CY7C2562XV18/CY7C2564XV18 72-Mbit QDR(R) II+ Xtreme SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency) with ODT 72-Mbit QDR(R) II+ Xtreme SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency) with ODT Features Configurations Separate independent read and write data ports Supports concurrent transactions With Read Cycle Latency of 2.5 cycles: 450 MHz clock for high bandwidth CY7C2564XV18 - 2M x 36 Two-word burst for reducing address bus frequency Functional Description Double data rate (DDR) interfaces on both read and write ports (data transferred at 900 MHz) at 450 MHz Available in 2.5 clock cycle latency Two input clocks (K and K) for precise DDR timing SRAM uses rising edges only Echo clocks (CQ and CQ) simplify data capture in high-speed systems Data valid pin (QVLD) to indicate valid data on the output On-Die Termination (ODT) feature Supported for D[x:0], BWS[x:0], and K/K inputs Single multiplexed address input bus latches address inputs for both read and write ports Separate port selects for depth expansion Synchronous internally self-timed writes QDRTM-II+ Xtreme operates with 2.5 cycle read latency when DOFF is asserted HIGH Operates similar to QDR I device with 1 cycle read latency when DOFF is asserted LOW Available in x 18, and x 36 configurations Full data coherency, providing most current data Core VDD = 1.8 V 0.1 V; VDDQ = 1.4 V to 1.6 V Supports 1.5 V I/O supply HSTL inputs and variable drive HSTL output buffers Available in 165-ball FBGA package (13 x 15 x 1.4 mm) The CY7C2562XV18 and CY7C2564XV18 are 1.8 V Synchronous Pipelined SRAMs, equipped with QDRTM-II+ architecture. Similar to QDR II architecture, QDR II+ architecture consists of two separate ports: the read port and the write port to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations. QDR II+ architecture has separate data inputs and data outputs to completely eliminate the need to "turnaround" the data bus that exists with common devices. Access to each port is through a common address bus. Addresses for read and write addresses are latched on alternate rising edges of the input (K) clock. Accesses to the QDR II+ read and write ports are completely independent of one another. To maximize data throughput, both read and write ports are equipped with DDR interfaces. Each address location is associated with two 18-bit words (CY7C2562XV18), or 36-bit words (CY7C2564XV18) that burst sequentially into or out of the device. Because data can be transferred into and out of the device on every rising edge of both input clocks (K and K), memory bandwidth is maximized while simplifying system design by eliminating bus "turnarounds". These devices have an on-die termination (ODT) feature supported for D[x:0], BWS[x:0], and K/K inputs, which helps eliminate external termination resistors, reduce cost, reduce board area, and simplify board routing. Depth expansion is accomplished with port selects, which enables each port to operate independently. All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the K or K input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry. For a complete list of related documentation, click here. CY7C2564XV18 offered in both Pb-free and non Pb-free packages and CY7C2562XV18 offered in Pb-free package only. JTAG 1149.1 compatible test access port Phase-locked loop (PLL) for accurate data placement CY7C2562XV18 - 4M x 18 Selection Guide Description Maximum Operating Frequency Maximum Operating Current Cypress Semiconductor Corporation Document Number: 001-70204 Rev. *F x 18 x 36 * 198 Champion Court * 450 MHz 450 1205 1445 San Jose, CA 95134-1709 366 MHz 366 970 1165 Unit MHz mA * 408-943-2600 Revised May 12, 2016 CY7C2562XV18/CY7C2564XV18 Logic Block Diagram - CY7C2562XV18 K CLK Gen. DOFF 21 Address Register Read Add. Decode K Write Reg 2M x 18 Array Address Register Write Reg 2M x 18 Array A(20:0) 21 18 Write Add. Decode D[17:0] A(20:0) RPS Control Logic Read Data Reg. CQ 36 VREF WPS BWS[1:0] 18 Control Logic 18 Reg. Reg. 18 Reg. 18 CQ 18 Q[17:0] QVLD Logic Block Diagram - CY7C2564XV18 K CLK Gen. DOFF 20 Address Register Read Add. Decode K Write Reg 1M x 36 Array Address Register Write Reg 1M x 36 Array A(19:0) 20 36 Write Add. Decode D[35:0] A(19:0) RPS Control Logic Read Data Reg. CQ 72 VREF WPS BWS[3:0] 36 Control Logic 36 Reg. Reg. 36 Reg. 36 CQ 36 Q[35:0] QVLD Document Number: 001-70204 Rev. *F Page 2 of 29 CY7C2562XV18/CY7C2564XV18 Contents Pin Configurations ........................................................... 4 Pin Definitions .................................................................. 5 Functional Overview ........................................................ 6 Read Operations ......................................................... 6 Write Operations ......................................................... 7 Byte Write Operations ................................................. 7 Concurrent Transactions ............................................. 7 Depth Expansion ......................................................... 7 Programmable Impedance .......................................... 7 Echo Clocks ................................................................ 7 Valid Data Indicator (QVLD) ........................................ 7 On-Die Termination (ODT) .......................................... 7 PLL .............................................................................. 7 Application Example ........................................................ 8 Truth Table ........................................................................ 9 Write Cycle Descriptions ................................................. 9 Write Cycle Descriptions ............................................... 10 IEEE 1149.1 Serial Boundary Scan (JTAG) .................. 11 Disabling the JTAG Feature ...................................... 11 Test Access Port ....................................................... 11 Performing a TAP Reset ........................................... 11 TAP Registers ........................................................... 11 TAP Instruction Set ................................................... 11 TAP Controller State Diagram ....................................... 13 TAP Controller Block Diagram ...................................... 14 TAP Electrical Characteristics ...................................... 14 TAP AC Switching Characteristics ............................... 15 TAP Timing and Test Conditions .................................. 16 Identification Register Definitions ................................ 17 Scan Register Sizes ....................................................... 17 Document Number: 001-70204 Rev. *F Instruction Codes ........................................................... 17 Boundary Scan Order .................................................... 18 Power Up Sequence in QDR II+ Xtreme SRAM ............ 