PC845XIJ000F - Sharp Microelectronics of the Americas

PC845XJ0000F Series

Sheet No.: D2-A08501EN

Date Sep. 1. 2006

Notice The content of data sheet is subject to change without prior notice.

In the absence of conﬁ rmation by device speciﬁ cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP

devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device speciﬁ cation sheets before using any SHARP device.

PC845XJ0000F

Series

DIP 16pin (4-channel)

Darlington Phototransistor Output,

Photocoupler

■Description

PC845XJ0000F Series contains an IRED optically

coupled to a phototransistor.

It is packaged in a 4-channel package, available in

SMT gullwing lead-form option.

Input-output isolation voltage(rms) is 5.0 kV.

CTR is MIN. to 600% at input current of 1.0 mA.

■Features

1. 6pin DIP 4-channnel package

2. Double transfer mold package (ldeal for Flow

Soldering)

3. Darlington phototransistor output (CTR : MIN. 50% at

IF=1.0 mA, VCE=2 V)

4. High isolation voltage between input and output

(Viso(rms) : 5.0 kV)

5. Lead-free and RoHS directive compliant

■Agency approvals/Compliance

1. Recognized by UL1577 (Double protection isolation),

ﬁ le No. E64380 (as model No. PC845)

2. Approved by VDE, DIN EN60747-5-2(∗) (as an

option), ﬁ le No. 40008087 (as model No. PC845)

3. Package resin : UL ﬂ ammability grade (94V-0))

(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884.

■Applications

1. Home appliances

2. Programmable controller

3. Signal transmission between circuits of different

potentials and impedances

∗1-channel package type is also available.

(model No. PC815XJ0000F Series)

Sheet No.: D2-A08501EN

PC845XJ0000F Series

■Internal Connection Diagram

■Outline Dimensions (Unit : mm)

1234 5 6 7 8

Anode

Cathode

Emitter

Collector

2468

10 12 14 16

11 13 15

1357

16 15 14 13 12 11 10

1. Through-Hole [

ex. PC845XJ0000F

]

PC815

7.62±0.30

θθ

θ : 0 to 13˚

19.82±0.50

3.5±0.5

3.0±0.5

2.7±0.5

0.5TYP.

0.5±0.1

Epoxy resin

6.5±0.5

0.6±0.2

1.2±0.3

Anode mark Factory identification

mark

Date code

2.54±0.25

1234 5 6 7 8

11 1013141516 12

Product mass : approx. 1.0g

2. SMT Gullwing Lead-Form [ex. PC845XIJ000F]

PC815

7.62±0.30

19.82±0.50

3.5±0.5 6.5±0.5

0.6±0.2

1.2±0.3

Date code

2.54±0.25

0.26±0.10

Epoxy resin 1.0+0.4

−0.0

1.0+0.4

−0.0

10.0+0.0

−0.5

0.35

±0.25

1234 5 6 7 8

11 1013141516 12

Factory identification

mark

Anode mark

Product mass : approx. 0.9g

Sheet No.: D2-A08501EN

PC845XJ0000F Series

3. Through-Hole (VDE option) [ex. PC845XYJ000F]

(Unit : mm)

PC815

7.62±0.30

θθ

θ : 0 to 13˚

19.82±0.50

3.5±0.5

3.0±0.5

2.7±0.5

0.5TYP.

0.5±0.1

Epoxy resin

6.5±0.5

0.6±0.2

1.2±0.3

Anode mark Factory identification

mark

Date code

2.54±0.25

1234 5 6 7 8

11 1013141516 12

SHARP mark "S"

VDE Indenfication mark

Product mass : approx. 1.0g

Plating material : SnCu (Cu : TYP. 2%)

4. SMT Gullwing Lead-Form (VDE option) [ex. PC845XIYJ00F]

PC815

7.62±0.30

19.82±0.50

3.5±0.5 6.5±0.5

0.6±0.2

1.2±0.3

Date code

2.54±0.25

0.26±0.10

Epoxy resin 1.0+0.4

−0.0

1.0+0.4

−0.0

10.0+0.0

−0.5

0.35

±0.25

1234 5 6 7 8

11 1013141516 12

Factory identification

mark

Anode mark

SHARP mark "S"

VDE Indenfication mark

Product mass : approx. 0.9g

Sheet No.: D2-A08501EN

PC845XJ0000F Series

repeats in a 20 year cycle

Rank mark

There is no rank mark indicator.

