November 2011 Doc ID 15354 Rev 4 1/12
12
2N3700HR
Hi-Rel 80 V - 1 A NPN bipolar transistor
Features
■Hi-Rel NPN bipolar transistor
■Linear gain characteristics
■ESCC qualified
■European preferred part list - EPPL
■100 krad low dose rate
■Radiation level: lot specific total dose contact
marketing for specified level
Description
The 2N3700HR is a silicon planar epitaxial NPN
transistor in TO-18 and LCC-3 packages. It is
specifically designed for aerospace Hi-Rel
applications and ESCC qualified according to the
5201-004 specification. In case of conflict
between this datasheet and ESCC detailed
specification, the latter prevails.
Figure 1. Internal schematic diagram
BVCEO 80 V
IC (max) 1 A
HFE at 10 V - 150 mA > 100
Operating temperature range -65°C to +200°C
TO-18 LCC-3
3
1
2
LCC-3UB
3
1
2
4
3
1
2
Table 1. Device summary
Order codes ESCC part num. Qual. level Rad level Packages Lead finish Mass (g) EPPL
2N37000UB1 - Eng. model LCC-3UB Gold 0.06 -
2N37000UBSW 5201/004/07 ESCC flight 100 krad LCC-3UB Solder dip 0.06 Y
2N37000UB06 5201/004/06 ESCC flight LCC-3UB Gold 0.06 -
2N37000UB07 5201/004/07 ESCC flight LCC-3UB Solder dip 0.06 -
SOC37000 - Eng. model LCC-3 Gold 0.06 -
SOC3700SW 5201/004/05 ESCC flight 100 krad LCC-3 Solder dip 0.06 Y
SOC3700HRB 5201/004/04 or 05 ESCC flight LCC-3 Gold/Solder dip(1) 0.06 Y
2N3700T1 - Eng. model TO-18 Gold 0.40 -
2N3700HR 5201/004/01 or 02 ESCC flight TO-18 Gold/Solder dip(1) 0.40 -
1. Depending ESCC part number mentioned on the purchase order
www.st.com
Electrical ratings 2N3700HR
2/12 Doc ID 15354 Rev 4
1 Electrical ratings
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
VCBO Collector-base voltage (IE = 0) 140 V
VCEO Collector-emitter voltage (IB = 0) 80 V
VEBO Emitter-base voltage (IC = 0) 7 V
ICCollector current 1 A
Ptot
Total dissipation at Tamb ≤ 25 °C
for 2N3700HR
for SOC3700HRB
for SOC3700HRB (1)
Total dissipation at Tc ≤ 25 °C
for 2N3700HR
1. When mounted on a 15 x 15 x 0.6 mm ceramic substrate.
0.5
0.5
0.76
1.8
W
W
W
W
Tstg Storage temperature -65 to 200 °C
TJMax. operating junction temperature 200 °C
Table 3. Thermal data for through-hole package
Symbol Parameter TO-18 Unit
RthJC
RthJA
Thermal resistance junction-case __ max
Thermal resistance junction-ambient __ max
97
350
°C/W
°C/W
Table 4. Thermal data for SMD package
Symbol Parameter SOC Unit
RthJA
RthJA
Thermal resistance junction-ambient max
Thermal resistance junction-ambient (1) max
1. When mounted on a 15 x 15 x 0.6 mm ceramic substrate.
350
230
°C/W
°C/W
2N3700HR Electrical characteristics
Doc ID 15354 Rev 4 3/12
2 Electrical characteristics
Tcase = 25 °C unless otherwise specified.
