Total-ACE(R) Complete MIL-STD-1553 Solution Product Brief Model: BU-6X8X3T/U/H/i8 Save board space and simplify your 1553 design and layout with the world's first fully integrated MIL-STD-1553 terminal, complete with 1553 protocol, memory, transceivers, and isolation transformers--all in one small plastic BGA package with direct and/or transformer coupled 1553 connections inside. Key Features * 1 Dual Redundant MIL-STD-1553 Channel -- BC, RT, MT or RT/MT Functionality -- Direct and/or Transformer Coupled -- Supports MIL-STD-1553 A/B -- Supports MIL-STD-1760 -- 4K x 16 or 64K x 16 RAM -- Tx Inhibit Ball for MT Only Applications -- BC Disable Ball for RT Only Applications -- Simple System RT Mode * Small Package: -- 312 Ball BGA (1.1 in. x 0.6 in.) (27.9 mm x 15.2 mm) -- 0.185" (4.7 mm) Max Height Benefits * Small Size Saves Board Space * Simplified Board Design with Single Package System * Single Part Provides Increased Reliability * Field Proven & Reliable Technology with over 62 Million Hours of In-Service History * Qualified and RT Validated to Simplify Qualification * Lower Total Cost of Ownership * Software Compatible with ACE, Mini-ACE(R), Enhanced Mini-ACE(R), Micro-ACE(R), and Mini-ACE(R) Mark3 Series Applications * Extended Industrial Temperature Range -- -40C to +100C -- Thermal Balls for Improved Heatsinking * Mission Computers * 3.3 Volt Only Operation * Radios/Modems * DO-254 Certifiable * Generic Processor or PCI Interface * Leaded and RoHS Versions Available * High-Level C Software Development Kits with Sample Code for Windows(R), Linux(R), and VxWorks(R) * Digital Data Recorders * LRU's * Displays * Ground Vehicles * Commercial Aerospace * Radar Systems/Situational Awareness * Graphical User Interface to Generate Application C Code For more information: www.ddc-web.com/BU-64843T (c) 2008, 2010 Data Device Corporation. All trademarks are the property of their respective owners. Product Overview Total-ACE(R) processor interface allows direct connection with little or no glue logic to a variety of 8-, 16-, and 32-bit processors. The PCI interface model allows for a direct connection to a 32-bit PCI bus. The Total-ACE is a complete and compact solution to MIL-STD-1553 applications. With a footprint as small as 0.6 inches by 1.10 inches (15.2 mm x 27.9 mm), it is ideal for extended temperature range applications where PC board space is at a premium. The Total-ACE is available in a 312-ball (24 x 13 matrix) BGA package, and is rated for -40C to +100C operation. The required isolation transformers (with "Transformer Coupled" output ratios) are integrated within the plastic BGA package, and the device is powered entirely by +3.3 volts. The Total-ACE model with both direct and transformer coupled 1553 connections inside the small plastic BGA package is just 0.7 inches by 1.1 inches (17.8 mm x 27.9 mm). Advanced architecture is the key to the Total-ACE series' high performance. Advanced bus controller architecture gives the Total-ACE a high degree of flexibility and autonomy. This creates advantages in a number of areas: improving message scheduling control, minimizing host overhead for asynchronous message insertion, facilitating bulk data transfers and double buffering, message retry and bus switching strategies, and data logging and fault reporting. In addition, its remote terminal architecture provides flexibility in meeting all common MIL-STD-1553 protocols. RT data buffering and interrupt options offer robust support for synchronous and asynchronous messaging, ensure data sample consistency, and support bulk data transfers. The Total-ACE is fully software and architecturally compatible with DDC's ACE, Enhanced Mini-ACE, Micro-ACE, and Mini-ACE Mark3 series of devices. It integrates dual transceivers, dual transformers, a protocol engine and 4K or 64K words of internal RAM. The Total-ACE's flexible generic Product