19 Power Up Sequence ................................................. 19 PLL Constraints ......................................................... 19 Maximum Ratings ........................................................... 20 Operating Range ............................................................. 20 Neutron Soft Error Immunity ......................................... 20 Electrical Characteristics ............................................... 20 DC Electrical Characteristics ..................................... 20 AC Electrical Characteristics ..................................... 21 Capacitance .................................................................... 22 Thermal Resistance ........................................................ 22 AC Test Loads and Waveforms ..................................... 22 Switching Characteristics .............................................. 23 Switching Waveforms .................................................... 24 Read/Write/Deselect Sequence ................................ 24 Ordering Information ...................................................... 25 Ordering Code Definitions ......................................... 25 Package Diagram ............................................................ 26 Acronyms ........................................................................ 27 Document Conventions ................................................. 27 Units of Measure ....................................................... 27 Document History Page ................................................. 28 Sales, Solutions, and Legal Information ...................... 29 Worldwide Sales and Design Support ....................... 29 Products .................................................................... 29 PSoC(R) Solutions ...................................................... 29 Cypress Developer Community ................................. 29 Technical Support ..................................................... 29 Page 3 of 29 CY7C2562XV18/CY7C2564XV18 Pin Configurations The pin configuration for CY7C2562XV18 and CY7C2564XV18 follow. [1] Figure 1. 165-ball FBGA (13 x 15 x 1.4 mm) pinout CY7C2562XV18 (4M x 18) 1 2 3 4 5 6 7 8 9 10 11 A CQ NC/144M A WPS BWS1 K NC/288M RPS A A CQ B NC Q9 D9 A NC K BWS0 A NC NC Q8 C NC NC D10 VSS A A A VSS NC Q7 D8 D NC D11 Q10 VSS VSS VSS VSS VSS NC NC D7 E NC NC Q11 VDDQ VSS VSS VSS VDDQ NC D6 Q6 F NC Q12 D12 VDDQ VDD VSS VDD VDDQ NC NC Q5 G NC D13 Q13 VDDQ VDD VSS VDD VDDQ NC NC D5 H DOFF VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ J NC NC D14 VDDQ VDD VSS VDD VDDQ NC Q4 D4 K NC NC Q14 VDDQ VDD VSS VDD VDDQ NC D3 Q3 L NC Q15 D15 VDDQ VSS VSS VSS VDDQ NC NC Q2 M NC NC D16 VSS VSS VSS VSS VSS NC Q1 D2 N NC D17 Q16 VSS A A A VSS NC NC D1 P NC NC Q17 A A QVLD A A NC D0 Q0 R TDO TCK A A A ODT A A A TMS TDI CY7C2564XV18 (2M x 36) 1 2 3 4 5 6 7 8 9 10 11 A CQ NC/288M A WPS BWS2 K BWS1 RPS A NC/144M CQ B Q27 Q18 D18 A BWS3 K BWS0 A D17 Q17 Q8 C D27 Q28 D19 VSS A A A VSS D16 Q7 D8 D D28 D20 Q19 VSS VSS VSS VSS VSS Q16 D15 D7 E Q29 D29 Q20 VDDQ VSS VSS VSS VDDQ Q15 D6 Q6 F Q30 Q21 D21 VDDQ VDD VSS VDD VDDQ D14 Q14 Q5 G D30 D22 Q22 VDDQ VDD VSS VDD VDDQ Q13 D13 D5 H DOFF VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ J D31 Q31 D23 VDDQ VDD VSS VDD VDDQ D12 Q4 D4 K Q32 D32 Q23 VDDQ VDD VSS VDD VDDQ Q12 D3 Q3 L Q33 Q24 D24 VDDQ VSS VSS VSS VDDQ D11 Q11 Q2 M D33 Q34 D25 VSS VSS VSS VSS VSS D10 Q1 D2 N D34 D26 Q25 VSS A A A VSS Q10 D9 D1 P Q35 D35 Q26 A A QVLD A A Q9 D0 Q0 R TDO TCK A A A ODT A A A TMS TDI Note 1. NC/144M and NC/288M are not connected to the die and can be tied to any voltage level. Document Number: 001-70204 Rev. *F Page 4 of 29 CY7C2562XV18/CY7C2564XV18 Pin Definitions Pin Name I/O Pin Description D[x:0] InputData Input Signals. Sampled on the rising edge of K and K clocks during valid write operations. Synchronous CY7C2562XV18 D[17:0] CY7C2564XV18 D[35:0] WPS InputWrite Port Select Active LOW. Sampled on the rising edge of the K clock. When asserted active, a Synchronous write operation is initiated. Deasserting deselects the write port. Deselecting the write port ignores D[x:0]. BWS0, BWS1, BWS2, BWS3 InputByte Write Select 0, 1, 2, and 3 Active LOW. Sampled on the rising edge of the K and K clocks during Synchronous write operations. Used to select which byte is written into the device during the current portion of the write operations. Bytes not written remain unaltered. CY7C2562XV18 BWS0 controls D[8:0] and BWS1 controls D[17:9]. CY7C2564XV18 BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18] and BWS3 controls D[35:27]. All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte Write Select ignores the corresponding byte of data and it is not written into the device. A InputAddress Inputs. Sampled on the rising edge of the K (read address) and K (write address) clocks during Synchronous active read and write operations. These address inputs are multiplexed for both read and write operations. Internally, the device is organized as 4M x 18 (2 arrays each of 2M x 18) for CY7C2562XV18, and 2M x 36 (2 arrays each of 1M x 36) for CY7C2564XV18. Therefore, only 21 address inputs are needed to access the entire memory array for CY7C2562XV18, and 20 address inputs for CY7C2564XV18. These inputs are ignored when the appropriate port is deselected. The Address pins (A) can be assigned any bit order. Q[x:0] OutputData Output Signals. These pins drive out the requested data during a read operation. Valid data is Synchronous driven out on the rising edge of the K and K clocks during read operations. When the read port is deselected, Q[x:0] are automatically tristated. CY7C2562XV18 Q[17:0] CY7C2564XV18 Q[35:0] RPS InputRead Port Select Active LOW. Sampled on the rising edge of positive input clock (K). When active, Synchronous a read operation is initiated. Deasserting deselects the read port. When deselected, the pending access is allowed to complete and the output drivers are automatically tristated following the next rising edge of the K clock. Each read access consists of a burst of two sequential transfers. QVLD Valid output Valid Output Indicator. The Q Valid indicates valid output data. QVLD is edge aligned with CQ and CQ. indicator ODT [2] On-Die On-Die Termination Input. This pin is used for on-die termination (ODT) of the input signals. ODT range Termination selection is made during power up initialization. A LOW on this pin selects a low range that follows input pin RQ/3.33 for 175 < RQ < 350(where RQ is the resistor tied to ZQ pin)A HIGH on this pin selects a high range that follows RQ/1.66 for 175 < RQ < 250 (where RQ is the resistor tied to ZQ pin). When left floating, a high range termination value is selected by default. K Input Clock Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the device and to drive out data through Q[x:0]. All accesses are initiated on the rising edge of K. K Input Clock Negative Input