WM2125
Dual 10-bit 40MSPS ADC
WOLFSON MICROELECTRONICS plc
www.wolfsonmicro.com
Advance Information, January 2003, Rev 1.2
Copyright 2003 Wolfson Microelectronics plc
DESCRIPTION
The WM2125 is a dual channel 10-bit 40MSPS ADC which
consumes only 240mW from a single 3.3V supply. The
device is optimised for communications applications that
require close matching between channels and a wide input
bandwidth.
Input signals are differential for improved noise
performance. Both A and B input channels are sampled
simultaneously and are processed through matched signal
paths and 10-bit multistage pipeline ADC. A number of
different input clock / output data formats are supported
including 20-bits wide at the sampling rate or 10-bits wide at
twice the sampling rate, with additional clock outputs
supplied by the device to latch the output data.
System design and power requirements are further
simplified by the provision of an on-chip precision voltage
reference. Alternatively, external references can be used if
higher precision references are required.
FEATURES
Two 10-bit resolution ADCs
40MSPS conversion rate
Programmable clock / output data formats
10-bit multiplexed or 20-bit wide output
Input clock at sample rate or twice sample rate for
multiplexed output
Output clocks for output data sampling
Precision internal voltage references
Hardware mode selection
Wide input bandwidth 300MHz
Low power 240mW typical at 3.3V supplies
Powerdown mode to less than 1mW
48-pin TQFP package
APPLICATIONS
I/Q demodulation for
Wireless Local Loop (WLL)
Set Top Box (STB)
Cable Modem
IF and Baseband Digitisation
Test Instrumentation
Medical Imaging
BLOCK DIAGRAM
WM2125
AP
PRECISION
REFERENCE
CIRCUITS
AN DA[9:0]
AVSSAVDD
REFT REFB
STBY
DVSS
DVDD
TIMING
CONTROL
COUTB
PWDN_REF
BP
BN
OEB
DB[9:0]
COUT
CLK
DRVSS
DRVDD
CML
CONFIGURATION
CONTROL
TP
MODE
SELB
10-Bit
ADC
10-Bit
ADC
DATA
OUTPUT
FORMAT
AND
OUTPUT
BUFFERS
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PIN CONFIGURATION ORDERING INFORMATION
DEVICE TEMP. RANGE PACKAGE
WM2125CFT 0 to +70oC48-pin TQFP
WM2125IFT -40 to +85oC48-pin TQFP
OEB
DVSS
SELB
DVDD
MODE
CLK
AVDD
AP
AN
AVSS
AVDD
STBY
3747 46 45 44 43 42 41 40 39 3848
DRVSS
DA5
DA1
DA4
DA3
DA2
DA0
DA8
DRVDD
DA9
DA7
DA6
DRVDD
DB4
DB5
DB6
DB7
DB8
DB9
DB3
DB2
DB1
DB0
DRVSS
AVSS
REFB
REFT
CML
PWDNREF
BP
BN
COUTB
COUT
AVDD
AVSS
TP
25
31
30
29
28
27
26
36
35
34
33
32
1
9
8
7
6
5
4
3
2
12
11
10
24
2316 17 18 19 20 21 22
13 14 15
PIN DESCRIPTION
PIN NAME TYPE DESCRIPTION
1DRVDD Supply Positive digital output driver supply
2DB9 Digital Output Digital output for Q channel in dual bus mode bit 9 (msb)
3DB8 Digital Output Digital output for Q channel in dual bus mode bit 8
4DB7 Digital Output Digital output for Q channel in dual bus mode bit 7
5DB6 Digital Output Digital output for Q channel in dual bus mode bit 6
6DB5 Digital Output Digital output for Q channel in dual bus mode bit 5
7DB4 Digital Output Digital output for Q channel in dual bus mode bit 4
8DB3 Digital Output Digital output for Q channel in dual bus mode bit 3
