Agilent HSMx-C110/170/190 High Performance ChipLED Data Sheet Description These chip-type LEDs utilize Alu- minum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 605 nm Orange, 626 nm Red for AS AlInGaP and 631 nm red for TS AlInGaP. All packages are binned by both color and intensity, except for red color. These ChipLEDs come either in two top emitting packages (HSMx-C170/C190) or in a side emitting package (HSMx-C110). The right angle ChipLEDs are suitable for applications such as LCD backlighting. The top emit- ting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place opera- tion, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for the top emitting package and 3000 units per reel for the right angle package. These packages are compatible with IR soldering process. Features High brightness AllnGaP material Small size Industry standard footprint Diffused optics Top emitting or right angle emitting Available in3 colors (red, orange, amber) Compatible with IR soldering Available in 8 mm tape on 7" diameter reel Reel sealed in zip locked moisture barrier bags Applications LCD backlighting Push button backlighting Front panel indicator Symbol indicator Microdisplays Small message panel signage Agilent Technologies Innovating the HP WayPackage Dimensions CATHODE CATHODE LED DIE MARK LED DIE MARK x . G fet 1.0 wens Fe-4 --> 1.25 i | | [| | T a (0.102 | 0.62 (0.024) op}o _ (0.079 \_- 3.2 (0.126 )>| POLARITY CLEAR \ EPOXY DIFFUSED jw 1.4 __ POLARITY EPOXY (0.055) 1.5 (0.059) t 0.3 (0.012 | ( ) } PC BOARD > | PC BOARD >- | T 1 0.8 (0.031) 0.5 (0.020) 0.3 (0.012) 1.6 (0.063 ) 3.2 (0.126) 0.44 0.15 0.4 0.15 (0.016 + 0.006) (0.016 + 0.006) 3. (0.126) >| 1.0 (0.039) oy 1.0 (0.039) iS 4 0.2 (0.008) SOLDERING CATHODE LINE SOLDERING TERMINAL a RMIRIAL HSMx-C110 HSMx-C170 CATHODE LED DIE MARK ! ) K 4 J ~_ 0.8 (0.031) | {4 16 0.4 (0.016) (0.063 } 1.0 (0.039) POLARITY 0.3 (0.012) DIFFUSED EPOXY PC BOARD 0.8 (0.031) 0.3 (0.012) 0.3 + 0.15 0.3 0.15 (0.012 + 0.006) [ 7] (0.012 + 0.006) 0.2 (0.008) SOLDERING TERMINAL HSMx-C190 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS + 0.1 mm (+ 0.004 IN.) UNLESS OTHERWISE SPECIFIED.Device Selection Guide Footprint AS AllnGaP AS AllnGaP AS AllnGaP TS AllnGaP Package (mm)[1.2] Amber Orange Red Red Description 1.6 x 0.8 x 0.8 HSMA-C190 HSML-C190 HSMC-C190 HSMZ-C190 Untinted, Diffused 2.0 x 1.25 x 0.8 HSMA-C170 HSML-C170 HSMC-C170 HSMZ-C170 Untinted, Diffused 3.2x 1.0x 1.5 HSMA-C110 HSML-C110 HSMC-C110 HSMZ-C110 Untinted, Nondiffused Notes: 1. Dimensions in mm. 2. Tolerance +0.1 mm unless otherwise noted. Absolute Maximum Ratings Ta = 25C HSMA-C110/170/190 HSML-C110/170/190 Parameter HSMC-C110/170/190 HSMZ-C110/170/190 Units DC Forward Currentl'.2.3] 30 30 mA Power Dissipation 75 81 mw Reverse Voltage (Ip = 100 pA) 5 5 V LED Junction Temperature 95 95 C Operating Temperature Range 30 to +85 30 to +85 C Storage Temperature Range 40 to +85 40 to +85 Soldering Temperature See IR soldering profile (Figure 7) Notes: 1. Derate linearly as shown in Figure 4. 