Clock Input. K is used to capture synchronous inputs being presented to the device and to drive out data through Q[x:0]. CQ Echo Clock Synchronous Echo Clock Outputs. This is a free running clock and is synchronized to the input clock (K) of the QDR II+. The timing for the echo clocks is shown in Switching Characteristics on page 23. CQ Echo Clock Synchronous Echo Clock Outputs. This is a free running clock and is synchronized to the input clock (K) of the QDR II+. The timing for the echo clocks is shown in the Switching Characteristics on page 23. Note 2. On-die termination (ODT) feature is supported for D[x:0], BWS[x:0], and K/K inputs. Document Number: 001-70204 Rev. *F Page 5 of 29 CY7C2562XV18/CY7C2564XV18 Pin Definitions (continued) Pin Name I/O Pin Description ZQ Input Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor connected between ZQ and ground. Alternatively, connect this pin directly to VDDQ, which enables the minimum impedance mode. This pin cannot be connected directly to GND or left unconnected. DOFF Input PLL Turn Off Active LOW. Connecting this pin to ground turns off the PLL inside the device. The timing in the operation with the PLL turned off differs from those listed in this data sheet. For normal operation, connect this pin to a pull up through a 10 k or less pull up resistor. The device behaves in QDR I mode when the PLL is turned off. In this mode, the device can be operated at a frequency of up to 167 MHz with QDR I timing. TDO Output TDO Pin for JTAG. TCK Input TCK Pin for JTAG. TDI Input TDI Pin for JTAG. TMS Input TMS Pin for JTAG. NC N/A Not Connected to the Die. Can be tied to any voltage level. NC/144M Input Not Connected to the Die. Can be tied to any voltage level. NC/288M Input Not Connected to the Die. Can be tied to any voltage level. VREF VDD VSS VDDQ InputReference Reference Voltage Input. Static input used to set the reference level for HSTL inputs, outputs, and AC measurement points. Power Supply Power Supply Inputs to the Core of the Device. Ground Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Functional Overview The CY7C2562XV18, and CY7C2564XV18 are synchronous pipelined Burst SRAMs equipped with a read port and a write port. The read port is dedicated to read operations and the write port is dedicated to write operations. Data flows into the SRAM through the write port and flows out through the read port. These devices multiplex the address inputs to minimize the number of address pins required. By having separate read and write ports, the QDR II+ completely eliminates the need to "turn around" the data bus and avoids any possible data contention, thereby simplifying system design. Each access consists of two 18-bit data transfers in the case of CY7C2562XV18, and two 36-bit data transfers in the case of CY7C2564XV18 in one clock cycle. These devices operate with a read latency of two and half cycles when DOFF pin is tied HIGH. When DOFF pin is set LOW or connected to VSS then the device behaves in QDR I mode with a read latency of one clock cycle. Accesses for both ports are initiated on the rising edge of the positive input clock (K). All synchronous input and output timing are referenced from the rising edge of the input clocks (K and K). All synchronous data inputs (D[x:0]) pass through input registers controlled by the input clocks (K and K). All synchronous data outputs (Q[x:0]) pass through output registers controlled by the rising edge of the input clocks (K and K) as well. Document Number: 001-70204 Rev. *F All synchronous control (RPS, WPS, BWS[x:0]) inputs pass through input registers controlled by the rising edge of the input clocks (K and K). CY7C2562XV18 is described in the following sections. The same basic descriptions apply to CY7C2564XV18. Read Operations The CY7C2562XV18 is organized internally as two arrays of 2M x 18. Accesses are completed in a burst of two sequential 18-bit data words. Read operations are initiated by asserting RPS active at the rising edge of the positive input clock (K). The address is latched on the rising edge of the K clock. The address presented to the address inputs is stored in the read address register. Following the next two K clock rise, the corresponding lowest order 18-bit word of data is driven onto the Q[17:0] using K as the output timing reference. On the subsequent rising edge of K, the next 18-bit data word is driven onto the Q[17:0]. The requested data is valid 0.45 ns from the rising edge of the input clock (K and K). When the read port is deselected, the CY7C2562XV18 first completes the pending read transactions. Synchronous internal circuitry automatically tristates the outputs following the next rising edge of the negative input clock (K). This enables for a seamless transition between devices without the insertion of wait states in a depth expanded memory. Page 6 of 29 CY7C2562XV18/CY7C2564XV18 Write Operations Write operations are initiated by asserting WPS active at the rising edge of the positive input clock (K). On the same K clock rise the data presented to D[17:0] is latched and stored into the lower 18-bit write data register, provided BWS[1:0] are both asserted active. On the subsequent rising edge of the negative input clock (K), the address is latched and the information presented to D[17:0] is also stored into the write data register, provided BWS[1:0] are both asserted active. The 36 bits of data are then written into the memory array at the specified location. When deselected, the write port ignores all inputs after the pending write operations have been completed. Byte Write Operations Byte write operations are supported by the CY7C2562XV18. A write operation is initiated as described in the Write Operations section. The bytes that are written are determined by BWS0 and BWS1, which are sampled with each set of 18-bit data words. Asserting the appropriate Byte Write Select input during the data portion of a write latches the data being presented and writes it into the device. Deasserting the Byte Write Select input during the data portion of a write enables the data stored in the device for that byte to remain unaltered. This feature can be used to simplify read, modify, or write operations to a byte write operation. Concurrent Transactions The read and write ports on the CY7C2562XV18 operate completely independently of one another. As each port latches the address inputs on different clock edges, the user can read or write to any location, regardless of the transaction on the other port. The user can start reads and writes in the same clock cycle. If the ports access the same location at the same time, the SRAM delivers the most recent information associated with the specified address location. This includes forwarding data from a write cycle that was initiated on the previous K clock rise. Depth Expansion The CY7C2562XV18 has a port select input for each port. This enables for easy depth expansion. Both