9DB2 Digital Output Digital output for Q channel in dual bus mode bit 2
10 DB1 Digital Output Digital output for Q channel in dual bus mode bit 1
11 DB0 Digital Output Digital output for Q channel in dual bus mode bit 0 (lsb)
12 DRVSS Ground Negative digital output driver supply
13 DRVDD Supply Positive digital output driver supply
14 DA9 Digital Output Digital output for I (dual bus mode), I/Q (single bus mode) bit 9 (msb)
15 DA8 Digital Output Digital output for I (dual bus mode), I/Q (single bus mode) bit 8
16 DA7 Digital Output Digital output for I (dual bus mode), I/Q (single bus mode) bit 7
17 DA6 Digital Output Digital output for I (dual bus mode), I/Q (single bus mode) bit 6
18 DA5 Digital Output Digital output for I (dual bus mode), I/Q (single bus mode) bit 5
19 DA4 Digital Output Digital output for I (dual bus mode), I/Q (single bus mode) bit 4
20 DA3 Digital Output Digital output for I (dual bus mode), I/Q (single bus mode) bit 3
21 DA2 Digital Output Digital output for I (dual bus mode), I/Q (single bus mode) bit 2
22 DA1 Digital Output Digital output for I (dual bus mode), I/Q (single bus mode) bit 1
23 DA0 Digital Output Digital output for I (dual bus mode), I/Q (single bus mode) bit 0 (lsb)
24 DRVSS Ground Negative digital output driver supply
25 COUTB Digital Output Inverted latch clock output for digital outputs
26 COUT Digital Output Latch clock output for digital outputs
27 AVDD Supply Positive Analogue Supply
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PIN NAME TYPE DESCRIPTION
28 AVSS Ground Negative Analogue Supply
29 TP This pin must be connected to DVDD. It should not be left floating.
30 REFB Analogue Input/Output ADC bottom reference
31 REFT Analogue Input/Output ADC top reference
32 CML Analogue Output ADC reference common mode level output
33 PWDNREF Digital Input Powerdown control for internal ADC reference generator
34 BP Analogue Input Positive input for the B signal channel
35 BN Analogue Input Negative input for the B signal channel
36 AVSS Ground Negative Analogue Supply
37 AVDD Supply Positive Analogue Supply
38 AP Analogue Input Positive input for the A signal channel
39 AM Analogue Input Negative input for the A signal channel
40 AVSS Ground Negative Analogue Supply
41 AVDD Supply Positive Analogue Supply
42 STBY Digital Input Standby control
43 DVSS Ground Negative Digital Supply
44 SELB Digital Input Selects either single bus data output or dual bus data output. A LOW
selects dual bus data output.
45 DVDD Supply Positive Digital Supply
46 MODE Digital Input Selects the COUT and COUTB output mode.
47
CLK
Digital Input Conversion clock. The input is sampled on each rising edge of CLK
when using a 40MHz input and alternate rising edges when using an
80MHz clock.
48 OEB Digital Input Output enable. A LOW on this terminal will enable the data output bus,
COUT and COUTB
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at
or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage
of this device.
