2N3700HR Hi-Rel 80 V - 1 A NPN bipolar transistor Features 3 BVCEO 80 V 1 IC (max) 1A 2 HFE at 10 V - 150 mA > 100 Operating temperature range -65C to +200C 1 2 3 TO-18 LCC-3 3 4 Hi-Rel NPN bipolar transistor 1 2 Linear gain characteristics ESCC qualified European preferred part list - EPPL 100 krad low dose rate Radiation level: lot specific total dose contact marketing for specified level LCC-3UB Figure 1. Internal schematic diagram Description The 2N3700HR is a silicon planar epitaxial NPN transistor in TO-18 and LCC-3 packages. It is specifically designed for aerospace Hi-Rel applications and ESCC qualified according to the 5201-004 specification. In case of conflict between this datasheet and ESCC detailed specification, the latter prevails. Table 1. Device summary Order codes ESCC part num. Qual. level Rad level Packages 2N37000UB1 - Eng. model LCC-3UB Gold 0.06 - 2N37000UBSW 5201/004/07 ESCC flight LCC-3UB Solder dip 0.06 Y 2N37000UB06 5201/004/06 ESCC flight LCC-3UB Gold 0.06 - 2N37000UB07 5201/004/07 ESCC flight LCC-3UB Solder dip 0.06 - SOC37000 - Eng. model LCC-3 Gold 0.06 - SOC3700SW 5201/004/05 ESCC flight LCC-3 Solder dip 0.06 Y 0.06 Y SOC3700HRB 2N3700T1 2N3700HR 1. 100 krad 100 krad 5201/004/04 or 05 ESCC flight - LCC-3 Lead finish Gold/Solder dip Mass (g) EPPL (1) Eng. model TO-18 Gold 0.40 - 5201/004/01 or 02 ESCC flight TO-18 Gold/Solder dip(1) 0.40 - Depending ESCC part number mentioned on the purchase order November 2011 Doc ID 15354 Rev 4 1/12 www.st.com 12 Electrical ratings 1 2N3700HR Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VCBO Collector-base voltage (IE = 0) 140 V VCEO Collector-emitter voltage (IB = 0) 80 V VEBO Emitter-base voltage (IC = 0) 7 V Collector current 1 A Total dissipation at Tamb 25 C for 2N3700HR for SOC3700HRB for SOC3700HRB (1) 0.5 0.5 0.76 W W W Total dissipation at Tc 25 C for 2N3700HR 1.8 W Storage temperature -65 to 200 C Max. operating junction temperature 200 C IC Ptot Tstg TJ 1. When mounted on a 15 x 15 x 0.6 mm ceramic substrate. Table 3. Symbol RthJC RthJA Table 4. Symbol RthJA RthJA Thermal data for through-hole package Parameter Thermal resistance junction-case __ Thermal resistance junction-ambient __ Unit 97 350 C/W C/W Thermal data for SMD package Parameter Thermal resistance junction-ambient Thermal resistance junction-ambient (1) 1. When mounted on a 15 x 15 x 0.6 mm ceramic substrate. 2/12 max max TO-18 Doc ID 15354 Rev 4 max max SOC Unit 350 230 C/W C/W 2N3700HR 2 Electrical characteristics Electrical characteristics Tcase = 25 C unless otherwise specified. Table 5. Symbol Electrical characteristics Parameter Test conditions Min. Typ. Max. Unit 10 100 10 nA nA A 10 nA ICBO Collector cut-off current (IE = 0) VCB = 90 V VCB = 90 V VCB = 90 V IEBO Emitter cut-off current (IC = 0) VEB = 5 V Collector-base breakdown voltage (IE = 0) IC = 100 A 140 V Collector-emitter V(BR)CEO (1) breakdown voltage (IB = 0) IC = 30 mA 80 V V(BR)EBO Emitter-base breakdown voltage (IC = 0) IE = 100 A 7 V VCE(sat) (1) Collector-emitter saturation voltage IC = 150 mA IC = 500 mA Base-emitter saturation voltage IB = 15 mA IC = 150 mA IB = 15 mA IC = 150 mA Tamb = 110 C 0.75 VBE(sat) (1) 0.65 DC current gain IC = 10 mA IC = 150 mA IC = 500 mA IC = 150 mA Tamb = - 55 C 90 100 50 V(BR)CBO hFE (1) Tamb = 110 C Tamb = 150 C 0.2 0.5 V V 0.87 1 V 