Specifications MIL-STD-1553 Terminal & Transformer Solution Autonomous Built-In Self-Test * Integrated Isolation Transformers with: -- Transformer Coupled Connections (0.6" x 1.1") (15.2 mm x 27.9 mm) -- Direct & Transformer Coupled Connections (0.7" x 1.1") (17.8 mm x 27.9 mm) * Single 3.3V Supply * 3.3V Transceivers have SLEEPIN input to Further Reduce Transceiver Power * * * * * Host initiated Protocol & RAM Self-Test Automatic Power On Self-Test Online Loopback Test Capability for CH. A-to-CH. B Wraparound Test Capability to Test Transmitter Timeout Function Total-ACE BGA Outline Drawing 12 EQ. SP. @ 0.0394 (1.00) = .473 (12) (TOL NONCUM) (TYP) *A Processor or PCI Bus Interface Flexibility * Direct Interface to 8, 16, or 32-bit Microprocessor or Microcontroller * Support for DMA Interface to External RAM * PCI Versions have 33MHz/32-bit PCI Target Interface 24 23 22 21 20 19 Extensive User Configurability 1.100 (27.9) .015 * Can be used with External Transceivers * Software Programmable Divider to Enable Master 1553 Clock of 10, 12, 16, or 20 MHz * RT Auto-Boot Option TOP VIEW 7 6 5 4 3 2 N M L K J H G F E D C B A Filter Based on RT Address, T/R bit, Subaddress Programmable Interrupt Conditions Command/Data Stack 32-Entry Interrupt Status Queue *B Cover Material Hard Pot Epoxy 1 BOTTOM VIEW Triangle denotes Ball A1 SIDE VIEW 0.185 (4.7) (MAX) 1553 Bus Controller (BC) 0.015 (0.38) .002 * Message Control Engine Offloads Host Processor * Minor/Major Frame Scheduling to Control Timing of 1553 Messages * High and Low Priority Asynchronous Message Insertion * Modify Messages or Data while BC is Running * Programmable Interrupt Conditions Hi TG-FR4 Board 0.022 (0.56) DIA T / H = Sn/Pb (63/37)BALL U / I = Sn/Ag/Cu (96.5/3/0.5) BALL (312 PL ACES) *DIMENSIONAL INFORMATION A B BU-648x3T(U)8 0.600 (15.2) .015 0.064 (1.63) TYP BU-648x3H(I)8 0.700 (17.8) .015 0.114 (2.89) TYP PART NUMBER 1553 Remote Terminal (RT) Notes: 1) Dimensions are in inches (mm) 2) Cover material: Hard Pot Epoxy 3) Base material: Substrate is Hi TG-FR4, Enig plated 1/2 oz copper 4) Solder Ball Cluster to be centralized within .010 of outline dimensions 5) Solder ball is 0.022". Substrate pads are 0.030" copper that are Solder mask defined to 0.022". Solder ball after reflow has a height of 0.015" and Diameter of 0.028". * Multiprotocol: MIL-STD-1553 A/B, STANAG 3838 * Multiple Buffering Techniques * Programmable Command Illegalization Data Device Corporation www.ddc-web.com 10 9 8 0.097 (2.46) TYP 1553 Bus Monitor (MT) * * * * 18 17 16 15 14 13 12 11 23 EQ. SP. @ 0.0394 (1.00) = .906 (23) (TOL NONCUM) (TYP) 2 PB-BU-64843T-7 06/10 Technical Data PARAMETER MIN TYP MAX -0.3 - 6.0 -0.3 - 6.0 -0.3 - 4.5 -0.3 - 6.0 ABSOLUTE MAXIMUM RATINGS Supply Voltage Logic +3.3V Transceivers +3.3V (not during transmit) V Transceivers +3.3V (during transmit) Logic +3.3V Logic Input Range POWER SUPPLY REQUIREMENTS Voltages/Tolerance Logic +3.3V V Transceivers +3.3V 3 3.3 3.6 3.14 3.3 3.46 - .132 .198 - .579 .764 - .861 1.165 -40 - +100 -65 - +125 POWER DISSIPATION - TOTAL HYBRID BU-64843T/U8 Idle 25% Transmitter Duty Cycle W 50% Transmitter Duty Cycle THERMAL Operating Temperature Component Case C Storage Temperature PHYSICAL CHARACTERISTICS Size (L x W x H) BU-6X8X3H/I models in 0.7 x 1.1 x 0.185 (mm) (17.8 x 27.9 x 4.7) BU-6X8X3T/U models in 0.6 x 1.1 x 0.185 (mm) (15.2 x 27.9 x 4.7) Note: For full specifications and additional information, refer to the BU-64843T Total-ACE Data Sheet (DS-BU-64843T), the BU-65863 PCI Total-ACE Data Sheet (DS-BU-65863), the BU-69092 SDK Software Manual (MN-69092SX-002), and the Enhanced Mini-ACE User's Guide (MN-6186X-001), available on our web site. Total-ACE(R) TRANSFORMER A CH. A CHA_1553 CHA_1553-Direct CHA_1553_L-Direct CHA_1553_L SHARED RAM +3.3V TRANSCEIVER A TX_INH A/B * TRANSFORMER B CH. B CHB_1553 CHB_1553-Direct CHB_1553_L-Direct