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78 Series Regulators
1A Output 78 series Regulators
500mA Output 78 series Regulators
BA78□□Series,BA78M□□Series
●Description
BA78□□, BA78M□□ series are three-terminal regulators available with several fixed output voltages. It supplies the
stable fixes voltage from unstable direct input voltage. The useful output voltage lineup is 5V, 6V, 7V, 8V, 9V, 10V, 12V, 15V,
18V, 20V, 24V with 0.5A / 1A current ability. They have nearly same electric characteristics as competitor products and cover
a wide range of application.
●Features
1) Built-in over-current protection circuit and thermal shutdown circuit
2) High ripple rejection
3) Available TO220CP-3, TO252-3 package to a wide range application
4) Compatible replacement to competitor products
5) Various voltage lineup (5V, 6V, 7V, 8V, 9V, 10V, 12V, 15V, 18V, 20V, 24V)
●Applications
Fixed voltage power supply for TV, Audio components, etc
●Line up
■1A BA78□□Series
Part Number 5V 6V 7V 8V 9V 10V 12V 15V 18V 20V 24V Package
BA78□□CP ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ TO220CP-3
BA78□□FP ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ TO252-3
■0.5A BA78M□□Series
Part Number 5V 6V 7V 8V 9V 10V 12V 15V 18V 20V 24V Package
BA78M□□CP ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ TO220CP-3
BA78M□□FP ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ TO252-3
●Output Voltage and Marking
Part Number：BA78□□□□ (1A) Part Number：BA78M□□□□ (0.5A)
Symbol assignment of output voltage Symbol assignment of output voltage
a
□□ Output voltage(V) □□ Output voltage(V)
a
□□ Output voltage(V) □□ Output voltage(V)
05 5.0V typ. 12 12V typ. 05 5.0V typ. 12 12V typ.
06 6.0V typ. 15 15V typ. 06 6.0V typ. 15 15V typ.
07 7.0V typ. 18 18V typ. 07 7.0V typ. 18 18V typ.
08 8.0V typ. 20 20V typ. 08 8.0V typ. 20 20V typ.
09 9.0V typ. 24 24V typ. 09 9.0V typ. 24 24V typ.
10 10.0V typ. 10 10.0V typ.
b
Package
b
Package
CP：TO220CP-3 CP：TO220CP-3
FP：TO252-3 FP：TO252-3
No.12019ECT01
b a
b a
BA78□□Series,BA78M□□Series
Technical Note
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●Absolute Maximum Rating (Ta=25℃)
BA78□□CP/FP, BA78M□□CP/FP
Parameter Symbol Limits Unit
Power supply voltage Vin 35 V
Power Dissipation 1 TO220CP-3 Pd1 2
*
1 W
TO252-3 1
*
1
Power Dissipation 2 TO220CP-3 Pd2 22
*
2 W
TO252-3 10
*
2
Output Current BA78□□ Io 1
*
3 A
BA78□□M 0.5
*
3
Operating Temperature Range Topr -40～+85 ℃
Storage Temperature Range Tstg -55～+150 ℃
Operating Junction Temperature Range Tj -40～+150 ℃
*1 Derating in done 16mW/℃(TO220CP-3), 8mW/℃(TO252-3) for temperatures above Ta=25℃
*2 Derating in done 176mW/℃(TO220CP-3), 80mW/℃(T O252-3) for temperatures above Ta=25℃, Mounted on infinity Alminium heat sink.
*3 Pd,ASO and Tjmax(150℃) should not be exceeded .
●Operating Conditions(Ta=25℃, Pd shoul d not be exceeded)
BA78□□CP/FP BA78M□□CP/FP
Parameter Symbol Min. Max. Unit. Parameter Symbol Min. Max. Unit.
