on the fly to drive two stereo single-ended (SE) signals into headphones. This makes the device
ideal for use in small notebook computers, PDAs, digital personal audio players, anyplace a mono speaker and
stereo headphones are required. From a 5-V supply, the TPA0253 can deliver 1-W of power into an 8- speaker.
The gain of the input stage is set by the user-selected input resistor and a 50-k internal feedback resistor
(AV = – RF/RI). The power stage is internally configured with a gain of –1.25 V/V in SE mode, and –2.5 V/V in
BTL mode. Thus, the overall gain of the amplifier is 62.5 k/RI in SE mode and 125 k/RI in BTL mode. The
input terminals are high-impedance CMOS inputs, and can be used as summing nodes.
The TPA0253 is available in the 10-pin thermally-enhanced MSOP package (DGQ) and operates over an
ambient temperature range of –40°C to 85°C.
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP
TAMSOP
(DGQ)
MSOP
SYMBOLIZATION
–40°C to 85°C TPA0253DGQ AEL
The DGQ package are available taped and reeled. To order a taped and reeled part, add the
suffix R to the part number (e.g., TPA0253DGQR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
5
10
9
8
7
6
FILT_CAP
SHUTDOWN
VDD
BYPASS
RIN
LO/MO–
LIN
GND
ST/MN
RO/MO+
DGQ PACKAGE
(TOP VIEW)
TPA0253
1-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS280D JANUARY 2000 REVISED NOVEMBER 2002
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
schematic
Left
Audio
Input
4
FILT_CAP
+
1.25*R
R
+
50 k
M
U
X
5
Ri
Ci
Right
Audio
Input
RO/MO+ 6
+
1.25*R
R
+
50 k
M
U
X
LIN
9
Ri
Ci10
50 kStereo/Mono
Control
Shutdown
and Depop
Circuitry
SHUTDOWN
2
From
System Control
ST/MN 7
LO/MO
CC
CC
100 k
100 k
VDD
1 k
CBYP
BYPASS
8
BYPASS
BYPASS BYPASS
BYPASS
BYPASS
VDD 3VDD GND
RIN
1
50 k
50 k
1 µF
TPA0253
1-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS280D JANUARY 2000 REVISED NOVEMBER 2002
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME NO. I/O DESCRIPTION
BYPASS 4 I Midrail bias voltage
FILT_CAP 1 Terminal used to filter power supply
GND 8 Ground terminal
LIN 9 I Left-channel input terminal
LO/MO10 O Left-output in SE mode and mono negative output in BTL mode.
RIN 5 I Right-channel input terminal
RO/MO+ 6 O Right-output in SE mode and mono positive output in BTL mode
SHUTDOWN 2 I TTL-compatible shutdown terminal
ST/MN 7 I Selects between stereo and mono mode. When held high, the amplifier is in SE stereo mode; while held
low, the amplifier is in BTL mono mode.
VDD 3 I Positive power supply
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VDD 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI 0.3 V to VDD +0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation internally limited (see Dissipation Rating Table). . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA (see Table 3) 40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating junction temperature range, TJ 40°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
DISSIPATION RATING TABLE
PACKAGE TA 25°CDERATING FACT OR TA = 70°C TA = 85°C
DGQ 2.14 W§17.1 mW/°C1.37 W 1.11 W
Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB
layout based on the information in the section entitled T exas Instruments Recommended Board for PowerPAD
on page 33 of that document.
PowerPAD is a trademark of Texas Instruments.