0.77 0.9 V IB = 15 mA IB = 50 mA VCE = 10 V VCE = 10 V VCE = 10 V VCE = 10 V 300 40 hfe Small signal current gain VCE = 10 V f = 20 MHz IC = 50 mA CCBO Output capacitance (IE = 0) VCB = 10 V f = 1 MHz 12 pF CIBO Input capacitance (IC = 0) VEB = 0.5 V f = 1 MHz 60 pF 5 1. Pulsed duration = 300 s, duty cycle 2 % Doc ID 15354 Rev 4 3/12 Electrical characteristics 2.1 2N3700HR Electrical characteristics (curves) Figure 2. DC current gain (VCE=1 V) Figure 3. DC current gain (VCE=10 V) ( ( 6#% 6 6#% 6 # # # # # # Figure 4. ,F $ H&% 6 # # # ,F $ Figure 5. H&% 6 !-V 4/12 !-V Collector emitter saturation voltage Doc ID 15354 Rev 4 ,F $ !-V Base emitter saturation voltage # # # ,F $ !-V 2N3700HR 2.2 Electrical characteristics Test circuit Figure 6. Resistive load switching test circuit 1. Fast electronic switch 2. Non-inductive resistor Doc ID 15354 Rev 4 5/12 Package mechanical data 3 2N3700HR Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 6/12 Doc ID 15354 Rev 4 2N3700HR Package mechanical data Table 6. LCC-3UB mechanical data mm. Dim. Min. Figure 7. Typ. Max. A 1.16 1.42 C 0.46 0.51 0.56 D 0.56 0.76 0.96 E 0.92 1.02 1.12 F 1.95 2.03 2.11 G 2.92 3.05 3.18 I 2.41 2.54 2.67 J 0.42 0.57 0.72 K 1.37 1.52 1.67 L 0.41 0.51 0.61 M 2.46 2.54 2.62 N 1.81 1.91 2.01 r 0.20 r1 0.30 r2 0.56 LCC-3UB drawings Doc ID 15354 Rev 4 7/12 Package mechanical data Table 7. 2N3700HR LCC-3 mechanical data mm. Dim. Min. 8/12 Max. A 1.16 C 0.45 0.50 0.56 D 0.60 0.76 0.91 E 0.91 1.01 1.12 F 1.95 2.03 2.11 G 2.92 3.05 3.17 I 2.41 2.54 2.66 J 0.42 0.57 0.72 K 1.37 1.52 1.67 L 0.40 0.50 0.60 M 2.46 2.54 2.62 N 1.80 1.90 2.00 R Figure 8. Typ. 1.42 0.30 LCC-3 drawings Doc ID 15354 Rev 4 2N3700HR Package mechanical data Table 8. TO-18 mechanical data mm. Dim. Min. A Max. 12.7 B 0.49 D 5.3 E 4.9 F 5.8 G 2.54 H 1.2 I 1.16 L Figure 9. Typ. 45 TO-18 drawings Doc ID 15354 Rev 4 9/12 Order codes 2N3700HR 4 Order codes Table 9. Order codes Order codes ESCC Part number 2N37000UB1 - 2N37000UBSW 5201/004/07 2N37000UB06 Rad level Packages Lead Finish Marking EPPL Packing LCC-3UB Gold 2N37000UB1 - Waffle pack LCC-3UB Solder Dip 520100407 Y Waffle pack 5201/004/06 LCC-3UB Gold 520100406 - Waffle pack 2N37000UB07 5201/004/07 LCC-3UB Solder Dip 520100407 - Waffle pack SOC37000 - LCC-3 Gold SOC3700 - Waffle pack SOC3700SW 5201/004/05 LCC-3 Solder Dip 520100405 Y Waffle pack SOC3700HRB 5201/004/04 or 05 LCC-3 Gold or Solder Dip (1) 520100404 or 05 Y Waffle pack 2N3700T1 - TO-18 Gold 2N3700T1 - Strip pack 2N3700HR 5201/004/01 or 02 TO-18 Gold or Solder Dip (1) 520100401 or 02 - Strip pack 100 krad 100 krad 1. Depending ESCC part number mentioned on the purchase order Contact ST sales office for information about the specific conditions for: 10/12 - Products in die form - Tape and reel packing Doc ID 15354 Rev 4 2N3700HR 5 Revision history Revision history Table 10. Document revision history Date Revision Changes 10-Jan-2008 1 Initial release 07-Jan-2010 2 Modified Table 1 on page 1 26-Jul-2010 3 Modified Table 1 on page 1, added Table 9 on page 10 30-Nov-2011 4 - Modified: Table 5 on page 3 - Added: Section 2.1: Electrical characteristics (curves) - Minor text change in the document title on the coverpage Doc ID 15354 Rev 4 11/12 2N3700HR Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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