Table 5. Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
ICBO
Collector cut-off
current (IE = 0)
VCB = 90 V
VCB = 90 V Tamb = 110 °C
VCB = 90 V Tamb = 150 °C
10
100
10
nA
nA
µA
IEBO
Emitter cut-off current
(IC = 0) VEB = 5 V 10 nA
V(BR)CBO
Collector-base
breakdown voltage
(IE = 0)
IC = 100 µA 140 V
V(BR)CEO (1)
1. Pulsed duration = 300 µs, duty cycle ≤ 2 %
Collector-emitter
breakdown voltage
(IB = 0)
IC = 30 mA 80 V
V(BR)EBO
Emitter-base
breakdown voltage
(IC = 0)
IE = 100 µA 7 V
VCE(sat) (1) Collector-emitter
saturation voltage
IC = 150 mA IB = 15 mA
IC = 500 mA IB = 50 mA
0.2
0.5
V
V
VBE(sat) (1) Base-emitter
saturation voltage
IC = 150 mA IB = 15 mA
IC = 150 mA IB = 15 mA
Tamb = 110 °C
0.75
0.65
0.87
0.77
1
0.9
V
V
hFE (1) DC current gain
IC = 10 mA VCE = 10 V
IC = 150 mA VCE = 10 V
IC = 500 mA VCE = 10 V
IC = 150 mA VCE = 10 V
Tamb = - 55 °C
90
100
50
40
300
hfe
Small signal current
gain
VCE = 10 V IC = 50 mA
f = 20 MHz 5
CCBO
Output capacitance
(IE = 0) VCB = 10 V f = 1 MHz 12 pF
CIBO
Input capacitance
(IC = 0) VEB = 0.5 V f = 1 MHz 60 pF
Electrical characteristics 2N3700HR
4/12 Doc ID 15354 Rev 4
2.1 Electrical characteristics (curves)
Figure 2. DC current gain
(VCE=1 V)
Figure 3. DC current gain
(VCE=10 V)
Figure 4. Collector emitter saturation
voltage
Figure 5. Base emitter saturation
voltage
!-V
,F$
(
#
#
#
6#%6
!-V
,F$
(
#
#
#
6#%6
!-V
,F$
#
#
#
H&%6
!-V
,F$
#
#
#
H&%6
2N3700HR Electrical characteristics
Doc ID 15354 Rev 4 5/12
2.2 Test circuit
Figure 6. Resistive load switching test circuit
1. Fast electronic switch
2. Non-inductive resistor
Package mechanical data 2N3700HR
6/12 Doc ID 15354 Rev 4
3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2N3700HR Package mechanical data
Doc ID 15354 Rev 4 7/12
Figure 7. LCC-3UB drawings
Table 6. LCC-3UB mechanical data
Dim.
mm.
Min. Typ. Max.
A 1.16 1.42
C 0.46 0.51 0.56
D 0.56 0.76 0.96
E 0.92 1.02 1.12
F 1.95 2.03 2.11
G 2.92 3.05 3.18
I 2.41 2.54 2.67
J 0.42 0.57 0.72
K 1.37 1.52 1.67
L 0.41 0.51 0.61
M 2.46 2.54 2.62
N 1.81 1.91 2.01
r 0.20
r1 0.30
r2 0.56
Package mechanical data 2N3700HR
8/12 Doc ID 15354 Rev 4
Figure 8. LCC-3 drawings
Table 7. LCC-3 mechanical data
Dim.
mm.
Min. Typ. Max.
A 1.16 1.42
C 0.45 0.50 0.56
D 0.60 0.76 0.91
E 0.91 1.01 1.12
F 1.95 2.03 2.11
G 2.92 3.05 3.17
I 2.41 2.54 2.66
J 0.42 0.57 0.72
K 1.37 1.52 1.67
L 0.40 0.50 0.60
M 2.46 2.54 2.62
N 1.80 1.90 2.00
R 0.30
2N3700HR Package mechanical data
Doc ID 15354 Rev 4 9/12
Figure 9. TO-18 drawings
Table 8. TO-18 mechanical data
Dim.
mm.
Min. Typ. Max.
A 12.7
B 0.49
D 5.3
E 4.9
F 5.8
G 2.54
H1.2
I1.16
L 45°
Order codes 2N3700HR
10/12 Doc ID 15354 Rev 4
4 Order codes
Contact ST sales office for information about the specific conditions for:
– Products in die form
– Tape and reel packing
Table 9. Order codes
Order codes ESCC Part
number Rad level Packages Lead Finish Marking EPPL Packing
2N37000UB1 - LCC-3UB Gold 2N37000UB1 - Waffle pack
2N37000UBSW 5201/004/07 100 krad LCC-3UB Solder Dip 520100407 Y Waffle pack
2N37000UB06 5201/004/06 LCC-3UB Gold 520100406 - Waffle pack
2N37000UB07 5201/004/07 LCC-3UB Solder Dip 520100407 - Waffle pack
SOC37000 - LCC-3 Gold SOC3700 - Waffle pack
SOC3700SW 5201/004/05 100 krad LCC-3 Solder Dip 520100405 Y Waffle pack
SOC3700HRB 5201/004/04 or
05 LCC-3 Gold or
Solder Dip (1)
1. Depending ESCC part number mentioned on the purchase order
520100404 or
05 Y Waffle pack
2N3700T1 - TO-18 Gold 2N3700T1 - Strip pack
2N3700HR 5201/004/01 or
02 TO-18 Gold or
Solder Dip (1)
520100401 or
02 - Strip pack
2N3700HR Revision history
Doc ID 15354 Rev 4 11/12
5 Revision history
Table 10. Document revision history
Date Revision Changes
10-Jan-2008 1 Initial release
07-Jan-2010 2 Modified Table 1 on page 1
26-Jul-2010 3 Modified Table 1 on page 1, added Table 9 on page 10
30-Nov-2011 4
– Modified: Table 5 on page 3
– Added: Section 2.1: Electrical characteristics (curves)
– Minor text change in the document title on the coverpage
2N3700HR
12/12 Doc ID 15354 Rev 4
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