port selects are sampled on the rising edge of the positive input clock only (K). Each port select input can deselect the specified port. Deselecting a port does not affect the other port. All pending transactions (read and write) are completed before the device is deselected. Programmable Impedance An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to enable the SRAM to adjust its output driver impedance. The value of RQ must be 5 x the value of the intended line impedance driven by the SRAM. The allowable range of RQ to guarantee impedance matching with a tolerance Document Number: 001-70204 Rev. *F of 15% is between 175 and 350 , with VDDQ = 1.5V. The output impedance is adjusted every 1024 cycles upon power up to account for drifts in supply voltage and temperature. Echo Clocks Echo clocks are provided on the QDR II+ to simplify data capture on high-speed systems. Two echo clocks are generated by the QDR II+. CQ is referenced with respect to K and CQ is referenced with respect to K. These are free running clocks and are synchronized to the input clock of the QDR II+. The timing for echo clocks is shown in Switching Characteristics on page 23. Valid Data Indicator (QVLD) QVLD is provided on the QDR II+ to simplify data capture on high speed systems. The QVLD is generated by the QDR II+ device along with data output. This signal is also edge-aligned with the echo clock and follows the timing of any data pin. This signal is asserted half a cycle before valid data arrives. On-Die Termination (ODT) These devices have an On-Die Termination feature for Data inputs (D[x:0]), Byte Write Selects (BWS[x:0]), and Input Clocks (K and K). The termination resistors are integrated within the chip. The ODT range selection is enabled through ball R6 (ODT pin). The ODT termination tracks value of RQ where RQ is the resistor tied to the ZQ pin. ODT range selection is made during power-up initialization. A LOW on this pin selects a low range that follows RQ/3.33 for 175 < RQ < 350 (where RQ is the resistor tied to ZQ pin)A HIGH on this pin selects a high range that follows RQ/1.66 for 175 < RQ < 250 (where RQ is the resistor tied to ZQ pin). When left floating, a high range termination value is selected by default. For a detailed description on the ODT implementation, refer to the application note, On-Die Termination for QDRII+/DDRII+ SRAMs. PLL These chips use a PLL that is designed to function between 120 MHz and the specified maximum clock frequency. During power up, when the DOFF is tied HIGH, the PLL is locked after 100 s of stable clock. The PLL can also be reset by slowing or stopping the input clocks K and K for a minimum of 30 ns. However, it is not necessary to reset the PLL to lock to the desired frequency. The PLL automatically locks 100 s after a stable clock is presented. The PLL may be disabled by applying ground to the DOFF pin. When the PLL is turned off, the device behaves in QDR I mode with one cycle latency and a longer access time). For information, refer to the application note, PLL Considerations in QDRII/DDRII/QDRII+/DDRII+. Page 7 of 29 CY7C2562XV18/CY7C2564XV18 Application Example Figure 2 shows two QDR II+ used in an application. Figure 2. Application Example (Width Expansion) SRAM#1 D[x:0] A RPS WPS ZQ CQ/CQ Q[x:0] BWS K K RQ SRAM#2 D[x:0] A RPS WPS ZQ CQ/CQ Q[x:0] BWS K K RQ DATA IN[2x:0] DATA OUT [2x:0] ADDRESS RPS WPS BWS CLKIN1/CLKIN1 CLKIN2/CLKIN2 SOURCE K SOURCE K FPGA / ASIC Document Number: 001-70204 Rev. *F Page 8 of 29 CY7C2562XV18/CY7C2564XV18 Truth Table The truth table for CY7C2562XV18, and CY7C2564XV18 follow. [3, 4, 5, 6, 7, 8] Operation K RPS WPS DQ DQ Write Cycle: Load address on the rising edge of K; input write data on K and K rising edges. L-H X L D(A) at K(t) D(A + 1) at K(t) Read Cycle: (2.5 cycle Latency) Load address on the rising edge of K; wait two and half cycles; read data on K and K rising edges. L-H L X Q(A) at K(t + 2) Q(A + 1) at K(t + 3) NOP: No Operation L-H H H D=X Q = High Z D=X Q = High Z Stopped X X Previous State Previous State Standby: Clock Stopped Write Cycle Descriptions The write cycle description table for CY7C2562XV18 follow. [3, 9] BWS0 BWS1 K K L L L-H - L L - L H L-H L H - H L L-H H L - H H L-H H H - Comments During the data portion of a write sequence CY7C2562XV18 both bytes (D[17:0]) are written into the device. L-H During the data portion of a write sequence: CY7C2562XV18 both bytes (D[17:0]) are written into the device. - During the data portion of a write sequence: CY7C2562XV18 only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered. L-H During the data portion of a write sequence CY7C2562XV18 only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered. - During the data portion of a write sequence CY7C2562XV18 only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered. L-H During the data portion of a write sequence CY7C2562XV18 only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered. - No data is written into the devices during this portion of a write operation. L-H No data is written into the devices during this portion of a write operation. Notes 3. X = "Don't Care," H = Logic HIGH, L = Logic LOW, represents rising edge. 4. Device powers up deselected with the outputs in a tristate condition. 5. "A" represents address location latched by the devices when transaction was initiated. A + 1 represents the internal address sequence in the burst. 6. "t" represents the cycle at which a Read/Write operation is started. t + 1, and t + 2 are the first, and second clock cycles respectively succeeding the "t" clock cycle. 7. Data inputs are registered at K and K rising edges. Data outputs are delivered on K and K rising edges as well. 8. Ensure that when clock is stopped K = K and C = C = HIGH. This is not essential, but permits most rapid restart by overcoming transmission line charging symmetrically. 9. Is based on a write cycle that was initiated in accordance with the Truth Table. BWS0, BWS1, BWS2 and BWS3 can be altered on different portions of a write cycle, as long as the setup and hold requirements are achieved. Document Number: 001-70204 Rev. *F Page 9 of 29 CY7C2562XV18/CY7C2564XV18 Write Cycle Descriptions The write cycle description table for CY7C2564XV18 follow. [10, 11] BWS0 BWS1 BWS2 BWS3 K K Comments L L L L L-H - During the data portion of a write sequence, all four bytes (D[35:0]) are written into the device. L L L L - L H H H L-H L H H H - H L H H L-H H L H H - H H L H L-H H H L H - H H H L L-H H H H L - H H H H L-H H H H H - L-H During the data portion of a write sequence, all four bytes (D[35:0]) are written into the device. - During the data portion of a write sequence, only the lower byte (D[8:0]) is written into the device. D[35:9] remains unaltered. L-H During the data portion of a write sequence, only the lower byte (D[8:0]) is written into the device. D[35:9] remains unaltered. - During the data portion of a write