CONDITION MIN MAX
Digital supply voltage, DVDD to DVSS -0.5V +3.6V
Digital output driver supply voltage, DRVDD to DRVSS -0.5V +3.6V
Analogue supply voltage, AVDD to AVSS -0.5V +3.6V
Maximum ground difference between AVSS, DVSS and DRVSS -0.5V +0.5V
Voltage range digital inputs DVSS 0.5V DVDD + 0.5V
Voltage range analogue inputs (includes CLK pin) AVSS - 0.5V AVDD + 0.5V
Operating temperature range, TA-45°C+85°C
Storage temperature -65°C +150°C
Lead temperature (1.6mm from case for 10 seconds) +300°C
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RECOMMENDED OPERATING CONDITIONS
PARAMETER SYMBOL TEST CONDITIONS MIN NOM MAX UNIT
Power Supply
Digital supply range DVDD 3.0 3.3 3.6 V
Digital output driver supply range DRVDD 3.0 3.3 3.6 V
Analogue supply range AVDD 3.0 3.3 3.6 V
Ground DVSS, DRVSS,
AVSS
0V
Analogue and Reference Inputs
Reference Input Voltage (top) VREFT FCLK = 1MHz to 80MHz 1.9 2.0 2.15 V
Reference Input Voltage (bottom) VREFB FCLK = 1MHz to 80MHz 0.95 1.0 1.1 V
Reference Voltage Differential VREFT-VREFB FCLK = 1MHz to 80MHz 0.95 1.0 1.1 V
Reference Input Resistance RREF FCLK = 80MHz 1650
Reference Input Current IREF FCLK = 80MHz 0.62 mA
Analogue Input Voltage (differential) VIN V
Analogue Input Voltage (single
ended) Note 1
VIN -1 1 V
Analogue Input Capacitance CI CML 1.0 CML + 1.0 pF
Clock Input Note 2 8V
Analogue Outputs
CML Voltage AVDD/2 V
CML Output Resistance 2.3 k
Digital Inputs
High-Level Input Voltage 2.4 DVDD V
Low-Level Input Voltage DGND 0.8 V
Input Capacitance 5pF
Clock Period 12.5 ns
Pulse Duration Clock HIGH or LOW 5.25 ns
Clock Period 25 ns
Pulse Duration Clock HIGH or LOW 11.25 ns
Notes
1. Applies only when the signal reference input connects to CML.
2. Clock pin is referenced to AVDD/AVSS.
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ELECTRICAL CHARACTERISTICS
Test Conditions:
over recommended operation conditions with FCLK = 80MHz and use of internal voltage references, and PGA gain = 0dB,
unless otherwise stated.
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
DC Accuracy
Integral nonlinearity INL nternal References (Note 1) -1.5 ±0.4 +1.5 LSB
Differential nonlinearity DNL nternal References (Note 2) -0.9 ±0.5 +1.0 LSB
Zero error (Note 3) 0.12 ±1.5 % of FS
Full-Scale error 0.28 ±1.5 % of FS
Gain error
AVDD = DVDD = DRVDD =
3.3V
External References
(Note3) 0.24 ±1.5 % of FS
Missing codes No missing codes guaranteed
References
REFT output voltage VREFTO 1.9 2.0 2.1 V
REFB output voltage VREFBO
Absolute Min/Max Values
Valid and Tested for AVDD
=3.3V 0.95 1.0 1.05 V
Differential Reference Voltage REFT-
RERB 0.95 1.0 1.05 V
Power Supplies
AVDD 56 62
DVDD 1.7 2.2
IDD Operating Supply Current
DRVDD
AVDD = DVDD = DRVDD =
3.3V, CL = 10pF, VIN =
3.5MHz, -1dBFS 15 26
mA
PWDN_REF = L 240 290
Power Dissipation PD PWDN_REF = H 220 240 mW
Standby Power PD(STBY) STDBY = H, CLK held
HIGH or LOW 95 150 uW
Power-Up Time for all
references from Standby tPD 550 ms
Wake up Time tWU External Reference 40 us
Digital Inputs
High-Level Input Current on
Digital Inputs incl. CLK IIH -1 +1 uA
Low-Level Input Current on
Digital Inputs incl. CLK IIL
AVDD = DVDD = DRVDD =
3.6V -1 +1 uA
Digital Outputs
High-Level Output Voltage VOH
AVDD = DVDD = DRVDD =
3.0V at IOH = 50uA, Digital
Outputs Forced HIGH
2.8 2.96 V
Low-Level Output Voltage VOL
AVDD = DVDD = DRVDD =
3.0V at IOH = 50uA, Digital
Outputs Forced LOW
0.04 0.2 V
Output Capacitance CO5pF
High-Impedance State Output
Current to High-Level IOZH -1 +1 uA
High-Impedance State Output
Current to Low-Level IOZL
AVDD = DVDD = DRVDD =
3.6V -1 +1 uA
CLOAD = 10pF, Single-Bus
Mode 3ns
Data Output Rise and Fall Time CLOAD = 10pF, Dual-Bus
Mode 5ns
Notes
1. INL refers to the deviation of each individual code from a line drawn from zero to full-scale. The point used as zero
occurs 1/2LSB before the first code transition. The full-scale point is defined as a level 1/2LSB beyond the last code
transition. The deviation is measured from the center of each particular code to the best fit line between these two
points.