TPA0253
1-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS280D JANUARY 2000 REVISED NOVEMBER 2002
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions
MIN MAX UNIT
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Supply voltage, VDD
ÁÁÁ
ÁÁÁ
2.5
ÁÁÁ
ÁÁÁ
5.5
ÁÁÁ
ÁÁÁ
V
ST/MN
VDD = 3 V 2.7
High-level input voltage, VIH ST/MN VDD = 5 V 4.5 V
High level
in ut
voltage,
VIH
SHUTDOWN 2
ST/MN
VDD = 3 V 1.65
Low-level input voltage, VIL ST/MN VDD = 5 V 2.75 V
Low level
in ut
voltage,
VIL
SHUTDOWN 0.8
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Operating free-air temperature, TA
ÁÁÁ
ÁÁÁ
40
ÁÁÁ
ÁÁÁ
85
ÁÁÁ
ÁÁÁ
°C
electrical characteristics at specified free-air temperature, VDD = 3 V, T A = 25°C (unless otherwise
noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ÁÁÁÁ
ÁÁÁÁ
|VOO|
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
Output offset voltage (measured dif ferentially)
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
RL = 4 , ST/MN = 0 V, SHUTDOWN = 2 V
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
30
ÁÁÁ
ÁÁÁ
mV
ÁÁÁÁ
ÁÁÁÁ
PSRR
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
Power supply rejection ratio
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
VDD = 2.9 V to 3.1 V, BTL mode
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
65
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
dB
|I |
High level input current
SHUTDOWN, VDD = 3.3 V, VI = VDD
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
ÁÁÁ
|IIH|High-level input current ST/MN, VDD = 3.3 V, VI = VDD
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
ÁÁÁ
µA
|I |
Low level input current
SHUTDOWN, VDD = 3.3 V, VI = 0 V
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
|IIL|Low-level input current ST/MN, VDD = 3.3 V, VI = 0 V
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
ÁÁÁ
µA
ZIInput impedance
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
50
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
k
ÁÁÁÁ
ÁÁÁÁ
IDD
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
Supply current
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
VDD = 2.5 V, SHUTDOWN = 2 V
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
2.7
ÁÁÁ
ÁÁÁ
4
ÁÁÁ
ÁÁÁ
mA
ÁÁÁÁ
ÁÁÁÁ
IDD(SD)
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
Supply current, shutdown mode
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
SHUTDOWN = 0 V
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
ÁÁÁ
10
ÁÁÁ
ÁÁÁ
µA
ÁÁÁÁ
Á
ÁÁ
Á
ÁÁÁÁ
RF
ÁÁÁÁÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁÁÁÁÁ
Feedback resistor
ÁÁÁÁÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁÁÁÁÁ
VDD = 2.5 V, RL = 4 , ST/MN = 1.375 V,
SHUTDOWN = 2 V
ÁÁÁ
Á
Á
Á
ÁÁÁ
47
ÁÁÁ
Á
Á
Á
ÁÁÁ
50
ÁÁÁ
Á
Á
Á
ÁÁÁ
57
ÁÁÁ
Á
Á
Á
ÁÁÁ
k
operating characteristics, VDD = 3 V, TA = 25°C, RL = 8 , f = 1 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
THD = 0.1%,
ÁÁÁÁÁÁÁÁÁÁ
BTL mode, Gain = 14 dB
ÁÁÁ
ÁÁÁ
300
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
Á
ÁÁ
Á
ÁÁÁÁ
PO
ÁÁÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁÁÁ
Output power, see Note 1
ÁÁÁÁÁ
Á
ÁÁÁ
Á
ÁÁÁÁÁ
THD = 0.1%
Gain = 1.9 dB
ÁÁÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁÁÁ
SE mode, RL = 32
ÁÁÁ
Á
Á
Á
ÁÁÁ
ÁÁÁ
Á
Á
Á
ÁÁÁ
30
ÁÁÁ
Á
Á
Á
ÁÁÁ
ÁÁÁ
Á
Á
Á
ÁÁÁ
mW
ÁÁÁÁ
Á
ÁÁ
Á
ÁÁÁÁ
THD + N
ÁÁÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁÁÁ
Total harmonic distortion plus
noise
ÁÁÁÁÁ
Á
ÁÁÁ
Á
ÁÁÁÁÁ
PO = 250 mW,
ÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁ
f = 20 Hz to 20 kHz
ÁÁÁÁ
Á
ÁÁ
Á
ÁÁÁÁ
ÁÁÁ
Á
Á
Á
ÁÁÁ
ÁÁÁ
Á
Á
Á
ÁÁÁ
0.2%
ÁÁÁ
Á
Á
Á
ÁÁÁ
ÁÁÁ
Á
Á
Á
ÁÁÁ
ÁÁÁÁ
BOM
ÁÁÁÁÁÁÁÁÁÁ
Maximum output power bandwidth
ÁÁÁÁÁ
Gain = 1.9 dB,
ÁÁÁÁÁÁÁ
THD = 2%
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
20
ÁÁÁ
ÁÁÁ
kHz
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
Supple ripple rejection ratio
ÁÁÁÁÁ
ÁÁÁÁÁ
f 1 kHz
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
C047F
ÁÁÁÁ
ÁÁÁÁ
BTL mode
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
46
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
dB
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
Supple ripple rejection ratio
ÁÁÁÁÁ
ÁÁÁÁÁ
f = 1 kHz,
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
C(BYP) = 0.47 µF
ÁÁÁÁ
ÁÁÁÁ
SE mode
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
68
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
dB
ÁÁÁÁ
ÁÁÁÁ
V
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
Noise out
p
ut voltage
ÁÁÁÁÁ
ÁÁÁÁÁ
C(BYP) 047µF
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
f=20Hzto20kHz
ÁÁÁÁ
ÁÁÁÁ
BTL mode
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
83
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
µVRMS
ÁÁÁÁ
ÁÁÁÁ
Vn
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
Noise output voltage
ÁÁÁÁÁ
ÁÁÁÁÁ
C(BYP) = 0.47 µF,
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
f = 20 Hz to 20 kHz
ÁÁÁÁ
ÁÁÁÁ
SE mode
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
33
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
µVRMS
NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz.
