PROTECTION PRODUCTS
1www.semtech.com
PROTECTION PRODUCTS - MicroClampTM
uClamp3311P
Low Voltage μClampTM
for ESD and CDE Protection
Description Features
Dimensions Schematic & PIN Configuration
Revision 08/22/2007
The μClampTM series of Transient Voltage Suppressors
(TVS) are designed to replace multilayer varistors
(MLVs) in portable applications where low operating
voltage is vital. They offer superior electrical characteris-
tics such as lower clamping voltage and no device
degradation when compared to MLVs. They are de-
signed to protect sensitive semiconductor components
from damage or upset due to electrostatic discharge
(ESD), lightning, electrical fast transients (EFT), and
cable discharge events (CDE).
The μClampTM3311P is constructed using Semtech’s
proprietary EPD process technology. The EPD process
provides low standoff voltages with significant reduc-
tions in leakage currents and capacitance over silicon-
avalanche diode processes. They feature a true
operating voltage of 3.3 volts for superior protection
when compared to traditional pn junction devices.
The μClampTM3311P is in an 2-pin, RoHS/WEEE compli-
ant, SLP1006P2 package. It measures 1.0 x 0.6 x
0.5mm. The leads are spaced at a pitch of 0.65mm
and are finished with lead-free NiPdAu. Each device
will protect one line operating at 3.3 volts. It gives the
designer the flexibility to protect single lines in applica-
tions where arrays are not practical. They may be used
to meet the ESD immunity requirements of IEC 61000-
4-2, Level 4 (±15kV air, ±8kV contact discharge). The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and MP3 players.
Applications
Mechanical Characteristics
Cellular Handsets & Accessories
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package (1.0 x 0.6 x 0.5mm)
Protects one data line
Low clamping voltage
Working voltage: 3.3V
Low leakage current
Solid-state silicon-avalanche technology
SLP1006P2 package
RoHS/WEEE Compliant
Nominal Dimensions: 1.0 x 0.6 x 0.5 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code, cathode band
Packaging : Tape and Reel
SLP1006P2 (Bottom View)
Maximum Dimensions (mm)
0.65
0.50
0.60
1.0
2© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3311P
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
retemaraPlobmySsnoitidnoCmuminiMlacipyTmumixaMstinU
egatloVffO-dnatSesreveRV
MWR
3.3V
egatloVhguorhT-hcnuPV
TP
I
TP
Aμ2=5.3V
egatloVkcaB-panSV
BS
I
BS
Am05=8.2V
tnerruCegakaeLesreveRI
R
V
MWR
V3.3=50.05.0Aμ
egatloVgnipmalCV
C
I
PP
sμ02/8=pt,A1=8V
egatloVgnipmalCV
C
I
PP
sμ02/8=pt,A5=81V
ecnaticapaCnoitcnuJC
j
dnGotnipO/I
V
R
zHM1=f,V0=
2151Fp
dnGotnipO/I
V
R
zHM1=f,V3.3=
01Fp
gnitaRlobmySeulaVstinU
)sμ02/8=pt(rewoPesluPkaePP
kp
09sttaW
(tnerruCesluPkaePmumixaM)sμ02/8=ptI
pp
5spmA
)riA(2-4-00016CEIrepDSE
)tcatnoC(2-4-00016CEIrepDSE
V
PP
52-/+
02-/+
Vk
erutarepmeTgnitarepOT
J
58+ot04-C°
erutarepmeTegarotST
GTS
051+ot55-C°
3
© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3311P
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature - TA (oC)
% of Rated Power or IPP
Power Derating Curve
Clamping Voltage vs. Peak Pulse Current Junction Capacitance vs. Reverse Voltage
Insertion Loss S21
START
. 030 MHz 3
STOP 000
. 000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -3.0120 dB
616.229 MHz
2: -3.8355 dB
900 MHz
3: -5.9804 dB
1.8 GHz
4: -8.1629 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
1
GHz
100
MHz 3
GHz
10
MHz
1
MHz
1 2
3
4
0.01
0.1
1
10
0.1 1 10 100 1000
Pulse Duration - tp (us)
Peak Pulse Power - PPP (kW)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
00.511.522.533.5
Reverse Voltage - VR (V)
CJ(VR) / CJ(VR=0)
f = 1 MHz
0
2
4
6
8
10
12
14
16
18
20
0123456
Peak Pulse Current - IPP (A)
Clamping Voltage - VC (V)
Waveform
Parameters:
tr = 8μs
td = 20μs
4© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3311P
Device Connection Options
The μClamp3311P is designed to protect one data line
operating up to 3.3 volts. It will present a high
impedance to the protected line up to 3.3 volts. It will
“turn on” when the line voltage exceeds 3.5 volts. The
device is bidirectional and may be used on lines where
the signal polarity is above and below ground. These
devices are not recommended for use on dc power supply
lines due to their snap-back voltage characteristic.
