Total-ACE®
Complete MIL-STD-1553 Solution
Product Brief
© 2008, 2010 Data Device Corporation. All trademarks are the property of their respective owners.
Model: BU-6X8X3T/U/H/i8
For more information: www.ddc-web.com/BU-64843T
Save board space and simplify your 1553 design and layout with the world's first fully integrated MIL-STD-1553 terminal,
complete with 1553 protocol, memory, transceivers, and isolation transformers—all in one small plastic BGA package
with direct and/or transformer coupled 1553 connections inside.
Model: BU-6X8X3T/U/H/i8
Key Features
1 Dual Redundant MIL-STD-1553 Channel
- BC, RT, MT or RT/MT Functionality
- Direct and/or Transformer Coupled
- Supports MIL-STD-1553 A/B
- Supports MIL-STD-1760
- 4K x 16 or 64K x 16 RAM
- Tx Inhibit Ball for MT Only Applications
- BC Disable Ball for RT Only Applications
- Simple System RT Mode
Small Package:
- 312 Ball BGA (1.1 in. x 0.6 in.) (27.9 mm x 15.2 mm)
- 0.185" (4.7 mm) Max Height
Extended Industrial Temperature Range
- -40°C to +100°C
- Thermal Balls for Improved Heatsinking
3.3 Volt Only Operation
DO-254 Certifiable
Generic Processor or PCI Interface
Leaded and RoHS Versions Available
High-Level C Software Development Kits with
Sample Code for Windows®, Linux®, and VxWorks®
Graphical User Interface to Generate Application C
Code
Applications
Mission Computers
Digital Data Recorders
LRU's
Radios/Modems
Displays
Ground Vehicles
Commercial Aerospace
Radar Systems/Situational Awareness
Benefits
Small Size Saves Board Space
Simplified Board Design with Single Package System
Single Part Provides Increased Reliability
Field Proven & Reliable Technology with over 62 Million
Hours of In-Service History
Qualified and RT Validated to Simplify Qualification
Lower Total Cost of Ownership
Software Compatible with ACE, Mini-ACE®, Enhanced
Mini-ACE®, Micro-ACE®, and Mini-ACE® Mark3 Series
2
Data Device Corporation
www.ddc-web.com
PB-BU-64843T-7
06/10
Total-ACE®
The Total-ACE is a complete and compact solution to
MIL-STD-1553 applications. With a footprint as small as 0.6
inches by 1.10 inches (15.2 mm x 27.9 mm), it is ideal for
extended temperature range applications where PC board
space is at a premium. The Total-ACE is available in a 312-ball
(24 x 13 matrix) BGA package, and is rated for -40°C to
+100°C operation. The required isolation transformers (with
“Transformer Coupled” output ratios) are integrated within
the plastic BGA package, and the device is powered
entirely by +3.3 volts. The Total-ACE model with both direct
and transformer coupled 1553 connections inside the small
plastic BGA package is just 0.7 inches by 1.1 inches (17.8 mm
x 27.9 mm).
The Total-ACE is fully software and architecturally compatible
with DDC's ACE, Enhanced Mini-ACE, Micro-ACE, and
Mini-ACE Mark3 series of devices. It integrates dual
transceivers, dual transformers, a protocol engine and 4K or
64K words of internal RAM. The Total-ACE's flexible generic
Product Overview
Total-ACE BGA Outline Drawing
1.100 (27.9)
± .015
Triangle denotes
Ball A1
0.185 (4.7) (MAX)
BOTTOM VIEW
SIDE VIEW
0.015 (0.38)
± .002 0.022 (0.56) DIA
T / H = Sn/Pb (63/37)BALL
U / I = Sn/Ag/Cu (96.5/3/0.5) BALL
(312 PL
A
CES)
0.097 (2.46)
TYP
12 EQ. SP. @
0.0394 (1.00) =
.473 (12)
(TOL NONCUM)
(TYP)
23 EQ. SP. @
0.0394 (1.00) = .906 (23)
(TOL NONCUM)
(TYP)
TOP VIEW
Hi TG-FR4 Board
Cover Material
Hard Pot Epoxy
Notes:
1) Dimensions are in inches (mm)
2) Cover material: Hard Pot Epoxy
3) Base material: Substrate is Hi TG-FR4, Enig plated 1/2 oz copper
4) Solder Ball Cluster to be centralized within ±.010 of outline dimensions
5) Solder ball is 0.022”. Substrate pads are 0.030” copper that are Solder mask dened to 0.022”.
Solder ball after reow has a height of 0.015” and Diameter of 0.028”.