Input
Voltage
BA7805
Vin
7.5 25
V
Input
Voltage
BA78M05
Vin
7.5 25
V
BA7806 8.5 21 BA78M06 8.5 21
BA7807 9.5 22 BA78M07 9.5 22
BA7808 10.5 23 BA78M08 10.5 23
BA7809 11.5 26 BA78M09 11.5 26
BA7810 12.5 25 BA78M10 12.5 25
BA7812 14.5 27 BA78M12 14.5 27
BA7815 17.5 30 BA78M15 17.5 30
BA7818 21 33 BA78M18 21 33
BA7820 23 33 BA78M20 23 33
BA7824 27 33 BA78M24 27 33
Output Current Io - 1 A Output Current Io - 0.5 A
BA78□□Series,BA78M□□Series
Technical Note
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●Electrical Characteristics BA78M□□CP/FP
(Ta=25℃,Vin=10 V( 05) , 11V(06),13V(07),14V(08),15V(09),16V(10) ,1 9V( 12) ,2 3V( 1 5) ,27 V( 1 8) ,29V(20),33V(24), Io＝350mA unless otherwise specified)
Parameter Symbol Type Limit Unit Condition
Min Typ Max
Output Voltage 1 Vo1
05 4.8 5.0 5.2
V Io=350mA
06 5.75 6.0 6.25
07 6.7 7.0 7.3
08 7.7 8.0 8.3
09 8.6 9.0 9.4
10 9.6 10.0 10.4
12 11.5 12.0 12.5
15 14.4 15.0 15.6
18 17.3 18.0 18.7
20 19.2 20.0 20.8
24 23.0 24.0 25.0
Output Voltage 2 Vo2
05 4.75 - 5.25
V
Vin=7.5～20V, Io=5mA～350mA
06 5.7 - 6.3 Vin=8.5～21V, Io=5mA～350mA
07 6.65 - 7.35 Vin=9.5～22V, Io=5mA～350mA
08 7.6 - 8.4 Vin=10.5～23V, Io=5mA～350mA
09 8.55 - 9.45 Vin=11.5～24V, Io=5mA～350mA
10 9.5 - 10.5 Vin=12.5～25V, Io=5mA～350mA
12 11.4 - 12.6 Vin=15～27V, Io=5mA～350mA
15 14.25 - 15.75 Vin=17.5～30V, Io=5mA～350mA
18 17.1 - 18.9 Vin=21～33V, Io=5mA～350mA
20 19.0 - 21.0 Vin=23～33V, Io=5mA～350mA
24 22.8 - 25.2 Vin=27～33V, Io=5mA～350mA
Line Regulation 1 Reg.I1
05 - 3 100
mV
Vin=7～25V, Io=200mA
06 - 3 100 Vin=8～25V, Io=200mA
07 - 4 100 Vin=9～25V, Io=200mA
08 - 4 100 Vin=10.5～25V, Io=200mA
09 - 4 100 Vin=11.5～26V, Io=200mA
10 - 5 100 Vin=12.5～28V, Io=200mA
12 - 5 100 Vin=14.5～30V, Io=200mA
15 - 6 100 Vin=17.5～30V, Io=200mA
18 - 7 100 Vin=21～33V, Io=200mA
20 - 8 100 Vin=23～33V, Io=200mA
24 - 10 100 Vin=27～33V, Io=200mA
Line Regulation 2 Reg.I2
05 - 1 50
mV
Vin=8～12V, Io=200mA
06 - 1 50 Vin=9～25V, Io=200mA
07 - 1 50 Vin=10～25V, Io=200mA
08 - 1 50 Vin=11～25V, Io=200mA
09 - 2 50 Vin=12～25V, Io=200mA
10 - 2 50 Vin=14～26V, Io=200mA
12 - 3 50 Vin=16～30V, Io=200mA
15 - 3 50 Vin=20～30V, Io=200mA
18 - 3 50 Vin=24～33V, Io=200mA
20 - 4 50 Vin=24～33V, Io=200mA
24 - 5 50 Vin=28～33V, Io=200mA
Ripple Rejection R.R.
