2
Data Device Corporation
www.ddc-web.com
PB-BU-64843T-7
06/10
Total-ACE®
The Total-ACE is a complete and compact solution to
MIL-STD-1553 applications. With a footprint as small as 0.6
inches by 1.10 inches (15.2 mm x 27.9 mm), it is ideal for
extended temperature range applications where PC board
space is at a premium. The Total-ACE is available in a 312-ball
(24 x 13 matrix) BGA package, and is rated for -40°C to
+100°C operation. The required isolation transformers (with
“Transformer Coupled” output ratios) are integrated within
the plastic BGA package, and the device is powered
entirely by +3.3 volts. The Total-ACE model with both direct
and transformer coupled 1553 connections inside the small
plastic BGA package is just 0.7 inches by 1.1 inches (17.8 mm
x 27.9 mm).
The Total-ACE is fully software and architecturally compatible
with DDC's ACE, Enhanced Mini-ACE, Micro-ACE, and
Mini-ACE Mark3 series of devices. It integrates dual
transceivers, dual transformers, a protocol engine and 4K or
64K words of internal RAM. The Total-ACE's flexible generic
Product Overview
Total-ACE BGA Outline Drawing
1.100 (27.9)
± .015
Triangle denotes
Ball A1
0.185 (4.7) (MAX)
BOTTOM VIEW
SIDE VIEW
0.015 (0.38)
± .002 0.022 (0.56) DIA
T / H = Sn/Pb (63/37)BALL
U / I = Sn/Ag/Cu (96.5/3/0.5) BALL
(312 PL
A
CES)
0.097 (2.46)
TYP
12 EQ. SP. @
0.0394 (1.00) =
.473 (12)
(TOL NONCUM)
(TYP)
23 EQ. SP. @
0.0394 (1.00) = .906 (23)
(TOL NONCUM)
(TYP)
TOP VIEW
Hi TG-FR4 Board
Cover Material
Hard Pot Epoxy
Notes:
1) Dimensions are in inches (mm)
2) Cover material: Hard Pot Epoxy
3) Base material: Substrate is Hi TG-FR4, Enig plated 1/2 oz copper
4) Solder Ball Cluster to be centralized within ±.010 of outline dimensions
5) Solder ball is 0.022”. Substrate pads are 0.030” copper that are Solder mask dened to 0.022”.
Solder ball after reow has a height of 0.015” and Diameter of 0.028”.
JHGF E D C BA
N M LK
2
1
3
9
7
6
5
4
13
12
11
10
8
14
22
21
20
19
18
17
16
15
24
23
*A
*B
*DIMENSIONAL INFORMATION
PART NUMBER A B
BU-648x3T(U)8 0.600 (15.2) ± .015 0.064 (1.63) TYP
BU-648x3H(I)8 0.700 (17.8) ± .015 0.114 (2.89) TYP
Product Specifications
MIL-STD-1553 Terminal & Transformer Solution
• Integrated Isolation Transformers with:
- Transformer Coupled Connections (0.6" x 1.1")
(15.2 mm x 27.9 mm)
- Direct & Transformer Coupled Connections (0.7" x 1.1")
(17.8 mm x 27.9 mm)
• Single 3.3V Supply
• 3.3V Transceivers have SLEEPIN input to Further Reduce
Transceiver Power
Processor or PCI Bus Interface Flexibility
• Direct Interface to 8, 16, or 32-bit Microprocessor or
Microcontroller
• Support for DMA Interface to External RAM
• PCI Versions have 33MHz/32-bit PCI Target Interface
Extensive User Configurability
• Can be used with External Transceivers
• Software Programmable Divider to Enable Master 1553
Clock of 10, 12, 16, or 20 MHz
• RT Auto-Boot Option
1553 Bus Monitor (MT)
• Filter Based on RT Address, T/R bit, Subaddress
• Programmable Interrupt Conditions
• Command/Data Stack
• 32-Entry Interrupt Status Queue
1553 Bus Controller (BC)
• Message Control Engine Offloads Host Processor
• Minor/Major Frame Scheduling to Control Timing of 1553
Messages
• High and Low Priority Asynchronous Message Insertion
• Modify Messages or Data while BC is Running
• Programmable Interrupt Conditions
1553 Remote Terminal (RT)
• Multiprotocol: MIL-STD-1553 A/B, STANAG 3838
• Multiple Buffering Techniques
• Programmable Command Illegalization
processor interface allows direct connection with little or no
glue logic to a variety of 8-, 16-, and 32-bit processors. The
PCI interface model allows for a direct connection to a 32-bit
PCI bus.
Advanced architecture is the key to the Total-ACE series’
high performance. Advanced bus controller architecture
gives the Total-ACE a high degree of flexibility and
autonomy. This creates advantages in a number of areas:
improving message scheduling control, minimizing host
overhead for asynchronous message insertion, facilitating
bulk data transfers and double buffering, message retry and
bus switching strategies, and data logging and fault report-
ing. In addition, its remote terminal architecture provides
flexibility in meeting all common MIL-STD-1553 protocols. RT
data buffering and interrupt options offer robust support for
synchronous and asynchronous messaging, ensure data
sample consistency, and support bulk data transfers.
Autonomous Built-In Self-Test
• Host initiated Protocol & RAM Self-Test
• Automatic Power On Self-Test
• Online Loopback Test
• Capability for CH. A-to-CH. B Wraparound Test
• Capability to Test Transmitter Timeout Function