1st digit 2nd digit

Year of production Month of production

A.D. Mark A.D. Mark Month Mark

1990 A 2002 P January 1

1991 B 2003 R February 2

1992 C 2004 S March 3

1993 D 2005 T April 4

1994 E 2006 U May 5

1995 F 2007 V June 6

1996 H 2008 W July 7

1997 J 2009 X August 8

1998 K 2010 A September 9

1999 L 2011 B October O

2000 M 2012 C November N

2001 N : : December D

Date code (2 digit)

Factory identiﬁ cation Mark Country of origin

no mark

Japan

Indonesia

China

* This factory marking is for identiﬁ cation purpose only.

Please contact the local SHARP sales representative to see the actural status of the

production.

Factory identiﬁ cation mark

Sheet No.: D2-A08501EN

PC845XJ0000F Series

■Absolute Maximum Ratings

■Electro-optical Characteristics

(Ta=25˚C )

Parameter Symbol Rating Unit

Input

Forward current IF50 mA

*1 Peak forward current IFM 1A

Reverse voltage VR6V

Power dissipation P 70 mW

Output

Collector-emitter voltage

VCEO 35 V

Emitter-collector voltage

VECO 6V

Collector current IC80 mA

Collector power dissipation PC150 mW

Total power dissipation Ptot 200 mW

Operating temperature Topr −30 to +100 ˚C

Storage temperature Tstg −55 to +125 ˚C

*2 Isolation voltage Viso(rms) 5kV

*3 Soldering temperature Tsol 270 ˚C

*1 Pulse width≤100ms, Duty ratio : 0.001

*2 40 to 60%RH, AC for 1minute, f=60Hz

*3 For 10s

(Ta=25˚C)

Parameter Symbol Condition MIN. TYP. MAX. Unit

Input

Forward voltage VFIF=20mA −1.2 1.4 V

Peak forward voltage VFM IFM=0.5V −−

3.0 V

Reverse current IRVR=4V −−

10 μA

Terminal capacitance CtV=0, f=1kHz −30 250 pF

Output

Collector dark current ICEO VCE=10V, IF=0−−

1 000 nA

Collector-emitter breakdown voltage

BVCEO IC=0.1mA, IF=035

−−V

Emitter-collector breakdown voltage

BVECO IE=10μA, IF=06

−−V

Transfer

charac-

teristics

Current transfer ratio ICIF=1mA, VCE=2V 6.0 16.0 75.0 mA

Collector-emitter saturation voltage

VCE(sat) IF=20mA, IC=5mA −0.8 1.0 V

Isolation resistance RISO DC500V, 40 to 60%RH 5×1010 1×1011 −Ω

Floating capacitance CfV=0, f=1MHz −0.6 1.0 pF

Cut-off frequency fCVCE=2V, IC=2mA, RL=100Ω, −3dB 1 6 −kHz

Response time Rise time trVCE=2V, IC=10mA, RL=100Ω−60 300 μs

Fall time tf−53 250 μs

Sheet No.: D2-A08501EN

PC845XJ0000F Series

■Model Line-up

Please contact a local SHARP sales representative to inquire about production status.

Lead Form Through-Hole SMT Gullwing Form

Package Sleeve

25pcs/sleeve

DIN EN60747-5-2

−

Approved

−

Approved

Model No. PC845XJ0000F PC845XYJ000F PC845XIJ000F PC845XIYJ00F

Sheet No.: D2-A08501EN

PC845XJ0000F Series

Fig.5 Peak Forward Current vs. Duty Ratio Fig.6 Current Transfer Ratio vs.