05 62 78 -
dB ein=1Vrms, f=120Hz, Io=100mA
06 60 74 -
07 57 71 -
08 56 69 -
09 56 67 -
10 56 66 -
12 55 63 -
15 54 60 -
18 53 58 -
20 53 58 -
24 50 55 -
Temperature
Coefficient of
Output Voltage Tcvo
05 - -1.0 -
mV/℃Io=5mA, Tj=0～125℃
06/07/08/09/10/12 - -0.5 -
15/18 - -0.6 -
20/24 - -0.7 -
Peak Output Current Io-p common - 875 - mA Tj=25℃
Dropout Voltage Vd common - 2.0 - V Io=500mA
BA78□□Series,BA78M□□Series
Technical Note
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●Electrical Characteristics BA78M□□CP/FP
(Ta=25℃,Vin=10V(05),11V(06),13V(07),14V(08),15V(09),16V(10),19V(12),23V(15),27V(18),29V(20),33V(24),Io＝350mA unless otherwise specified)
Parameter Symbol Type Limit Unit Condition
Min Typ Max
Load Regulation 1 Reg.L1
05 - 20 100
mV Io=5mA～500mA
06 - 20 120
07 - 20 140
08 - 20 160
09 - 20 180
10 - 20 200
12 - 20 240
15 - 20 300
18 - 20 360
20 - 20 400
24 - 20 480
Load Regulation 2 Reg.L2
05 - 10 50
mV Io=5mA～200mA
06 - 10 60
07 - 10 70
08 - 10 80
09 - 10 90
10 - 10 100
12 - 10 120
15 - 10 150
18 - 10 180
20 - 10 200
24 - 10 240
Output Noise
Voltage Vn
05 - 40 -
µV f=10Hz～100kHz
06 - 60 -
07 - 70 -
08 - 80 -
09 - 90 -
10 - 100 -
12 - 110 -
15 - 130 -
18 - 140 -
20 - 150 -
24 - 170 -
Bias Current Ib common - 4.5 6.0 mA Io=0mA
Bias Current Change1 Ib1 common - - 0.5 mA Io=5mA～350mA
Bias Current Change 2 Ib2
05 - - 0.8
mA
Vin:8～25V, Io=200mA
06 - - 0.8 Vin:9～25V, Io=200mA
07 - - 0.8 Vin:10～25V, Io=200mA
08 - - 0.8 Vin:10.5～25V, Io=200mA
09 - - 0.8 Vin:12～25V, Io=200mA
10 - - 0.8 Vin:13～25V, Io=200mA
12 - - 0.8 Vin:14.5～30V, Io=200mA
15 - - 0.8 Vin:17.5～30V, Io=200mA
18 - - 0.8 Vin:21～33V, Io=200mA
20 - - 0.8 Vin:23～33V, Io=200mA
24 - - 0.8 Vin:27～33V, Io=200mA
Short-Circuit
Output Current Ios 05/06/07/08 - 0.4 -
A Vin=25V
09/10/12/15/18/20/24 - 0.17 - Vin=30V
Output Resistance Ro
05 - 9 -
mΩ f=1kHz
06 - 10 -
07 - 11 -
08 - 12 -
09 - 13 -
10 - 14 -
12 - 16 -
15 - 19 -
18 - 22 -
20 - 25 -
24 - 37 -
BA78□□Series,BA78M□□Series
Technical Note
5/12
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●Electrical Characteristics BA78□□CP/FP
(Ta=25℃,Vin=10V(05),11V(06),13V(07),14V(08),15V(09),16V(10),19V(12),23V(15),27V(18),29V(20),33V(24),Io=500mA unless otherwise specified)
Parameter Symbol Type Limit Unit Condition
Min Typ Max
Output Voltage 1 Vo1
05 4.8 5.0 5.2
V Io=500mA
06 5.75 6.0 6.25
07 6.7 7.0 7.3
08 7.7 8.0 8.3
09 8.6 9.0 9.4
10 9.6 10.0 10.4
12 11.5 12.0 12.5
15 14.4 15.0 15.6
18 17.3 18.0 18.7
20 19.2 20.0 20.8
24 23.0 24.0 25.0
Output Voltage 2 Vo2
05 4.75 - 5.25
V
Vin=7.5～20V, Io=5mA～1A
06 5.7 - 6.3 Vin=8.5～21V, Io=5mA～1A