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2. An ideal ADC exhibits code transitions that are exactly 1LSB apart. DNL is the deviation from this ideal value.
Therefore this measure indicates how uniform the transfer function step sizes are. The ideal step size is defined here
as the step size for the device under test, (i.e., (the last transition level-first transition level)/(2n-2)). Using this
definition for DNL separates the effects of gain and offset error. A minimum DNL better than -1LSB ensures no
mission codes.
3. Zero is defined as the difference in analogue input voltage between the ideal voltage and the actual voltage that
will switch the ADC output from code 0 to code 1. The ideal voltage level is determined by adding the voltage
corresponding to 1/2LSB to the bottom reference level. The voltage corresponding to 1LSB is found from the
difference of top and bottom references divided by the number of ADC output levels (1024). Full scale error is defined
as the difference in analogue input voltage between the ideal voltage and the actual voltage that will switch the
ADC output from code 1022 to 1023. The ideal voltage level is determined by subtracting the voltage corresponding to
1.5LSB from the top reference level. The voltage corresponding to 1LSB is found from the difference of top and
bottom references divided by the number of ADC output levels (1024).
DYNAMIC PERFORMANCE (NOTE 1)
Test Conditions:
TA=T
MIN to TMAX, AVDD = DVDD = DRVDD = 3.3V, fIN = -1dBFS, Internal Reference, fCLK = 80MHz, fS= 40MSPS, Differential
Input Range = 2Vp-p, and PGA Gain = 0dB, unless otherwise noted.
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
Dynamic Performance
fIN = 3.5MHz 9.7
fIN = 10.5MHz 9.3 9.7
Effective number of bits ENOB
fIN = 20MHz 9.6
bits
fIN =3.5MHz 75
fIN = 10.5MHz 69 73
Spurious free dynamic range SFDR
fIN = 20MHz 70.5
dB
fIN =3.5MHz -71
fIN = 10.5MHz -71 -66
Total harmonic distortion THD
fIN = 20MHz -68
dB
fIN = 3.5MHz 60.5
fIN = 10.5MHz 60.5
Signal to noise ratio SNR
fIN = 20MHz 60
dB
fIN =3.5MHz 60
fIN = 10.5MHz 57 60
Signal to noise and distortion ratio SINAD
fIN = 20MHz 60
dB
Analogue Input Bandwidth See Note 2 300 MHz
2-Tone Intermodulation Distortion IMD F1 = 9.5MHz, F2 =
9.9MHz -68 dBc
A/B Channel Crosstalk -75 dBc
A/B Channel Offset Mismatch 0.016 1.75 % of FS
A/B Channel Full-Scale Error
Mismatch 0.025 1.0 % of FS
Notes
1. These specifications refer to a 25series resistor and 15pF differential capacitor between A/B+ and A/B- inputs; any
source impedance will bring the bandwidth down.
2. Analogue input bandwidth is defined as the frequency at which the sampled input signal is 3dB down on unity gain
and is limited by the input switch impedance.