Forward Current

Forward current IF (mA)

Ambient temperature Ta (˚C)

30 0 25 50 55 75 100 125

Diode power dissipation P (mW)

Ambient temperature Ta (˚C)

100

30 0 25 50 55 75 100 125

Collector power dissipation PC (mW)

Ambient temperature Ta (˚C)

250

200

150

100

30 0 25 50 75 100 125

Total Power dissipation Ptot (mW)

Ambient temperature Ta (˚C)

250

200

150

100

30 0 25 50 75 100 125

Duty ratio

Pulse widthb100Ms

Ta25˚C

100

103102101

Peak forward current IFM (mA)

10 000

1 000

Current transfer ratio CTR (%)

Forward current IF (mA)

0.1 1 10

2 000

1 800

1 600

1 400

400

600

800

1 000

1 200

200

VCE2V

Ta25˚C

Fig.3 Collector Power Dissipation vs.

Ambient Temperature

Fig.4 Total Power Dissipation vs.

Ambient Temperature

Fig.1 Forward Current vs.

Ambient Temperature

Fig.2 Diode Power Dissipation vs.

Ambient Temperature

Sheet No.: D2-A08501EN

PC845XJ0000F Series

Fig.7 Forward Current vs. Forward Voltage Fig.8 Collector Current vs.

Collector-emitter Voltage

Fig.9

Relative Current Transfer Ratio vs.

Ambient Temperature

Fig.10

Collector - emitter Saturation Voltage

vs. Ambient Temperature

Fig.11 Collector Dark Current vs.

Ambient Temperature

Fig.12 Collector-emitter Saturation Voltage

vs. Forward Current

50˚C25˚C

0˚C

0 0.5 1 1.5 2 2.5 3 3.5

100

25˚C

Ta75˚C

Forward current IF (mA)

Forward voltage VF (V)

01234

100

5mA

2mA

1mA

Collector current IC (mA)

Collector-emitter voltage VCE (V)

IF10mA

PC (MAX.)

Ta25˚C

Relative current transfer ratio ()

150

100

Ambient temperature Ta (˚C)

IF1mA

VCE2V

30 000000

1.3

1.2

1.1

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

Collector-emitter saturation voltage V

CE (sat)

(V)

IF20mA

IC5mA

Ambient temperature Ta (˚C)

30 000000

Collector dark current ICEO (A)

105

106

107

108

109

1010

1011

80604030 0 20 100

Ambient temperature Ta (˚C)

VCE10V

Collector-emitter saturation voltage VCE (sat) (V)

Forward current IF (mA)

7mA

50mA

30mA

1mA

3mA

5mA

IC0.5mA Ta25˚C

43.532.521.510.50

Sheet No.: D2-A08501EN

PC845XJ0000F Series

Fig.11

Response Time vs. Load Resistance

Fig.12 Test Circuit for Response Time

Fig.13 Frequency Response Fig.14

Test Circuit for Frequency Response

Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.

VCC

90%

10%

trtr

Output

Input

Input RDOutput

VCE

Please refer to the conditions in Fig.13

10.1

100

VCE2V

IC10mA

Ta25˚C

Response time (Ms)

Load resistance RL (k7)

0.10.01

20

10

1k7

1007

100

10k7

VCE2V

IC2mA

Ta25˚C

Voltage gain Av (dB)

Frequency f (kHz)

VCC

Output

VCE

Please refer to the conditions in Fig.15

Sheet No.: D2-A08501EN

PC845XJ0000F Series

■Design Considerations

●Design guide

While operating at IF<1.0mA, CTR variation may increase.

Please make design considering this fact.

This product is not designed against irradiation and incorporates non-coherent IRED.

●Degradation

In general, the emission of the IRED used in photocouplers will degrade over time.

In the case of long term operation, please take the general IRED degradation (50% degradation over 5

years) into the design consideration.

●Recommended foot print (reference)

(Unit : mm)

2.2

2.54 2.54 2.54 2.54 2.54 2.54 2.54

1.7

8.2

✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.

Sheet No.: D2-A08501EN

PC845XJ0000F Series

■Manufacturing Guidelines

●Soldering Method

Reﬂ ow Soldering:

Reﬂ ow soldering should follow the temperature proﬁ le shown below.

Soldering should not exceed the curve of temperature proﬁ le and time.

Please don't solder more than twice.