2. Drive currents between 1 mA and 30 mA are recommended for best long term performance. 3. Operating at currents below 1 mA is not recommended. Please contact your Agilent representative for further information. Electrical Characteristics Ta = 25C Forward Voltage Reverse Breakdown Capacitance C Thermal Vr (Volts) Vr (Volts) (pF), Ve =0, Resistance @IlrF=20mA @ IR = 100 pA f= 1MHz Rqu-pin = (C/W) Parameter Number Typ. Max. Min. Typ. Typ. HSMA-C110 1.9 2.4 5 45 600 HSML-C110 1.9 2.4 5 45 600 HSMC-C110 1.9 2.4 5 45 600 HSMZ-C110 2.2 2.6 5 35 600 HSMA-C170/190 1.9 2.4 5 45 300 HSML-C170/190 1.9 2.4 5 45 300 HSMC-C170/190 1.9 2.4 5 45 300 HSMZ-C170/190 2.2 2.6 5 35 300Optical Characteristics Ta = 25C Luminous Color, Viewing Luminous Intensity Peak Dominant Angle Efficacy ly (med) Wavelength Wavelength 264 Tv Part @ 20 mAl peak (nm) Aal2! (nm) Degrees] (Im/w) Number Color Min. Typ. Typ. Typ. Typ. Typ. HSMA-C110 AS Amber 25 95 595 592 130 480 HSMA-C170 AS Amber 25 90 595 592 170 480 HSMA-C190 AS Amber 25 90 595 592 170 480 HSML-C110 AS Orange 25 95 609 605 130 370 HSML-C170 AS Orange 25 90 609 605 170 370 HSML-C190 AS Orange 25 90 609 605 170 370 HSMC-C110 AS Red 25 95 637 626 130 155 HSMC-C170 AS Red 25 90 637 626 170 155 HSMC-C190 AS Red 25 90 637 626 170 155 HSMZ-C110 TS Red 40 170 643 631 130 122 HSMZ-C170 TS Red 40 165 643 631 170 122 HSMZ-C190 TS Red 40 165 643 631 170 122 Notes: 1. The luminous intensity |, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength A, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 94/9 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 1.0 AS AllnGaP ~ = AS AllnGaP RED AS AllnGaP ~ is eee | el Leeann] 0.5 h| | > TS AllnGaP RED RELATIVE INTENSITY S 0 500 550 600 Figure 1. Relative Intensity vs. Wavelength. ww 650 WAVELENGTH - nm 700 750< 100 | 35 ke 2 ? AlinGaP i 30 z ce 1 z <{ 5 Ee EE Oo 25 a 10 ge a wi Zn ec c we < Be = 2 Oo a 5 Ry.4 = 800C/W e an i 15 a TS AllnGaP Sz S ROy_q = 600C/W = 1 Zs 5 co =e Ss 10 5 >0 X Ry.4 = 500C/W 7 2 a a s 5 I 0.1 x 0 15 417 1.9 21 23 25 0 5 10 15 20 25 30 3 0 20 40 60 80 100 Ve - FORWARD VOLTAGE - V Ip - FORWARD CURRENT - mA + Ta - AMBIENT TEMPERATURE - C Figure 2. Forward Current vs. Forward Voltage. Figure 3. Luminous Intensity vs. Forward Figure 4. Maximum Forward Current vs. Current. Ambient Temperature. 