CHB_1553_L +3.3V DUAL ENCODER / DECODER, MULTIPROTOCOL AND MEMORY MANAGEMENT DATA S BUFFERS ADDRESS BUS ADDRESS S S BUFFERS D15-D0 A15-A0 IOEN, READYD ADDR_LAT/MEMOE, ZERO_WAIT/MEMWR, 8/16-BIT/DTREQ, POLARITY_SEL/DTACK INCMD/MCRST PCI Total-ACE(R) INT 4K X 16 OR 64K X 17 SHARED RAM TRANSFORMER A CH. A CHA_1553 CHA_1553-Direct CHA_1553_L-Direct CHA_1553_L +3.3V TRANSCEIVER A TX_INH A/B * TRANSFORMER B CHB_1553 CHB_1553-Direct CHB_1553_L-Direct CHB_1553_L INTERRUPT REQUEST 32 X 32 WRITE FIFO +3.3V DUAL ENCODER / DECODER, MULTIPROTOCOL AND MEMORY MANAGEMENT PAR PCI Address/Data, Parity and Bus Command/Byte Enable C/BE#3 - C/BE#0 ADDRESS BUS * TRANSCEIVER B 33 MHZ, 32-BIT PCI SLAVE INTERFACE FRAME#, IRDY#,IDSEL PCI Control TRDY#, STOP#, DEVSEL#, PERR#, SERR# (PCI) CLK RT ADDRESS AND ADDRESS LATCH PROCESSOR AND MEMORY CONTROL AD31-AD0 DATA BUS CH. B PROCESSOR PRO ADDR ADDRESS BUS TRANSPARENT/BUFFERED, STRBD, SELECT, RD/WR, MEM/REG, TRIGGER_SEL/MEMENA-IN, MSB/LSB/DTGRT PROCESSOR AND MEMORY INTERFACE LOGIC CLK_IN, TAG_CLK, MSTCLR, SSFLAG/EXT_TRG, TX-INH_A, TX-INH_B, SLEEPIN/UPADDREN MISCELLANEOUS PROCESSOR PRO DA DATA BUS TRANSCEIVER B RTAD4-RTAD0, RTAD4 R RTADP, RTADD_LAT RT ADDRESS DATA BUS RTAD4-RTAD0, RTADP PCI CLK RT-AD4-LAT INT A # INCMD/MCRST PCI Interrupt MISCELLANEOUS 1553_CLK, SSFLAG/EXT_TRIG,TAG_CLK BOOT_L,CLK_SEL_0/1 Data Device Corporation www.ddc-web.com 3 MSTCLR (RST#) PB-BU-64843T-7 06/10 Ordering Information BU-6X8X3T8-E02 Test Criteria: 2 = MIL-STD-1760 Amplitude Included Software: * 1553 C Software Development Kit (SDK) * Windows 2000/XP/Vista/7, Linux, and VxWorks support Process Requirements: 0 = Standard DDC practices, no Burn-In Temperature Range/Data Requirements: E = -40C to +100C Case Temperature Voltage/Transceiver Option: 8 = +3.3 Volts rise/fall times = 100 ns to 300 ns (1553B) Package Type: T = Leaded Transformer Coupled Total-ACE (0.6" x 1.1") (15.2 mm x 27.9 mm) U = RoHS Transformer Coupled Total-ACE (0.6" x 1.1") (15.2 mm x 27.9 mm) H = Leaded Direct and Transformer Coupled Total-ACE (0.7" x 1.1") (17.8 mm x 27.9 mm) i = RoHS Direct and Transformer Coupled Total-ACE (0.7" x 1.1") (17.8 mm x 27.9 mm) Logic / RAM Voltage: 3 = 3.3 Volt Logic and RAM Memory: 4 = 4K Word RAM 6 = 64K Word RAM Product Type: BU-648 = BC/RT/MT Generic Processor Interface BU-658 = BC/RT/MT PCI Bus Interface Notes: Please contact factory for availability of varions versions of Total-ACE(R). See Application Note AN/B-37 for SSRT Implementation, available at www.ddc-web.com Standard DDC Processing for MIL-STD-1553 BGA Products TEST TYPE METHOD(S) CONDITIONS INSPECTION 2010, 2017, and 2032 -- TEMPERATURE CYCLE 1010 B Optional Software: Data Bus Analyzer and Monitor Software * Generate or monitor live MIL-STD-1553 data without writing any code * Saves time and reduces development costs * Program in minutes with one-click ANSI C source code generation * Rapid creation and setup of custom applications Model: BU-69066S0-XX0 (R) IR M RE G U IST E For ordering assistance and technical support, Call: 1-800-DDC-5757 E-mail: service@ddc-web.com Visit: www.ddc-web.com RED F Headquarters, N.Y., U.S.A. - Tel: (631) 567-5600, Fax: (631) 567-7358 United Kingdom - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264 France - Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425 Germany - Tel: +49-(0)89-1500 -12-11, Fax:+49(0)89-1500 12-22 Japan - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689 DATA DEVICE CORPORATION REGISTERED TO ISO 9001:2008 REGISTERED TO AS9100:2004-01 FILE NO. A5976 The information in this Product Brief is believed to be accurate; however, no responsibility is assumed by Data Device Corporation for its use, and no license or rights are granted by implication or otherwise in connection therewith. Specifications are subject to change without notice. Data Device Corporation www.ddc-web.com 4 PB-BU-64843T-7 06/10