07 6.65 - 7.35 Vin=9.5～22V, Io=5mA～1A
08 7.6 - 8.4 Vin=10.5～23V, Io=5mA～1A
09 8.55 - 9.45 Vin=11.5～26V, Io=5mA～1A
10 9.5 - 10.5 Vin=12.5～25V, Io=5mA～1A
12 11.4 - 12.6 Vin=15～27V, Io=5mA～1A
15 14.25 - 15.75 Vin=17.5～30V, Io=5mA～1A
18 17.1 - 18.9 Vin=21～33V, Io=5mA～1A
20 19.0 - 21.0 Vin=23～33V, Io=5mA～1A
24 22.8 - 25.2 Vin=27～33V, Io=5mA～1A
Line Regulation 1 Reg.I1
05 - 3 100
mV
Vin=7～25V, Io=500mA
06 - 4 120 Vin=8～25V, Io=500mA
07 - 5 140 Vin=9～25V, Io=500mA
08 - 5 160 Vin=10.5～25V, Io=500mA
09 - 6 180 Vin=11.5～26V, Io=500mA
10 - 7 200 Vin=12.5～27V, Io=500mA
12 - 8 240 Vin=14.5～30V, Io=500mA
15 - 9 300 Vin=17.5～30V, Io=500mA
18 - 10 360 Vin=21～33V, Io=500mA
20 - 12 400 Vin=23～33V, Io=500mA
24 - 15 480 Vin=27～33V, Io=500mA
Line Regulation 2 Reg.I2
05 - 1 50
mV
Vin=8～12V, Io=500mA
06 - 2 60 Vin=9～13V, Io=500mA
07 - 2 70 Vin=10～15V, Io=500mA
08 - 3 80 Vin=11～17V, Io=500mA
09 - 4 90 Vin=13～19V, Io=500mA
10 - 4 100 Vin=14～20V, Io=500mA
12 - 5 120 Vin=16～22V, Io=500mA
15 - 5 150 Vin=20～26V, Io=500mA
18 - 5 180 Vin=24～30V, Io=500mA
20 - 7 200 Vin=26～32V, Io=500mA
24 - 10 240 Vin=30～33V, Io=500mA
Ripple Rejection R.R.
05 62 78 -
dB ein=1Vrms, f=120Hz,
Io=100mA
06 59 73 -
07 57 69 -
08 56 65 -
09 56 64 -
10 55 64 -
12 55 63 -
15 54 62 -
18 53 61 -
20 53 60 -
24 50 58 -
Temperature
Coefficient of
Output Voltage Tcvo
05 - -1.0 -
mV/℃ Io=5mA, Tj=0～125℃
06/07/08/09/10/12 - -0.5 -
15/18 - -0.6 -
20/24 - -0.7 -
Peak Output Current Io-p common - 1.7 - A Tj=25℃
Dropout Voltage Vd common - 2.0 - V Io=1A
BA78□□Series,BA78M□□Series
Technical Note
6/12
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●Electrical Characteristics BA78□□CP/FP
(Ta=25℃,Vin=10V(05),11V(06),13V(07),14V(08),15V(09),16V(10),19V(12),23V(15),27V(18),29V(20),33V(24),Io=500mA unless otherwise specified)
Parameter Symbol Type Limit Unit Condition
Min Typ Max
Load Regulation 1 Reg.L1
05 - 15 100
mV Io=5mA～1A
06 - 16 120
07 - 17 140
08 - 19 160
09 - 20 180
10 - 21 200
12 - 23 200
15 - 27 300
18 - 30 360
20 - 32 400
24 - 37 480
Load Regulation 2 Reg.L2
05 - 5 50
mV Io=250mA～750mA
06 - 6 60
07 - 6 70
08 - 7 80
09 - 8 90
10 - 8 90
12 - 10 100
15 - 10 150
18 - 12 180
20 - 14 200
24 - 15 240
Output Noise
Voltage Vn
05 - 40 -
µV f=10Hz～100kHz
06 - 60 -
07 - 70 -
08 - 80 -
09 - 90 -
10 - 100 -
12 - 110 -
15 - 125 -
18 - 140 -
20 - 150 -
24 - 180 -
Bias Current Ib common - 4.5 8.0 mA Io=0mA
Bias Current Change 1 Ib1 common - - 0.5 mA Io=5mA～1A
Bias Current Change 2 Ib2
05 - - 0.8
mA
Vin:8～25V, Io=500mA
06 - - 0.8 Vin:8.5～25V, Io=500mA
07 - - 0.8 Vin:9.5～25V, Io=500mA