sequence, only the byte (D[17:9]) is written into the device. D[8:0] and D[35:18] remains unaltered. L-H During the data portion of a write sequence, only the byte (D[17:9]) is written into the device. D[8:0] and D[35:18] remains unaltered. - During the data portion of a write sequence, only the byte (D[26:18]) is written into the device. D[17:0] and D[35:27] remains unaltered. L-H During the data portion of a write sequence, only the byte (D[26:18]) is written into the device. D[17:0] and D[35:27] remains unaltered. - During the data portion of a write sequence, only the byte (D[35:27]) is written into the device. D[26:0] remains unaltered. L-H During the data portion of a write sequence, only the byte (D[35:27]) is written into the device. D[26:0] remains unaltered. - No data is written into the device during this portion of a write operation. L-H No data is written into the device during this portion of a write operation. Notes 10. X = "Don't Care," H = Logic HIGH, L = Logic LOW, represents rising edge. 11. Is based on a write cycle that was initiated in accordance with the Truth Table on page 9. BWS0, BWS1, BWS2 and BWS3 can be altered on different portions of a write cycle, as long as the setup and hold requirements are achieved. Document Number: 001-70204 Rev. *F Page 10 of 29 CY7C2562XV18/CY7C2564XV18 IEEE 1149.1 Serial Boundary Scan (JTAG) These SRAMs incorporate a serial boundary scan Test Access Port (TAP) in the FBGA package. This part is fully compliant with IEEE Standard #1149.1-2001. The TAP operates using JEDEC standard 1.8 V logic levels. Disabling the JTAG Feature It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternatively be connected to VDD through a pull up resistor. TDO must be left unconnected. Upon power up, the device comes up in a reset state, which does not interfere with the operation of the device. Test Access Port Test Clock The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK. Test Mode Select (TMS) The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. This pin may be left unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level. Test Data-In (TDI) The TDI pin is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information about loading the instruction register, see the TAP Controller State Diagram on page 13. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) on any register. Test Data-Out (TDO) The TDO output pin is used to serially clock data out from the registers. The output is active, depending upon the current state of the TAP state machine (see Instruction Codes on page 17). The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. Performing a TAP Reset A Reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This Reset does not affect the operation of the SRAM and can be performed while the SRAM is operating. At power up, the TAP is reset internally to ensure that TDO comes up in a High Z state. TAP Registers Registers are connected between the TDI and TDO pins to scan the data in and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction registers. Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 001-70204 Rev. *F Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins, as shown in TAP Controller Block Diagram on page 14. Upon power up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state, as described in the previous section. When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary "01" pattern to allow for fault isolation of the board level serial test path. Bypass Register To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between TDI and TDO pins. This enables shifting of data through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. Boundary Scan Register The boundary scan register is connected to all of the input and output pins on the SRAM. Several No Connect (NC) pins are also included in the scan register to reserve pins for higher density devices. The boundary scan register is loaded with the contents of the RAM input and output ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO pins when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD, and SAMPLE Z instructions can be used to capture the contents of the input and output ring. The Boundary Scan Order on page 18 shows the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI, and the LSB is connected to TDO. Identification (ID) Register The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in Identification Register Definitions on page 17. TAP Instruction Set Eight different instructions are possible with the three-bit instruction register. All combinations are listed in Instruction Codes on page 17. Three of these instructions are listed as RESERVED and must not be used. The other five instructions are described in this section in detail. Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO pins. To execute the instruction after it is shifted in, the TAP controller must be moved into the Update-IR state. Page 11 of 29 CY7C2562XV18/CY7C2564XV18 IDCODE BYPASS The IDCODE instruction loads a vendor-specific, 32-bit code into the instruction register. It also places the instruction register between the TDI and TDO pins and shifts the IDCODE out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is loaded into the instruction register at power up or whenever the TAP controller is supplied a Test-Logic-Reset state. When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. SAMPLE Z The SAMPLE Z instruction connects the boundary scan register between the TDI and TDO pins when the TAP controller is in a Shift-DR state. The SAMPLE Z command puts the output bus into a High Z state until the next command is supplied during the Update IR state. SAMPLE/PRELOAD SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the input and output pins is captured in the boundary scan register. The user must be aware that the TAP controller clock can only operate at a frequency up to 20 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output undergoes a transition. The TAP may then try to capture a signal while in transition (metastable state). This does not harm the device, but there is no guarantee as to the value that is captured. Repeatable results may not be possible. To guarantee that the boundary scan register captures the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller's capture setup plus hold times (tCS and tCH). The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK captured in the boundary scan register. EXTEST The EXTEST instruction drives the preloaded data out through the system output pins. This instruction also connects the boundary scan register for serial access between the TDI and TDO in the Shift-DR controller state. EXTEST OUTPUT BUS TRISTATE IEEE Standard 1149.1 mandates that the TAP controller be able to put the output bus into a tristate mode. The boundary scan register has a special bit located at bit #108. When this scan cell, called the "extest output bus tristate," is latched into the preload register during the Update-DR state in the TAP controller, it directly controls the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it enables the output buffers to drive the output bus. When LOW, this bit places the output bus into a High Z condition. This bit can be set by entering the SAMPLE/PRELOAD or EXTEST command, and then shifting the desired bit into that cell, during the Shift-DR state. During Update-DR, the value loaded into that shift-register cell latches into the preload register. When the EXTEST instruction is entered, this bit directly controls the output Q-bus pins. Note that this bit is pre-set LOW to enable the output when the device is powered up, and also when the TAP controller is in the Test-Logic-Reset state. