Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200140I • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 26, 2013 1
DATA SHEET
PIN Diode Chips Supplied on Film Frame
Applications
Switches
Attenuators
Features
Preferred device for module applications
PIN diodes supplied are 100% tested, saw cut, and mounted on
film frame
Low cost
Description
The PIN diodes that comprise this family of diodes supplied on
film frames are designed for high volume applications from
10 MHz to over 3 GHz. This family contains two groups of PIN
diodes:
1. Low-capacitance, low-resistance PIN diodes designed primarily
for RF switching applications:
SMP1320-099
SMP1321-099
SMP1322-099
SMP1340-099
SMP1353-099
2. PIN diodes with thick I-layers designed for low-distortion RF
variable attenuator applications:
SMP1302-099
SMP1304-099
SMP1307-099
These PIN diodes are provided as 100 percent tested, diced
wafers mounted on film frames for optimal compatibility with
high-volume pick-and-place assembly techniques.
Absolute maximum ratings are provided in Table 1. Electrical
specifications are provided in Table 2. Chip dimensions are shown
in Table 3. Typical performance characteristics are illustrated in
Figures 1 through 6. Figure 7 describes the wafer film frame.
DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
2 June 26, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200140I
Table 1. PIN Diode Chips Absolute Maximum Ratings
Parameter Symbol Minimum Maximum Units
Reverse voltage VR Voltage rating V
Power dissipation @ 25 °C at the base of the
chip
PD 250 mW
Operating temperature TOP –65 +150 °C
Storage temperature TSTG –65 +150 °C
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
CAUTION: Although these devices are designed to be as robust as possible, Electrostatic Discharge (ESD) can damage them. These
devices must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the
human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all
times. PIN diode chips supplied on film frames are Class 1C ESD devices.
Table 2. PIN Diode Chips Electrical Specifications (Note 1)
(TOP = 25 °C)
Part Number Voltage Rating
(V)
Max CJ
(pF)
VR = 30 V,
f = 1 MHz
Typ VF
(mV)
@ IF = 10 mA
Max RS
(Ω)
IF = 1 mA,
f = 100 MHz
Max RS
(Ω)
IF = 10 mA,
f = 100 MHz
Typ TL
(ns)
IF = 10 mA
Switching Applications
SMP1320-099 50 0.175 850 2 typ 0.9 400
SMP1321-099 100 0.150 860 3 typ 2.0 400
SMP1322-099 50 0.850 825 1.5 0.45 typ 400
SMP1340-099 50 0.15 @ 10 V 880 1.7 typ 1.2 100
SMP1353-099 200 0.13 @ 20 V 825 15 2.8 1000
Attenuator Applications
SMP1302-099 200 0.15 800 20 3 700
SMP1304-099 200 0.15 800 50 7 1000
SMP1307-099 200 0.20 850 75 typ 1.5 1500
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Reverse current is specified @ 10 μA maximum at the voltage rating. This voltage should not be exceeded.
The PIN diodes listed here are processed on 100 mm silicon wafers, 100% DC tested, saw cut, and shipped on 6-inch film frame hoops.
Electrical rejects are identified with black ink on the film frame.
Attenuators are 100% series resistance tested @ 1 mA/100 MHz.
Table 3. PIN Diode Chip Dimensions
Part Number Quantity of Good Diodes Per Wafer Chip Size
(In)
Chip Height
(In)
Anode Contact
(In)
Minimum Nominal
SMP1320-099 40000 46000 0.0135 ± 0.001 0.005 ± 0.001 0.0030 ± 0.0003
SMP1321-099 40000 46000 0.0135 ± 0.001 0.005 ± 0.001 0.0030 ± 0.0003
SMP1322-099 40000 46000 0.0135 ± 0.001 0.005 ± 0.001 0.0075 ± 0.0005
SMP1340-099 65000 72000 0.0105 ± 0.001 0.005 ± 0.001 0.0029 ± 0.0003
SMP1353-099 65000 72000 0.0105 ± 0.001 0.005 ± 0.001 0.0070 ± 0.0005
SMP1302-099 40000 46000 0.0135 ± 0.001 0.005 ± 0.001 0.0085 ± 0.0005
SMP1304-099 40000 46000 0.0135 ± 0.001 0.009 ± 0.001 0.0085 ± 0.0005
SMP1307-099 20000 25000 0.0185 ± 0.001 0.009 ± 0.001 0.0110 ± 0.0005
DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200140I • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 26, 2013 3
Typical Performance Characteristics
(TOP = 25 °C)
Series Resistance (Ω)
Forward Current (mA)
0.1
1
10
100
1000
0.01 0.1 1.0 10 100
SMP1322
SMP1340
SMP1320
SMP1321
SMP1353
Figure 1. Series Resistance vs Forward Current @ 100 MHz
0.01 0.1 1 10 100
Forward Current (mA)
Series Resistance ()
0.1
1
10
100
1000
10000
SMP1302
SMP1304
Figure 3. Series Resistance vs Forward Current @ 100 MHz
Capacitance (pF)
Reverse Voltage (V)
0
0.2
0.4
0.6
0.8
1.0
1.2
0 5 10 15 20 25 30
SMP1320
SMP1321
SMP1322
SMP1340
SMP1353
Figure 2. Capacitance vs Reverse Voltage
Reverse Voltage (V)
Capacitance (pF)
0
0.05
0.10
0.15
0.20
0.25
0 5 10 15 20 25 30
1302
1304
Figure 4. Capacitance vs Reverse Voltage
DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
4 June 26, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200140I
0
0.1
0.2
0.3
0.4
0.5
0.6
0 5 10 15 20 25 30
Reverse Voltage (V)
Junction Capacitance (pF)
Figure 5. Capacitance vs Reverse Voltage
(SMP1307-099)
0.01 0.1 1 10 100
Forward Current (mA)
Series Resistance ()
1
10
100
1000
10000
Figure 6. Series Resistance vs Forward Current
(SMP1307-099)
Grip Ring
0.003 (0.076 mm)
Separation
Between Die
3.940 (100 mm)
Wafer Dia.
5.520 (140.2 mm)
Inner Ring I.D.
5.981 (151.92 mm)
Outer Ring O.D.
0.236 (5.99 mm)
Ring Thickness
Wafer on nitto tape
Color: light blue
Thickness: 2.2 to 3.0 mils
Tensile strength: 6.6 lbs (in width)
Ring material: plastic
0.003 (0.076 mm) Nom.
Separation
Between Die
Figure 7. Wafer Film Frame Description
DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200140I • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 26, 2013 5
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