EPD TVS Characteristics
These devices are constructed using Semtech’s
proprietary EPD technology. The structure of the EPD
TVS is vastly different from the traditional pn-junction
devices. At voltages below 5V, high leakage current
and junction capacitance render conventional ava-
lanche technology impractical for most applications.
However, by utilizing the EPD technology, these devices
can effectively operate at 3.3V while maintaining
excellent electrical characteristics.
The EPD TVS employs a complex nppn structure in
contrast to the pn structure normally found in tradi-
tional silicon-avalanche TVS diodes. The EPD mecha-
nism is achieved by engineering the center region of
the device such that the reverse biased junction does
not avalanche, but will “punch-through” to a conduct-
ing state. This structure results in a device with supe-
rior DC electrical parameters at low voltages while
maintaining the capability to absorb high transient
currents.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
zPlace the TVS near the input terminals or connec-
tors to restrict transient coupling.
zMinimize the path length between the TVS and the
protected line.
zMinimize all conductive loops including power and
ground loops.
zThe ESD transient return path to ground should be
kept as short as possible.
zNever run critical signals near board edges.
zUse ground planes whenever possible.
Applications Information
Device Schematic & Pin Configuration
IPP
ISB
IPT
IR
V
RWM VV PT VC
VF
IF
SB
EPD TVS IV Characteristic Curve
5
© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3311P
Figure 1 - uClamp3311P Spice Model
Applications Information - Spice Model
sretemaraPecipSP1133pmalCu-1elbaT
retemaraPtinU)SVT(1D)SVT(2D
SIpmA02-E102-E1
VBtloV8.38.3
JVtloV7.07.0
SRmhO1.11.1
VBIpmA3-
E13-E1
OJCdaraF21-E0221-E02
TTces9-E145.29-E145.2
M--412.0412.0
N--1.11.1
GEVe11.111.1
6© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3311P
Outline Drawing - SLP1006P2
Land Pattern - SLP1006P2
INCHES
.026 BSC
aaa
N
E
L
e
.008
.020
DIM
A
MIN
.018
.016
0.30
0.70
0.20
0.50
.003
2
.010
.024
.012
.028
0.08
2
0.25
0.60
0.65 BSC
MILLIMETERS
MAX
0.55
0.55
DIMENSIONS
MIN
0.45
NOM
.020
.020
MAX
.022
.022
NOM
0.40
0.50
0.50
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
1.
BOTTOM VIEW
TOP VIEW
AB
C
b
aaa C
SEATING
PLANE
bbb C A B
D.035 .039 .043 0.90 1.10
1.00
.004bbb 0.10
D
E
A1
A
bxN
e
A1 .000 .001 .002 0.00 0.03 0.05
R
2x L
PIN 1 ID
R .002 .004 .006 0.05 0.10 0.15
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
DIM
Y
G
C
MILLIMETERSINCHES
(0.85)
.055
.012
.022
(.033)
1.40
0.55
0.30
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
Z
Y
(C) GZ
X .024 0.60
X
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
7
© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3311P
Marking Code
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Ordering Information
rebmuNtraP gnikroW
egatloV
repytQ
leeR
leeR
eziS
TCT.P1133pmalCuV3.3000,3hcnI7
Tape and Reel Specification
Notes:
1) This is a lead-free, RoHS/WEEE compliant product
MicroClamp, uClamp and μClamp are marks of Semtech
Corporation
epaT
htdiW )xaM(,BD1DE F P0P2PTW
mm8 mm2.4
)561.(
mm1.0+5.1
mm0.0-
500.+95.0(
)000.-
mm4.0
52.0±
)130.(
01.±057.1
mm
)400.±960.
(
50.0±5.3
mm
)200.±831.(
01.0±0.4
mm
-00.±751.(
)4
1.0±0.4
mm
-00.±751.(
)4
50.0±0.2
mm
)200.±970.(
20.0±452.0
)610.(mm
mm0.8
mm3.0+
mm1.0-
)210.±213.(
0A0B0K
mm01.0-/+96.0mm01.0-/+91.1mm01.0-/+66.0
X
PIN 1 ID