JHGF E D C BA
N M LK
2
1
3
9
7
6
5
4
13
12
11
10
8
14
22
21
20
19
18
17
16
15
24
23
*A
*B
*DIMENSIONAL INFORMATION
PART NUMBER A B
BU-648x3T(U)8 0.600 (15.2) ± .015 0.064 (1.63) TYP
BU-648x3H(I)8 0.700 (17.8) ± .015 0.114 (2.89) TYP
Product Specifications
MIL-STD-1553 Terminal & Transformer Solution
Integrated Isolation Transformers with:
- Transformer Coupled Connections (0.6" x 1.1")
(15.2 mm x 27.9 mm)
- Direct & Transformer Coupled Connections (0.7" x 1.1")
(17.8 mm x 27.9 mm)
Single 3.3V Supply
3.3V Transceivers have SLEEPIN input to Further Reduce
Transceiver Power
Processor or PCI Bus Interface Flexibility
Direct Interface to 8, 16, or 32-bit Microprocessor or
Microcontroller
Support for DMA Interface to External RAM
PCI Versions have 33MHz/32-bit PCI Target Interface
Extensive User Configurability
Can be used with External Transceivers
Software Programmable Divider to Enable Master 1553
Clock of 10, 12, 16, or 20 MHz
RT Auto-Boot Option
1553 Bus Monitor (MT)
Filter Based on RT Address, T/R bit, Subaddress
Programmable Interrupt Conditions
Command/Data Stack
32-Entry Interrupt Status Queue
1553 Bus Controller (BC)
Message Control Engine Offloads Host Processor
Minor/Major Frame Scheduling to Control Timing of 1553
Messages
High and Low Priority Asynchronous Message Insertion
Modify Messages or Data while BC is Running
Programmable Interrupt Conditions
1553 Remote Terminal (RT)
Multiprotocol: MIL-STD-1553 A/B, STANAG 3838
Multiple Buffering Techniques
Programmable Command Illegalization
processor interface allows direct connection with little or no
glue logic to a variety of 8-, 16-, and 32-bit processors. The
PCI interface model allows for a direct connection to a 32-bit
PCI bus.
Advanced architecture is the key to the Total-ACE series’
high performance. Advanced bus controller architecture
gives the Total-ACE a high degree of flexibility and
autonomy. This creates advantages in a number of areas:
improving message scheduling control, minimizing host
overhead for asynchronous message insertion, facilitating
bulk data transfers and double buffering, message retry and
bus switching strategies, and data logging and fault report-
ing. In addition, its remote terminal architecture provides
flexibility in meeting all common MIL-STD-1553 protocols. RT
data buffering and interrupt options offer robust support for
synchronous and asynchronous messaging, ensure data
sample consistency, and support bulk data transfers.
Autonomous Built-In Self-Test
Host initiated Protocol & RAM Self-Test
Automatic Power On Self-Test
Online Loopback Test
Capability for CH. A-to-CH. B Wraparound Test
Capability to Test Transmitter Timeout Function
3
Data Device Corporation
www.ddc-web.com
PB-BU-64843T-7
06/10
Technical Data
Note: For full specifications and additional information, refer to the BU-64843T Total-ACE Data Sheet (DS-BU-64843T), the BU-65863 PCI Total-ACE Data Sheet
(DS-BU-65863), the BU-69092 SDK Software Manual (MN-69092SX-002), and the Enhanced Mini-ACE User's Guide (MN-6186X-001), available on our web site.
Total-ACE®
TRANSCEIVER
A
TRANSCEIVER
B
DUAL
ENCODER /
DECODER,
MULTIPROTOCOL
AND
MEMORY
MANAGEMENT
RT ADDRESS
SHARED
RAM
ADDRESS BUS
PROCESSOR
AND
MEMORY
INTERFACE
LOGIC
DATA BUS DATA
BUFFERS
ADDRESS
BUFFERS
PROCESSOR
DATA BUS
PROCESSOR
ADDRESS BUS
MISCELLANEOUS
INCMD/MCRST
CLK_IN, TAG_CLK,
MSTCLR, SSFLAG/EXT_TRG, TX-INH_A, TX-INH_B,
SLEEPIN/UPADDREN
RTAD4-RTAD0, RTADP, RTADD_LAT
TRANSPARENT/BUFFERED, STRBD, SELECT,
RD/WR, MEM/REG, TRIGGER_SEL/MEMENA-IN,
MSB/LSB/DTGRT
IOEN, READYD
ADDR_LAT/MEMOE, ZERO_WAIT/MEMWR,
8/16-BIT/DTREQ, POLARITY_SEL/DTACK
INT
PROCESSOR
AND
MEMORY
CONTROL
INTERRUPT
REQUEST
S
P
R
O
D
A
S
S
P
R
O
A
DD
R
A15-A0
D15-D0
RTAD4 R
+3.3V
TRANSFORMER
A
+3.3V
TRANSFORMER
B
CH. A
CH. B
CHA_1553-Direct
CHA_1553_L-Direct
CHA_1553_L
CHB_1553
CHB_1553-Direct
CHB_1553_L-Direct
CHB_1553_L
TX_INH A/B
CHA_1553
PCI Total-ACE®
TRANSCEIVER
A
CH. A
TRANSCEIVER
B
CH. B
DUAL
ENCODER /
DECODER,
