TCD2503C TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) TCD2503C The TCD2503C is a high sensitive and low dark current 5000 elements x 3 line CCD color image sensor. The sensor is designed for color scanner. The device contains a row of 5000 elements x 3 line photodiodes which provide a 16 lines / mm across a A3 size paper. The device is operated by 5 V pulse, and 12 V power supply. FEATURES Number of Image Sensing Element : 5000 elements x 3 line Image Sensing Element Size : 14 m by 14 m on 14 m centers Photo Sensing Region : High sensitive pn photodiode Clock : 2 Phase (5 V) Weight: 17.1g (Typ.) Distance Between Photodiode Array : 84 m (6 lines) Internal Circuit : Clamp circuit Package : 24 pin DIP Color Filter : Red, Green, Blue PIN CONNECTION MAXIMUM RATINGS (Note 1) CHARACTERISTIC SYMBOL Clock Pulse Voltage V Shift Pulse Voltage VSH Reset Pulse Voltage VRS RATING UNIT -0.3~8 V Clamp Pulse Voltage VCP Power Supply Voltage VOD -0.3~15 V Operating Temperature Topr 0~60 C Storage Temperature Tstg -25~85 C Note 1: All voltage are with respect to SS terminals (Ground). 1 (TOP VIEW) 2001-10-15 TCD2503C CIRCUIT DIAGRAM 2 2001-10-15 TCD2503C PIN NAMES PIN No. SYMBOL 1 OS3 2 NAME PIN No. SYMBOL NAME Signal Output 3 (Green) 13 SH1 Shift Gate 1 OS5 Signal Output 5 (Red) 14 2A2 Clock 2 (Phase 2) 3 OS6 Signal Output 6 (Red) 15 1A2 Clock 2 (Phase 1) 4 OD Power (Analog) 16 SS 5 NC Non Connection 17 1A1 Clock 1 (Phase 1) 6 2B Final Stage clock (phase 2) 18 2A1 Clock 1 (Phase 2) 7 2A4 Clock 4 (Phase 2) 19 RS Reset Gate 8 1A4 Clock 4 (Phase 1) 20 CP Clamp Gate 9 1A3 Clock 3 (Phase 1) 21 SS Ground 10 2A3 Clock 3 (Phase 2) 22 OS1 Signal Output 1 (Blue) 11 SH3 Shift Gate 3 23 OS2 Signal Output 2 (Blue) 12 SH2 Shift Gate 2 24 OS4 Signal Output 4 (Green) Ground OPTICAL / ELECTRICAL CHARACTERISTICS (Ta = 25C, VOD = 11V, V = VSH = VRS = VCP = 5V (pulse), f = 1MHz LOAD RESISTANCE = 100 k, tINT (INTEGRATION TIME) = 10 ms, LIGHT SOURCE = A LIGHT SOURCE + CM500S FILTER (t = 1.0 mm)) CHARACTERISTIC Sensitivity SYMBOL MIN TYP. MAX Red RR 12.1 17.3 22.5 GREEN RG 15.1 21.7 28.3 UNIT NOTE V / lx*s (Note 2) RB 5.0 7.2 9.4 PRNU (1) 10 20 % (Note 3) PRNU (3) 3 12 mV (Note 4) VSAT 2.0 V (Note 5) Saturation Exposure SE 0.18 lx*s (Note 6) Dark Signal Voltage VDRK 1 5 mV (Note 7) Dark Signal Non Uniformity DSNU 2 10 mV (Note 8) DC Power Dissipation PD 800 1200 mW Total Transfer Efficiency TTE 92 % Zo 0.2 0.5 k DC Signal Output Voltage VOS 4.5 6.0 7.5 V (Note 9) Random Noise ND 1.3 mV (Note 10) BLUE Photo Response Non Uniformity Saturation Output Voltage Output Impedance 3 2001-10-15 TCD2503C Note 2: Sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. Note 3: PRNU (1) is defined for each color on a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. PRNU (1)= x 100(%) Where is average of total signal outputs and is the maximum deviation from . Note 4: PRNU (3) is defined as maximum voltage with next pixel, where measured 5% of SE (Typ.). Note 5: VSAT is defined as minimum Saturation Output voltage of all effective pixels. V Note 6: Definition of SE : SE = SAT R Note 7: VDRK is defined as average dark signal voltage of all effective pixels. Note 8: DSNU is defined as different voltage between VDRK and VMDK, when VMDK is maximum dark signal voltage. Note 9: DC Signal Output Voltage is defined as follows : 4 2001-10-15 TCD2503C Note 10: Random noise is defined as the standard deviation (sigma) of the output level difference between two adjacent effective pixels under no illumination (i.e. dark conditions) calculated by the following procedure. 