Flow Soldering :

Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the

below listed guidelines.

Flow soldering should be completed below 270 C and within 10s.

Preheating is within the bounds of 100 to 150 C and 30 to 80s.

Please don't solder more than twice.

Hand soldering

Hand soldering should be completed within 3s when the point of solder iron is below 400 C.

Please don't solder more than twice.

Other notice

Please test the soldering method in actual condition and make sure the soldering works fine, since

the impact on the junction between the device and PCB varies depending on the tooling and soldering

conditions.

1234

300

200

100

(˚C)

Terminal : 260˚C peak

( package surface : 250˚C peak)

Preheat

150 to 180˚C, 120s or less

Reflow

220˚C or more, 60s or less

(min)

Sheet No.: D2-A08501EN

PC845XJ0000F Series

●Cleaning instructions

Solvent cleaning :

Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.

Ultrasonic cleaning :

The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,

size of PCB and mounting method of the device.

Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of

mass production.

Recommended solvent materials :

Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.

In case the other type of solvent materials are intended to be used, please make sure they work fine in

actual using conditions since some materials may erode the packaging resin.

●Presence of ODC

This product shall not contain the following materials.

And they are not used in the production process for this product.

Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)

Speciﬁ c brominated ﬂ ame retardants such as the PBB and PBDE are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).

•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated

diphenyl ethers (PBDE).

Sheet No.: D2-A08501EN

PC845XJ0000F Series

■Package speciﬁ cation

●Sleeve package

Package materials

Sleeve : HIPS (with anti-static material)

Stopper : Styrene-Elastomer

Package method

MAX. 25 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless

stoppers.

The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.

MAX. 20 sleeves in one case.

Sleeve outline dimensions

(Unit : mm)

12.0

6.7

5.8

10.8

520

Sheet No.: D2-A08501EN

PC845XJ0000F Series

■Important Notices

· The circuit application examples in this publication

are provided to explain representative applications of

SHARP devices and are not intended to guarantee any

circuit design or license any intellectual property rights.

SHARP takes no responsibility for any problems related

to any intellectual property right of a third party resulting

from the use of SHARP's devices.

· Contact SHARP in order to obtain the latest device

specification sheets before using any SHARP device.

SHARP reserves the right to make changes in the

speciﬁ cations, characteristics, data, materials, structure,

and other contents described herein at any time

without notice in order to improve design or reliability.

Manufacturing locations are also subject to change

without notice.

· Observe the following points when using any devices

in this publication. SHARP takes no responsibility for

damage caused by improper use of the devices which

does not meet the conditions and absolute maximum

ratings to be used speciﬁ ed in the relevant speciﬁ cation

sheet nor meet the following conditions:

(i) The devices in this publication are designed for use

in general electronic equipment designs such as:

--- Personal computers

--- Ofﬁ ce automation equipment

--- Telecommunication equipment [terminal]

--- Test and measurement equipment

--- Industrial control

--- Audio visual equipment

--- Consumer electronics

(ii) Measures such as fail-safe function and redundant

design should be taken to ensure reliability and safety

when SHARP devices are used for or in connection

with equipment that requires higher reliability such as:

--- Transportation control and safety equipment (i.e.,

aircraft, trains, automobiles, etc.)

--- Trafﬁ c signals

--- Gas leakage sensor breakers

--- Alarm equipment

--- Various safety devices, etc.

(iii) SHARP devices shall not be used for or in

connection with equipment that requires an extremely

high level of reliability and safety such as:

--- Space applications

--- Telecommunication equipment [trunk lines]

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g.,

scuba).

· If the SHARP devices listed in this publication fall

within the scope of strategic products described in the

Foreign Exchange and Foreign Trade Law of Japan, it

is necessary to obtain approval to export such SHARP

devices.

· This publication is the proprietary product of SHARP

the copyright laws, no part of this publication may be

reproduced or transmitted in any form or by any means,

electronic or mechanical, for any purpose, in whole or in

part, without the express written permission of SHARP.

Express written permission is also required before any

use of this publication may be made by a third party.

· Contact and consult with a SHARP representative

if there are any questions about the contents of this

publication.

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