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TIMING REQUIREMENTS
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
Input Clock Rate fCLK 180MHz
Conversion Rate 1 40 MSPS
Clock Duty Cycle (40MHz) 45 50 55 %
Clock Duty Cycle (80MHz) 42 50 58 %
Output Delay Time td(o) CL= 10pF 9 14 ns
Mux Setup Time ts(m) 9 10.4 ns
Mux Hold Time th(m) CL= 10pF 1.7 2.1 ns
Output Setup Time ts(o) CL= 10pF 9 10.4 ns
Pipeline Delay (latency, channels A
and B) td(pipe) MODE = 0, SELB = 0 8 CLK Cycles
Pipeline Delay (latency, channels A
and B) td(pipe) MODE = 1, SELB = 0 4 CLK Cycles
Pipeline Delay (latency, channel A) td(pipe) MODE = 0, SELB = 1 8 CLK Cycles
Pipeline Delay (latency, channel B) td(pipe) MODE = 0, SELB = 1 9 CLK Cycles
Pipeline Delay (latency, channel A) td(pipe) MODE = 1, SELB = 1 8 CLK Cycles
Pipeline Delay (latency, channel B) td(pipe) MODE = 1, SELB = 1 9 CLK Cycles
Output Hold Time th(o) CL= 10pF 1.5 2.2 ns
Aperture Delay Time td(a) 3ns
Aperture Jitter tj(a) 1.5 ps, rms
DisableTime,OEBRisingtoHi-Z tdis 58 ns
Enable Time, OEB Falling to Valid
Data ten 58 ns
Notes
1. All internal operations are performed at a 40MHz clock rate.
TIMING OPTIONS
OPERATING MODE MODE SELB TIMING DIAGRAM FIGURE
80MHz Input Clock, Dual-Bus Output, COUT = 40MHz 00 1
40MHz Input Clock, Dual-Bus Output, COUT = 40MHz 10 2
80MHz Input Clock, Single-Bus Output, COUT = 40MHz 0 1 3
80MHz Input Clock, Single-Bus Output, COUT = 80MHz 11 4
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TIMING DIAGRAMS
Figure 1 Timing Diagram, Dual Bus Output - Option 1
Figure 2 Timing Diagram, Dual Bus Output - Option 2
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Figure 3 Timing Diagram, Single Bus Output - Option 1
Figure 4 Timing Diagram, Single Bus Output - Option 2
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TYPICAL CHARACTERISTICS
At TA=25
oC,AVDD=DVDD=DRVDD=3.3V,f
IN = -0.5dBFS, Internal Reference, fCLK = 80MHz,
fS= 40MSPS, Differential Input Range = 2Vp-p, 25series resistor, and 15pF differential capacitor at
A/B+ and A/B- inputs, unless otherwise stated.
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DEVICE OPERATION
INTRODUCTION
The WM2125 implements a dual high-speed 10-bit, 40MSPS converter in a cost-effective CMOS
process. The differential inputs on each channel are sampled simultaneously. Signal inputs are
differential and the clock signal is single-ended. The clock signal is either 80MHz or 40MHz,
depending on the device configuration set by the user. Powered from 3.3V, the dual-pipeline design
architecture ensures low-power operation and 10-bit resolution. The digital inputs are 3.3V
TTL/CMOS compatible. Internal voltage references are included for both bottom and top voltages.
Alternatively, the user may apply externally generated reference voltages. In doing so, the input
range can be modified to suit the application.
The ADC is a 5-stage pipelined ADC with four stages of fully-differential switched capacitor sub-
ADC/MDAC pairs and a single sub-ADC in stage five. All stages deliver two bits of the final
conversion result. A digital error correction is used to compensate for modest comparator offsets in
the sub-ADCs.
SAMPLE AND HOLD AMPLIFIER
Figure 6 shows the internal SHA/SHPGA architecture. The circuit is balanced and fully differential for
good supply noise rejection. The sampling circuit has been kept as simple as possible to obtain good
performance for high-frequency input signals.
Figure 5. SHA/SHPGA Architecture
The analogue input signal is sampled on capacitors CSP and CSN while the internal device clock is
LOW. The sampled voltage is transferred to capacitors CHP and CHN and held on these while the
internal device clock is HIGH. The SHA can sample both single-ended and differential input signals.
The load presented to the AIN pin consists of the switched input sampling capacitor CS
(approximately 2pF) and its various stray capacitances. A simplified equivalent circuit for the
switched capacitor input is shown in Figure 7. The switched capacitor circuit is modelled as a resistor
RIN .f
CLK is the clock frequency, which is 40MHz at full speed, and CSis the sampling capacitor. The
use of 25 series resistors and a differential 15pF capacitor at the A/B+ and A/B– inputs is
recommended to reduce noise.