1) Two adjacent pixels (pixel n and n + 1) in one reading are fixed as measurement points. 2) Each of the output levels at video output periods averaged over 200 ns period to get Vn and V (n + 1). 3) V (n + 1) is subtracted from Vn to get V. V = Vn - V (n + 1) 4) The standard deviation of V is calculated after procedure 2) and 3) are repeated 30 times (30 readings). V = 1 30 Vi 30 i=1 ( ) 2 1 30 Vi - V 30 i=1 = 5) Procedure 2), 3) and 4) are repeated 10 times to get 10 sigma value. = 1 10 j 10 j=1 6) value calculated using the above procedure is observed 2 times larger than that measured relative to the ground level. So we specify random noise as follows. Random noise = 1 2 5 2001-10-15 TCD2503C OPERATING CONDITION CHARACTERISTIC "H" Level Clock Pulse Voltage "H" Level Reset Pulse Voltage Clamp Pulse Voltage TYP MAX 4.5 5.0 5.5 0 0.5 4.5 5.0 5.5 0 0.5 VA"H"-0.5 VA"H" VA"H" 0 0.5 4.5 5.0 5.5 0 0.5 4.5 5.0 5.5 0 0.5 10.5 11.0 13.0 V B "L" Level (Note 11) MIN V A "L" Level Final Stage Clock Pulse Voltage Shift Pulse Voltage SYMBOL "H" Level VSH "L" Level "H" Level VRS "L" Level "H" Level VCP "L" Level Power Supply Voltage VOD UNIT V V V V V V Note 11: VA"H" means the high level voltage of VA when SH pulse is high level. CLOCK CHARACTERISTICS (Ta = 25C) CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT Clock Pulse Frequency f 1 13 MHz Reset Pulse Frequency fRS 1 13 MHz Clamp Pulse Frequency fCP 1 13 MHz Clock Capacitance (Note 12) CA 250 pF Final Stage Clock Capacitance C2B 50 pF Reset Gate Capacitance CRS 50 pF Shift Gate Capacitance CSH 50 pF Clamp Gate Capacitance CCP 50 pF Note 12: VOD = 12 V 6 2001-10-15 TIMING CHART TCD2503C 7 2001-10-15 TCD2503C TIMING REQUIREMENTS Note 13: Each RS and CP pins put to Low level during this period CHARACTERISTIC Pulse Timing of SH and 1A SH Pulse Rise Time, Fall Time SH Pulse Width SYMBOL MIN TYP. (Note 14) MAX t1 0 1000 t5 500 1000 t2, t4 0 50 UNIT ns ns t3 1000 2000 ns t6, t7 0 50 ns t8, t10 0 20 ns t9 10 100 ns t11, t13 0 20 ns CP Pulse Width t12 10 100 ns Pulse Timing of 2B and CP t14 5 40 ns t15 0 100 t16 10 100 t21 15 1, 2 Pulse Rise Time, Fall Time RS Pulse Rise Time, Fall Time RS Pulse Width CP Pulse Rise Time, Fall Time Pulse Timing of RS and CP Video Data Delay Time (Note 15) ns ns Note 14: TYP. is the case of fRS = 1 MHz. Note 15: Load Resistance is 100 k. 8 2001-10-15 TCD2503C TYPICAL PERFORMANCE CURVES 9 2001-10-15 TCD2503C TYPICAL DRIVE CIRCUIT 10 2001-10-15 TCD2503C CAUTION 1. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Soldering Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260C, or within three seconds for lead temperatures of up to 350C. 11 2001-10-15 TCD2503C PACKAGE DIMENSIONS Unit: mm Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note 3: GLASS THICKNES (n = 1.5) Weight: 17.1 g (Typ.) 12 2001-10-15 TCD2503C RESTRICTIONS ON PRODUCT USE 000707EBA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 13 2001-10-15