Plateau HS Dock™ Press-In Tool
Doc No: ATS-622020232 Release Date: 11-15-02 UNCONTROLLED COPY Page 3 of 3
Revision: C Revision Date: 07-23-08
THE PRESS-IN-TOOL
WITH THE PEGS
ON THE INTERPOSER
ASSEMBLY
Tool Operation
1. Carefully insert, by hand, the
Interposer Assembly into the printed
circuit board hole pattern.
2. The Press-In-Tool is then located on
the assembly by aligning the pilot
holes in the press-in-tool with the
pegs that protrude through the upper
circuit board on the interposer
assembly. See Figure 2.
3. Using the press-in-tool and an
appropriate press, seat the Interposer
Assembly until there is less than
0.25mm (0.01 in) clearance between
the bottom of the plastic housing and
the surface of the printed circuit
board.
4. A support fixture, placed below the
printed circuit board, is highly
recommended due to the high forces required to press in the interposer assembly. This support would require
clearance holes for protruding pins if the board thickness is less than the pin length. A press stop to control
the insertion stroke is also recommended.
CAUTION: To prevent injury, never operate any press without the guards in place. Refer to the press
manufacturer’s instruction manual.
CAUTION: Molex application tooling specifications are valid only when used with Molex connectors and
tooling.
Contact Information
For more information on Molex application tooling please contact Molex at 1-800-786-6539.
Americas Headquarters
Lisle, Illinois 60532 U.S.A.
1-800-78MOLEX
amerinfo@molex.com
Far East North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
feninfo@molex.com
Far East South Headquarters
Jurong, Singapore
65-6-268-6868
fesinfo@molex.com
European Headquarters
Munich, Germany
49-89-413092-0
eurinfo@molex.com
Corporate Headquarters
2222 Wellington Ct.
Lisle, IL 60532 U.S.A.
630-969-4550
Fax: 630-969-1352
Visit our Web site at http://www.molex.com