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Figure 6 Equivalent Circuit for the Switched Capacitor Input
ANALOGUE INPUT, DIFFERENTIAL CONNECTION
The analogue input of the WM2125 is a differential architecture that can be configured in various
ways depending on the signal source and the required level of performance. A fully differential
connection will deliver the best performance from the converter. The analogue inputs must not go
below AVDD or above AVDD. The inputs can be biased with any common-mode voltage provided
that the minimum and maximum input voltages stay within the range AVSS to AVDD. It is
recommended to bias the inputs with a common-mode voltage around AVDD/2. This can be
accomplished easily with the output voltage source CML, which is equal to AVDD/2. CML is made
available to the user to help simplify circuit design. This output voltage source is not designed to be a
reference or to be loaded but makes an excellent DC bias source and stays well within the analogue
input common-mode voltage range over temperature. Table 3 lists the digital outputs for the
corresponding analogue input voltages.
DIFFERENTIAL INPUT
VIN = (A/B+) (A/B-), REFT REFB = 1V, PGA = 0dB
Analogue Input Voltage Digital Output Code
VIN =+1V 3FFH
VIN =0V 200H
VIN =-1V 000H
Table 1 Output Format for Differential Configuration
DC-COUPLED DIFFERENTIAL ANALOGUE INPUT CIRCUIT
Driving the analogue input differentially can be achieved in various ways. Figure 8 gives an example
where a single-ended signal is converted into a differential signal by using a fully differential amplifier.
The input voltage applied to VOCM of the amplifier shifts the output signal into the desired
common–mode level. VOCM can be connected to CML of the WM2125, the common-mode level is
shiftedtoAV
DD /2.
Figure 7 Single Ended to Differential Conversion
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AC-COUPLED DIFFERENTIAL ANALOGUE INPUT CIRCUIT
Driving the analogue input differentially can be achieved by using a transformer coupling, as
illustrated in Figure 9. The centre tap of the transformer is connected to the voltage source CML,
which sets the common–mode voltage to AV DD /2. No buffer is required at the output of CML since
the circuit is balanced and no current is drawn from CML.
Figure 8 AC-Coupled Differential Input with Transformer
ANALOGUE INPUT, SINGLE ENDED CONFIGURATION
For a single-ended configuration, the input signal is applied to only one of the two inputs. The signal
applied to the analogue input must not go below AVSS or above AVDD. The inputs can be biased
with any common-mode voltage provided that the minimum and maximum input voltage stays within
the range AV SS to AVDD. It is recommended to bias the inputs with a common-mode voltage
around AVDD/2. This can be accomplished easily with the output voltage source CML, which is
equal to AVDD/2. An example for this is shown in Figure 10.
Figure 9 AC-Coupled, Single-Ended Configuration
The signal amplitude to achieve full-scale is 2Vp-p. The signal, which is applied at A/B+ is centred at
the bias voltage. The input A/B is also centred at the bias voltage. The CML output is connected via
a4.7k resistor to bias the input signal. There is a direct DC–coupling from CML to A/B while this
input is AC–decoupled through the 10uF and 0.1uF capacitors. The decoupling minimizes the
coupling of A/B+ into the A/B– path. Table 4 lists the digital outputs for the corresponding analogue
input voltages.
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Single Ended Input, REFT-REFB = 1V PGA = 0dB
Analogue Input Voltage Digital Output Code
V(A/B+) = VCML +1V 3FFH
V(A/B+) = VCML 200H
V(A/B+) = VCML –1V 000H
Table 2 Output Format for Single Ended Configuration
REFERENCE TERMINALS
The WM2125’s input range is determined by the voltages on its REFB and REFT pins. The WM2125
has an internal voltage reference generator that sets the ADC reference voltages REFB = 1V and
REFT = 2V. The internal ADC references must be decoupled to the PCB AVSS plane. The
recommended decoupling scheme is shown in Figure 11. The common-mode reference voltages
should be 1.5V for best ADC performance.
Figure 10 Recommended External Decoupling for the Internal ADC Reference
External ADC references can also be chosen. The WM2125 internal references must be disabled by
tying PWDN_REF HIGH before applying the external reference sources to the REFT and REFB pins.