08 - - 0.8 Vin:10.5～25V, Io=500mA
09 - - 0.8 Vin:11.5～26V, Io=500mA
10 - - 0.8 Vin:12.5～27V, Io=500mA
12 - - 0.8 Vin:14.5～30V, Io=500mA
15 - - 0.8 Vin:17.5～30V, Io=500mA
18 - - 0.8 Vin:21～33V, Io=500mA
20 - - 0.8 Vin:23～33V, Io=500mA
24 - - 0.8 Vin:27～33V, Io=500mA
Short-Circuit
Output Current Ios 05/06/07/08 - 0.6 - A Vin=25V
09/10/12/15/18/20/24 - 0.3 - Vin=30V
Output Resistance Ro
05 - 9 -
mΩ f=1kHz
06 10 -
07 10 -
08 10 -
09 - 10 -
10 - 11 -
12 - 12 -
15 - 14 -
18 - 17 -
20 - 19 -
24 - 27 -
BA78□□Series,BA78M□□Series
Technical Note
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●BA78M□□ Characteristics data(Ta=25℃, Vin=10V(05), 14V(08), 23V(15) unless otherwise specified)
Ta=25℃ Io=0mA
BA78M05
BA78M08
BA78M15
Fig.4 Vin - Ib
0.0
0.5
1.0
1.5
2.0
0 5 10 15 20 25 30
Vin [V]
Io-p [A]
Ta=25℃
BA78M15
BA78M08
BA78M05
Fig.6 Peak Output Current
0
1
2
3
4
5
6
0 0.1 0.2 0.3 0.4 0.5
Io [A]
Ib [mA]
Ta=25℃
BA78M05
BA78M08
BA78M15
Fi
g
.12 Io - Ib
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
-40-200 20406080100
Ta [℃
]
⊿Vo/Vo [%]
Io=5mA
BA78M15
BA78M08
BA78M05
Fig.10 Ta - Vo
BA78M05
BA78M08
BA78M15
Fig.11 Ta - Ib
0
1
2
3
4
5
6
-40 -20 0 20 40 60 80 100
Ta[℃]
Ib[mA]
Io=0mA
BA78M05
BA78M08
BA78M15
0
5
10
15
20
0.0 0.5 1.0 1.5 2.0
Io [ A]
Vo [V]
Fig.5 Load Regulation
Ta=25℃
BA78M05
BA78M08
BA78M15
0.0
0.2
0.4
0.6
0.8
1.0
0 5 10 15 20 25 30
Vin [ V]
Ios [A]
Ta=25℃
BA78M05
BA78M08
BA78M15
Fig.8 Short – Circuit Output Current
0
5
10
15
20
0 5 10 15 20 25 30
Vin [V]
Vo [V]
Ta=25℃ Io=350mA
Fig.2 Line Regulation (Io=35 0mA)
BA78M15
BA78M08
BA78M05
Ta=25℃ Io=500mA
0
5
10
15
20
0 5 10 15 20 25 30
Vin [V]
Vo [V]
BA78M15
BA78M08
BA78M05
Fig.3 Line Regulation(Io=500mA)
0.0
0.5
1.0
1.5
2.0
0 0.1 0.2 0.3 0.4 0.5
Io [A]
Vd [V]
Ta=25℃
BA78M05
BA78M08
BA78M15
Fig.7 Dropout Voltage
0
20
40
60
80
100
10 100 1000 10000 100000 1000000
Fre
q
uenc
y
[
Hz
]
R.R. [dB]
Ta=25℃
Io=100mA
BA78M05
BA78M15
BA78M08
0
Fig.9 Ripple Rejection Ratio
Frequency［Hz］
Ta=25℃ Io=500mA
Fig.1 Line Regulation (Io=0mA)
0
5
10
15
20
0 5 10 15 20 25 30
Vin [V]
Vo [V]
Ta=25℃ Io=0mA
BA78M05
BA78M08
BA78M15
10 100 1K 10K 100K 1M
0
1
2
3
4
5
6
0 5 10 15 20 25 30
Vin [V]
Ib [mA]
Ta=25℃ Io=0mA
BA78M05
BA78M08
BA78M15
Fig.4 VIN - Io
BA78□□Series,BA78M□□Series
Technical Note
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●BA78□□ Characteristics data (Ta=25℃, Vin=10V(05), 14V(08), 23V(15) unless other wise sp ecified)
Io=0mA
BA7805
BA7808
BA7815
Fig.23 Ta - Ib
0
1
2
3
4
5
6
-40 -20 0 20 40 60 80 100
Ta [℃]
Ib [mA]
Io=0mA
BA7805
BA7808
BA7815
0
1
2
3
4
5
6
0 5 10 15 20 25 30