1.00 0.90 > 0.80 5 0.70 i 0.60 a = 0.50 > z= 0.40 + 0.30 Ww 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 1.00 0.90 0.80 > 5 0.70 i 0.60 5 = 0.50 AT | a z 0.40 t 0.30 Ww 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative Intensity vs. Angle for HSMx-C110.1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 RELATIVE INTENSITY 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative Intensity vs. Angle for HSMx-C170 and C190. 10 SEC. max ~ w 230C MAX. = E 140-160C fa 4C/SEC. MAX. = x a 5 | 4C/SEC. -3C/SEC. MAX. iu MAX. a OVER 2 MIN. TIME - Figure 7. Recommended Reflow Soldering Profile. | ao | 1.2 1.2 (0.047) (0.047) 0.9 (0.035) 4 +-4- 1.2 (0.047) Figure 9. Recommended Soldering Pattern for HSMx-C170. Note: All dimensions in millimeters (inches). ++ 5.0 (0.200) + 0.9 (0.035) 0.9 (0.035) Poe I LoL ee -}4---++ | 1.5 (0.059) * | 0.2 (0.008) | - CENTERING BOARD 1.5 2.0 1.5 (0.059) (0.079) (0.059) Figure 8. Recommended Soldering Pattern for HSMx-C110. 0.8 (0.031) Ba! 0.8 0.8 (0.031) (0.031) 0.7 (0.028) Figure 10. Recommended Soldering Pattern for HSMx-C190.USER FEED DIRECTION PRINTED LABEL Figure 11. Reeling Orientation. 178.40 + 1.00 (7.024 + 0.039) 4.00.5 (0.157 + 0.020) Figure 12. Reel Dimensions. Note: All dimensions in millimeters (inches). CATHODE SIDE 5.0+0.5 (0.197 + 0.020) 9 20.20 MIN. | (8 0.795 MIN.) 59.60 8.0 + 1.0 (0.315 + 0.039) 10.50 + 1.0 (0.413 + 0.039) + 1.00 (2.346 + 0.039)DIM. C CATHODE (SEE TABLE 1) 4.00 (0.157) 1.50 (0.059) 0.20 + 0.05 (0.008 + 0.002) 1.75 (0.069) 3.50 + 0.05 (0.138 + 0.002) DIM. A (SEE TABLE 1) 8.00 + 0.30 (0.315 + 0.012) CARRIER TAPE DIM. B (SEE TABLE 1) USER FEED 2.00 + 0.05 DIRECTION (0.079 + 0.002} COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) HSMx-C110 DIM. A DIM. B DIM. C POSITION IN PART NUMBER __ |: 0.10 (+ 0.004)| + 0.10 (+ 0.004)|+ 0.10 (+ 0.004) CARRIER TAPE N HSMx-C190 SERIES | 1.95 (0.073) | 1.00 (0.039) | 1.20 (0.047) NS HSMx-C170 SERIES | 2.40 (0.094) | 1.60 (0.063) | 1.20 (0.047) N \Y - HSMx-C110 SERIES | 3.35 (0.132) | 1.85 (0.073) | 1.20 (0.047) N GC Figure 13. Tape Dimensions. END START Convective IR Reflow Soldering Q Op Q C For more information on IR T 1 . -->7 WI} --7 a ordi reflow soldering, refer to ! ! ! ! ! Application Note 1060, Srrface ! | ! | ! ! ! ! Mounting SMT LED Indicator I I I I I Lo Py 3 Loo Components. I et al ee oo THERE SHALL BEA MOUNTED WITH| THERE SHALL BEA MINIMUM OF MINIMUM OF 160 mm COMPONENTS MINIMUM OF 160 mm 230 mm (6.3 INCH) OF EMPTY (6.3 INCH) OF EMPTY (9.05 INCH) COMPONENT POCKETS COMPONENT POCKETS MAY CONSIST SEALED WITH COVER SEALED WITH COVER OF CARRIER TAPE. TAPE. AND/OR COVER TAPE. Figure 14. Tape Leader and Trailer Dimensions. NOTES: 1. All dimensions in millimeters (inches). 2. Tolerance is + 0.1 mm (+ 0.004 in.) unless otherwise specified. www.semiconductor.agilent.com . ' e . . Data subject to change. -aed Gee- Agilent Technologies Copyright 2000 Agilent Technologies, Inc. oreo, Innovating the HP Way 5968-9393E (2/00) os