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. After the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. PRELOAD places an initial data pattern at the latched parallel outputs of the boundary scan register cells before the selection of another boundary scan test operation. The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required, that is, while the data captured is shifted out, the preloaded data can be shifted in. Document Number: 001-70204 Rev. *F Page 12 of 29 CY7C2562XV18/CY7C2564XV18 TAP Controller State Diagram The state diagram for the TAP controller follows. [12] 1 TEST-LOGIC RESET 0 0 TEST-LOGIC/ IDLE 1 SELECT DR-SCAN 1 1 SELECT IR-SCAN 0 0 1 1 CAPTURE-DR CAPTURE-IR 0 0 SHIFT-DR 0 SHIFT-IR 1 1 EXIT1-DR 1 EXIT1-IR 0 0 PAUSE-IR 1 0 1 EXIT2-DR 0 EXIT2-IR 1 1 UPDATE-IR UPDATE-DR 1 1 0 PAUSE-DR 0 0 0 1 0 Note 12. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-70204 Rev. *F Page 13 of 29 CY7C2562XV18/CY7C2564XV18 TAP Controller Block Diagram 0 Bypass Register 2 Selection Circuitry TDI 1 0 Selection Circuitry Instruction Register 31 30 29 . . 2 1 0 1 0 TDO Identification Register 108 . . . . 2 Boundary Scan Register TCK TAP Controller TMS TAP Electrical Characteristics Over the Operating Range Parameter [13, 14, 15] Description Test Conditions Min Max Unit VOH1 Output HIGH voltage IOH =-2.0 mA 1.4 - V VOH2 Output HIGH voltage IOH = -100 A 1.6 - V VOL1 Output LOW voltage IOL = 2.0 mA - 0.4 V VOL2 Output LOW voltage IOL = 100 A - 0.2 V VIH Input HIGH voltage VIL Input LOW voltage IX Input and Output load current 0.65 x VDD VDD + 0.3 GND VI VDD V -0.3 0.35 x VDD V -5 5 A Notes 13. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics on page 20. 14. Overshoot: VIH(AC) < VDD + 0.35 V (Pulse width less than tTCYC/2), Undershoot: VIL(AC) > 0.3 V (Pulse width less than tTCYC/2). 15. All Voltage referenced to Ground. Document Number: 001-70204 Rev. *F Page 14 of 29 CY7C2562XV18/CY7C2564XV18 TAP AC Switching Characteristics Over the Operating Range Parameter [16, 17] Description Min Max Unit 50 - ns tTCYC TCK clock cycle time tTF TCK clock frequency - 20 MHz tTH TCK clock HIGH 20 - ns tTL TCK clock LOW 20 - ns tTMSS TMS setup to TCK clock rise 5 - ns tTDIS TDI setup to TCK clock rise 5 - ns tCS Capture setup to TCK rise 5 - ns Setup Times Hold Times tTMSH TMS Hold after TCK clock rise 5 - ns tTDIH TDI Hold after clock rise 5 - ns tCH Capture Hold after clock rise 5 - ns tTDOV TCK clock LOW to TDO valid - 10 ns tTDOX TCK clock LOW to TDO invalid 0 - ns Output Times Notes 16. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register. 17. Test conditions are specified using the load in TAP AC Test Conditions. tR/tF = 1 V/ns. Document Number: 001-70204 Rev. *F Page 15 of 29 CY7C2562XV18/CY7C2564XV18 TAP Timing and Test Conditions Figure 3 shows the TAP timing and test conditions. [18] Figure 3. TAP Timing and Test Conditions 0.9V ALL INPUT PULSES 1.8V 50 0.9V TDO 0V Z0 = 50 (a) Slew Rate = 1 V/ns CL = 20 pF tTH GND tTL Test Clock TCK tTMSH tTMSS tTCYC Test Mode Select TMS tTDIS tTDIH Test Data In TDI Test Data Out TDO tTDOV tTDOX Note 18. Test conditions are specified using the load in TAP AC Test Conditions. tR/tF = 1 V/ns. Document Number: 001-70204 Rev. *F Page 16 of 29 CY7C2562XV18/CY7C2564XV18 Identification Register Definitions Value Instruction Field CY7C2562XV18 Revision Number (31:29) Description CY7C2564XV18 000 000 Cypress Device ID (28:12) 11010010000010100 11010010000100100 Version number. Cypress JEDEC ID (11:1) 00000110100 00000110100 Allows unique identification of SRAM vendor. ID Register Presence (0) 1 1 Indicates the presence of an ID register. Defines the type of SRAM. Scan Register Sizes Register Name Bit Size Instruction 3 Bypass 1 ID 32 Boundary Scan 109 Instruction Codes Instruction Code Description EXTEST 000 Captures the input and output ring contents. IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO. This operation does not affect SRAM operation. SAMPLE Z 010 Captures the input and output contents. Places the boundary scan register between TDI and TDO. Forces all SRAM output drivers to a High Z state. RESERVED 011 Do Not Use: This instruction is reserved for future use. SAMPLE/PRELOAD 100 Captures the input and output contents. Places the boundary scan register between TDI and TDO. Does not affect the SRAM operation. RESERVED 101 Do Not Use: This instruction is reserved for future use. RESERVED 110 Do Not Use: This instruction is reserved for future use. BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 001-70204 Rev. *F Page 17 of 29 CY7C2562XV18/CY7C2564XV18 Boundary Scan Order Bit # Bump ID Bit # Bump ID Bit # Bump ID Bit # Bump ID 0 6R 28 10G 56 6A 84 1J 1 6P 29 9G 57 5B 85 2J 2 6N 30 11F 58 5A 86 3K 3 7P 31 11G 59 4A 87 3J 4 7N 32 9F 60 5C 88 2K 5 7R 33 10F 61 4B 89 1K 6 8R 34 11E 62 3A 90 2L 7 8P 35 10E 63 2A 91 3L 8 9R 36 10D 64 1A 92 1M 9 11P 37 9E 65 2B 93 1L 10 10P 38 10C 66 3B 94 3N 11 10N 39 11D 67 1C 95 3M 12 9P 40 9C 68 1B 96 1N 13 10M 41 9D 69 3D 97 2M 14 11N 42 11B 70 3C 98 3P 15 9M 43 11C 71 1D 99 2N 16 9N 44 9B 72 2C 100 2P 17 11L 45 10B 73 3E 101 1P 18 11M 46 11A 74 2D 102 3R 19 9L 47 10A 75 2E 103 4R 20 10L 48 9A 76 1E 104 4P 21 11K 49 8B 77 2F 105 5P 22 10K 50 7C 78 3F 106 5N 23 9J 51 6C 79 1G 107 5R 24 9K 52 8A 80 1F 108 Internal 25 10J 53 7A 81 3G 26 11J 54 7B 82 2G 27 11H 55 6B 83 1H Document Number: 001-70204 Rev. *F Page 18 of 29 CY7C2562XV18/CY7C2564XV18 Power Up Sequence in QDR II+ Xtreme SRAM PLL Constraints QDR II+ Xtreme SRAMs must be powered up and initialized in a predefined manner to prevent undefined operations. PLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as tKC Var. The PLL functions at frequencies down to 120 MHz. If the input clock is unstable and the PLL is enabled, then the PLL may lock onto an incorrect frequency, causing unstable SRAM behavior. To avoid this, provide 100 s of stable clock to relock to the desired clock frequency. Power Up Sequence Apply power and drive DOFF either HIGH or LOW (All other inputs can be HIGH or LOW). Apply VDD before VDDQ. Apply VDDQ before VREF or at the same time as VREF. Drive DOFF HIGH. Provide stable DOFF (HIGH), power and clock (K, K) for 100 s to lock the PLL Figure 4. Power Up Waveforms Document Number: 001-70204 Rev. *F Page 19 of 29 CY7C2562XV18/CY7C2564XV18 Maximum Ratings Operating Range Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ............................... -65 C to +150 C Supply Voltage on VDD Relative to GND .....