Vin [V]
Ib [mA]
Ta=25℃ Io=0mA
BA7805
BA7808
BA7815
Fig.16 Vin - Ib
0
5
10
15
20
0.0 0.5 1.0 1.5 2.0
Io [A]
Vo [V]
Ta=25℃
BA7815
BA7808
BA7805
Fig.17 Load Regulation
0.0
0.5
1.0
1.5
2.0
0 5 10 15 20 25 30
Vin [V]
Io-p [A]
Fig.18 Peak Output Current
Ta=25℃
BA7815
BA7808
BA7805
0.0
0.5
1.0
1.5
2.0
0 0.2 0.4 0.6 0.8 1
Io [A]
Vd [V]
Ta=25℃
BA7805
BA7808
BA7815
Fig.19 Dropout Voltage
0
0.5
1
1.5
2
0 5 10 15 20 25 30
Vin [V]
Ios [A]
Ta=25℃
BA7805
BA7808
BA7815
Fig.20 Short – Circuit Output Current
0
1
2
3
4
5
6
0 0.2 0.4 0.6 0.8 1
Io [A]
Ib [mA]
Ta=25℃ BA7815
BA7808
BA7805
Fig.24 Io - Ib
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
-40-200 20406080100
Ta [℃]
ΔVo/Vo [%]
Io=5mA
BA7815
BA7808
BA7805
Fig.22 Ta - Vo
Fig.13 Line Regul ation (Io= 0mA)
0
5
10
15
20
0 5 10 15 20 25 30
V in [V]
Vo [V]
Ta=25℃ Io=0mA
BA7805
BA7808
BA7815
Fig.14 Line Regulation (Io=500mA)
0
5
10
15
20
0 5 10 15 20 25 30
Vin [V]
Vo [V]
Ta=25℃ Io=500mA
BA7805
BA7808
BA7815
Fig15. Line Regulation (Io=1A)
0
5
10
15
20
0 5 10 15 20 25 30
Vin [V]
Vo [V]
Ta=25℃ Io=1A
BA7815
BA7805
BA7808
0
20
40
60
80
100
10 100 1000 10000 100000 1000000
Frequency [Hz]
R.R. [dB]
Ta=25℃
Io=100mA
BA7805
BA7815
BA7808
1
0
1
00
1K 1
0
K 1
00
K 1M
Fig.21 Ripple Rejection R atio
0
BA78□□Series,BA78M□□Series
Technical Note
9/12
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●Internal Circu it Structural Diagram
TO220CP-3 TO252-3
PIN No. Symbol Function PIN No. Symbol Function
1 INPUT Input terminal 1 INPUT Input terminal
2 COMMON Ground terminal 2 N.C. Non connection terminal
3 OUTPUT Output terminal 3 OUTPUT Output terminal
FIN COMMON Ground terminal
●Protection Circuit
(1)Over-current protection circuit
(2) Thermal shutdown circuit
(3) Safety operation area control circuit
Q5
R4 R10
R5
R6
R7
R8
Q8
R9
Q9
R13
Q17
Q16
Q15
Q13
Q10 Q6
Q18
Q14
Q1
Q7
Q2
R21
R17
R20
R12
R19
Q11
Q3
R14
R3
R18
R1
R15
R11
C1
D2
D1
Q12
R2
D3
INPUT
OUTPUT
COMM ON
R22
Q4
R16
FIN
12 3
When the chip temperature of IC exceeds the setting temperature, the IC goes
OFF, and it controls the IC not to be destroyed by the heat generation.
It can be restored by being lowered the chip temperatur e of IC below the
setting temperature.
It controls the output current in inverse proportion ratio to voltage difference
(input-output).
When voltage dif ference becomes bigger, the IC will be destroy ed in rush current.
It protects the IC by controlling the current ability according to the voltage level.
When the maximum rating current or more is rushed, it controls the
current ability and protects the IC from destruction.