MULTIPROTOCOL
AND
MEMORY
MANAGEMENT
RT ADDRESS AND
ADDRESS LATCH
4K X 16
OR
64K X 17
SHARED
RAM
ADDRESS BUS
DATA BUS
AD31-AD0
C/BE#3 - C/BE#0
33 MHZ,
32-BIT
PCI SLAVE
INTERFACE
MISCELLANEOUS
INCMD/MCRST
1553_CLK, SSFLAG/EXT_TRIG,TAG_CLK
RTAD4-RTAD0, RTADP
PCI Interrupt
RT-AD4-LAT
BOOT_L,CLK_SEL_0/1
32 X 32
WRITE
FIFO
PAR
FRAME#, IRDY#,IDSEL
TRDY#, STOP#, DEVSEL#,
PERR#, SERR#
(PCI) CLK
INT A #
MSTCLR (RST#)
PCI CLK
PCI Control
PCI Address/Data, Parity
and Bus Command/Byte Enable
CHA_1553 +3.3V
TRANSFORMER
A
+3.3V
TRANSFORMER
B
CHA_1553-Direct
CHA_1553_L-Direct
CHA_1553_L
CHB_1553
CHB_1553-Direct
CHB_1553_L-Direct
CHB_1553_L
TX_INH A/B
PARAMETER MIN TYP MAX
ABSOLUTE MAXIMUM RATINGS
Supply Voltage Logic +3.3V
V
-0.3 6.0
Transceivers +3.3V (not during transmit) -0.3 6.0
Transceivers +3.3V (during transmit) -0.3 4.5
Logic +3.3V Logic Input Range -0.3 6.0
POWER SUPPLY REQUIREMENTS
Voltages/Tolerance Logic +3.3V V3 3.3 3.6
Transceivers +3.3V 3.14 3.3 3.46
POWER DISSIPATION - TOTAL HYBRID
BU-64843T/U8 Idle
W
.132 .198
25% Transmitter Duty Cycle .579 .764
50% Transmitter Duty Cycle .861 1.165
THERMAL
Operating Temperature Component Case °C -40 +100
Storage Temperature -65 +125
PHYSICAL CHARACTERISTICS
Size (L x W x H) BU-6X8X3H/I models in 0.7 x 1.1 x 0.185
(mm) (17.8 x 27.9 x 4.7)
BU-6X8X3T/U models in 0.6 x 1.1 x 0.185
(mm) (15.2 x 27.9 x 4.7)
4
Data Device Corporation
www.ddc-web.com
PB-BU-64843T-7
06/10
For ordering assistance and technical support,
Call: 1-800-DDC-5757
E-mail: service@ddc-web.com
Visit: www.ddc-web.com
Headquarters, N.Y., U.S.A. - Tel: (631) 567-5600, Fax: (631) 567-7358
United Kingdom - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264
France - Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425
Germany - Tel: +49-(0)89-1500-12-11, Fax:+49(0)89-1500 12-22
Japan - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689
The information in this Product Brief is believed to be accurate; however, no responsibility
is assumed by Data Device Corporation for its use, and no license or rights are granted
by implication or otherwise in connection therewith. Specifications are subject to change
without notice.
DATA DEVICE CORPORATION
REGISTERED TO ISO 9001:2008
REGISTERED TO AS9100:2004-01
FILE NO. A5976
R
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T
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D
F
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M
®
U
BU-6X8X3T8-E02
Test Criteria:
2 = MIL-STD-1760 Amplitude
Process Requirements:
0 = Standard DDC practices, no Burn-In
Temperature Range/Data Requirements:
E = -40°C to +100°C Case Temperature
Voltage/Transceiver Option:
8 = +3.3 Volts rise/fall times = 100 ns to 300 ns (1553B)
Package Type:
T = Leaded Transformer Coupled Total-ACE (0.6" x 1.1") (15.2 mm x 27.9 mm)
U = RoHS Transformer Coupled Total-ACE (0.6" x 1.1") (15.2 mm x 27.9 mm)
H = Leaded Direct and Transformer Coupled Total-ACE (0.7" x 1.1") (17.8 mm x 27.9 mm)
i = RoHS Direct and Transformer Coupled Total-ACE (0.7" x 1.1") (17.8 mm x 27.9 mm)
Logic / RAM Voltage:
3 = 3.3 Volt Logic and RAM
Memory:
4 = 4K Word RAM
6 = 64K Word RAM
Product Type:
BU-648 = BC/RT/MT Generic Processor Interface
BU-658 = BC/RT/MT PCI Bus Interface
Notes: Please contact factory for availability of varions versions of Total-ACE®.
See Application Note AN/B-37 for SSRT Implementation, available at www.ddc-web.com
Ordering Information
Standard DDC Processing for MIL-STD-1553 BGA Products
TEST TYPE METHOD(S) CONDITIONS
INSPECTION 2010, 2017, and 2032
TEMPERATURE CYCLE 1010 B
Included Software:
1553 C Software Development Kit (SDK)
Windows 2000/XP/Vista/7, Linux, and VxWorks support
Optional Software:
Model: BU-69066S0-XX0
Generate or monitor live MIL-STD-1553 data without
writing any code
Saves time and reduces development costs
Program in minutes with one-click ANSI C source code
generation
Rapid creation and setup of custom applications
Data Bus Analyzer and Monitor Software