The common-mode reference voltages should be 1.5V for best ADC performance.
Figure 11 External ADC Reference Configuration
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DIGITAL INPUTS
Digital inputs are CLK, SCLK, SDI, CSB, STDBY, PWDN_REF, and OEB. These inputs don’t have a
pull-down resistor to ground, therefore, they should not be left floating.
The CLK signal at high frequencies should be considered as an analogue’ input. CLK should be
referenced to AVDD and AVSS to reduce noise coupling from the digital logic.
Overshoot/undershoot should be minimized by proper termination of the signal close to the WM2125.
An important cause of performance degradation for a high-speed ADC is clock jitter. Clock jitter
causes uncertainty in the sampling instant of the ADC, in addition to the inherent uncertainty on the
sampling instant caused by the part itself, as specified by its aperture jitter. There is a theoretical
relationship between the frequency (f) and resolution (2 N) of a signal that needs to be sampled on
one hand, and on the other hand the maximum amount of aperture error dtmax that is tolerable. It is
given by the following relation:
)1(
max 2
1
+
Π
=N
f
dt
As an example, for a 10-bit converter with a 20MHz input, the jitter needs to be kept less than 7.8ps
in order not to have changes in the LSB of the ADC output due to the total aperture error.
DIGITAL OUTPUTS
The output of WM2125 is an unsigned binary or Binary Two’s Complement code. Capacitive loading
on the output should be kept as low as possible (a maximum loading of 10pF is recommended) to
ensure best performance. Higher output loading causes higher dynamic output currents and can,
therefore, increase noise coupling into the part’s analogue front end. To drive higher loads, the use of
an output buffer is recommended.
When clocking output data from WM2125, it is important to observe its timing relation to COUT.
Please refer to the timing section for detailed information on the pipeline latency in the different
modes. For safest system timing, COUT and COUTB should be used to latch the output data (see
Figures 1 to 4). In Figure 4, COUT can be used by the receiving device to identify whether the data
presently on the bus is from channel A or B.
LAYOUT, DECOUPLING AND GROUNDING RULES
Proper grounding and layout of the PCB on which the WM2125 is populated is essential to achieve
the stated performance. It is advised to use separate analogue and digital ground planes that are
spliced underneath the IC. The WM2125 has digital and analogue pins on opposite sides of the
package to make this easier. Since there is no connection internally between analogue and digital
grounds, they have to be joined on the PCB. It is advised to do this at one point in close proximity to
the WM2125.
As for power supplies, separate analogue and digital supply pins are provided on the part (AVDD
/DVDD ). The supply to the digital output drivers is kept separate as well (DRVDD ). Lowering the
voltage on this supply to 3.0V instead of the nominal 3.3V improves performance because of the
lower switching noise caused by the output buffers. Due to the high sampling rate and switched-
capacitor architecture, the WM2125 generates transients on the supply and reference lines. Proper
decoupling of these lines is, therefore, essential.
SERIAL INTERFACE
A falling edge on CSB enables the serial interface, allowing the 16-bit control register date to be
shifted (MSB first) on subsequent falling edges of SCLK. The data is loaded into the control register
on the first rising edge of SCLK after its 16th falling edge or CSB rising, whichever occurs first. CSB
rising before 16 falling SCLK edges have been counted is an error and the control register will not be
updated. The maximum update rate is:
MHz
MHz
f
fSCLK
update 25.1
16
20
16
max ===
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NOTES
1. Integral Nonlinearity (INL) Integral nonlinearity refers to the deviation of each individual code
from a line drawn from zero to full-scale. The point used as zero occurs _ LSB before the first code
transition. The full-scale point is defined as a level _ LSB beyond the last code transition. The
deviation is measured from the centre of each particular code to the true straight line between these
two endpoints.
2. Differential Nonlinearity (DNL) An ideal ADC exhibits code transitions that are exactly 1LSB
apart. DNL is the deviation from this ideal value. Therefore, this measure indicates how uniform the
transfer function step sizes are. The ideal step size is defined here as the step size for the device
under test (i.e., (last transition level first transition level)/(2n 2)). Using this definition for DNL
separates the effects of gain and offset error. A minimum DNL better than –1LSB ensures no
missing codes.