6
Chip Junction temperature : Tj [℃]
175
50
25
Vin=10V
BA7805CP
Output Voltage : Vo [V]
75 100 125 150 200
5
4
3
2
1
0
21
Vin=10V
BA7805CP
Output voltage : Vo [V]
6
5
4
3
2
1
0
Output Current : IO[A]
Input-Output voltage difference: Vin-Vo [V]
30 20
Maximum output cu rrent : IO-P[A]
40
2
0 10
1.5
1
0.5
Tj=25℃
BA7805CP
BA78□□Series,BA78M□□Series
Technical Note
10/12
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© 2012 ROHM Co., Ltd. All rights reserved.
●Thermal design
Refer to the following thermal derating curves (Fig. 25, 26), when using in the status of Ta=25℃ or more.
The characteristic of IC is greatly related to the operating temperature.
When it is used in over maximum junction temperature, the elements inside IC might become weaker and be destroyed.
It is recommended to take into consideration thermal of IC.
Note that the temperatures are in the allo wed temperature limits and operated within Pd.
It is necessary to operate it at junction temperature Tjmax or less to prevent IC from the thermal destruction.
Please operate IC within permissibl e loss Pd because the junction tempera ture Tj might become considerably a high
temperature even if ambient temperature Ta is normal temperature (25℃).
Power consumption Pc(W) may be expressed by the equation shown below:
Pc=(Vin-Vo)×Io+ Vin×Iｂ
permissible loss Pd≧Pc
Maximum Output current IoMAX can be calculated in therma l design.
・Calculation example
Ex.1) Ta=85℃, Vin =7.5V, Vo=5.0V
Io≦400ｍA
Be sure to use this IC within a power dissipation at the range of operating temperature.
Fig.25 Thermal derating curve (TO220CP-3) Fig.26 Thermal derating curve (TO252-3)
●Terminal Setting and Cautions
・INPUT
It is recommended that a capacitor (about 0.33uF) be inserted between INPUT and COMMON.
The value of capacitor is designed suitable for the actual application.
・OUTPUT
It is recommended that a capacitor (about 0.1uF) be inserted between OUTPUT and COMMON.
A tantalum capacitor can also be use d for this pin because insufficient capacitors may cause oscillation by a temperature
change.
・COMMON
Keep the no voltage drop between Ground level of set board and IC.
When there is the voltage difference, setting voltage becom es inaccuracy and unstable.
It is recommended to connect by wide, short pattern, and lower the inpeda nce.
VoVin
IbVinPd
Io
≦
5.07.5 4.5m7.51.04
Io
≦
Vin : Input Voltage
Vo : Output Voltage
Io : Output Current
Ib : Bias current
Using TO220CP-3 alone
θja=62.5℃/W→16mW/℃
Pd=1.04W at 85℃
12.5
10
7.5
5
2.5
0 0 25 50 75 125 100 150
AMBIENT TEMPERATURE : Ta[℃]
POWER DISSIPATION: Pd[W]
(2) 1.0
(1) 10.0 (1) M ounted on infinity A l minium heat sinkθj-c=12.5 (℃/W)
(2) Using an IC aloneθj-a=125.0℃/W
25
20
15
10
5
0 0 25 50 75 125 100 150
AMBIENT TEMPERATURE : Ta[℃]
POWER DISSIPATION: Pd[W]
(2) 2.0
(1) 22.0 (1) Mounted on infinity Alminium heat sinkθj-c=5.7(℃/W)
(2) Using an IC aloneθj-a=62.5℃/W
BA78□□Series,BA78M□□Series
Technical Note
11/12
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© 2012 ROHM Co., Ltd. All rights reserved.
●Notes for use
(1) Absolute Maximum Ratings
While utmost care is taken to quality control of this product, any application that may exceed some of the absolute
maximum ratings including th e voltage appli ed and the operating temperature range ma y result in breakag e. If broken,
short-mode or open-mode may not be identif ied. So if it is expected t o encounter with special mode tha t may exceed the
absolute maximum ratings, it is requested to take necessary safety measures phys ically including insertion of fuses.
(2) Ground voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure n o terminals are at a potential low er than the GND voltage incl uding an actual electric transient.
(3) Thermal design
When you do the kind of use which excee ds Pd, I t may be happened t o deterior ating IC origina l qualit y such as decrea se
of electric current ability with chip temperature rise. Do not exceed the power dissipation (Pd) of the package specification
rating under actual operation, and please design enough temperat ure margins.
(4) Short-circuiting between terminals, and mismounting
When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so may
result in IC breakdown. Sho rt-circuit ing due t o foreign matters ent ered between output terminals, or bet ween output and
power supply or GND may also cause br eakdown.