-0.5 V to +2.9 V Ambient Temperature (TA) Commercial 0 C to +70 C Industrial Supply Voltage on VDDQ Relative to GND .... -0.5 V to +VDD DC Applied to Outputs in High Z ...... -0.5 V to VDDQ + 0.3 V Range VDD [20] VDDQ [20] 1.8 0.1 V 1.4 V to 1.6 V -40 C to +85 C Neutron Soft Error Immunity DC Input Voltage [19] ........................... -0.5 V to VDD + 0.3 V Current into Outputs (LOW) ........................................ 20 mA Static Discharge Voltage (MIL-STD-883, M. 3015) ......................................... > 2001V Latch up Current ................................................... > 200 mA Maximum Junction Temperature .............................. 125 C Description Test Conditions Typ Max* Unit LSBU Logical Single-Bit Upsets 25 C 260 271 FIT/ Mb LMBU Logical Multi-Bit Upsets 25 C 0 0.01 FIT/ Mb Single Event Latch up 85 C 0 0.1 FIT/ Dev Parameter SEL * No LMBU or SEL events occurred during testing; this column represents a statistical 2, 95% confidence limit calculation. For more details refer to Application Note AN54908 "Accelerated Neutron SER Testing and Calculation of Terrestrial Failure Rates". Electrical Characteristics Over the Operating Range DC Electrical Characteristics Over the Operating Range Parameter [21] Description Test Conditions Min Typ Max Unit 1.7 1.8 1.9 V VDD Power supply voltage VDDQ Supply voltage 1.4 1.5 1.6 V VOH Output HIGH voltage Note 22 VDDQ/2 - 0.12 - VDDQ/2 + 0.12 V VOL Output LOW voltage Note 23 VDDQ/2 - 0.12 - VDDQ/2 + 0.12 V VOH(LOW) Output HIGH voltage IOH =0.1 mA, Nominal Impedance VDDQ - 0.2 - VDDQ V VOL(LOW) Output LOW voltage IOL = 0.1 mA, Nominal Impedance VSS - 0.2 V VIH Input HIGH voltage VREF + 0.1 - VDDQ + 0.15 V VIL Input LOW voltage -0.15 - VREF - 0.1 V IX Input leakage current GND VI VDDQ 2 - 2 A IOZ Output leakage current GND VI VDDQ, Output Disabled VREF Input reference voltage Typical Value = 0.75 V VDD Operating Supply IDD [24] 2 - 2 A 0.68 0.75 0.86 V VDD = Max, 450 MHz (x 18) IOUT = 0 mA, (x 36) f = fMAX = 1/tCYC 366 MHz (x 18) - - 1205 mA - - 1445 - - 970 (x 36) - - 1165 mA Notes 19. Overshoot: VIH(AC) < VDDQ + 0.35 V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > 0.3 V (Pulse width less than tCYC/2). 20. Power up: Assumes a linear ramp from 0 V to VDD(min) within 200 ms. During this time VIH < VDD and VDDQ < VDD. 21. All Voltage referenced to Ground. 22. Output are impedance controlled. IOH = (VDDQ/2)/(RQ/5) for values of 175 ohms < RQ < 350 ohms. 23. Output are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175 ohms < RQ < 350 ohms. 24. The operation current is calculated with 50% read cycle and 50% write cycle. Document Number: 001-70204 Rev. *F Page 20 of 29 CY7C2562XV18/CY7C2564XV18 Electrical Characteristics (continued) Over the Operating Range DC Electrical Characteristics (continued) Over the Operating Range Parameter [21] ISB1 Description Automatic Power down Current Test Conditions Min Typ Max Unit Max VDD, 450 MHz (x 18) Both Ports (x 36) Deselected, VIN VIH or 366 MHz (x 18) VIN VIL, (x 36) f = fMAX = 1/tCYC, Inputs Static - - 1205 mA - - 1445 - - 970 - - 1165 Test Conditions Min Typ Max Unit mA AC Electrical Characteristics Over the Operating Range Parameter [25] Description VIH Input HIGH voltage VREF + 0.2 - VDDQ + 0.24 V VIL Input LOW voltage -0.24 - VREF - 0.2 V Note 25. Overshoot: VIH(AC) < VDDQ + 0.35 V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > 0.3 V (Pulse width less than tCYC/2). Document Number: 001-70204 Rev. *F Page 21 of 29 CY7C2562XV18/CY7C2564XV18 Capacitance Parameter [26] Description Test Conditions TA = 25 C, f = 1 MHz, VDD = 1.8 V, VDDQ = 1.5 V CIN Input capacitance CO Output capacitance Max Unit 4 pF 4 pF Thermal Resistance Parameter [26] JA (0 m/s) JA (1 m/s) Description 165-ball FBGA Unit Package Test Conditions Thermal resistance (junction to ambient) Socketed on a 170 x 220 x 2.35 mm, eight-layer printed circuit board JA (3 m/s) 14.43 C/W 13.40 C/W 12.66 C/W JB Thermal resistance (junction to board) 11.38 C/W JC Thermal resistance (junction to case) 3.30 C/W AC Test Loads and Waveforms Figure 5. AC Test Loads and Waveforms VREF = 0.75 V VREF 0.75 V VREF OUTPUT DEVICE UNDER TEST ZQ Z0 = 50 RL = 50 VREF = 0.75 V R = 50 ALL INPUT PULSES 1.25 V 0.75 V OUTPUT DEVICE UNDER TEST ZQ RQ = 250 (a) 0.75 V INCLUDING JIG AND SCOPE 5 pF [27] 0.25V SLEW RATE= 2 V/ns RQ = 250 (b) Notes 26. Tested initially and after any design or process change that may affect these parameters. 27. Unless otherwise noted, test conditions are based on signal transition time of 2 V/ns, timing reference levels of 0.75 V, Vref = 0.75 V, RQ = 250 , VDDQ = 1.5 V, input pulse levels of 0.25 V to 1.25 V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of Figure 5. Document Number: 001-70204 Rev. *F Page 22 of 29 CY7C2562XV18/CY7C2564XV18 Switching Characteristics Over the Operating Range Parameter [28, 29] Cypress Parameter 450 MHz Description Consortium Parameter Min VDD(typical) to the first access [30] tPOWER Max 366 MHz Min Max Unit 1 - 1 - ms tCYC tKHKH K clock cycle time 2.2 8.4 2.73 8.4 ns tKH tKHKL Input clock (K/K) HIGH 0.4 - 0.4 - ns tKL tKLKH Input clock (K/K) LOW 0.4 - 0.4 - ns tKHKH tKHKH K clock rise to K clock rise (rising edge to rising edge) 0.94 - 1.16 - ns tSA tAVKH Address setup to K clock rise 0.275 - 0.4 - ns tSC tIVKH Control setup to K clock rise (RPS, WPS) 0.275 - 0.4 - ns tSCDDR tIVKH DDR control setup to clock (K/K) rise (BWS0, BWS1, BWS2, BWS3) 0.275 - 0.4 - ns tSD tDVKH D[X:0] setup to clock (K/K) rise 0.275 - 0.4 - ns tHA tKHAX Address hold after K clock rise 0.275 - 0.4 - ns tHC tKHIX Control hold after K clock rise (RPS, WPS) 0.275 - 0.4 - ns tHCDDR tKHIX DDR control hold after clock (K/K) rise (BWS0, BWS1, BWS2, 0.275 BWS3) - 0.4 - ns tHD tKHDX D[X:0] hold after clock (K/K) rise 0.275 - 0.4 - ns tCCQO tCHCQV K/K clock rise to echo clock valid tCQOH tCHCQX tCQD Setup Times Hold Times Output Times - 0.45 - 0.45 ns - -0.45 - ns tCQHQV Echo clock hold after K/K clock rise Echo clock high to data valid -0.45 - 0.13 - 0.15 ns tCQDOH tCQHQX Echo clock high to data invalid -0.13 - -0.15 - ns tCQH tCQHCQL Output clock (CQ/CQ) HIGH [31] 1.02 - 1.285 - ns 1.02 - 1.285 - ns - 0.45 - 0.45 ns -0.45 - -0.45 - ns -0.15 0.15 -0.20 0.20 ns tCQHCQH tCQHCQH CQ clock rise to CQ clock rise (rising edge to rising edge) tCHZ tCHQZ Clock (K/K) rise to high Z (active to high Z) [32, 33] tCLZ tQVLD tCHQX1 Clock (K/K) rise to low Z [32, 33] [34] [31] tCQHQVLD Echo clock high to QVLD valid tKC Var tKC Var Clock phase jitter - 0.15 - 0.15 ns tKC lock tKC lock PLL lock time (K) 100 - 100 - s tKC Reset tKC Reset K static to PLL reset [35] 30 - 30 - ns PLL Timing Notes 28. Unless otherwise noted, test conditions are based on signal transition time of 2 V/ns, timing reference levels of 0.75 V, Vref = 0.75 V, RQ = 250 , VDDQ = 1.5 V, input pulse levels of 0.25 V to 1.25 V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of Figure 5 on page 22. 