344
CM100TF-24H
Six-IGBT IGBTMOD™ H-Series Module
100 Amperes / 1200 Volts
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
Ratings Symbol CM100TF-24H Units
Junction Temperature Tj–40 to 150 °C
Storage Temperature Tstg –40 to 125 °C
Collector-Emitter Voltage (G-E SHORT) VCES 1200 Volts
Gate-Emitter V oltage VGES ±20 Volts
Collector Current IC100 Amperes
Peak Collector Current ICM 200* Amperes
Diode Forward Current IF100 Amperes
Diode Forward Surge Current IFM 200* Amperes
Power Dissipation Pd780 Watts
Max. Mounting Torque M5 Terminal Screws – 17 in-lb
Max. Mounting Torque M5 Mounting Screws – 17 in-lb
Module Weight (Typical) – 830 Grams
V Isolation VRMS 2500 Volts
* Pulse width and repetition rate should be such that device junction temperature does not exceed the device rating.
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current ICES VCE = VCES, VGE = 0V – – 1.0 mA
Gate Leakage Current IGES VGE = VGES, VCE = 0V – – 0.5
µ
A
Gate-Emitter Threshold Voltage VGE(th) IC = 10mA, VCE = 10V 4.5 6.0 7.5 Volts
Collector-Emitter Saturation Voltage VCE(sat) IC = 100A, VGE = 15V – 2.5 3.4** Volts
IC = 100A, VGE = 15V, Tj = 150°C – 2.25 – Volts
Total Gate Charge QGVCC = 600V, IC = 100A, VGS = 15V – 500 – nC
Diode Forward Voltage VFM IE = 100A, VGS = 0V – – 3.4 Volts
** Pulse width and repetition rate should be such that device junction temperature rise is negligible.
Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Input Capacitance Cies –– 20nF
Output Capacitance Coes VGE = 0V, VCE = 10V, f = 1MHZ – – 7 nF
Re verse Transfer Capacitance Cres – – 4 nF
Resistive Turn-on Delay Time td(on) – – 250 ns
Load Rise Time trVCC = 600V, IC = 100A, – – 350 ns
Switch Turn-off Delay Time td(off) VGE1 = VGE2 = 15V, RG = 3.1Ω– – 300 ns
Times F all Time tf– – 350 ns
Diode Reverse Recovery Time trr IE = 100A, diE/dt = –200A/
µ
s––250ns
Diode Reverse Recovery Charge Qrr IE = 100A, diE/dt = –200A/
µ
s – 0.74 –
µ
C
Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case Rth(j-c) Per IGBT – – 0.16 °C/W
Thermal Resistance, Junction to Case Rth(j-c) Per FWDi – – 0.35 °C/W
Contact Thermal Resistance Rth(c-f) Per Module, Thermal Grease Applied – – 0.025 °C/W