(5) Operation in Strong el ectromagnetic field
Be noted that using the I C in the strong electromagnetic radiation can cause operation failures.
(6) Inspection with the IC set t o a pc board
If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the
capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper
grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the
inspection process, be sure to turn OFF the power supply before it is connect ed and removed.
(7) Input to IC terminals
This is a monolithic IC with P+ isolation between P-substrate and each element as illustrated below. This P-layer and the
N-layer of each element form a P-N junction, and various parasitic eleme nt are formed.
If a resistor is joined to a transistor terminal as shown in Fi g 28.
○P-N junction works as a parasitic diode if the following relations hip is satisfied;
GND>Terminal A (at resistor side), or GND>Terminal B (at transistor side); and
○if GND>Terminal B (at NPN transistor side) ,
a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode.
The structure of t he IC in evitably forms parasitic elements, the activat i on o f which ma y cause i nterf erenc e amo ng circuits,
and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such
manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in
activation of parasitic elements.
(8) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations du e to a large current will cause no fluctuati ons in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(9) Thermal shutdown circuit
A temperature control circuit is built in the IC to prevent the damage due to overheat.Therefore, the output is turned off
when the thermal circuit works and is turned on when the temperat ure goes down to the specified level.
But, built-in the IC a temperature control circuit to protect itself, and avoid the design used the thermal pr otection.
(10) Over current protection circuit
The over-current protection ci rcuits are built in at output, according to their respective current outputs and prevent the IC
from being damaged when the load is short-circuited or over-current. But, these protection circuits are effective for
preventing destruct ion by unexpected acc ident. When it’s in continuous protect ion circuit moving peri od don’t use ple ase.
And for ability, because this chip has minus characteristic, be careful for heat plan.
(11) There is a possibility to damage an internal circuit or the element when Vin and the voltage of each terminal reverse in the
application. For instance, Vin is short-circuited to GND etc. with the charge charged t o an external capacitor. Please use
the capacitor of the output terminal with 1000μF or less. Moreover, the Vin series is recommended to insert the diode of
the by-pass the diode of the backflow prevention or between each terminal and Vin.
Fig.27 Bypass Diode Fig.28
Simplified structure of monorisic IC
VCC
Output terminal
Bypass diode
Backflow prevention diode
P substrate Pin A
P
aras
iti
c
element
Resistor
N
N N P+ P
+
P
GND
Parasitic element
Pin A
P substrate
Transistor (NPN)
N
N P+ P+
P
GND
Parasitic element
Pin B C B
E
N
GND
Pin B
Other adjacent elements
E
B C
GND
P
aras
iti
c
element
BA78□□Series,BA78M□□Series
Technical Note
12/12
www.rohm.com 2012.03 - Rev.C
© 2012 ROHM Co., Ltd. All rights reserved.
●Ordering part number
B A 7 8 M 0 5 F P - E 2
Part No Part No Output
Current
None：1A
M
：0.5A
Output
Voltage
05 : 5V
24 : 24V
Package
CP :TO220CP-3
FP :TO252-3
Packaging and forming specification
E2: Embossed tape and reel
(TO220CP-3, TO252-3)
～
(Unit : mm)
TO220CP-3
123
10.0+0.3
-
0.1
φ3.2±0.1
0.82±0.1
(0.585)
1.3
2.542.46
2.8+0.2
-
0.1
+0.4
-
0.2
15.2
5.61±0.2
12.0±0.21.0±0.2 8.0±0.2
4.5±0.1
2.85
0.42±0.1
231
Direction of feed
1pin
Reel ∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the lower left when you hold
reel on the left hand and you pull out the tape on the right hand
500pcs
E2
()
(Unit : mm)
TO252-3
21 3
0.8
0.65 0.65
1.5
2.5
0.75
FIN
6.5±0.2
2.3±0.2 2.3±0.2
0.5±0.1
1.0±0.2
2.3±0.2
9.5±0.5
0.5±0.1
5.5±0.2 1.5±0.2
5.1+0.2
-
0.1 C0.5
Direction of feed
1pin
Reel ∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the lower left when you hold
reel on the left hand and you pull out the tape on the right hand
2000pcs
E2
( )
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