3. Zero and Full-Scale Error Zero error is defined as the difference in analogue input voltage—
between the ideal voltage and the actual voltage—that will switch the ADC output from code 0 to
code 1. The ideal voltage level is determined by adding the voltage corresponding to _ LSB to the
bottom reference level. The voltage corresponding to 1LSB is found from the difference of top and
bottom references divided by the number of ADC output levels (1024).
Full-scale error is defined as the difference in analogue input voltage—between the ideal voltage and
the actual voltage—that will switch the ADC output from code 1022 to code 1023. The ideal voltage
level is determined by subtracting the voltage corresponding to 1.5LSB from the top reference level.
The voltage corresponding to 1LSB is found from the difference of top and bottom references divided
by the number of ADC output levels (1024).
4. Analogue Input Bandwidth The analogue input bandwidth is defined as the max. frequency of a
1dBFS input sine that can be applied to the device for which a extra 3dB attenuation is observed in
the reconstructed output signal.
5. Output Timing Output timing td(o) is measured from the 1.5V level of the CLK input falling edge
to the 10%/90% level of the digital output. The digital output load is not higher than 10pF. Output hold
time t h(o) is measured from the 1.5V level of the COUT input rising edge to the 10%/90% level of the
digital output. The digital output is load is not less than 2pF. Aperture delay td(A) is measured from
the 1.5V level of the CLK input to the actual sampling instant.
The OEB signal is asynchronous. OEB timing tdis is measured from the VIH(MIN) level of OEB to the
high-impedance state of the output data. The digital output load is not higher than 10pF. OEB timing
ten is measured from the VIL(MAX) level of OEB to the instant when the output data reaches
VOH(min) or VOL(max) output levels. The digital output load is not higher than 10pF.
6. Pipeline Delay (latency) The number of clock cycles between conversion initiation on an input
sample and the corresponding output data being made available from the ADC pipeline. Once the
data pipelines full, new valid output data is provided on every clock cycle. The first valid data is
available on the output pins after the latency time plus the output delay time td(o) through the digital
output buffers. Note that a minimum td(o) is not guaranteed because data can transition before or
after a CLK edge. It is possible to use CLK for latching data, but at the risk of the prop delay varying
over temperature, causing data to transition one CLK cycle earlier or later. The recommended
method is to use the latch signals COUT and COUTB which are designed to provide reliable setup and
hold times with respect to the data out.
7. Wake-Up Time Wake-up time is from the power-down state to accurate ADC samples being
taken, and is specified for external reference sources applied to the device and an 80MHz clock
applied at the time of release of STDBY. Cells that need to power up are the bandgap, bias
generator, SHAs, and ADCs.
8. Power-Up Time Power-up time is from the power-down state to accurate ADC samples being
taken with an 80MHz clock applied at the time of release of STDBY. Cells that need to power up are
the bandgap, internal reference circuit, bias generator, SHAs, and ADCs
WM2125 Advance Information
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PACKAGE DIMENSIONS
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS.
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM.
D. MEETS JEDEC.95 MS-026, VARIATION = ABC. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
DM004.C
FT:48PINTQFP (7x7x1.0mm)
Symbols
Dimensions
(mm)
MIN NOM MAX
A----- ----- 1.20
A10.05 ----- 0.15
A20.95 1.00 1.05
b0.17 0.22 0.27
c0.09 ----- 0.20
D9.00 BSC
D17.00 BSC
E9.00 BSC
E17.00 BSC
e0.50 BSC
L0.45 0.60 0.75
Θ
ΘΘ
Θ0o3.5o7o
Tolerances of Form and Position
ccc 0.08
REF: JEDEC.95, MS-026
2536
e
b
121
D1
D
E1 E
13
2437
48
AA2 A1
SEATING PLANE
ccc C
-C-
Θ
ΘΘ
Θ
c
L
Advance Information WM2125
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IMPORTANT NOTICE
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