TPA0253
1-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS280D JANUARY 2000 REVISED NOVEMBER 2002
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VDD = 5 V, T A = 25°C (unless otherwise
noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ÁÁÁÁ
ÁÁÁÁ
|VOO|
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
Output offset voltage (measured dif ferentially)
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
RL = 4 , ST/MN = 0 V, SHUTDOWN = 2 V
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
30
ÁÁÁ
ÁÁÁ
mV
ÁÁÁÁ
ÁÁÁÁ
PSRR
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
Power supply rejection ratio
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
VDD = 4.9 V to 5.1 V, BTL mode
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
62
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
dB
|I |
High level input current
SHUTDOWN, VDD =5.5 V, VI = VDD
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
ÁÁÁ
A
|IIH|High-level input current ST/MN, VDD = 5.5 V, VI = VDD
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
ÁÁÁ
µA
|I |
Low level input current
SHUTDOWN, VDD = 5.5 V, VI = 0 V
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
ÁÁÁ
A
|IIL|Low-level input current ST/MN, VDD = 5.5 V, VI = 0 V
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
µA
ZIInput impedance
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
50
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
k
ÁÁÁÁ
ÁÁÁÁ
IDD
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
Supply current
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
SHUTDOWN = 2 V
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
3.2
ÁÁÁ
ÁÁÁ
4.8
ÁÁÁ
ÁÁÁ
mA
ÁÁÁÁ
ÁÁÁÁ
IDD(SD)
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
Supply current, shutdown mode
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
SHUTDOWN = 0 V
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
ÁÁÁ
10
ÁÁÁ
ÁÁÁ
µA
operating characteristics, VDD = 5 V, TA = 25°C, RL = 8 , f = 1 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ÁÁÁÁ
ÁÁÁÁ
P
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Output power (see Note 1)
ÁÁÁÁÁ
ÁÁÁÁÁ
THD = 0.1%,
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
BTL mode
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
1
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
W
ÁÁÁÁ
ÁÁÁÁ
PO
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Output power (see Note 1)
ÁÁÁÁÁ
ÁÁÁÁÁ
THD = 0.1%,
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
SE mode,
ÁÁÁÁ
ÁÁÁÁ
RL = 32
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
85
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
mW
ÁÁÁÁ
ÁÁÁÁ
THD + N
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Total harmonic distortion plus
noise
ÁÁÁÁÁ
ÁÁÁÁÁ
PO = 1 W,
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
f = 20 Hz to 20 kHz
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
0.33%
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
Á
ÁÁ
Á
ÁÁÁÁ
BOM
ÁÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁÁ
Maximum output power
bandwidth
ÁÁÁÁÁ
Á
ÁÁÁ
Á
ÁÁÁÁÁ
Gain = 8 dB,
ÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁ
THD = 2%
ÁÁÁÁ
Á
ÁÁ
Á
ÁÁÁÁ
ÁÁÁ
Á
Á
Á
ÁÁÁ
ÁÁÁ
Á
Á
Á
ÁÁÁ
20
ÁÁÁ
Á
Á
Á
ÁÁÁ
ÁÁÁ
Á
Á
Á
ÁÁÁ
kHz
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Supple ripple rejection ratio
ÁÁÁÁÁ
ÁÁÁÁÁ
f 1 kHz
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
C047F
ÁÁÁÁ
ÁÁÁÁ
BTL mode
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
46
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
dB
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Supple ripple rejection ratio
ÁÁÁÁÁ
ÁÁÁÁÁ
f = 1 kHz,
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
C(BYP) = 0.47 µF
ÁÁÁÁ
ÁÁÁÁ
SE mode
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
60
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
dB
ÁÁÁÁ
ÁÁÁÁ
V
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Noise output voltage
ÁÁÁÁÁ
ÁÁÁÁÁ
C047F
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
f 20Hzto20kHz
ÁÁÁÁ
ÁÁÁÁ
BTL mode
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
85
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
V
ÁÁÁÁ
Vn
ÁÁÁÁÁÁÁÁÁ
Noise output voltage
ÁÁÁÁÁ
C(BYP) = 0.47 µF,
ÁÁÁÁÁÁÁ
f = 20 Hz to 20 kHz
ÁÁÁÁ
SE mode
ÁÁÁ
ÁÁÁ
34
ÁÁÁ
ÁÁÁ
µVRMS
NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPA0253DGQ ACTIVE MSOP-
Power
PAD
DGQ 10 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPA0253DGQG4 ACTIVE MSOP-
Power
PAD
DGQ 10 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPA0253DGQR ACTIVE MSOP-
Power
PAD
DGQ 10 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPA0253DGQRG4 ACTIVE MSOP-
Power
PAD
DGQ 10 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Jul-2006
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPA0253DGQR MSOP-
Power
PAD
DGQ 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jan-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA0253DGQR MSOP-PowerPAD DGQ 10 2500 358.0 335.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jan-2012
Pack Materials-Page 2
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