TAS2562YFPR - TEXAS INSTRUMENTS

September, 2018 − Rev. 1 1Publication Order Number:

NL17SZ04E/D

NL17SZ04E

Single Inverter

The NL17SZ04E is an inverter in three tiny footprint packages. The

device performs much as LCX multi−gate products in speed and drive.

Features

•Tiny SOT−353 Package

•24 mA Sink and Source Output Capability

•Over−Voltage Tolerant Inputs and Outputs

•Chip Complexity: FETs = 20

•Designed for 1.65 V to 5.5 V VCC Operation

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Figure 1. Pinout (Top View)

Figure 2. Logic Symbol

IN A OUT Y

VCC

IN A

GND OUT Y

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

MARKING

DIAGRAMS

SOT−353/SC70−5/SC−88A

DF SUFFIX

CASE 419A

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L5 MG

L5 = Specific Device Marking

M = Date Code*

G= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation and/or position may

vary depending upon manufacturing location.

PIN ASSIGNMENT

Function

IN A

GND

OUT Y

VCC

Input

FUNCTION TABLE

Output

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MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage −0.5 to +6.5 V

VIDC Input Voltage −0.5 to +6.5 V

VODC Output Voltage Active Mode, High or Low State (Note 1)

Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5

−0.5 to +6.5 V

IIK DC Input Diode Current VI < GND −50 mA

IOK DC Output Diode Current VO < GND −50 mA

IODC Output Sink Current ±50 mA

ICC DC Supply Current per Supply Pin ±100 mA

IGND DC Ground Current per Supply Pin ±100 mA

TSTG Storage Temperature Range −65 to )150 °C

TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C

TJJunction Temperature Under Bias )150 °C

qJA Thermal Resistance (Note 2) 350 °C/W

PDPower Dissipation in Still Air at 85°C 186 mW

MSL Moisture Sensitivity Level 1

FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

ESD ESD Classification Human Body Model (Note 3)

Charged Device Model (Note 4) 4000

1000 V

ILATCHUP Latchup Performance Above VCC and Below GND at 125°C (Note 5) ±100 mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. IO absolute maximum rating must be observed.

2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

3. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.

4. Tested to JESD22−C101−A.

5. Tested to EIA/JESD78.

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RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Unit

VCC DC Supply Voltage Operating

Data Retention 1.65

1.5 5.5

5.5 V

VIN DC Input Voltage 0 5.5 V

VOUT DC Output Voltage (High or Low State)

(VCC = 0 V) 0

0VCC

5.5 V

VOUT DC Output Voltage (SOT−953 Package) (High or Low State) 0 VCC V

TAOperating Temperature Range −55 +125 °C

tr, tfInput Rise and Fall Time VCC = 2.5 V $ 0.2 V

VCC = 3.0 V $ 0.3 V

VCC = 5.0 V $ 0.5 V

ns/V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

DC ELECTRICAL CHARACTERISTICS

Symbo

Parameter Condition VCC

(V)

TA = 255C−555C ≤ TA ≤ 1255C

Uni

Min Typ Max Min Max

VIH High−Level Input Voltage 1.65 to 1.95

2.3 to 5.5 0.75 VCC

0.7 VCC 0.75 VCC

0.7 VCC V

VIL Low−Level Input Voltage 1.65 to 1.95

2.3 to 5.5 0.25 VCC

0.3 VCC 0.25 VCC

0.3 VCC V

VOH High−Level Output Voltage

VIN = VIL IOH = −100 mA1.65 to 5.5 VCC − 0.1 VCC VCC − 0.1 V

IOH = − 4 mA 1.65 1.29 1.52 1.29

IOH = − 8 mA 2.3 1.9 2.1 1.9

IOH = − 12 mA 2.7 2.2 2.4 2.2

IOH = − 16 mA 3.0 2.4 2.7 2.4

IOH = − 24 mA 3.0 2.3 2.5 2.3

IOH = − 32 mA 4.5 3.8 4.0 3.8

VOL Low−Level Output Voltage

VIN = VIH IOL = 100 mA1.65 to 5.5 0.0 0.1 0.1 V

IOH = 4 mA 1.65 0.08 0.24 0.24

IOL = 8 mA 2.3 0.20 0.3 0.3

IOL = 1 2 mA 2.7 0.22 0.4 0.4

IOL = 1 6 mA 3.0 0.28 0.4 0.4

IOL = 2 4 mA 3.0 0.38 0.55 0.55

IOL = 3 2 mA 4.5 0.42 0.55 0.55

IIN Input Leakage Current VIN = 5.5 V or

GND 1.65 to 5.5 $0.1 $1.0 mA

IOFF Power Off Leakage

Current VIN = 5.5 V or

VOUT = 5.5 V 0 1 10 mA

ICC Quiescent Supply Current VIN = 5.5 V or

GND 5.5 1 10 mA

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

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AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns

Symbo

Parameter Condition VCC (V)

TA = 255C−555C ≤TA ≤ 1255C

Uni

Min Typ Max Min Max

tPLH

tPHL Propagation Delay

(Figure 3 and 4) RL = 1 MW, CL = 15 pF 1.65

1.8 5.3

4.4 11.4

9.5 12.0

10.0 ns

RL = 1 MW, CL = 15 pF 2.5 $0.2 3.5 6.5 7.0

RL = 1 MW, CL = 15 pF 3.3 $0.3 2.1 4.5 4.7

RL = 500 W, CL = 50 pF 2.9 5.5 5.2

RL = 1 MW, CL = 15 pF 5.0 $0.5 1.8 3.9 4.1

RL = 500 W, CL = 50 pF 2.4 4.3 4.5

CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Unit

CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC u2.5 pF

CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC

10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9

11 pF

6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic

power consumption; PD = CPD  VCC2  fin + ICC  VCC.

Figure 3. Switching Waveform

INPUT RLCL

A 1−MHz square input wave is recommended for

propagation delay tests.

Figure 4. Test Circuit

tf = 3 ns

VCC

GND

VOH

VOL

90%

50%

10%

50%

tPLH

tPHL

OUTPUT Y

INPUT

A and B

tf = 3 ns

90%

50%

10%

50%

OUTPUT

ORDERING INFORMATION

Device Package Shipping†

NL17SZ04EDFT2G SC−88A/SOT−353/SC−70−5

(Pb−Free) 3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NL17SZ04E

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PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 419A−01 OBSOLETE. NEW STANDARD

419A−02.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

DIM

MIN MAX MIN MAX

MILLIMETERS

1.80 2.200.071 0.087

INCHES

B1.15 1.350.045 0.053

C0.80 1.100.031 0.043

D0.10 0.300.004 0.012

G0.65 BSC0.026 BSC

H--- 0.10---0.004

J0.10 0.250.004 0.010

K0.10 0.300.004 0.012

N0.20 REF0.008 REF

S2.00 2.200.079 0.087

B0.2 (0.008) MM

12 3

D 5 PL

−B−

SC−88A (SC−70−5/SOT−353)

CASE 419A−02

ISSUE L

ǒmm

inchesǓ

SCALE 20:1

0.65

0.025

0.65

0.025

0.50

0.0197

0.40

0.0157

1.9

0.0748

SOLDER FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

NL17SZ04E/D

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