29. When a part with a maximum frequency above 366 MHz is operating at a lower clock frequency, it requires the input timings of the frequency range in which it is being operated and outputs data with the output timings of that frequency range. 30. This part has a voltage regulator internally; tPOWER is the time that the power must be supplied above VDD minimum initially before initiating a read or write operation. 31. These parameters are extrapolated from the input timing parameters (tCYC/2 - 80 ps, where 80 ps is the internal jitter). These parameters are only guaranteed by design and are not tested in production. 32. tCHZ, tCLZ, are specified with a load capacitance of 5 pF as in part (b) of Figure 5 on page 22. Transition is measured 100 mV from steady state voltage. 33. At any given voltage and temperature tCHZ is less than tCLZ . 34. tQVLD spec is applicable for both rising and falling edges of QVLD signal. 35. Hold to >VIH or <VIL. Document Number: 001-70204 Rev. *F Page 23 of 29 CY7C2562XV18/CY7C2564XV18 Switching Waveforms Read/Write/Deselect Sequence Figure 6. Waveform for 2.5 Cycle Read Latency [36, 37, 38] Notes 36. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, that is, A0 + 1. 37. Outputs are disabled (High Z) one clock cycle after a NOP. 38. In this example, if address A0 = A1, then data Q00 = D10 and Q01 = D11. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 001-70204 Rev. *F Page 24 of 29 CY7C2562XV18/CY7C2564XV18 Ordering Information The following table contains only the parts that are currently available. If you do not see what you are looking for, contact your local sales representative. For more information, visit the Cypress website at www.cypress.com and refer to the product summary page at http://www.cypress.com/products Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives and distributors. To find the office closest to you, visit us at http://www.cypress.com/go/datasheet/offices. Speed (MHz) 450 Ordering Code CY7C2564XV18-450BZC Package Diagram Package Type 51-85180 165-ball FBGA (13 x 15 x 1.4 mm) CY7C2562XV18-450BZXC Operating Range Commercial 165-ball FBGA (13 x 15 x 1.4 mm) Pb-free CY7C2564XV18-450BZXC CY7C2564XV18-450BZXI 366 CY7C2564XV18-366BZC Industrial 51-85180 165-ball FBGA (13 x 15 x 1.4 mm) CY7C2562XV18-366BZXC Commercial 165-ball FBGA (13 x 15 x 1.4 mm) Pb-free CY7C2564XV18-366BZXC Ordering Code Definitions CY 7 C 256X X V18 - XXX BZ X X Temperature Range: X = C or I C = Commercial; I = Industrial Pb-free Package Type: BZ = 165-ball FBGA Frequency Range: XXX = 450 MHz or 366 MHz V18 = 1.8 V Die Revision Part Identifier: 256X = 2562 or 2564 Technology Code: C = CMOS Marketing Code: 7 = SRAM Company ID: CY = Cypress Document Number: 001-70204 Rev. *F Page 25 of 29 CY7C2562XV18/CY7C2564XV18 Package Diagram Figure 7. 165-ball FBGA (13 x 15 x 1.4 mm) BB165D/BW165D (0.5 Ball Diameter) Package Outline, 51-85180 51-85180 *G Document Number: 001-70204 Rev. *F Page 26 of 29 CY7C2562XV18/CY7C2564XV18 Acronyms Acronym Document Conventions Description Units of Measure DDR Double Data Rate FBGA Fine-Pitch Ball Grid Array C degree Celsius HSTL High-Speed Transceiver Logic k kilohm I/O Input/Output MHz megahertz JTAG Joint Test Action Group A microampere LSB Least Significant Bit s microsecond LMBU Logical Multi-Bit Upsets mA milliampere LSBU Logical Single-Bit Upsets MSB Most Significant Bit ODT On-Die Termination PLL Phase-Locked Loop QDR Quad Data Rate SEL Single Event Latch-up pF picofarad SRAM Static Random Access Memory ps picosecond TAP Test Access Port V volt TCK Test Clock W watt TMS Test Mode Select TDI Test Data-In TDO Test Data-Out Document Number: 001-70204 Rev. *F Symbol Unit of Measure mV millivolt mm millimeter ms millisecond ns nanosecond ohm % percent Page 27 of 29 CY7C2562XV18/CY7C2564XV18 Document History Page Document Title: CY7C2562XV18/CY7C2564XV18, 72-Mbit QDR(R) II+ Xtreme SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency) with ODT Document Number: 001-70204 Rev. ECN No. Orig. of Change Submission Date Description of Change ** 3302894 OSN 07/05/2011 New data sheet. *A 3532349 PRIT 02/22/2012 Changed status from Preliminary to Final. *B 3639849 PRIT 06/08/2012 No technical updates. Completing Sunset Review. *C 3781737 PRIT 10/24/2012 Updated Application Example (Updated Figure 2). Updated TAP Electrical Characteristics (Updated Note 14). Updated TAP AC Switching Characteristics (Updated Note 17). Updated TAP Timing and Test Conditions (Updated Note 18 and updated Figure 3). Updated Thermal Resistance (Changed value of JA parameter from 23.94 C/W to 14.84 C/W (for Test Condition "With Still Air (0 m/s)") for 165-ball FBGA Package, changed value of JA parameter from 20.07 C/W to 13.68 C/W (for Test Condition "With Air flow (1 m/s)") for 165-ball FBGA Package, changed value of JC parameter from 3.0 C/W to 5.1 C/W for 165-ball FBGA Package). Updated Package Diagram (spec 51-85180 (Changed revision from *E to *F)). *D 4380995 PRIT 05/15/2014 Updated Application Example: Updated Figure 2. Updated Thermal Resistance: Updated values of JA parameter. Included JB parameter and its details. Updated to new template. Completing Sunset Review. *E 4574060 PRIT 11/19/2014 Updated Functional Description: Added "For a complete list of related documentation, click here." at the end. *F 5269064 PRIT 05/12/2016 Added Industrial Temperature Range related information in all instances across the document. Updated Ordering Information: Updated part numbers. Updated Package Diagram: spec 51-85180 - Changed revision from *F to *G. Updated to new template. Document Number: 001-70204 Rev. *F Page 28 of 29 CY7C2562XV18/CY7C2564XV18 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC(R)Solutions Products ARM(R) Cortex(R) Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface Lighting & Power Control Memory cypress.com/clocks cypress.com/interface cypress.com/powerpsoc cypress.com/memory PSoC Cypress Developer Community Forums | Projects | Video | Blogs | Training | Components Technical Support cypress.com/support cypress.com/psoc Touch Sensing cypress.com/touch USB Controllers Wireless/RF PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP cypress.com/usb cypress.com/wireless (c) Cypress Semiconductor Corporation 2011-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document, including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. 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Document Number: 001-70204 Rev. *F Revised May 12, 2016 QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, IDT, NEC, Renesas, and Samsung. Page 29 of 29